CN111725097A - Laser packaging device - Google Patents

Laser packaging device Download PDF

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Publication number
CN111725097A
CN111725097A CN202010502068.5A CN202010502068A CN111725097A CN 111725097 A CN111725097 A CN 111725097A CN 202010502068 A CN202010502068 A CN 202010502068A CN 111725097 A CN111725097 A CN 111725097A
Authority
CN
China
Prior art keywords
energy
area
reflecting
reflective
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010502068.5A
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Chinese (zh)
Inventor
张亮
李金川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202010502068.5A priority Critical patent/CN111725097A/en
Priority to PCT/CN2020/100178 priority patent/WO2021243791A1/en
Publication of CN111725097A publication Critical patent/CN111725097A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67115Apparatus for thermal treatment mainly by radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings

Abstract

The invention provides a laser packaging device, which comprises a machine table, a laser packaging device and a packaging device, wherein the machine table is used for bearing a substrate; a light source; the mask plate comprises a masking part and a hollow part, and light emitted by the light source passes through the hollow part and irradiates the packaging area of the substrate; in the direction far away from the light source, the cover part converges towards the hollow part to form a reflecting part; when light emitted by the light source passes through the hollow part, energy directly incident to the packaging area is high energy, energy incident to the reflecting surface of the reflecting part is low energy, the low energy is reflected to the edge area of the packaging area through the reflecting surface and is superposed with the energy directly incident to the edge area of the packaging area, so that the energy difference between the energy of the edge area of the packaging area and the energy of the central area is reduced, namely the energy in the whole packaging area tends to be uniformly distributed, the energy difference between the central area and the edge area of the packaging area is compensated, and the technical problem of uneven energy irradiation of the packaging area is solved.

