CN111710705A - Display substrate repairing method, display substrate and display device - Google Patents
Display substrate repairing method, display substrate and display device Download PDFInfo
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- CN111710705A CN111710705A CN202010615519.6A CN202010615519A CN111710705A CN 111710705 A CN111710705 A CN 111710705A CN 202010615519 A CN202010615519 A CN 202010615519A CN 111710705 A CN111710705 A CN 111710705A
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Abstract
The application provides a repairing method of a display substrate, the display substrate and a display device, wherein the display substrate comprises a substrate and a pixel driving circuit which is arranged on the substrate and located in a sub-pixel, and the pixel driving circuit comprises a driving transistor; a scanning signal line and a high-voltage signal line which are arranged on the same layer as the gate of the driving transistor and extend along a first direction; the insulating layer is arranged on one side, away from the substrate, of the scanning signal line and the high-voltage signal line; the high-voltage data line is arranged on one side, away from the substrate, of the insulating layer, the high-voltage data line extends along a second direction, the first direction is intersected with the second direction, and the high-voltage data line is connected with the high-voltage signal line through a first through hole formed in the insulating layer; the first pole of the driving transistor is connected with a high-voltage data line or a high-voltage signal line. When the defects are generated between the transverse scanning signal lines and the longitudinal data lines, the high-voltage signal lines can be adopted for maintenance, and the product yield is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate repairing method, a display substrate and a display device.
Background
Referring to fig. 1, a conventional signal line arrangement is shown, wherein a ring-shaped dual-channel design is adopted at the overlapping positions of a Gate line (transverse) and other signal lines (longitudinal), and if a transverse Gate line and a longitudinal signal line at one overlapping position are in poor short circuit, a channel at the short circuit position can be cut off, and a method without a poor channel is reserved for repair, so as to ensure that a product can normally work.
However, the current high pixel density PPI (pixel Per Inch) display products of Organic Light Emitting Diodes (OLEDs) suffer from the problem of limited layout space, on one hand, because the external compensation pixel driving circuit is complicated, and on the other hand, because the layout space required by the oxide thin film transistor process is large, in the high pixel density display products, the traditional annular dual-channel repair method cannot be adopted due to the limited layout space, so that the defect between the transverse gate wiring and the vertical signal line cannot be repaired.
Disclosure of Invention
The invention provides a display substrate repairing method, a display substrate and a display device, which aim to improve the product yield.
In order to solve the above problems, the present invention discloses a display substrate, including:
the pixel driving circuit comprises a substrate and a pixel driving circuit which is arranged on the substrate and positioned in the sub-pixels, wherein the pixel driving circuit comprises a driving transistor;
the scanning signal line and the high-voltage signal line are arranged on the same layer as the grid electrode of the driving transistor and extend along a first direction;
the insulating layer is arranged on one side, away from the substrate, of the scanning signal line and the high-voltage signal line;
the high-voltage data line is arranged on one side, away from the substrate, of the insulating layer, extends along a second direction, the first direction is intersected with the second direction, and the high-voltage data line is connected with the high-voltage signal line through a first through hole formed in the insulating layer;
wherein the first pole of the driving transistor is connected with the high voltage data line or the high voltage signal line.
In an alternative implementation manner, the scan signal lines include a first scan signal line and a second scan signal line, the display substrate further includes a first transistor and a second transistor which are disposed on the substrate and located in the sub-pixels, a gate of the first transistor is connected to the first scan signal line, and a gate of the second transistor is connected to the second scan signal line;
the high-voltage signal line is arranged between the first scanning signal line of the previous sub-pixel row and the second scanning signal line of the next sub-pixel row.
In an alternative implementation manner, the high-voltage signal line and the scanning signal line are made of the same material.
In an optional implementation manner, the display substrate further includes a plurality of binding blocks, each binding block includes a first binding layer and a second binding layer, the first binding layer is disposed on the same layer as the high-voltage signal line and connected to the high-voltage signal line, the second binding layer is disposed on the same layer as the high-voltage data line, and the second binding layer is connected to the first binding layer through a second via hole disposed on the insulating layer.
