CN111716235A - Heating-assisted chemical mechanical composite abrasive flow polishing device and method - Google Patents
Heating-assisted chemical mechanical composite abrasive flow polishing device and method Download PDFInfo
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- CN111716235A CN111716235A CN202010566904.6A CN202010566904A CN111716235A CN 111716235 A CN111716235 A CN 111716235A CN 202010566904 A CN202010566904 A CN 202010566904A CN 111716235 A CN111716235 A CN 111716235A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/006—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor for grinding the interior surfaces of hollow workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
- B24B31/14—Abrading-bodies specially designed for tumbling apparatus, e.g. abrading-balls
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a heating-assisted chemical mechanical composite abrasive flow polishing device and a method, which comprises a hydraulic system, a temperature measurement and feedback control system, a heating system, an oxidant injection system, an oxidant discharge system, an abrasive, an upper abrasive cylinder, a lower abrasive cylinder, an upper piston, a lower piston and a clamp, wherein the temperature measurement and feedback control system is connected with the heating system through a pipeline; the fixture is connected with an upper abrasive cylinder and a lower abrasive cylinder, an upper piston and a lower piston are respectively arranged in the upper abrasive cylinder and the lower abrasive cylinder, the upper piston and the lower piston are respectively connected with a hydraulic system and can reciprocate under the action of the hydraulic system, and the abrasive is arranged in the upper abrasive cylinder and/or the lower abrasive cylinder; the polishing reaction area is arranged in the clamping area of the clamp, and the temperature measuring and feedback control system can control the heating temperature of the heating system to the polishing reaction area; the oxidant injection system and the oxidant discharge system are capable of injecting and discharging the oxidant to and from the upper and lower abrasive cylinders, respectively. The invention adopts a mode of combining mechanical polishing with chemical polishing and then heating for assistance, thereby improving the efficiency and quality of polishing.
Description
Technical Field
The invention relates to the technical field of ultra-precision machining, in particular to a heating-assisted chemical-mechanical composite abrasive flow polishing device and method.
Background
Abrasive Flow Machining (AFM) is suitable for polishing surfaces with complex shapes, but the basic material removal principle is Abrasive wear, and the adopted Abrasive Flow is a mixture of a fluid carrier and Abrasive grains, so that the polishing efficiency of hard and superhard materials is low. Taking the diamond film with the highest hardness as an example, the traditional abrasive flow processing is almost difficult to polish the intrinsic micron diamond film with high purity, the grain refinement can improve the initial surface finish of the diamond film, reduce the surface hardness and improve the polishing efficiency to a certain extent, but the effect is limited.
With the development of Hot Filament Chemical Vapor Deposition (HFCVD) technology, the preparation and application of diamond films with complex shapes (such as diamond film coated complex-shaped tools and special-shaped dies) are becoming more common, and in order to realize the surface polishing process, a new type of composite abrasive flow polishing method and device needs to be developed on the basis of abrasive flow processing.
Patent publication CN1069859C, "abrasive flow machining and polishing device", describes a classical abrasive flow machining and polishing device comprising a hydraulically driven, reciprocating piston and a pressing medium chamber which receives a viscoelastic dispersion of abrasive and presses it unidirectionally through an interior surface of a workpiece having an internal passage to abrade the surface, and further comprising clamping means, a collector, a pressing medium chamber inlet, and the like. Patent publication CN101602182A, "an abrasive flow machining machine", describes a machine tool that can realize automatic control of the stroke of a cylinder in the abrasive flow machining machine tool and self-positioning and clamping functions of a part under machining. The abrasive flow machining machine tool in the patent document is characterized in that the extending strokes of the upper material pushing cylinder and the lower material pushing cylinder are limited through a material cylinder limiting device consisting of a locking nut, a stroke limiting nut, an upper gland, a sealing ring, a compression nut, a pressure spring, a conical block, a stroke switch and a switch bracket. The mechanism is simple, the structure is compact, and the reliability is high. The spherical surface restraining is adopted between the spherical surface pressing sleeve and the discharging cylinder during self-positioning clamping, so that a workpiece can deflect along with the deflection of a pressing beam in the clamping process, the workpiece is guaranteed to be effectively clamped, a gap between the workpiece and the discharging cylinder is eliminated, the abrasive material overflow is avoided, the processing effect is guaranteed, the device is suitable for surface processing or polishing of conventional materials with complex shapes, but the processing force is very small when the device is applied to hard and superhard materials, the processing efficiency is extremely low, and the application requirement cannot be met.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a heating auxiliary chemical mechanical composite abrasive flow polishing device and a method.
