CN111722686A - Cross-node in-band heat dissipation control method and device - Google Patents
Cross-node in-band heat dissipation control method and device Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 43
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Abstract
The invention discloses a cross-node in-band heat dissipation control method and a device, wherein the method comprises the following steps: sending a first instruction for acquiring temperature information of a storage node by a substrate management controller of the computing node; the host bus adapter of the computing node sends the serial connection SCSI expander chip of the storage node through a serial connection SCSI data link; the serial SCSI expander chip obtains the temperature information of the storage node and feeds the temperature information back to the substrate management controller in the original way; determining a second instruction for controlling the working strength of a fan of the storage node according to the temperature information of the storage node by the baseboard management controller, and transmitting the second instruction to the serial SCSI expander chip; and the fan complex logic programmable device which sends the second instruction to the storage node by the serial SCSI expander chip controls the working strength of the fan. The invention can reduce extra cost, avoid using extra cables, and improve working stability and autonomous control capability of the storage node.
Description
Technical Field
The present invention relates to the field of heat dissipation control, and more particularly, to a method and an apparatus for controlling in-band heat dissipation across nodes.
Background
In the development of the whole server cabinet, the scheme of matching and using the computing node and the storage node is more and more popular, and the corresponding heat dissipation pipe control method is also gradually paid attention. At present, a server generally adopts an air cooling mode for heat dissipation, and a fan regulation and control strategy is realized through a management chip so as to meet the heat dissipation requirement.
In a structure in which a computing node is collocated with a storage node, the computing node generally adopts a BMC to realize control of a fan, and heat dissipation of the storage node becomes a problem. One method is to add BMC to the storage node to realize management and control, but this will increase the cost greatly; the other method is to control the heat dissipation pipe of the storage node to be managed by the BMC of the computing node, and a mode of pulling management signals such as PWM of the BMC to the storage node or a mode of using BMC-I2C-storage node CPLD is adopted, but the method needs to add an additional management cable, and real-time heat dissipation regulation and control are difficult to realize when the BMC is hung.
Aiming at the problems of high cross-node heat dissipation control cost, more cables, low stability and poor autonomous capability in the prior art, no effective solution is available at present.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide a method and an apparatus for controlling in-band heat dissipation across nodes, which can reduce additional cost, avoid using additional cables, and improve working stability and autonomous control capability of storage nodes.
In view of the foregoing, a first aspect of the embodiments of the present invention provides a method for controlling in-band heat dissipation across nodes, including the following steps:
sending, by a baseboard management controller of a compute node, an inter-integrated circuit signal to a host bus adapter of a first instruction to obtain temperature information of a storage node;
the host bus adapter of the computing node converts the internal integrated circuit signal into an SCSI cabinet service signal and sends the SCSI cabinet service signal to the serial connection SCSI expander chip of the storage node through a serial connection SCSI data link;
analyzing a first instruction from an SCSI cabinet service signal by a serial connection SCSI expander chip, accessing a sensor of a storage node through a temporary internal integrated circuit link to obtain temperature information of the storage node, and feeding back the temperature information to a substrate management controller in an original path;
determining a second instruction for controlling the working strength of the fan of the storage node according to the temperature information of the storage node by the baseboard management controller, and transmitting the second instruction to the serial SCSI expander chip in the same manner as the first instruction;
and sending a second instruction to the fan complex logic programmable device of the storage node by the serial SCSI expander chip in the manner of an internal integrated circuit signal, so that the fan complex logic programmable device controls the working strength of the fan according to the second instruction.
In some embodiments, further comprising:
setting the working strength of the fan to be the highest strength before the fan complex logic programmable device receives the second instruction for the first time;
determining a second instruction by the serial attached SCSI expander chip according to the temperature information of the storage node in response to the serial attached SCSI expander chip not obtaining the second instruction from the baseboard management controller within a predetermined time;
and in response to the fan complex logic programmable device not obtaining the second instruction from the serial connection SCSI expander chip within the preset time, the fan complex logic programmable device sets the working strength of the fan to the highest strength.
In some embodiments, further comprising:
acquiring the rotating speed information and the in-place information of the fan by the complex logic programmable device of the fan, and storing the rotating speed information and the in-place information in a register of the complex logic programmable device of the fan;
the serial SCSI expander chip access register and/or the substrate management controller accesses the register through the serial SCSI expander chip to acquire rotating speed information and in-place information so as to monitor the working state of the fan;
the working strength of the fan is controlled by the serial SCSI expander chip and/or the baseboard management controller according to the working state of the fan and the temperature information of the storage node.