In an alternative implementation, each of the binding blocks connecting the same high-voltage signal line corresponds to a sub-pixel column one to one.
In order to solve the above problem, the present invention further discloses a display device, which includes the display substrate according to any one of the embodiments.
In order to solve the above problem, the present invention further discloses a method for repairing a display substrate, which is applied to the display substrate according to any embodiment, and if a short circuit occurs between the scanning signal line and the data line extending along the second direction, the method for repairing a display substrate includes:
cutting off the scanning signal lines at two sides of the short-circuit point to obtain a third scanning signal line and a fourth scanning signal line;
connecting the high-voltage signal line with the high-voltage data line, and disconnecting the high-voltage signal line from the driving transistor;
and forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high-voltage signal line.
In an optional implementation manner, the step of forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high-voltage signal line includes:
depositing a tungsten powder layer on the display substrate to connect the third scanning signal line and the fourth scanning signal line through the tungsten powder layer and the high-voltage signal line.
In an alternative implementation, when the display substrate includes a first bonding block corresponding to the third scan signal line and a second bonding block corresponding to the fourth scan signal line, the step of forming a metal layer on the display substrate so that the third scan signal line and the fourth scan signal line are connected through the metal layer and the high voltage signal line includes:
forming a first metal layer on the display substrate, wherein an orthographic projection of the first metal layer on the substrate is overlapped with an orthographic projection of the third scanning signal line on the substrate, and the first metal layer covers the second binding layer of the first binding block;
forming a second metal layer on the display substrate, wherein an orthographic projection of the second metal layer on the substrate is overlapped with an orthographic projection of the fourth scanning signal line on the substrate, and the second metal layer covers a second binding layer of the second binding block;
performing laser breakdown at an overlapping position of the first metal layer and the third scanning signal line to connect the first metal layer and the third scanning signal line;
and performing laser breakdown at the overlapping position of the second metal layer and the fourth scanning signal line to connect the second metal layer and the fourth scanning signal line.
In an optional implementation manner, the step of forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high-voltage signal line includes:
forming a first metal layer on the display substrate, wherein orthographic projections of the first metal layer on the substrate are respectively overlapped with orthographic projections of the third scanning signal lines on the substrate, and orthographic projections of the high-voltage signal lines on the substrate;
forming a second metal layer on the display substrate, wherein orthographic projections of the second metal layer on the substrate are respectively overlapped with orthographic projections of the fourth scanning signal lines on the substrate and orthographic projections of the high-voltage signal lines on the substrate;
performing laser breakdown at an overlapping position of the first metal layer and the third scanning signal line to connect the first metal layer and the third scanning signal line;
performing laser breakdown at the overlapping position of the first metal layer and the high-voltage signal line to connect the first metal layer and the high-voltage signal line;
performing laser breakdown at an overlapping position of the second metal layer and the fourth scanning signal line to connect the second metal layer and the fourth scanning signal line;
and carrying out laser breakdown at the overlapping position of the second metal layer and the high-voltage signal line, so that the second metal layer is connected with the high-voltage signal line.