According to one aspect of the invention, a heating-assisted chemical mechanical composite abrasive flow polishing device is provided, which comprises a hydraulic system, a temperature measurement and feedback control system, a heating system, an oxidant injection system, an oxidant discharge system, an abrasive, an upper abrasive cylinder, a lower abrasive cylinder, an upper piston, a lower piston and a clamp;
the clamp can clamp a workpiece to be polished, the upper end of the clamp is connected with an upper abrasive cylinder, the lower end of the clamp is connected with a lower abrasive cylinder, an upper piston is arranged in the upper abrasive cylinder, a lower piston is arranged in the lower abrasive cylinder, the upper piston and the lower piston are respectively connected with a hydraulic system and can reciprocate under the action of the hydraulic system, and the abrasive is arranged in the upper abrasive cylinder and/or the lower abrasive cylinder;
the clamp clamping area is a polishing reaction area, the heating system can heat the polishing reaction area, the temperature measurement and feedback control system is connected with the heating system, and the temperature measurement and feedback control system can measure and control the temperature of the polishing reaction area;
the oxidant injection system can inject an oxidant into the upper abrasive cylinder and the lower abrasive cylinder, and the oxidant discharge system can discharge the oxidant in the upper abrasive cylinder and the lower abrasive cylinder.
Preferably, the heating system is integrated in any one or more of the following:
-a workpiece to be polished;
-a clamp;
-an upper grinding cylinder;
-a lower milling cylinder.
Preferably, the temperature measurement and feedback control system comprises a measurement module and a control module, and the control module is connected with the measurement module and the heating system;
the measuring module can measure the temperature of the polishing reaction zone in real time and feed the temperature back to the control module, and the control module can control the heating system to work according to the set temperature and the temperature information fed back by the measuring module so as to keep the temperature of the polishing reaction zone at the set temperature.
Preferably, the upper grinding cylinder, the lower grinding cylinder, the upper piston, the lower piston and the surface of the clamp, which is in contact with the grinding material, are made of oxidation-resistant materials.
Preferably, watertight connections are respectively arranged between the upper grinding cylinder and the clamp, between the lower grinding cylinder and the clamp, between the upper piston and the upper grinding cylinder, and between the lower piston and the lower grinding cylinder.
Preferably, the abrasive is selected from a material having a viscosity in the range of-Pa · s.
Preferably, the oxidant injection system is connected with the upper abrasive cylinder and/or the lower abrasive cylinder through a one-way valve, and the oxidant injection system is in watertight connection with the upper abrasive cylinder and/or the lower abrasive cylinder;
the oxidant injection system also includes a flow meter capable of metering the volume of oxidant added to the upper and/or lower abrasive cylinders.
Preferably, the oxidant discharge system is connected with the upper abrasive cylinder and/or the lower abrasive cylinder through a one-way valve, and the oxidant discharge system is in watertight connection with the upper abrasive cylinder and/or the lower abrasive cylinder.