In some embodiments, further comprising:
the power module of the storage node supplies power to the fan, and the power module provides an electronic fuse for power supply protection;
and the serial SCSI expander chip acquires power consumption data of the fan from the electronic fuse through the power management bus, and caches and/or feeds back the power consumption data of the fan to the baseboard management controller so that the serial SCSI expander chip and/or the baseboard management controller acquire the power consumption information of the fan.
In some embodiments, the serial attached SCSI expander chip uses a solid state disk connected by a serial attached SCSI data bus as a cache.
A second aspect of an embodiment of the present invention provides a cross-node in-band heat dissipation control device, including:
a compute node having a baseboard management controller and a host bus adapter; and
the system comprises a storage node with a serial connection SCSI expander chip, a fan complex logic programmable device, a sensor and a fan;
the baseboard management controller, the serial SCSI expander chip and the fan complex logic programmable device are respectively stored with executable program codes, and when the program codes are operated, the following steps are executed:
sending, by a baseboard management controller of a compute node, an inter-integrated circuit signal to a host bus adapter of a first instruction to obtain temperature information of a storage node;
the host bus adapter of the computing node converts the internal integrated circuit signal into an SCSI cabinet service signal and sends the SCSI cabinet service signal to the serial connection SCSI expander chip of the storage node through a serial connection SCSI data link;
analyzing a first instruction from an SCSI cabinet service signal by a serial connection SCSI expander chip, accessing a sensor of a storage node through a temporary internal integrated circuit link to obtain temperature information of the storage node, and feeding back the temperature information to a substrate management controller in an original path;
determining a second instruction for controlling the working strength of the fan of the storage node according to the temperature information of the storage node by the baseboard management controller, and transmitting the second instruction to the serial SCSI expander chip in the same manner as the first instruction;
and sending a second instruction to the fan complex logic programmable device of the storage node by the serial SCSI expander chip in the manner of an internal integrated circuit signal, so that the fan complex logic programmable device controls the working strength of the fan according to the second instruction.
In some embodiments, the steps further comprise:
setting the working strength of the fan to be the highest strength before the fan complex logic programmable device receives the second instruction for the first time;
determining a second instruction by the serial attached SCSI expander chip according to the temperature information of the storage node in response to the serial attached SCSI expander chip not obtaining the second instruction from the baseboard management controller within a predetermined time;
and in response to the fan complex logic programmable device not obtaining the second instruction from the serial connection SCSI expander chip within the preset time, the fan complex logic programmable device sets the working strength of the fan to the highest strength.
In some embodiments, the steps further comprise:
acquiring the rotating speed information and the in-place information of the fan by the complex logic programmable device of the fan, and storing the rotating speed information and the in-place information in a register of the complex logic programmable device of the fan;
the serial SCSI expander chip access and/or the substrate management controller accesses the register through the serial SCSI expander chip to acquire the rotating speed information and the in-place information so as to monitor the working state of the fan;
the working strength of the fan is controlled by the serial SCSI expander chip and/or the baseboard management controller according to the working state of the fan and the temperature information of the storage node.
In some embodiments, the steps further comprise:
the power module of the storage node supplies power to the fan, and the power module provides an electronic fuse for power supply protection;
and the serial SCSI expander chip acquires power consumption data of the fan from the electronic fuse through the power management bus, and caches and/or feeds back the power consumption data of the fan to the baseboard management controller so that the serial SCSI expander chip and/or the baseboard management controller acquire the power consumption information of the fan.
In some embodiments, the serial attached SCSI expander chip uses a solid state disk connected by a serial attached SCSI data bus as a cache.
The invention has the following beneficial technical effects: according to the cross-node in-band heat dissipation control method and device provided by the embodiment of the invention, an internal integrated circuit signal of a first instruction for acquiring temperature information of a storage node is sent to a host bus adapter through a substrate management controller of a computing node; the host bus adapter of the computing node converts the internal integrated circuit signal into an SCSI cabinet service signal and sends the SCSI cabinet service signal to the serial connection SCSI expander chip of the storage node through a serial connection SCSI data link; analyzing a first instruction from an SCSI cabinet service signal by a serial connection SCSI expander chip, accessing a sensor of a storage node through a temporary internal integrated circuit link to obtain temperature information of the storage node, and feeding back the temperature information to a substrate management controller in an original path; determining a second instruction for controlling the working strength of the fan of the storage node according to the temperature information of the storage node by the baseboard management controller, and transmitting the second instruction to the serial SCSI expander chip in the same manner as the first instruction; the serial SCSI expander chip sends the second instruction to the fan complex logic programmable device of the storage node in the manner of the internal integrated circuit signal, so that the fan complex logic programmable device controls the working strength of the fan according to the second instruction, the additional cost can be reduced, the use of additional cables can be avoided, and the working stability and the autonomous control capability of the storage node can be improved.
