CN111732069A - Gas sensor and preparation method thereof - Google Patents
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- CN111732069A CN111732069A CN202010561989.9A CN202010561989A CN111732069A CN 111732069 A CN111732069 A CN 111732069A CN 202010561989 A CN202010561989 A CN 202010561989A CN 111732069 A CN111732069 A CN 111732069A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
Abstract
The application provides a gas sensor and a preparation method thereof, wherein the gas sensor comprises: a first package including a gas sensitive chip; the second packaging body is stacked on one side of the first packaging body and comprises a packaging substrate and a functional chip located on the bearing surface of the packaging substrate, and the gas-sensitive chip and the functional chip are electrically connected with the packaging substrate respectively. In this way, the gas sensitive chip can be independently packaged into the first packaging body and then attached to the second packaging body packaged with the functional chip.
Description
Technical Field
The application belongs to the technical field of semiconductors, and particularly relates to a gas sensor and a preparation method thereof.
Background
At present, the gas sensor uses MEMS process manufacturing method, which comprises the following steps: and (3) mounting the gas sensitive chip and other components on the circuit board PCB side by side.
The gas sensor has larger size and low integration level due to the process; and the gas sensitive chip may be affected by other components in the mounting process, and the problems of pollution and the like may occur, so that the reliability of the gas sensitive sensor is reduced.
Disclosure of Invention
The application provides a gas sensor and a preparation method thereof, which can independently package a gas sensitive chip into a first package body and then attach the first package body to a second package body packaged with a functional chip.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a gas sensor including: a first package including a gas sensitive chip; the second packaging body is stacked on one side of the first packaging body and comprises a packaging substrate and a functional chip located on the bearing surface of the packaging substrate, and the gas-sensitive chip and the functional chip are electrically connected with the packaging substrate respectively.
Wherein the second package further comprises: the conductive posts are positioned on the bearing surface, are electrically connected with the packaging substrate and are higher than the functional chip; the plastic packaging layer covers one side of the bearing surface of the packaging substrate and is flush with the conductive columns in height; and the gas-sensitive chip is electrically connected with the surface of the conductive post exposed from the plastic packaging layer.
The second package body further includes at least one passive element, the height of the passive element is smaller than the height of the conductive pillars, and the passive element is located in an area surrounded by the conductive pillars.
The thicknesses of the functional chip and the passive element are smaller than or equal to a preset thickness.
Wherein the first package further comprises: the base comprises a groove extending towards one side of the second packaging body, a plurality of pins are arranged in the base, one ends of the pins are exposed out of the groove, the other ends of the pins are exposed out of one side of the base facing the second packaging body, and the exposed positions of the pins correspond to the positions of the conductive columns and are electrically connected with the conductive columns; the gas-sensitive chip is positioned in the groove and is electrically connected with the region of the pin exposed from the groove; and the cover plate is provided with a through hole and covers one side surface of the base, which is far away from the second packaging body.
Wherein, still include: and the removable protective film covers one side of the cover plate away from the base.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a method for manufacturing a gas sensor, including: stacking a first packaging body containing a gas-sensitive chip and a second packaging body containing a functional chip and a packaging substrate, and electrically connecting the gas-sensitive chip and the packaging substrate; the functional chip is located on the bearing surface of the packaging substrate and electrically connected with the packaging substrate.
Wherein, first encapsulation body still includes a plurality of electrically conductive posts and plastic-sealed layer, will include the first encapsulation body of gas-sensitive chip and the range upon range of setting of the second encapsulation body that contains functional chip and packaging substrate, preceding, include: arranging the functional chip and a plurality of conductive columns in each packaging unit on the bearing surface of the packaging substrate, wherein the conductive columns are electrically connected with the packaging substrate and the height of the conductive columns is greater than that of the functional chip; and forming a plastic packaging layer on one side of the bearing surface of the packaging substrate, wherein the plastic packaging layer is flush with the conductive column.