In accordance with another aspect of the present invention, there is provided a heat assisted chemical mechanical composite abrasive flow polishing method comprising the steps of:
the method comprises the following steps: moving the upper grinding cylinder upwards to lift the upper grinding cylinder, and injecting the grinding materials into the lower grinding cylinder;
step two: clamping and fixing a workpiece to be polished by a clamp, placing the clamp for clamping the workpiece to be polished on a lower grinding cylinder, and then controlling an upper grinding cylinder to move downwards to compress the clamp;
step three: setting a heating temperature and heating the polishing reaction zone through a heating system;
step four: after the polishing reaction zone is heated to a set temperature, setting the pressure of an upper abrasive cylinder and the pressure of a lower abrasive cylinder through a hydraulic system, and setting the reciprocating times of an upper piston and a lower piston, namely the preset processing times;
step five: injecting an oxidant into the upper abrasive cylinder through an oxidant injection system, wherein the oxidant can cover the surface to be processed of the workpiece to be polished, starting the hydraulic system, and starting the upper piston and the lower piston to reciprocate to process;
step six: after the upper piston and the lower piston move for a set number of times, the upper piston is pushed to move downwards, the abrasive is pressed into the lower abrasive cylinder, and then an oxidant is injected into the upper abrasive cylinder through an oxidant injection system to continue processing;
step seven: repeating the step six until the upper piston and the lower piston reciprocate to process for a preset number of times to finish processing;
step eight: and after finishing processing, moving the upper grinding cylinder upwards, taking the polished workpiece to be polished off the clamp, taking the grinding material out of the lower grinding cylinder, and discharging the oxidizing agent from the oxidizing agent discharge system.
Preferably, the polishing is carried out by using the heating-assisted chemical mechanical composite abrasive flow polishing device.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, mechanical polishing is combined with chemical polishing, and then a heating auxiliary mode is adopted, aiming at the surface with a complex shape prepared by hard and superhard materials easy to oxidize, an oxidant is introduced in the abrasive flow polishing process, the polishing temperature is raised to the temperature easy to generate oxidation reaction through a heating device, and the polishing efficiency and quality are improved through the combination and mutual promotion of chemical action and mechanical action.
2. The polishing device is simple in structure and convenient to operate, and can be suitable for polishing workpieces made of different materials by changing the types of the grinding materials and the oxidizing agents.
3. The method is suitable for polishing the surface of hard or superhard materials with complex shapes, takes micron-sized diamond film materials as an example, the reduction rate of the surface roughness of the material can be improved by more than two times, and the surface graphitization phenomenon caused by polishing can be effectively avoided.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural view of a heat assisted chemical mechanical composite abrasive flow polishing apparatus according to the present invention.
FIG. 2 is a flow chart of a method of heat assisted chemical mechanical composite abrasive flow polishing in accordance with the present invention.
The figures show that:
Upper grinding material cylinder 8 of temperature measurement and feedback control system 2
Lower grinding cylinder 9 of heating system 3
Lower piston 11 of oxidant exhaust system 5
Clamp 12 for workpiece 6 to be polished
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
According to the invention, as shown in fig. 1, the heating-assisted chemical mechanical composite abrasive flow polishing device provided by the invention comprises a hydraulic system 1, a temperature measurement and feedback control system 2, a heating system 3, an oxidant injection system 4, an oxidant discharge system 5, an abrasive 7, an upper abrasive cylinder 8, a lower abrasive cylinder 9, an upper piston 10, a lower piston 11 and a clamp 12; the polishing device comprises a clamp 12, an upper grinding cylinder 8, a lower grinding cylinder 9, an upper piston 10, a lower piston 11, a hydraulic system 1 and an abrasive 7, wherein the clamp 12 can clamp a workpiece 6 to be polished, the upper end of the clamp 12 is connected with the upper grinding cylinder 8, the lower end of the clamp 12 is connected with the lower grinding cylinder 9, the upper piston 10 is arranged in the upper grinding cylinder 8, the lower piston 11 is arranged in the lower grinding cylinder 9, the upper piston 10 and the lower piston 11 are respectively connected with the hydraulic system 1 and can reciprocate under the action of the hydraulic system 1, and the abrasive 7 is arranged in the; the polishing reaction area is arranged in the clamping area of the clamp 12, the heating system 3 can heat the polishing reaction area, the temperature measurement and feedback control system 2 is connected with the heating system 3, and the temperature measurement and feedback control system 2 can measure and control the temperature of the polishing reaction area; the oxidant injection system 4 can inject oxidant into the upper abrasive cylinder 8 and the lower abrasive cylinder 9, and the oxidant discharge system 5 can discharge the oxidant in the upper abrasive cylinder 8 and the lower abrasive cylinder 9. The chemical polishing effect is provided by injecting an oxidant, the hydraulic system drives the upper piston, the lower piston and the abrasive to reciprocate so as to provide a mechanical polishing effect, the temperature required by chemical reaction is provided by temperature measurement, feedback control and a heating system, and the chemical polishing device is suitable for polishing the surface of hard or superhard material with a complex shape and has higher polishing efficiency and quality.
