CN214625084U - LED chip light-homogenizing packaging structure - Google Patents
LED chip light-homogenizing packaging structure Download PDFInfo
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- CN214625084U CN214625084U CN202121317371.4U CN202121317371U CN214625084U CN 214625084 U CN214625084 U CN 214625084U CN 202121317371 U CN202121317371 U CN 202121317371U CN 214625084 U CN214625084 U CN 214625084U
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- front reflector
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000001126 phototherapy Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 229910052709 silver Inorganic materials 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000003760 hair shine Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000001225 therapeutic effect Effects 0.000 description 1
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Abstract
The application relates to a LED chip packaging structure, especially relates to a LED chip even light packaging structure, and its technical scheme main points are: the LED packaging structure comprises a substrate, an LED chip is arranged on the substrate, a packaging adhesive layer is arranged on the surface of the substrate, a tapered front reflector is fixed on the packaging adhesive layer, the front reflector is arranged opposite to the LED chip, and the radial sectional area of the front reflector is gradually increased along the direction from the front reflector to the back reflector; the surface of the substrate is provided with a bottom reflecting layer used for reflecting the light rays reflected by the front reflector to the direction far away from the substrate; the purpose of realizing the light uniformization treatment of the light emitted by the LED chip and further optimizing the treatment effect of the phototherapy instrument is achieved.
Description
Technical Field
The application relates to an LED chip packaging structure, in particular to an LED chip light homogenizing packaging structure.
Background
The LED light source is used as a new generation of illumination product, has the characteristics of low energy consumption, power saving, long service life, small volume, quick response and the like, and is gradually utilized on phototherapy instrument products.
With the updating of the technology, the size of the iterative LED chip is smaller and higher, but at the same time, the light emitted by the LED chip is not uniformly scattered and irradiated on the skin, but rather is more intensively irradiated on the skin in a small range, which may cause the effect of the phototherapy apparatus due to the non-uniform distribution of the irradiation dose after long-term use.
SUMMERY OF THE UTILITY MODEL
In order to realize the even light treatment to the light that the LED chip sent, and then optimize the treatment of phototherapy instrument, this application provides an even light packaging structure of LED chip.
The application provides a LED chip even light packaging structure adopts following technical scheme:
a light-homogenizing packaging structure of an LED chip comprises a substrate, wherein the LED chip is arranged on the substrate, a packaging adhesive layer is arranged on the surface of the substrate, a tapered front reflector is fixed on the packaging adhesive layer, the front reflector is arranged opposite to the LED chip, and the radial sectional area of the front reflector is gradually increased along the direction from the front reflector close to the LED chip to the front reflector far away from the LED chip; the surface of the substrate is provided with a bottom reflecting layer used for reflecting the light rays reflected by the front reflector to the direction far away from the substrate.
Through adopting above-mentioned technical scheme, the light that the LED chip sent is irradiation on the positive reflector first, because the positive reflector has the tapering, and then make the light that shines on the positive reflector distribute away around to the positive reflector, the reflection light that jets into towards the base plate shines on the bottom reflection stratum, the bottom reflection stratum jets out this part light to the direction of keeping away from the base plate again, compare in the light that original LED chip sent, the light after the multiple reflection is more dispersed evenly, the photic area and the photic homogeneity of skin have been increased, the treatment of phototherapy instrument has been optimized.
Optionally, the bottom reflective layer includes a plurality of bottom mirrors uniformly distributed on the substrate, the bottom mirrors have a taper and a radial cross-sectional area of the bottom mirrors gradually increases along a direction from close to far from the substrate.
By adopting the technical scheme, the light reflected by the front reflector partially irradiates one side of the bottom reflector close to the front reflector, and then is emitted in the direction far away from the substrate under the reflection action of the bottom reflector, and the bottom reflector can enable the light reflected by the front reflector to be emitted to the surface of the skin in a relatively-gathered manner.
Optionally, the front mirror is a conical front mirror, and a cone angle of the front mirror is 90 ° to 180 °.
Optionally, the bottom reflector is a conical bottom reflector, and the cone angle of the bottom reflector is 30 ° to 180 °.
Optionally, the bottom reflective layer is a planar reflective layer covering the surface of the substrate.