Wherein, set up in every encapsulation unit on the loading face of packaging substrate functional chip and a plurality of electrically conductive post, preceding, include: and thinning the thickness of the functional chip to enable the thickness of the functional chip to be smaller than or equal to the preset thickness.
Wherein, first encapsulation body still includes base and apron, will contain the first encapsulation body of gas-sensitive chip and contain the second encapsulation body range upon range of setting of functional chip and packaging substrate, preceding, include: the gas-sensitive chip is arranged in a groove of the base, and the gas-sensitive chip is electrically connected with a pin in the base; a cover plate with a through hole is arranged above the groove; one end of the pin in the base is exposed out of the groove, and the other end of the pin is exposed out of the outer surface of the base below the bottom of the groove; the stacking arrangement of the first packaging body containing the gas sensitive chip and the second packaging body containing the functional chip and the packaging substrate comprises: and arranging the base towards the plurality of conductive columns, and enabling pins of the base to be electrically connected with the conductive columns at corresponding positions.
Being different from the prior art situation, the beneficial effect of this application is: the gas-sensitive chip is independently packaged in the first packaging body, the functional chip and the packaging substrate are arranged in the second packaging body, and the gas-sensitive chip can be electrically connected with the packaging substrate in the second packaging body. The design mode can greatly reduce the transverse size of the whole gas sensor, and improve the integration level of the gas sensor; and because the gas-sensitive chip is independently packaged, the probability that the gas-sensitive chip is influenced by other components in the packaging process is reduced, the probability that the gas-sensitive chip is polluted is reduced, and the reliability of the gas-sensitive sensor is greatly improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic diagram of the structure of an embodiment of the gas sensor of the present application;
FIG. 2 is a schematic flow chart illustrating one embodiment of a method for making a gas sensor according to the present application;
FIG. 3 is a schematic flow chart illustrating an embodiment of a method for manufacturing the gas sensor before step S101 in FIG. 2;
FIG. 4a is a schematic structural diagram of an embodiment corresponding to step S201 in FIG. 3;
FIG. 4b is a schematic structural diagram of an embodiment corresponding to step S202 in FIG. 3;
FIG. 5 is a schematic flow chart illustrating another embodiment of a method for manufacturing the gas sensor before step S101 in FIG. 2;
FIG. 6a is a schematic structural diagram of an embodiment corresponding to step S301 in FIG. 5;
FIG. 6b is a schematic structural diagram of an embodiment corresponding to step S302 in FIG. 5;
fig. 7 is a schematic structural diagram of an embodiment corresponding to step S101 in fig. 2.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a gas sensor according to the present application. The gas sensor is a sensitive device capable of sensing a certain gas and the concentration thereof in the environment, and can convert the information related to the type and the concentration of the gas into an electric signal, and the related information of the existence condition of the gas to be detected in the environment can be obtained according to the strength of the electric signal.
Specifically, the gas sensor may include a first package 10 and a second package 12. Wherein, the gas sensitive chip 100 is disposed in the first package 10. The gas sensitive chip 100 may have any one of the prior art, for example, the gas sensitive chip 100 includes a silicon-based micro-hotplate, two heating electrodes, two measuring electrodes and a gas sensitive material, one end of the upper surface of the silicon-based micro-hotplate is provided with the two heating electrodes, the other end of the upper surface of the silicon-based micro-hotplate is provided with the two measuring electrodes, the middle area of the upper surface of the silicon-based micro-hotplate is provided with the gas sensitive material, an isolation groove is arranged between the heating electrodes and the measuring electrodes, and both the measuring electrodes and the heating electrodes can be led. The second package 12 is stacked on one side of the first package 10, and includes a package substrate 120 and a functional chip 122 located on the carrying surface 1200 of the package substrate 120, and the gas sensitive chip 100 and the functional chip 122 are electrically connected to the package substrate 120 respectively. In this embodiment, a circuit is disposed inside the package substrate 120, and a plurality of pads electrically connected to the circuit inside the package substrate are disposed on the carrying surface 1200, and the functional chip 122 can be flip-chip mounted on the carrying surface 1200 and electrically connected to the pads at corresponding positions. The number of the functional chips 122 in the second package 12 may be at least one, and the type of the functional chips 122 may be other types of chips than the gas sensor chip 100, for example, an application specific integrated circuit ASIC chip, etc., and this design manner may enable the final gas sensor to have more functions and applications. The manner in which the gas sensing chip 100 is electrically connected to the package substrate 120 will be described in detail later.