The heating system 3 is integrated in any one or more of the following:
a workpiece 6 to be polished;
-a clamp 12;
an upper abrasive cylinder 8;
a lower grinding cylinder 9.
The temperature measurement and feedback control system 2 comprises a measurement module and a control module, and the control module is connected with the measurement module and the heating system 3; the measuring module can measure the temperature of the polishing reaction zone in real time and feed the temperature back to the control module, and the control module can control the heating system 3 to work according to the set temperature and the temperature information fed back by the measuring module so as to keep the temperature of the polishing reaction zone at the set temperature. The heating system 3 can heat the surface of the workpiece 6 to be polished to a set temperature, preferably the set temperature is 30-150 ℃; the temperature measurement and feedback control system can maintain the surface temperature of the workpiece to be polished at a set temperature.
The surfaces of the upper grinding material cylinder 8, the lower grinding material cylinder 9, the upper piston 10, the lower piston 11 and the clamp 12, which are in contact with the grinding material 7, are made of anti-oxidation materials, namely all the contact areas with the grinding material 7 are made of anti-oxidation materials. The upper grinding cylinder 8 and the clamp 12, the lower grinding cylinder 9 and the clamp 12, the upper piston 10 and the upper grinding cylinder 8, and the lower piston 11 and the lower grinding cylinder 9 are all in watertight connection. The material with the viscosity of the grinding material 7 in the range of 1-1000000 Pa.s is selected, namely, the viscosity of the grinding material 7 is controlled in the range of 1-1000000 Pa.s at the preset temperature. The hydraulic system 1 can provide pressure (0-50MPa) required by reciprocating motion of an upper piston, a lower piston and the grinding material.
Preferably, the upper and lower abrasive cylinders 8 and 9 each include a transverse baffle plate, and the transverse baffle plate can move along the radial direction of the upper and lower abrasive cylinders 8 and 9, so as to change the contact area of the abrasive 7 in the upper or lower abrasive cylinder 8 or 9 and the workpiece 6 to be polished, and is suitable for polishing workpieces 6 to be polished with different shapes. The jig 12 has various models, and different jigs 12 are selected according to the shape of the workpiece 6 to be polished.
The oxidant injection system 4 is connected with the upper abrasive cylinder 8 and/or the lower abrasive cylinder 9 through a one-way valve, and the oxidant injection system 4 is in watertight connection with the upper abrasive cylinder 8 and/or the lower abrasive cylinder 9; the oxidant injection system 4 further comprises a flow meter capable of metering the volume of oxidant added to the upper and/or lower abrasive cylinders 8, 9. The oxidant discharge system 5 is connected with the upper abrasive cylinder 8 and/or the lower abrasive cylinder 9 through a one-way valve, and the oxidant discharge system 5 is in watertight connection with the upper abrasive cylinder 8 and/or the lower abrasive cylinder 9. The opening and closing of the oxidant inlet and the oxidant outlet can be controlled according to requirements, the inlet is controlled by a one-way valve, the injection flow can be controlled, and the injection flow is preferably controlled to be 0.01-100 mL/s. In the polishing process, the oxidant inlet and outlet are kept closed, and the polishing pad has good watertight property.