Through adopting above-mentioned technical scheme, the light part that comes from the reflection of positive mirror shines on the plane reflector layer, and the plane reflector layer distributes this part light again to the direction of keeping away from the base plate away from, has increased the photic area and the photic homogeneity of skin, has optimized the treatment of phototherapy instrument.
Optionally, the bottom reflecting layer includes a planar reflecting layer covering the surface of the substrate, a plurality of bottom reflectors are uniformly distributed on the planar reflecting layer, each bottom reflector has a taper, and the radial sectional area of each bottom reflector gradually increases along a direction from the bottom reflector to the bottom reflector away from the substrate.
By adopting the technical scheme, part of light reflected from the front reflector irradiates on the plane reflecting layer, and part of light irradiates on the bottom reflector, and the part of light is reflected for many times between the plane reflecting layer and the bottom reflector and is emitted towards the direction far away from the substrate.
Optionally, a side reflective layer is arranged on the packaging adhesive layer and close to the edge of the packaging adhesive layer, and the surface of the side reflective layer close to the LED chip is gradually away from the LED chip along the reverse direction from the side close to the substrate to the side far from the substrate.
Through adopting above-mentioned technical scheme, the light that comes from the reflection of positive speculum has the part to go out and lead to losing of light to the outside reflection of base plate, and through setting up the side reflector layer, makes this part light can jet out and shine on the skin surface to the direction of keeping away from the base plate, has reduced the light intensity loss.
In conclusion, by arranging the front reflector and the bottom reflecting layer, light rays emitted by the LED chip are more uniformly irradiated on the surface of the skin in the direction away from the substrate after being reflected for multiple times, the light receiving area and the light receiving uniformity of the skin are increased, and the treatment effect of the phototherapy instrument is optimized.
Drawings
Fig. 1 is a schematic structural diagram of an LED chip dodging package structure in a first embodiment, in which a positional relationship between a skin surface and an LED chip is shown, and solid arrows in the diagram are actual reflection paths of light rays, and dotted arrows are paths of light rays without reflection;
fig. 2 is a schematic structural diagram of an LED chip dodging package structure in the second embodiment;
fig. 3 is a schematic structural diagram of an LED chip dodging package structure in the third embodiment;
fig. 4 is a schematic structural diagram of an LED chip dodging package structure in the fourth embodiment.
In the figure, 1, an LED chip; 2. a substrate; 3. a front mirror; 4. a bottom reflector; 5. a planar light reflecting layer; 6. a side reflective layer; 7. and (6) packaging the adhesive layer.
Detailed Description
The present application is described in further detail below with reference to the attached drawings.
The first embodiment is as follows:
referring to fig. 1, the present application provides an LED chip light uniformizing package structure, which includes a substrate 2, and an LED chip 1 soldered on the substrate 2 by solder paste; the substrate 2 is covered with packaging glue and forms a packaging glue layer 7 for packaging the LED chip 1, the material of the packaging glue is not limited to epoxy resin or silica gel, and the coating method of the packaging glue is not limited to dispensing by a dispenser, spraying by a glue sprayer or injection molding by a Modling machine.
In order to realize the light uniformizing effect on the light emitted by the LED chip 1, a front reflector 3 arranged opposite to the LED chip 1 is arranged inside the packaging adhesive layer 7, and the front reflector 3 is fixed on one side of the packaging adhesive layer 7, which is far away from the substrate 2; specifically, the front reflector 3 has a taper, and a radial sectional area of the front reflector 3 gradually increases along a direction from close to the LED chip 1 to far away from the LED chip, that is, the front reflector 3 may be a conical or truncated cone-shaped front reflector 3, in this embodiment, the front reflector 3 is the conical front reflector 3; the front reflector 3 is arranged by spin-coating photoresist on the surface of the packaging adhesive layer 7 far away from the substrate 2, obtaining a circular pattern on the surface of the packaging adhesive layer 7 far away from the substrate 2 through photoetching and developing, then forming a conical groove in the packaging adhesive layer 7 through a plasma etching method, polishing the groove wall of the groove, and finally evaporating a silver layer in the conical groove through a PVD ion coating technology and forming a silver mirror, namely the front reflector 3; the cone angle of the front mirror 3 is 90-180 deg., and in this embodiment the cone angle of the front mirror 3 is 90 deg..