The design mode can greatly reduce the transverse size of the whole gas sensor, and improve the integration level of the gas sensor; and because the gas sensitive chip 100 is independently packaged in the first packaging body 10, the probability that the gas sensitive chip 100 is influenced by other components in the packaging process is reduced, the probability that the gas sensitive chip 100 is polluted is reduced, and the reliability of the gas sensor is greatly improved.
In one embodiment, as shown in fig. 1, the second package body 12 includes a plurality of conductive pillars 124 and a molding layer 126 in addition to the functional chip 122 and the package substrate 120. The conductive pillars 124 are located on the carrying surface 1200 and electrically connected to the package substrate 120, and the height of the conductive pillars is greater than that of the functional chip 122; the conductive post 124 may be a cylinder, a prism, etc., and may be made of various conductive metals or alloys such as copper, gold, aluminum, etc. The molding compound layer 126 covers one side of the carrying surface 1200 of the package substrate 120 and is flush with the conductive pillars 124. Since the height of the conductive pillars 124 is greater than that of the functional chip 122, when the molding layer 126 is flush with the conductive pillars 124, the surface of the conductive pillars 124 away from the package substrate 120 can be exposed from the molding layer 126, and the functional chip 122 is still located in the molding layer 126, so that the molding layer 126 protects the functional chip 122. Further, the gas sensitive chip 100 in the first package 10 can be electrically connected to the surface of the conductive pillar 124 exposed from the molding layer 126. In addition, in the present embodiment, some pins in the functional chip 122 can also be electrically connected to part of the conductive pillars 124 through the circuit in the package substrate 120, and further electrically connected to the gas sensitive chip 100 through the conductive pillars 124.
In addition, the second package 12 in the above embodiment further includes at least one passive element 128, where the passive element 128 may be a resistor, a capacitor, or the like, and the passive element 128 may cooperate with the functional chip 122 to implement some functions. The height of the passive element 128 is also smaller than the height of the conductive pillars 124, and the passive element 128 is located in an area surrounded by the conductive pillars 124, that is, the conductive pillars 124 may be located at an edge position of the second package body 12. The above design can make the molding layer 126 function as a protection for the passive component 128.
In an application scenario, the thicknesses of the functional chip 122 and the passive element 128 are less than or equal to a predetermined thickness, and the predetermined thickness may be 100 micrometers, 150 micrometers, 200 micrometers, or the like; for example, when the predetermined thickness is 100 micrometers, the thickness of the functional chip 122 and the passive element 128 may be 80 micrometers, and the like. The design mode is favorable for reducing the thickness of the second packaging body 12 and improving the integration level of the gas sensor.
In addition, the surface of the package substrate 120 of the second package body 12 facing away from the functional chip 122 may also be provided with a pad, through which the second package body 12 may be electrically connected to other circuits, for example, a circuit board, etc.
On the first package 10 side, the first package 10 may include, in addition to the gas sensitive chip 100: a base 102 and a cover plate 104 having a through-hole 1040. The base 102 includes a groove 1020 extending toward one side of the second package 12, and a plurality of pins 106 are disposed in the base 102, one end of each pin 106 is exposed from the groove 1020, the other end of each pin 106 is exposed from the base 102 toward one side of the second package 12, and the exposed position corresponds to and is electrically connected to the position of the conductive pillar 124; the gas sensor chip 100 is located in the groove 1020 and electrically connected to the region where the leads 106 are exposed from the groove 1020. The main material of the base 102 may be metal or ceramic, and the material design may make the base 102 have no material volatilization under the high condition, so as to reduce the influence of the base 102 itself on the gas sensitive chip 100. When the base 102 is made of metal, the base and the leads 106 may be electrically insulated from each other by a design method similar to a frame design method, such as a gap design method. The cover plate 104 covers a surface of the base 102 away from the second package body 12; and gas in the external environment can enter the groove 1020 through the through hole 1040 on the cover plate 104 to contact the gas sensitive chip 100. The cover plate 104 may be made of metal, which is beneficial for heat dissipation. Through the design of the base 102 and the cover plate 104, the gas sensitive chip 100 can be packaged and protected, and the probability of damage of the gas sensitive chip can be reduced.