According to the present invention, a method for polishing a cmp pad with a heat assisted cmp flow is provided, as shown in fig. 2, comprising the steps of:
the method comprises the following steps: moving the upper grinding cylinder 8 upwards to lift the upper grinding cylinder, and injecting the grinding material 7 into the lower grinding cylinder 9; preferably, the mass of the abrasive 7 is 1-10 kg;
step two: clamping and fixing the workpiece 6 to be polished through a clamp 12, placing the clamp 12 for clamping the workpiece 6 to be polished on a lower grinding cylinder 9, and then controlling an upper grinding cylinder 8 to move downwards to compress the clamp 12; selecting different types of clamps according to the shape and size of the workpiece 6 to be polished;
step three: setting a heating temperature and heating the polishing reaction zone through a heating system 3;
step four: after the polishing reaction zone is heated to a set temperature, the pressure intensity of an upper abrasive cylinder 8 and a lower abrasive cylinder 9 is set through a hydraulic system 1, and the times of reciprocating motion of an upper piston 10 and a lower piston 11, namely the preset times of processing, are set;
step five: injecting an oxidant into the upper abrasive cylinder 8 through the oxidant injection system 4, wherein the oxidant covers the surface to be machined of the workpiece 6 to be polished, starting the hydraulic system 1, and enabling the upper piston 10 and the lower piston 11 to reciprocate to start machining;
step six: after the upper piston 10 and the lower piston 11 move for a set number of times, the upper piston 10 is pushed to move downwards, the abrasive 7 is pressed into the lower abrasive cylinder 9, and then the oxidant is injected into the upper abrasive cylinder 8 through the oxidant injection system 4 to continue processing;
step seven: repeating the step six until the upper piston 10 and the lower piston 11 reciprocate to process for a preset number of times to finish processing; preferably, the flow rate of oxidant injection is controlled to be 0.01-100mL/s, and the volume of oxidant added each time is controlled to be 0.01-100 mL;
step eight: after the processing is finished, the upper grinding cylinder 8 is moved upwards, the workpiece 6 to be polished after the polishing is finished is taken down from the clamp 12, the grinding material 7 is taken out from the lower grinding cylinder 9, and the oxidant is discharged from the oxidant discharge system 5; if the abrasive 7 still exists in the upper abrasive cylinder 8 after the processing is finished, the upper piston 10 is pushed to move downwards, the abrasive 7 is pressed into the lower abrasive cylinder 9, and then the upper abrasive cylinder 8 moves upwards.
Preferably, the polishing is carried out by using the heating-assisted chemical mechanical composite abrasive flow polishing device.
While the basic embodiment of the present application has been described above, the present application will be described in more detail with reference to preferred embodiments and/or variations of the basic embodiment.
Example 1
The workpiece in the embodiment is provided with a through hole with the diameter of 2mm, the substrate of the workpiece is made of silicon carbide ceramics, an intrinsic micrometer diamond film with the thickness of 20 mu m is deposited on the surface of the inner hole, and the initial surface roughness of the film is Ra～450nm。
The workpiece is fixed by adopting a simple clamp, the clamp and the workpiece are heated by induction, and the temperature is controlled to be 50-60 ℃.
The grinding material with the viscosity of 5000-10000 Pa & s in the temperature range is adopted, and the grinding material flows through the through hole of the workpiece.
The pressure of the upper and lower grinding cylinder is 15MPa, the total reciprocating times of the grinding material is 100 times, the operation is carried out according to the sequence shown in figure 2, and the oxidizing agent is added after each reciprocating 10 times.
The surface roughness of the film after polishing is Ra～110nm，The surface roughness of the film after polishing by the same traditional abrasive flow processing equipment and parameters is Ra～300nm。
Example 2
In this embodiment, the workpiece is a wire-drawing die with a diameter of 4mm in the sizing region, the substrate of the workpiece is made of hard alloy, an intrinsic micrometer diamond film with a thickness of 30 μm is deposited on the surface of an inner hole, and the initial surface roughness of the film is Ra～410nm。
The special fixture is adopted to fix the workpiece, a resistance wire heating system is integrated in the fixture, and the surface temperature of the workpiece is controlled to be 55-60 ℃.