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In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a cross-node in-band heat dissipation control method provided in the present invention;
fig. 2 is a schematic structural diagram of the cross-node in-band heat dissipation control device provided in the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In view of the foregoing, a first aspect of the embodiments of the present invention provides an embodiment of a method for controlling in-band heat dissipation across nodes, which can reduce additional cost, avoid using additional cables, and improve operational stability and autonomous control capability of storage nodes. Fig. 1 is a schematic flow chart of a cross-node in-band heat dissipation control method provided by the present invention.
The method for controlling the in-band heat dissipation of the cross-node, as shown in fig. 1, includes the following steps:
step S101: sending, by a baseboard management controller of a compute node, an inter-integrated circuit signal to a host bus adapter of a first instruction to obtain temperature information of a storage node;
step S103: the host bus adapter of the computing node converts the internal integrated circuit signal into an SCSI cabinet service signal and sends the SCSI cabinet service signal to the serial connection SCSI expander chip of the storage node through a serial connection SCSI data link;
step S105: analyzing a first instruction from an SCSI cabinet service signal by a serial connection SCSI expander chip, accessing a sensor of a storage node through a temporary internal integrated circuit link to obtain temperature information of the storage node, and feeding back the temperature information to a substrate management controller in an original path;
step S107: determining a second instruction for controlling the working strength of the fan of the storage node according to the temperature information of the storage node by the baseboard management controller, and transmitting the second instruction to the serial SCSI expander chip in the same manner as the first instruction;
step S109: and sending a second instruction to the fan complex logic programmable device of the storage node by the serial SCSI expander chip in the manner of an internal integrated circuit signal, so that the fan complex logic programmable device controls the working strength of the fan according to the second instruction.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by a computer program to instruct relevant hardware to perform the processes, and the processes can be stored in a computer readable storage medium, and when executed, the processes can include the processes of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), a Random Access Memory (RAM), or the like. Embodiments of the computer program may achieve the same or similar effects as any of the preceding method embodiments to which it corresponds.
In some embodiments, the method further comprises: setting the working strength of the fan to be the highest strength before the fan complex logic programmable device receives the second instruction for the first time;
determining a second instruction by the serial attached SCSI expander chip according to the temperature information of the storage node in response to the serial attached SCSI expander chip not obtaining the second instruction from the baseboard management controller within a predetermined time;
and in response to the fan complex logic programmable device not obtaining the second instruction from the serial connection SCSI expander chip within the preset time, the fan complex logic programmable device sets the working strength of the fan to the highest strength.
In some embodiments, the method further comprises: acquiring the rotating speed information and the in-place information of the fan by the complex logic programmable device of the fan, and storing the rotating speed information and the in-place information in a register of the complex logic programmable device of the fan;
the serial SCSI expander chip access register and/or the substrate management controller accesses the register through the serial SCSI expander chip to acquire rotating speed information and in-place information so as to monitor the working state of the fan;
the working strength of the fan is controlled by the serial SCSI expander chip and/or the baseboard management controller according to the working state of the fan and the temperature information of the storage node.
In some embodiments, the method further comprises: the power module of the storage node supplies power to the fan, and the power module provides an electronic fuse for power supply protection;
and the serial SCSI expander chip acquires power consumption data of the fan from the electronic fuse through the power management bus, and caches and/or feeds back the power consumption data of the fan to the baseboard management controller so that the serial SCSI expander chip and/or the baseboard management controller acquire the power consumption information of the fan.
In some embodiments, the serial attached SCSI expander chip uses a solid state disk connected by a serial attached SCSI data bus as a cache.
The method disclosed according to an embodiment of the present invention may also be implemented as a computer program executed by a CPU, which may be stored in a computer-readable storage medium. The computer program, when executed by the CPU, performs the above-described functions defined in the method disclosed in the embodiments of the present invention. The above-described method steps and system elements may also be implemented using a controller and a computer-readable storage medium for storing a computer program for causing the controller to implement the functions of the above-described steps or elements.