In one application scenario, the gas sensitive chip 100 can be electrically connected to the leads 106 at corresponding positions by wire bonding. For the convenience of wire bonding, as shown in fig. 1, a step portion (not labeled) is disposed in the groove 1020 in fig. 1, and a surface of the step portion away from the second package 12 is higher than a surface of the gas sensitive chip 100 away from the second package 12, and a predetermined interval d is provided therebetween. The preset spacing d may be 10 microns or the like.
In another application scenario, in order to reduce the possibility of contamination of the gas sensor during transportation, the gas sensor may further include a removable protective film (not shown) covering a surface of the cover plate 104 away from the base 102, the protective film may be made of plastic or the like, and may be fixed to an edge of the cover plate 104 by an adhesive layer such as a double-sided adhesive tape.
The gas sensor provided above is further explained below in view of the manufacturing method. Referring to fig. 1 and fig. 2 together, fig. 2 is a schematic flow chart illustrating a manufacturing method of a gas sensor according to an embodiment of the present invention, the manufacturing method includes:
s101: stacking a first package 10 containing a gas sensitive chip 100 and a second package 12 containing a functional chip 122 and a package substrate 120, and electrically connecting the gas sensitive chip 100 and the package substrate 120; the functional chip 122 is located on the carrying surface 1200 of the package substrate 120 and electrically connected to the package substrate 120.
In one embodiment, the step S101 further includes: a second package 12 is provided, the second package 12 may further include a plurality of conductive pillars and a molding layer in addition to the functional chip 122 and the package substrate 120, please refer to fig. 3, and fig. 3 is a flowchart illustrating an embodiment of a method for manufacturing the gas sensor before step S101 in fig. 2. The specific process of providing the second package 12 before the step S101 may include:
s201: a functional chip 122 and a plurality of conductive pillars 124 are disposed in each package unit a on the carrying surface 1200 of the package substrate 120, wherein the conductive pillars 124 are electrically connected to the package substrate 120 and have a height greater than that of the functional chip 122.
Specifically, referring to fig. 4a, fig. 4a is a schematic structural diagram of an embodiment corresponding to step S201 in fig. 3. In this embodiment, the number of the package units a on the package substrate 120 may be 1 or more. In addition, in the step S201, at least one passive device 128 may be disposed in each package unit a on the carrying surface 1200 of the package substrate 120. The conductive pillars 124, the functional chip 122 and the passive component 128 may be mounted on the package substrate 120. Of course, in other embodiments, the conductive pillars 124 may be disposed on the package substrate 120 in other manners, for example, a photoresist layer having an opening may be formed on the package substrate 120, and then the conductive pillars 124 are formed in the opening of the photoresist layer by electroplating, and finally the photoresist layer is removed.
In addition, in order to reduce the thickness of the whole gas sensor, before the functional chip 122 is mounted, the thickness of the functional chip 122 needs to be reduced to be less than or equal to a predetermined thickness, and the predetermined thickness may be 100 micrometers, 150 micrometers, 200 micrometers, and the like. The specific implementation process can be as follows: the wafer containing the functional chips 122 is thinned to a suitable thickness and then cut into individual functional chips 122.
S202: the molding compound 126 is formed on one side of the carrying surface 1200 of the package substrate 120, and the molding compound 126 is flush with the conductive pillars 124.