The abrasive material with the viscosity of 10000-15000 Pa & s in the temperature range is adopted, and the abrasive material flows through the workpiece hole.
The pressure of the upper and lower grinding cylinder is 17MPa, the total reciprocating times of the grinding material is 120 times, the operation is carried out according to the sequence shown in figure 2, and the oxidizing agent is added after each 8 times of reciprocating.
The surface roughness of the film after polishing is RaAbout 90nm, and the surface roughness of the polished film is R by adopting the same traditional abrasive flow processing equipment and parametersa～320nm。
Example 3
The workpiece in this example is a spiral milling cutter with a handle diameter and a blade diameter of 8mm, the milling cutter base is made of hard alloy, an intrinsic nano-diamond film with a thickness of 10 μm is deposited on the surface, and the initial surface roughness of the film is Ra～170nm。
A special fixture is adopted to fix a workpiece, a resistance wire heating system is integrated in the fixture, and the surface temperature of the workpiece is controlled to be 65-70 ℃.
The abrasive material with viscosity of 10000-15000 Pa & s in the temperature range is adopted, and the abrasive material flows through the pores formed on the surfaces of the clamp and the cutter.
The pressure of the upper and lower grinding cylinder is 15MPa, the total reciprocating times of the grinding material is 150 times, the operation is carried out according to the sequence shown in figure 2, and the oxidizing agent is added after every 15 times of reciprocating.
The surface roughness of the film after polishing is Ra80nm, polished film surface using the same conventional abrasive flow processing equipment and parametersRoughness Ra～135nm。
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. A heating-assisted chemical mechanical composite abrasive flow polishing device is characterized by comprising a hydraulic system (1), a temperature measurement and feedback control system (2), a heating system (3), an oxidant injection system (4), an oxidant discharge system (5), an abrasive (7), an upper abrasive cylinder (8), a lower abrasive cylinder (9), an upper piston (10), a lower piston (11) and a clamp (12);
the polishing machine comprises a clamp (12), an upper grinding cylinder (8), a lower grinding cylinder (9), an upper piston (10), a lower piston (11), a hydraulic system (1), an abrasive (7) and a polishing head, wherein the clamp (12) can clamp a workpiece (6) to be polished, the upper end of the clamp (12) is connected with the upper grinding cylinder (8), the lower end of the clamp (12) is connected with the lower grinding cylinder (9), the upper piston (10) is arranged in the upper grinding cylinder (8), the lower piston (11) is arranged in the lower grinding cylinder (9), the upper piston (10) and the lower piston (11) are respectively connected with the hydraulic system (1) and can reciprocate under the action of the hydraulic system (1), and;
the polishing reaction area is arranged in the clamping area of the clamp (12), the heating system (3) can heat the polishing reaction area, the temperature measurement and feedback control system (2) is connected with the heating system (3), and the temperature measurement and feedback control system (2) can measure and control the temperature of the polishing reaction area;
the oxidant injection system (4) can inject oxidant into the upper abrasive cylinder (8) and the lower abrasive cylinder (9), and the oxidant discharge system (5) can discharge the oxidant in the upper abrasive cylinder (8) and the lower abrasive cylinder (9).
2. A heat assisted chemical mechanical composite abrasive flow polishing apparatus according to claim 1, characterized in that the heating system (3) is integrated in any one or more of the following:
-a workpiece (6) to be polished;
-a clamp (12);
-an upper grinding cylinder (8);
-a lower grinding cylinder (9).
3. The heat assisted chemical mechanical composite abrasive flow polishing apparatus according to claim 1, wherein the temperature measurement and feedback control system (2) comprises a measurement module and a control module, the control module connecting the measurement module and the heating system (3);
the measuring module can measure the temperature of the polishing reaction zone in real time and feed the temperature back to the control module, and the control module can control the heating system (3) to work according to the set temperature and the temperature information fed back by the measuring module so as to keep the temperature of the polishing reaction zone at the set temperature.