Further, a bottom reflecting layer for reflecting light reflected by the front reflector 3 in a direction away from the substrate 2 is arranged on the substrate 2, in this embodiment, the bottom reflecting layer includes a plurality of bottom reflectors 4 uniformly distributed on the substrate 2, the bottom reflectors 4 have a taper, and a radial sectional area of the bottom reflectors 4 gradually decreases along a direction from being close to the substrate 2, that is, the bottom reflectors 4 may be conical or truncated cone-shaped front reflectors 3, in this embodiment, the bottom reflectors 4 are conical bottom reflectors 4; the setting method of the bottom reflector 4 comprises the steps of before the LED chip 1 is fixed, evaporating a silver layer with the thickness of 10-1000nm on the substrate 2 through a PVD ion coating technology, spinning photoresist on the silver layer, obtaining a plurality of preset patterns on the silver layer through a photoetching development technology, etching the silver layer through a plasma etching technology, enabling the part left by the silver layer to form a plurality of conical structures uniformly distributed on the substrate 2, and finally polishing the conical structures through an HCL solution to form conical silver mirrors, namely the bottom reflector 4; the height of the bottom mirror 4 is 10-1000nm, the cone angle of the bottom mirror 4 is 30-180 °, the distance between two adjacent bottom mirrors 4 is 1-10 μm, and the cone angle of the bottom mirror 4 is 100 ° in this embodiment.
Thus, after the light emitted by the LED chip 1 irradiates the front reflector 3, because the surface of the front reflector 3 is inclined, and further under the reflection action of the surface of the front reflector 3, the light emitted by the LED chip 1 is reflected toward the surface of the substrate 2, when the reflected light irradiates the bottom reflector 4, a part of the light is reflected toward the direction away from the substrate 2 and irradiates the skin surface, and some light may be emitted toward the direction away from the substrate 2 after being reflected for many times between two adjacent bottom reflectors 4 and irradiate the skin surface, that is, after the light emitted by the LED chip 1 passes through the multiple reflection action of the front reflector 3 and the bottom reflector 4, the light is uniformly emitted toward the side of the front reflector 3 away from the substrate 2, compared with the irradiation range of the light emitted by the LED chip 1, the front reflector 3 and the bottom reflector 4 expand the irradiation range of the light and make the original relatively concentrated light irradiate more uniformly on the front reflector 3 On the surface of the skin, the therapeutic effect of the phototherapy instrument is optimized.
Example two:
referring to fig. 2, the difference between this embodiment and the first embodiment is that the bottom reflective layer is different, the bottom reflective layer in this embodiment is a planar reflective layer 5 covering a substrate 2, and the planar reflective layer 5 is provided by spin-coating a silver layer having a thickness of 10-1000nm on the substrate 2 by PVD ion plating, obtaining a pattern having the same shape as the LED chip 1 on the silver layer by photolithography and development, etching a space for placing the LED chip 1 on the silver layer by plasma etching, and finally polishing the silver layer by HCL solution to form a flat silver mirror, i.e., the planar reflective layer 5.
Light that reflects from front reflector 3 shines on plane reflector layer 5, and plane reflector layer 5 distributes away this part of light to the direction of keeping away from base plate 2 again, compares in the irradiation range that LED chip 1 self sent light, and front reflector 3 and plane reflector layer 5 have increased the photic area and the photic homogeneity of skin, have optimized the treatment of phototherapy instrument.
Example three:
referring to fig. 3, the difference between the present embodiment and the first embodiment is that the bottom reflective layer is different, the bottom reflective layer in the present embodiment includes a planar reflective layer 5 covering a substrate 2 and a plurality of bottom reflectors 4 uniformly distributed on the planar reflective layer 5, the shape, size, and distribution of the bottom reflectors 4 in the present embodiment are the same as those of the bottom reflectors 4 in the first embodiment, and the structure of the planar reflective layer 5 in the present embodiment is the same as that of the planar reflective layer 5 in the second embodiment, which is not described herein again.
The light reflected from the front reflector 3 partially irradiates the planar reflective layer 5 and is emitted by the planar reflective layer 5 in a direction away from the substrate 2; and part of the light rays irradiate on the bottom reflecting mirror 4, one part of the light rays directly emit to the direction far away from the substrate 2 through the reflection action of the bottom reflecting mirror 4 and irradiate on the skin surface, and the other part of the light rays are reflected to the plane reflecting layer 5 through the bottom reflecting mirror 4 and emit to the direction far away from the substrate 2 after multiple reflections between the plane reflecting layer and two adjacent bottom reflecting mirrors 4.