The following further illustrates embodiments of the invention in accordance with the specific example shown in fig. 2.
Under the initial condition, the CPLD is controlled by the storage node fan to control the full-speed rotation of the fan;
when a computing node BMC (baseboard management controller) is normal, an instruction for acquiring temperature information of a storage node is sent out through an I2C (internal integrated circuit), an HBA (host bus adapter) card supports MCTP over I2C, the BMC I2C management information is converted into an SES (SCSI cabinet service signal) command in an SAS (serial connection SCSI data) signal by the HBA card and is sent to a storage node SAS _ Expander chip through an SAS data link, the SAS _ Expander chip can realize analysis and data processing of SSP, SMP and SES command protocols in the SAS signal, the Expander analyzes the BMC management instruction in the SES protocol, the Expander chip supports multi-path I2C output, temperature information of sensors in the storage node is acquired through a Temp _ I2C link, and is converted into the SES command protocol and is fed back to the BMC through a high-speed link.
The SAS-Expander chip in the storage node can realize expansion of SAS signals and can also support multi-channel I2C output as an I2CMaster, the Expander chip can analyze SES command management instructions in an SAS data link, collect temperature information, fan state information and power consumption information of the storage node through I2C, send fan control information to a CPLD (complex programmable logic device) of a fan board of the storage node, and convert data collected through I2C into SES commands to be transmitted to an HBA card through the data link.
The HBA card of the computing node needs to support MCTP over I2C, interacts with the BMC through I2C, converts a management instruction of the BMC into the next SES command in an SAS protocol, and differentiates and converts a BMC control instruction and a storage node state instruction stored in different elements of the cabinet so as to complete the function of transmitting the management instruction to an SAS-Expander chip of the storage node or receiving state information sent by the Expander through an SAS high-speed data link.
The BMC sends a fan control command (mainly PWM (pulse width modulation) duty ratio) through the I2C according to the heat dissipation requirement of the storage node, the fan control command is analyzed into a fan control I2C by the Expander chip after being converted by the HBA card and is sent to the CPLD, and the fan control CPLD generates a PWM signal to realize the regulation and control of the rotating speed of the fan. The CPLD receives a TACH (rotating speed) signal and an on-position signal sent by the fan, and stores the rotating speed information and the on-position information in a register for the BMC or Expander chip to acquire through I2C, so that the monitoring of the state of the fan is realized.
The BMC of the calculation node is the highest control level of fan control, the storage node temperature information transmitted by the Expander through a data link is acquired from the HBA card through I2C, fan control information (PWM duty ratio information) is sent, the state information (fan in-place information and fan rotating speed information) of the fan is received, the fan state is judged by combining the TACH signal and the PWM signal, and a lighting instruction of a fan state lamp is given.
The fan board CPLD is mainly responsible for generating a fan control signal and acquiring state information, outputs a PWM signal to control the rotating speed of the fan according to received PWM duty ratio information and fan state lamp lighting information in I2C sent by the Expander, lights the state lamp corresponding to the fan, and stores the rotating speed information of the fan in a register by receiving a TACH signal sent by the fan, wherein the rotating speed information can be captured by the Expander through I2C.
The fan power supply is generated by a storage node power module, the power supply protection is realized through the Efuse, and the Expander chip can acquire the fan power consumption information through the PMBUS and return the information to the BMC through the SES protocol.
The interaction of management information of the BMC and the Expander chip is realized through the mode of out-of-band in-band conversion of the BMC-I2C-HBA-SAS (mainly through SES command protocol) -Expander, and by setting a response time threshold, when the SES command state information sent by the Expander does not obtain the response of the BMC for a long time or the Expander chip cannot detect the effective control instruction of the BMC in the received SES command protocol, the Expander chip judges that the BMC works abnormally, takes over the fan management work of the BMC, automatically realizes the fan regulation and control according to the temperature of the storage node, and realizes the autonomous heat dissipation management of the storage node. When the fan control I2C received by the fan control CPLD is hung up, the CPLD directly controls the full-speed rotation or high-speed rotation of the fan to prevent over-temperature, and the fan control I2 is used as a third-level fan control guarantee.