Description

Laser packaging device
Technical Field
The invention relates to the technical field of packaging, in particular to a laser packaging device.
Background
Traditional packaging hardware is as shown in fig. 1, including board 10, light source 20, mask plate 30, base plate 100 has been placed on board 10, the laser 200 that light source 20 sent, shine the encapsulation district 101 of base plate 100 through mask plate 30, make the glass of encapsulation district 101 glue 102 and melt, reach the effect of encapsulation, because laser energy is gaussian distribution, central energy is great, marginal energy is lower, when central region energy is suitable, marginal energy is not enough, glass glues the not enough melting encapsulation, and when marginal energy is suitable, central region energy is too big, glass glues and can burn out.
Therefore, the prior art has the technical problem of uneven irradiation energy of the packaging area.
Disclosure of Invention
The invention provides a laser packaging device, which is used for relieving the technical problem of uneven energy irradiation of the conventional packaging area.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the present invention provides a laser packaging apparatus, including:
the machine table is used for bearing a substrate;
a light source;
the mask plate comprises a masking part and a hollow part, and light emitted by the light source passes through the hollow part and irradiates the packaging area of the substrate;
and in the direction far away from the light source, the cover part converges towards the hollow part to form a reflecting part.
In the laser packaging device of the present invention, the cover portion is an integrally molded structure.
In the laser package device of the present invention, the reflection surface of the reflection portion is a tapered surface and has a straight cross section.
In the laser package device of the present invention, the reflection surface of the reflection portion is a tapered surface and has a curved cross section.
In the laser packaging device of the present invention, the mask portion includes a glass plate, a heat dissipation film, and a reflection film, and the reflection portion is formed by the reflection film.
In the laser packaging device of the present invention, the material of the reflecting portion is the same as the material of the reflecting film.
In the laser packaging device of the present invention, the mask portion includes a glass plate, a heat dissipation film, and a reflection film, and the reflection portion is formed by the heat dissipation film.
In the laser package device of the present invention, the reflecting portion is made of the same material as the heat dissipating film, and a reflecting material is added to the reflecting surface of the reflecting portion.
In the laser packaging device of the present invention, the mask portion includes a glass plate, a heat dissipation film, and a reflection film, and the reflection portion is formed by the glass plate.
In the laser package device of the present invention, the reflecting portion is made of the same material as the glass plate, and the reflecting surface of the reflecting portion is made of a reflecting material.
The invention has the beneficial effects that: the invention provides a laser packaging device, which comprises a machine table, a laser packaging device and a packaging device, wherein the machine table is used for bearing a substrate; a light source; the mask plate comprises a masking part and a hollow part, and light emitted by the light source passes through the hollow part and irradiates the packaging area of the substrate; in the direction far away from the light source, the cover part converges towards the hollow part to form a reflecting part; when light emitted by the light source passes through the hollow part, energy directly incident to the packaging area is high energy, energy incident to the reflecting surface of the reflecting part is low energy, the low energy is reflected to the edge area of the packaging area through the reflecting surface and is superposed with the energy directly incident to the edge area of the packaging area, so that the energy difference between the energy of the edge area of the packaging area and the energy of the central area is reduced, namely the energy in the whole packaging area tends to be uniformly distributed, the energy difference between the central area and the edge area of the packaging area is compensated, and the technical problem of uneven energy irradiation of the packaging area is solved.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a conventional package;
fig. 2 is a schematic structural diagram of a laser packaging apparatus according to an embodiment of the present invention;
fig. 3 is a schematic view of a first structure of a mask plate of a laser packaging apparatus according to an embodiment of the present invention;
fig. 4 is a schematic light ray diagram of a laser packaging apparatus according to an embodiment of the present invention;
fig. 5 is a second structural schematic diagram of a mask plate of the laser packaging device according to the embodiment of the present invention;
fig. 6 is a schematic diagram of a third structure of a mask plate of the laser packaging device according to the embodiment of the present invention;
fig. 7 is a schematic diagram of a fourth structure of a mask plate of the laser packaging device according to the embodiment of the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
The invention provides a laser packaging device, which is used for relieving the technical problem of uneven energy irradiation of the conventional packaging area.
As shown in fig. 2, which is a schematic structural diagram of a laser packaging device provided in an embodiment of the present invention, the laser packaging device includes a machine table 21, a light source 22, and a mask plate 23.
The machine table 21 is used for placing a substrate 210, the substrate 210 includes two glass plates placed up and down, a glass cement 211 is coated between the two glass plates, and an area where the glass cement 211 is located is a packaging area 2101 of the substrate 210.
The light source 22 is used for emitting a light 220, and irradiating the package region 2101 of the substrate 210 to cure the glass cement 211, in the present invention, the light 220 is a laser.
The mask 23 includes a masking portion 231 and a hollow portion 232, in a direction away from the light source 22, the masking portion 231 converges toward the hollow portion 232 to form a reflection portion 233, and the light 220 emitted by the light source 22 passes through the hollow portion 232 and reaches the packaging region 2101.
The light 220 emitted from the light source 22 partially irradiates the package region 2101 directly, and partially irradiates the reflective surface 2331 of the reflective portion 233, and then reflects the light to the edge region of the package region 2101, and overlaps with the energy of the light irradiated to the edge region of the package region 2101 directly.
The mask 23 may be a combined structure or an integrally formed structure. The following description is made specifically with reference to fig. 3 to 5.
Fig. 3 is a schematic view of a first structure of a mask plate of a laser packaging apparatus according to an embodiment of the present invention. The mask plate is of a combined structure. The mask plate comprises a cover part 31 and a hollow part 32, the cover part 31 comprises a first cover part 311 and a second cover part 312 which are oppositely arranged, a first reflection part 3111 of the first cover part 311 and a second reflection part 3121 of the second cover part 312 are symmetrically arranged, the first reflection part 3111 is provided with a first reflection surface 31111, and the second reflection part 3121 is provided with a second reflection surface 31211.
In one embodiment, the first reflection portion 3111 is the same shape as the second reflection portion 3121.
In one embodiment, the first reflective surface 31111 of the first reflective portion 3111 is planar.
In one embodiment, the first reflective surface 31111 of the first reflective portion 3111 is a curved surface.
In one embodiment, the angle between the plane and the incident direction of the light ray is more than 0 degree and less than 45 degrees. When the plane and the incident angle formed by the incident direction of the light are different, the reflected light of the incident light passing through the reflecting surface of the reflecting part and the packaging area form different position relations:
as shown in a of fig. 4, an incident angle θ formed by the incident light and the reflection surface is greater than 45 degrees, that is, the incident angle θ 1 of the incident light is smaller than 45 degrees, and at this time, the reflection angle θ 2 is also smaller than 45 degrees, and the reflected light reflects the light to a direction away from the substrate, that is, the reflected light does not intersect with the package region, which cannot satisfy the requirement of compensating for the energy difference between the central region and the edge region of the package region.
As shown in b of fig. 4, the incident angle θ formed by the incident light and the reflection surface is equal to 45 degrees, that is, the incident angle θ 1 of the incident light is 45 degrees, and the reflection angle θ 2 is also 45 degrees, that is, the reflection light is perpendicular to the light source incident surface, and the reflection light does not intersect with the package region, which cannot compensate for the energy difference between the central region and the edge region of the package region.
As shown in c in fig. 4, the incident light angle θ formed by the incident light and the reflection surface is smaller than 45 degrees, i.e. the incident angle θ 1 of the incident light is larger than 45 degrees, and at this time, the reflection angle θ 2 is also larger than 45 degrees, and the reflected light will irradiate the edge area of the package region.
Therefore, the angle of the plane with the incident direction of the light is more than 0 degree and less than 45 degrees. At this moment, because the laser energy is in gaussian distribution, that is, the central energy is larger, the edge energy is lower, when the light passes through the hollow part, the energy directly incident to the encapsulation area is high energy, the energy incident to the reflection surface of the reflection part is low energy, the low energy is reflected to the edge area of the encapsulation area through the reflection surface and is superposed with the energy directly incident to the edge area of the encapsulation area, so that the energy difference between the energy of the edge area of the encapsulation area and the energy of the central area is reduced, that is, the energy in the whole encapsulation area tends to be uniformly distributed, and the technical problem of uneven energy irradiation of the encapsulation area is solved.
Fig. 5 is a schematic view of a second structure of a mask plate of the laser packaging apparatus according to the embodiment of the present invention. The cover 231 is an integrally formed structure. The mask plate comprises a cover part 41 and a hollow part 42, and in the direction far away from the light source, the cover part 41 converges towards the hollow part 42 to form a reflecting part 43.
In one embodiment, the reflecting surface 431 of the reflecting portion 43 is a tapered surface with a straight cross section.
In one embodiment, the angle between the straight line and the incident direction of the light ray is more than 0 degree and less than 45 degrees. When the incident angle formed by the plane and the incident direction of the light is different, the reflected light of the incident light passing through the reflecting surface of the reflecting part and the packaging area form different position relations. The principle is as described above, please refer to fig. 4 specifically, and details are not repeated herein.
In one embodiment, the reflecting surface 431 of the reflecting portion 43 is a tapered surface with a curved cross section.
Fig. 6 is a schematic diagram of a third structure of a mask plate of the laser packaging apparatus according to the embodiment of the present invention. The mask plate comprises a cover part 61 and a hollow part 62, the cover part 61 converges towards the hollow part 62 in the direction far away from the light source to form a reflection part 63, the cover part 61 comprises a glass plate 611, a heat dissipation film 612 and a reflection film 613, and the reflection part 63 is formed by the reflection film 613.
In one embodiment, the reflective portion 63 is made of the same material as the reflective film 613.
In one embodiment, the reflective portion 63 is formed by the heat dissipation film 612. The reflective portion 63 is made of the same material as the heat dissipation film 612, and a reflective material is provided on the reflective surface 631 of the reflective portion 63.
In one embodiment, the reflective portion 63 is formed by the glass plate 611. The reflecting portion 63 is made of the same material as the glass plate 611, and a reflecting material is provided on a reflecting surface 631 of the reflecting portion 63.
Fig. 7 is a schematic diagram of a fourth structure of a mask plate of the laser packaging device according to the embodiment of the present invention. The mask plate comprises a masking part 71 and a hollow part 72, wherein the masking part 71 comprises a glass plate 711, a heat dissipation film 712 and a reflection film 713. In the laser package device of the present invention, the mask 71 includes a first mask 711 and a second mask 712 which are disposed opposite to each other, and the first reflection portion 7111 of the first mask 711 and the second reflection portion 7121 of the second mask 712 are disposed asymmetrically.
In one embodiment, the first reflective portion 7111 and the second reflective portion 7121 are formed of different reflective film layers. For example, the first reflective portion 7111 is formed of the heat dissipation film 712, and the second reflective portion 7121 is formed of the reflective film 711.
Of course, the structure of the mask is not limited thereto, and for example, the first reflective portion 7111 is formed by the reflective film 711 and the heat dissipation film 712 together, and the second reflective portion 7121 is formed by the heat dissipation film 712 and the glass plate 713 together.
In one embodiment, the first reflective portion 7111 is shaped differently than the second reflective portion 7121. For example, the reflecting surface of the first reflecting portion 7111 is a flat surface, and the reflecting surface of the second reflecting portion 7121 is a curved surface.
In one embodiment, the first reflective portion 7111 is a different material than the second reflective portion 7121. For example, the material of the first reflective portion 7111 is the same as the material of the heat dissipation film 712, and the material of the second reflective portion 7121 is the same as the material of the reflective film 711.
According to the above embodiments:
the embodiment of the invention provides a laser packaging device, which comprises a machine table, a first substrate, a second substrate and a first substrate, wherein the machine table is used for bearing a substrate; a light source; the mask plate comprises a masking part and a hollow part, and light emitted by the light source passes through the hollow part and irradiates the packaging area of the substrate; in the direction far away from the light source, the cover part converges towards the hollow part to form a reflecting part; when light emitted by the light source passes through the hollow part, energy directly incident to the packaging area is high energy, energy incident to the reflecting surface of the reflecting part is low energy, the low energy is reflected to the edge area of the packaging area through the reflecting surface and is superposed with the energy directly incident to the edge area of the packaging area, so that the energy difference between the energy of the edge area of the packaging area and the energy of the central area is reduced, namely the energy in the whole packaging area tends to be uniformly distributed, the energy difference between the central area and the edge area of the packaging area is compensated, and the technical problem of uneven energy irradiation of the packaging area is solved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims (10)