Specifically, please refer to fig. 4b, wherein fig. 4b is a schematic structural diagram of an embodiment corresponding to step S202 in fig. 3. The process for forming the plastic package layer 126 may be a wafer plastic package process, an injection molding plastic package process, a compression molding plastic package process, or other plastic package processes. In addition, when the molding layer 126 is formed, the height of the molding layer 126 may be higher than that of the conductive pillars 124, and then the molding layer 126 may be flush with the conductive pillars 124 by a grinding method, so that the conductive pillars 124 are exposed from the molding layer 126.
In addition, in order to reduce the damage to the second package device 12 during the grinding process, a removable protective film may be further disposed on the side of the package substrate 120 away from the molding layer 126, and after the grinding process is completed, the protective film is removed.
In another embodiment, the step S101 further includes: the first package 10 is provided, and the order of providing the first package 10 and providing the second package 12 is not limited in the present application. Referring to fig. 5, the first package 10 may further include a base 102 and a cover 104 in addition to the gas sensitive chip 100, and fig. 5 is a schematic flow chart of another embodiment of the method for manufacturing the gas sensor before step S101 in fig. 2. The specific process of providing the first package 10 before the step S101 may include:
s301: the gas chip 100 is disposed in the groove 1020 of the base 102, and the gas chip 100 is electrically connected to the pins 106 in the base 102.
Specifically, referring to fig. 6a, fig. 6a is a schematic structural diagram of an embodiment corresponding to step S301 in fig. 5. One end of the pin 106 in the base 102 is exposed from the groove 1020, and the other end of the pin 106 is exposed from the outer surface of the base 102 below the bottom of the groove 1020; the gas sensor chip 100 can be electrically connected to the end of the lead 106 exposed from the groove 1020 by wire bonding. An adhesive layer may be disposed between the non-functional surface of the gas sensor chip 100 and the base 102 to fix the position of the gas sensor chip 100.
S302: a cover plate 104 having vias 1040 is disposed over the grooves 1020.
Specifically, please refer to fig. 6b, wherein fig. 6b is a schematic structural diagram of an embodiment corresponding to step S302 in fig. 5. The cover plate 104 may cover only one side surface of the base 102 provided with the groove 1020; in other embodiments, the cover plate 104 may further cover the outer side of the base 102.
In addition, in order to reduce the probability of contamination of the gas sensitive chip 100 during the bonding process between the first package 10 and the second package 12, the side of the cover plate 104 away from the base 102 may be provided with a removable protective film.
Further, referring to fig. 7, fig. 7 is a schematic structural diagram of an embodiment corresponding to step S101 in fig. 2. The step S101 specifically includes: the base 102 is disposed toward the plurality of conductive pillars 124, and the pins 106 of the base 102 are electrically connected with the conductive pillars 124 at corresponding positions. The specific pin 106 and the conductive post 124 may be electrically connected by solder or the like.
Further, as shown in fig. 7, when a plurality of package units a are disposed on the package substrate 120, after the step S101, the method may further include: the molding layer 126 and the package substrate 120 between the adjacent package units a are cut off to obtain a gas sensor including a single first package 10.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.
Claims (10)
1. A gas sensor, comprising:
a first package including a gas sensitive chip;
the second packaging body is stacked on one side of the first packaging body and comprises a packaging substrate and a functional chip located on the bearing surface of the packaging substrate, and the gas-sensitive chip and the functional chip are electrically connected with the packaging substrate respectively.
2. The gas sensor of claim 1, wherein the second package further comprises:
the conductive posts are positioned on the bearing surface, are electrically connected with the packaging substrate and are higher than the functional chip;
the plastic packaging layer covers one side of the bearing surface of the packaging substrate and is flush with the conductive columns in height;
and the gas-sensitive chip is electrically connected with the surface of the conductive post exposed from the plastic packaging layer.
3. The gas sensor of claim 2,
the second package body further comprises at least one passive element, the height of the passive element is smaller than that of the conductive posts, and the passive element is located in an area surrounded by the conductive posts.