4. The heat assisted chemical mechanical composite abrasive flow polishing device according to claim 1, characterized in that the upper abrasive cylinder (8), the lower abrasive cylinder (9), the upper piston (10), the lower piston (11) and the surfaces of the clamp (12) contacting the abrasive (7) are made of oxidation resistant materials.
5. A heat assisted chemical mechanical composite abrasive flow polishing device according to claim 1, characterized in that between the upper abrasive cylinder (8) and the clamp (12), between the lower abrasive cylinder (9) and the clamp (12), between the upper piston (10) and the upper abrasive cylinder (8), and between the lower piston (11) and the lower abrasive cylinder (9) are watertight connections.
6. A heat assisted chemical mechanical composite abrasive flow polishing device according to claim 1, characterized in that the abrasive (7) is of a material selected for its viscosity in the range of 1-1000000 Pa-s.
7. The heat assisted chemical mechanical composite abrasive flow polishing device according to claim 1, characterized in that the oxidizer injection system (4) is connected to the upper abrasive cylinder (8) and/or the lower abrasive cylinder (9) by a one-way valve, and the oxidizer injection system (4) is in watertight connection with the upper abrasive cylinder (8) and/or the lower abrasive cylinder (9);
the oxidant injection system (4) further comprises a flow meter capable of metering the volume of oxidant added to the upper mill vat (8) and/or the lower mill vat (9).
8. A heat assisted chemical mechanical composite abrasive flow polishing device according to claim 1, characterized in that the oxidizer removal system (5) is connected to the upper abrasive cylinder (8) and/or the lower abrasive cylinder (9) by a one-way valve, and the oxidizer removal system (5) is in watertight connection with the upper abrasive cylinder (8) and/or the lower abrasive cylinder (9).
9. A method for polishing by heating auxiliary chemical mechanical composite abrasive flow is characterized by comprising the following steps:
the method comprises the following steps: the upper grinding material cylinder (8) is moved upwards and lifted, and grinding materials (7) are injected into the lower grinding material cylinder (9);
step two: clamping and fixing a workpiece (6) to be polished through a clamp (12), placing the clamp (12) for clamping the workpiece (6) to be polished on a lower grinding cylinder (9), and then controlling an upper grinding cylinder (8) to move downwards to compress the clamp (12);
step three: setting a heating temperature and heating the polishing reaction zone through a heating system (3);
step four: after the polishing reaction zone is heated to a set temperature, setting the pressure of an upper abrasive cylinder (8) and a lower abrasive cylinder (9) through a hydraulic system (1), and setting the reciprocating times of an upper piston (10) and a lower piston (11), namely the preset processing times;
step five: an oxidant is injected into the upper abrasive cylinder (8) through an oxidant injection system (4), the oxidant can cover the surface to be machined of the workpiece (6) to be polished, the hydraulic system (1) is started, and the upper piston (10) and the lower piston (11) reciprocate to start machining;
step six: after the upper piston (10) and the lower piston (11) move for a set number of times, the upper piston (10) is pushed to move downwards, the grinding materials (7) are pressed into the lower grinding material cylinder (9), then the oxidizing agents are injected into the upper grinding material cylinder (8) through the oxidizing agent injection system (4), and then the machining is continued;
step seven: repeating the step six until the upper piston (10) and the lower piston (11) reciprocate to process for a preset number of times to finish processing;
step eight: after finishing the processing, the upper grinding cylinder (8) is moved upwards, the workpiece (6) to be polished after finishing the polishing is taken off from the clamp (12), the grinding material (7) is taken out from the lower grinding cylinder (9), and the oxidizing agent is discharged from the oxidizing agent discharge system (5).
10. The method of claim 9, wherein the polishing is performed using the apparatus of any one of claims 1-8.
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| CN113211291A (en) * | 2021-05-06 | 2021-08-06 | 东南大学 | Polishing device and method for additive manufacturing of high-temperature alloy inner flow channel |
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