1. A laser packaging apparatus, comprising:
the machine table is used for bearing a substrate;
a light source;
the mask plate comprises a masking part and a hollow part, and light emitted by the light source passes through the hollow part and irradiates the packaging area of the substrate;
and in the direction far away from the light source, the cover part converges towards the hollow part to form a reflecting part.
2. The laser packaging apparatus of claim 1, wherein the mask portion is a unitary structure.
3. The laser packaging apparatus of claim 2, wherein the reflecting surface of the reflecting portion is a tapered surface having a straight cross section.
4. The laser packaging apparatus of claim 2, wherein the reflecting surface of the reflecting portion is a tapered surface having a curved cross section.
5. The laser packaging apparatus of claim 1, wherein the mask portion comprises a glass plate, a heat dissipation film, and a reflective film, the reflective portion being formed by the reflective film.
6. The laser packaging apparatus of claim 5, wherein the reflective portion material is the same as the reflective film material.
7. The laser packaging apparatus of claim 1, wherein the mask portion comprises a glass plate, a heat sink film, and a reflective film, the reflective portion being formed by the heat sink film.
8. The laser packaging apparatus of claim 7, wherein the reflective portion is made of the same material as the heat dissipation film, and a reflective material is added to a reflective surface of the reflective portion.
9. The laser packaging apparatus of claim 1, wherein the mask portion comprises a glass plate, a heat dissipation film, and a reflective film, the reflective portion being formed by the glass plate.
10. The laser packaging apparatus of claim 9, wherein the reflecting portion is made of the same material as the glass plate, and a reflecting surface of the reflecting portion is made of a reflecting material.
CN202010502068.5A 2020-06-04 2020-06-04 Laser packaging device Pending CN111725097A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010502068.5A CN111725097A (en) 2020-06-04 2020-06-04 Laser packaging device
PCT/CN2020/100178 WO2021243791A1 (en) 2020-06-04 2020-07-03 Laser packaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010502068.5A CN111725097A (en) 2020-06-04 2020-06-04 Laser packaging device