When the state information sent by the Expander is not responded by the BMC for a long time or the Expander chip cannot detect an effective control instruction of the BMC in the received SES command protocol, the Expander can switch the analog switch, and the Expander chip takes over fan control work of the BMC, wherein the fan control information is sent through the monitored temperature information of each Sensor in the case through I2C to regulate and control the rotating speed of the fan, the monitoring of the state of the fan and the like are used as second-level control, and the autonomous management of the storage node is realized. When the CPLD detects that the I2C sent by the Expander is hung, the CPLD takes over the fan to control the work, and controls the full-speed or high-speed operation of the fan so as to meet the heat dissipation requirement of the node and prevent the over-temperature problem.
As can be seen from the foregoing embodiments, in the cross-node in-band heat dissipation control method provided in the embodiments of the present invention, an inter-integrated circuit signal of a first instruction for acquiring temperature information of a storage node is sent to a host bus adapter by a baseboard management controller of a compute node; the host bus adapter of the computing node converts the internal integrated circuit signal into an SCSI cabinet service signal and sends the SCSI cabinet service signal to the serial connection SCSI expander chip of the storage node through a serial connection SCSI data link; analyzing a first instruction from an SCSI cabinet service signal by a serial connection SCSI expander chip, accessing a sensor of a storage node through a temporary internal integrated circuit link to obtain temperature information of the storage node, and feeding back the temperature information to a substrate management controller in an original path; determining a second instruction for controlling the working strength of the fan of the storage node according to the temperature information of the storage node by the baseboard management controller, and transmitting the second instruction to the serial SCSI expander chip in the same manner as the first instruction; the serial SCSI expander chip sends the second instruction to the fan complex logic programmable device of the storage node in the manner of the internal integrated circuit signal, so that the fan complex logic programmable device controls the working strength of the fan according to the second instruction, the additional cost can be reduced, the use of additional cables can be avoided, and the working stability and the autonomous control capability of the storage node can be improved.
It should be particularly noted that, the steps in the embodiments of the cross-node in-band heat dissipation control method described above may be mutually intersected, replaced, added, and deleted, and therefore, the cross-node in-band heat dissipation control method implemented by these reasonable permutation and combination transformations shall also fall within the scope of the present invention, and shall not limit the scope of the present invention to the described embodiments.
In view of the above, a second aspect of the embodiments of the present invention provides an embodiment of a cross-node in-band heat dissipation control device that can reduce additional cost, avoid using additional cables, and improve operational stability and autonomous control capability of storage nodes. The in-band heat dissipation controlling means of cross node includes:
a compute node having a baseboard management controller and a host bus adapter; and
the system comprises a storage node with a serial connection SCSI expander chip, a fan complex logic programmable device, a sensor and a fan;
the baseboard management controller, the serial SCSI expander chip and the fan complex logic programmable device are respectively stored with executable program codes, and when the program codes are operated, the following steps are executed:
sending, by a baseboard management controller of a compute node, an inter-integrated circuit signal to a host bus adapter of a first instruction to obtain temperature information of a storage node;
the host bus adapter of the computing node converts the internal integrated circuit signal into an SCSI cabinet service signal and sends the SCSI cabinet service signal to the serial connection SCSI expander chip of the storage node through a serial connection SCSI data link;
analyzing a first instruction from an SCSI cabinet service signal by a serial connection SCSI expander chip, accessing a sensor of a storage node through a temporary internal integrated circuit link to obtain temperature information of the storage node, and feeding back the temperature information to a substrate management controller in an original path;
determining a second instruction for controlling the working strength of the fan of the storage node according to the temperature information of the storage node by the baseboard management controller, and transmitting the second instruction to the serial SCSI expander chip in the same manner as the first instruction;
and sending a second instruction to the fan complex logic programmable device of the storage node by the serial SCSI expander chip in the manner of an internal integrated circuit signal, so that the fan complex logic programmable device controls the working strength of the fan according to the second instruction.
In some embodiments, the steps further comprise: setting the working strength of the fan to be the highest strength before the fan complex logic programmable device receives the second instruction for the first time;
determining a second instruction by the serial attached SCSI expander chip according to the temperature information of the storage node in response to the serial attached SCSI expander chip not obtaining the second instruction from the baseboard management controller within a predetermined time;
and in response to the fan complex logic programmable device not obtaining the second instruction from the serial connection SCSI expander chip within the preset time, the fan complex logic programmable device sets the working strength of the fan to the highest strength.