Example four:
referring to fig. 4, the present embodiment is different from the third embodiment in that a side reflective layer 6 disposed near the edge of the encapsulating adhesive layer 7 is disposed inside the encapsulating adhesive layer 7, and the surface of the side reflective layer 6 near the LED chip 1 gradually gets away from the LED chip 1 along a direction from near to far from the substrate 2.
Light that reflects from front reflector 3 has the part to go out and cause light to lose to base plate 2 outside reflection, and side reflector layer 6 can block this part light and make these light reflect away in order to shine on the skin surface to the direction of keeping away from base plate 2, and then reduced the light intensity loss, play the effect of gathering together to the light after the reflection, further explain for when having enlarged LED chip 1 and sent light irradiation scope and realizing dodging, make this part optic fibre gather together relatively and shine skin in order to guarantee that light intensity can satisfy the effect of phototherapy.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.
Claims (7)
1. The utility model provides a LED chip even light packaging structure, includes base plate (2), and LED chip (1) sets up on base plate (2), and base plate (2) surface is provided with encapsulation glue film (7), its characterized in that: a tapered front reflector (3) is fixed on the packaging adhesive layer (7), the front reflector (3) is arranged opposite to the LED chip (1), and the radial sectional area of the front reflector (3) is gradually increased along the direction from the front reflector to the back reflector away from the LED chip (1); the surface of the substrate (2) is provided with a bottom reflecting layer for reflecting the light rays reflected by the front reflector (3) in the direction far away from the substrate (2).
2. The LED chip dodging package structure of claim 1, wherein: the bottom reflecting layer comprises a plurality of bottom reflecting mirrors (4) which are uniformly distributed on the substrate (2), the bottom reflecting mirrors (4) have conicity, and the radial sectional areas of the bottom reflecting mirrors (4) are gradually increased along the direction from the position close to the substrate (2) to the position far away from the substrate.
3. The LED chip dodging package structure of claim 1, wherein: the front reflector (3) is a conical front reflector (3), and the cone angle of the front reflector (3) is 90-180 degrees.
4. The LED chip dodging package structure of claim 2, wherein: the bottom reflector (4) is a conical bottom reflector (4), and the cone angle of the bottom reflector (4) is 30-180 degrees.
5. The LED chip dodging package structure of claim 1, wherein: the bottom reflecting layer is a plane reflecting layer (5) covered on the surface of the substrate (2).
6. The LED chip dodging package structure of claim 1, wherein: the bottom reflecting layer comprises a plane reflecting layer (5) covering the surface of the substrate (2), a plurality of bottom reflecting mirrors (4) are uniformly distributed on the plane reflecting layer (5), each bottom reflecting mirror (4) has a taper, and the radial sectional area of each bottom reflecting mirror (4) is gradually increased along the direction from the position close to the substrate (2) to the position far away from the substrate.
7. The LED chip dodging package structure of any one of claims 1 to 6, wherein: the side reflective layer (6) which is close to the edge of the packaging adhesive layer (7) is arranged on the packaging adhesive layer (7), and the surface of the side reflective layer (6) which is close to the LED chip (1) is gradually far away from the LED chip (1) along the reverse direction from the position close to the substrate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121317371.4U CN214625084U (en) | 2021-06-11 | 2021-06-11 | LED chip light-homogenizing packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121317371.4U CN214625084U (en) | 2021-06-11 | 2021-06-11 | LED chip light-homogenizing packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214625084U true CN214625084U (en) | 2021-11-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121317371.4U Active CN214625084U (en) | 2021-06-11 | 2021-06-11 | LED chip light-homogenizing packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214625084U (en) |
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2021
- 2021-06-11 CN CN202121317371.4U patent/CN214625084U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 100000 East Side of 1st Floor, Building 1, No. 3 Yuncheng Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Chuangyingguang Medical Technology Co.,Ltd. Country or region after: China Address before: 102600 east side, 1st floor, building 1, No.3 Yuncheng street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: BEIJING TRUWIN OPTOELECTRONIC MEDICAL CO.,LTD. Country or region before: China |
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| CP03 | Change of name, title or address |