4. The gas sensor of claim 3,
the thicknesses of the functional chip and the passive element are less than or equal to a preset thickness.
5. The gas sensor of claim 2, wherein the first package further comprises:
the base comprises a groove extending towards one side of the second packaging body, a plurality of pins are arranged in the base, one ends of the pins are exposed out of the groove, the other ends of the pins are exposed out of one side of the base facing the second packaging body, and the exposed positions of the pins correspond to the positions of the conductive columns and are electrically connected with the conductive columns; the gas-sensitive chip is positioned in the groove and is electrically connected with the region of the pin exposed from the groove;
and the cover plate is provided with a through hole and covers one side surface of the base, which is far away from the second packaging body.
6. The gas sensor of claim 5, further comprising:
and the removable protective film covers one side of the cover plate away from the base.
7. A method of making a gas sensor, comprising:
stacking a first packaging body containing a gas-sensitive chip and a second packaging body containing a functional chip and a packaging substrate, and electrically connecting the gas-sensitive chip and the packaging substrate; the functional chip is located on the bearing surface of the packaging substrate and electrically connected with the packaging substrate.
8. The method for manufacturing a gas sensor according to claim 7, wherein the second package further comprises a plurality of conductive pillars and a molding layer, and the step of stacking the first package including the gas sensitive chip and the second package including the functional chip and the package substrate comprises:
arranging the functional chip and a plurality of conductive columns in each packaging unit on the bearing surface of the packaging substrate, wherein the conductive columns are electrically connected with the packaging substrate and the height of the conductive columns is greater than that of the functional chip;
and forming a plastic packaging layer on one side of the bearing surface of the packaging substrate, wherein the plastic packaging layer is flush with the conductive column.
9. The method according to claim 8, wherein the disposing the functional chip and the plurality of conductive pillars in each package unit on the carrying surface of the package substrate comprises:
and thinning the thickness of the functional chip to enable the thickness of the functional chip to be smaller than or equal to the preset thickness.
10. The method according to claim 8,
the first package further includes a base and a lid, and the first package including the gas-sensitive chip and the second package including the functional chip and the package substrate are stacked, and before that, include: the gas-sensitive chip is arranged in a groove of the base, and the gas-sensitive chip is electrically connected with a pin in the base; a cover plate with a through hole is arranged above the groove; one end of the pin in the base is exposed out of the groove, and the other end of the pin is exposed out of the outer surface of the base below the bottom of the groove;
the stacking arrangement of the first packaging body containing the gas sensitive chip and the second packaging body containing the functional chip and the packaging substrate comprises: and arranging the base towards the plurality of conductive columns, and enabling pins of the base to be electrically connected with the conductive columns at corresponding positions.
Priority Applications (1)
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| CN202010561989.9A CN111732069A (en) | 2020-06-18 | 2020-06-18 | Gas sensor and preparation method thereof |
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| CN202010561989.9A CN111732069A (en) | 2020-06-18 | 2020-06-18 | Gas sensor and preparation method thereof |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012230071A (en) * | 2011-04-27 | 2012-11-22 | Murata Mfg Co Ltd | Hydrogen gas sensor |
| US20140184263A1 (en) * | 2012-12-27 | 2014-07-03 | Robert Bosch Gmbh | Sensor system and cover device for a sensor system |
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2020
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| JP2012230071A (en) * | 2011-04-27 | 2012-11-22 | Murata Mfg Co Ltd | Hydrogen gas sensor |
| US20140184263A1 (en) * | 2012-12-27 | 2014-07-03 | Robert Bosch Gmbh | Sensor system and cover device for a sensor system |
| US20160047774A1 (en) * | 2014-08-18 | 2016-02-18 | Stmicroelectronics Pte Ltd | Compact microelectronic integrated gas sensor |
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| CN110400780A (en) * | 2019-07-23 | 2019-11-01 | 杭州晶通科技有限公司 | A kind of fan-out-type stack package structure and preparation method thereof using metallic conduction post |
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