In some embodiments, the steps further comprise: acquiring the rotating speed information and the in-place information of the fan by the complex logic programmable device of the fan, and storing the rotating speed information and the in-place information in a register of the complex logic programmable device of the fan;
the serial SCSI expander chip access and/or the substrate management controller accesses the register through the serial SCSI expander chip to acquire the rotating speed information and the in-place information so as to monitor the working state of the fan;
the working strength of the fan is controlled by the serial SCSI expander chip and/or the baseboard management controller according to the working state of the fan and the temperature information of the storage node.
In some embodiments, the steps further comprise: the power module of the storage node supplies power to the fan, and the power module provides an electronic fuse for power supply protection;
and the serial SCSI expander chip acquires power consumption data of the fan from the electronic fuse through the power management bus, and caches and/or feeds back the power consumption data of the fan to the baseboard management controller so that the serial SCSI expander chip and/or the baseboard management controller acquire the power consumption information of the fan.
In some embodiments, the serial attached SCSI expander chip uses a solid state disk connected by a serial attached SCSI data bus as a cache.
As can be seen from the foregoing embodiments, in the cross-node in-band heat dissipation control apparatus provided in the embodiments of the present invention, an inter-integrated circuit signal of a first instruction for acquiring temperature information of a storage node is sent to a host bus adapter by a baseboard management controller of a compute node; the host bus adapter of the computing node converts the internal integrated circuit signal into an SCSI cabinet service signal and sends the SCSI cabinet service signal to the serial connection SCSI expander chip of the storage node through a serial connection SCSI data link; analyzing a first instruction from an SCSI cabinet service signal by a serial connection SCSI expander chip, accessing a sensor of a storage node through a temporary internal integrated circuit link to obtain temperature information of the storage node, and feeding back the temperature information to a substrate management controller in an original path; determining a second instruction for controlling the working strength of the fan of the storage node according to the temperature information of the storage node by the baseboard management controller, and transmitting the second instruction to the serial SCSI expander chip in the same manner as the first instruction; the serial SCSI expander chip sends the second instruction to the fan complex logic programmable device of the storage node in the manner of the internal integrated circuit signal, so that the fan complex logic programmable device controls the working strength of the fan according to the second instruction, the additional cost can be reduced, the use of additional cables can be avoided, and the working stability and the autonomous control capability of the storage node can be improved.
It should be particularly noted that, the above embodiments of the in-band heat dissipation control device for a cross node use the embodiments of the in-band heat dissipation control method for a cross node to specifically describe the working process of each module, and those skilled in the art can easily think that these modules are applied to other embodiments of the in-band heat dissipation control method for a cross node. Of course, since the steps in the cross-node in-band heat dissipation control method embodiment may be mutually intersected, replaced, added, or deleted, these reasonably arranged, combined and transformed cross-node in-band heat dissipation control devices also belong to the scope of the present invention, and the scope of the present invention should not be limited to the embodiments.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items. The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, where the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (10)
1. A cross-node in-band heat dissipation control method is characterized by comprising the following steps:
sending, by a baseboard management controller of a compute node, an inter-integrated circuit signal to a host bus adapter of a first instruction to obtain temperature information of a storage node;
the host bus adapter of the computing node converts the internal integrated circuit signal into an SCSI cabinet service signal and sends the SCSI cabinet service signal to a serial SCSI expander chip of a storage node through a serial SCSI data link;
analyzing the first instruction from the SCSI cabinet service signal by the serial SCSI expander chip, accessing the sensor of the storage node through a temporary internal integrated circuit link to obtain the temperature information of the storage node, and feeding back the temperature information to the substrate management controller in the original way;
determining, by the baseboard management controller, a second instruction for controlling the operating strength of a fan of the storage node according to the temperature information of the storage node, and transmitting the second instruction to the serial attached SCSI expander chip in the same manner as the first instruction;
and sending the second instruction to the fan complex logic programmable device of the storage node by the serial SCSI expander chip in an internal integrated circuit signal mode, so that the fan complex logic programmable device controls the working strength of the fan according to the second instruction.
2. The method of claim 1, further comprising:
setting, by the fan complex logic programmable device, an operating intensity of the fan to a highest intensity before the second instruction is received for the first time;
determining, by the serial attached SCSI expander chip, the second instruction from the storage node temperature information in response to the serial attached SCSI expander chip not obtaining the second instruction from the baseboard management controller within a predetermined time;
setting, by the fan complex logic programmable device, an operating strength of the fan to a highest strength in response to the fan complex logic programmable device not obtaining the second instruction from the serial attached SCSI expander chip within a predetermined time.