Publications (1)

Publication Number Publication Date
CN111725097A true CN111725097A (en) 2020-09-29

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Application Number Title Priority Date Filing Date
CN202010502068.5A Pending CN111725097A (en) 2020-06-04 2020-06-04 Laser packaging device

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WO (1) WO2021243791A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1761033A (en) * 2004-07-28 2006-04-19 三星电子株式会社 Mask and manufacture method thereof and make the method for thin-film transistor with it
KR20130033621A (en) * 2011-09-27 2013-04-04 주식회사 엘티에스 Apparatus for sealing frit using laser and method for sealing frit using the same
WO2015135904A1 (en) * 2014-03-12 2015-09-17 Von Ardenne Gmbh Processing assembly and method for operating a processing assembly
CN205508888U (en) * 2016-03-17 2016-08-24 京东方科技集团股份有限公司 Encapsulation equipment, display panel and display device
CN106125313A (en) * 2016-06-29 2016-11-16 昆山国显光电有限公司 The adjustment structure of bubble during reduction frit seal

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1293401C (en) * 2004-05-25 2007-01-03 长春理工大学 Hollow circular truncated cone laser optical fibre coupler
KR101244290B1 (en) * 2011-07-13 2013-03-18 주식회사 엘티에스 Apparatus for sealing frit using laser

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1761033A (en) * 2004-07-28 2006-04-19 三星电子株式会社 Mask and manufacture method thereof and make the method for thin-film transistor with it
KR20130033621A (en) * 2011-09-27 2013-04-04 주식회사 엘티에스 Apparatus for sealing frit using laser and method for sealing frit using the same
WO2015135904A1 (en) * 2014-03-12 2015-09-17 Von Ardenne Gmbh Processing assembly and method for operating a processing assembly
CN205508888U (en) * 2016-03-17 2016-08-24 京东方科技集团股份有限公司 Encapsulation equipment, display panel and display device
CN106125313A (en) * 2016-06-29 2016-11-16 昆山国显光电有限公司 The adjustment structure of bubble during reduction frit seal

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Application publication date: 20200929