3. The method of claim 2, further comprising:
acquiring the rotating speed information and the in-place information of the fan by the fan complex logic programmable device, and storing the rotating speed information and the in-place information in a register of the fan complex logic programmable device;
the serial SCSI expander chip accesses the register and/or the baseboard management controller accesses the register through the serial SCSI expander chip to acquire the rotating speed information and the in-place information so as to monitor the working state of the fan;
and controlling the working strength of the fan by the serial SCSI expander chip and/or the baseboard management controller according to the working state of the fan and the temperature information of the storage node.
4. The method of claim 2, further comprising:
the power module of the storage node supplies power to the fan, and the power module provides an electronic fuse for power supply protection;
and acquiring power consumption data of the fan from the electronic fuse through a power management bus by the serial SCSI expander chip, and caching and/or feeding back the power consumption data of the fan to the baseboard management controller so that the serial SCSI expander chip and/or the baseboard management controller obtain the power consumption information of the fan.
5. The method of claim 4, wherein the serial attached SCSI expander chip uses a solid state disk connected via a serial attached SCSI data bus as a cache.
6. A cross-node in-band heat dissipation control device, comprising:
a compute node having a baseboard management controller and a host bus adapter; and
the system comprises a storage node with a serial connection SCSI expander chip, a fan complex logic programmable device, a sensor and a fan;
wherein the baseboard management controller, the serial SCSI expander chip, and the fan complex logic programmable device each store executable program codes, and when the program codes are executed, the following steps are executed:
sending, by a baseboard management controller of a compute node, an inter-integrated circuit signal to a host bus adapter of a first instruction to obtain temperature information of a storage node;
the host bus adapter of the computing node converts the internal integrated circuit signal into an SCSI cabinet service signal and sends the SCSI cabinet service signal to a serial SCSI expander chip of a storage node through a serial SCSI data link;
analyzing the first instruction from the SCSI cabinet service signal by the serial SCSI expander chip, accessing the sensor of the storage node through a temporary internal integrated circuit link to obtain the temperature information of the storage node, and feeding back the temperature information to the substrate management controller in the original way;
determining, by the baseboard management controller, a second instruction for controlling the operating strength of a fan of the storage node according to the temperature information of the storage node, and transmitting the second instruction to the serial attached SCSI expander chip in the same manner as the first instruction;
and sending the second instruction to the fan complex logic programmable device of the storage node by the serial SCSI expander chip in an internal integrated circuit signal mode, so that the fan complex logic programmable device controls the working strength of the fan according to the second instruction.
7. The apparatus of claim 6, wherein the steps further comprise:
setting, by the fan complex logic programmable device, an operating intensity of the fan to a highest intensity before the second instruction is received for the first time;
determining, by the serial attached SCSI expander chip, the second instruction from the storage node temperature information in response to the serial attached SCSI expander chip not obtaining the second instruction from the baseboard management controller within a predetermined time;
setting, by the fan complex logic programmable device, an operating strength of the fan to a highest strength in response to the fan complex logic programmable device not obtaining the second instruction from the serial attached SCSI expander chip within a predetermined time.
8. The apparatus of claim 7, wherein the steps further comprise:
acquiring the rotating speed information and the in-place information of the fan by the fan complex logic programmable device, and storing the rotating speed information and the in-place information in a register of the fan complex logic programmable device;
accessing the register by the serial SCSI expander chip and/or the substrate management controller through the serial SCSI expander chip to acquire the rotating speed information and the in-place information so as to monitor the working state of the fan;
and controlling the working strength of the fan by the serial SCSI expander chip and/or the baseboard management controller according to the working state of the fan and the temperature information of the storage node.
9. The apparatus of claim 7, wherein the steps further comprise:
the power module of the storage node supplies power to the fan, and the power module provides an electronic fuse for power supply protection;
and the serial SCSI expander chip acquires power consumption data of the fan from the electronic fuse through a power management bus, and caches and/or feeds back the power consumption data of the fan to the baseboard management controller so that the serial SCSI expander chip and/or the baseboard management controller acquire the power consumption information of the fan.
10. The apparatus of claim 9, wherein the serial attached SCSI expander chip uses solid state disks attached via a serial attached SCSI data bus as a cache.
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