Compared with the prior art, the invention has the following advantages:
the technical scheme of the application provides a repair method of a display substrate, the display substrate and a display device, wherein the display substrate comprises a substrate and a pixel driving circuit which is arranged on the substrate and positioned in a sub-pixel, and the pixel driving circuit comprises a driving transistor; a scanning signal line and a high-voltage signal line which are arranged on the same layer as the gate of the driving transistor and extend along a first direction; the insulating layer is arranged on one side, away from the substrate, of the scanning signal line and the high-voltage signal line; the high-voltage data line is arranged on one side, away from the substrate, of the insulating layer, the high-voltage data line extends along a second direction, the first direction is intersected with the second direction, and the high-voltage data line is connected with the high-voltage signal line through a first through hole formed in the insulating layer; the first pole of the driving transistor is connected with a high-voltage data line or a high-voltage signal line. When the transverse scanning signal line and the longitudinal data line are poor, the high-voltage signal line can be adopted for maintenance, and the high-voltage signal line and the scanning signal line are connected to avoid bad points, so that the product yield is improved. In addition, because the high-voltage signal line and the scanning signal line are arranged on the same layer in the application, the success rate of bad repair between the transverse scanning signal line and the longitudinal data line can be improved in the repair process, and the product yield is further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic plan view illustrating a display substrate according to a related art;
fig. 2 is a schematic plan view illustrating a display substrate according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional view illustrating a display substrate according to an embodiment of the present disclosure;
fig. 4 is a circuit configuration diagram of a pixel driving circuit provided in the present embodiment;
fig. 5 is a diagram illustrating a pixel array of a display substrate provided in this embodiment;
fig. 6 is a schematic view illustrating repair of a display substrate according to the present embodiment;
FIG. 7 is a cross-sectional view of a display substrate according to an embodiment of the present application;
fig. 8 is a cross-sectional view showing a display substrate in the related art;
fig. 9 is a flowchart illustrating steps of a method for repairing a display substrate according to an embodiment of the present disclosure.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
An embodiment of the present application provides a display substrate, a schematic plan structure of the display substrate provided in this embodiment is shown in fig. 2, and a schematic cross-sectional structure of the display substrate at a dashed line position in fig. 2 is shown in fig. 3. The display substrate includes: the liquid crystal display device includes a substrate and a pixel driving circuit disposed on the substrate and in a sub-pixel, the pixel driving circuit including a driving transistor DR TFT.
The display panel further includes: a scanning signal line 21 and a high-voltage signal line 22 provided on the same layer as the gate electrode 31 of the driving transistor DR TFT, the scanning signal line 21 and the high-voltage signal line 22 extending in a first direction; an insulating layer 32 disposed on a side of the scanning signal line 21 and the high-voltage signal line 22 away from the substrate; and a high voltage data line VDD disposed on a side of the insulating layer 32 facing away from the substrate, the high voltage data line VDD extending along a second direction, the first direction intersecting the second direction, the high voltage data line VDD and the high voltage signal line 22 being connected by a first via 23 disposed on the insulating layer 32.
The first electrode of the driving transistor DR TFT is connected to the high voltage data line VDD or the high voltage signal line 22. In practical applications, the high voltage data line VDD or the high voltage signal line 22 may input the dc high voltage signal VDD to the first electrode of the driving transistor DR TFT.
The display substrate provided by this embodiment may further include a display data line data extending along the second direction, such as data1, data2, data3, data4, data5, and data6 shown in fig. 2, and the high voltage data line VDD and the display data line data may be formed in the same layer and process. The display substrate provided by the embodiment may further include a Sense data line extending in the second direction. The pixel arrangement of the display substrate provided in this embodiment may be RWBRGB, but is not limited to this sequential arrangement. In practical applications, the display substrate may further include a PVX passivation layer and a Resin film layer covering the film layer structure shown in fig. 3, resulting in the display substrate shown in fig. 7.
Referring to fig. 5, which shows an array diagram of the pixel structure shown in fig. 2, since the horizontal scanning signal lines and the vertical data lines overlap each other, there is a risk of short circuit in the overlapping area, and if the repair design is not used, the short circuit failure cannot be repaired. For the high PPI display product, it can be seen that the density of the scan signal lines 21 extending along the first direction is very large, and there is no room for the conventional repair design in the pixel structure under the existing process limit.
In this embodiment, when a short circuit failure occurs between the horizontal scanning signal line 21 and the vertical data line (e.g., the display signal line data), the scanning signal line 21 may be cut off at both sides of the short circuit point, and the connection between the high voltage signal line 22 and the high voltage data line VDD and the connection between the high voltage signal line 22 and the driving transistor DR TFT may be cut off; then, metal (such as tungsten powder) is deposited to cover and connect the scanning signal line 21 and the high-voltage signal line 22, laser breakdown is carried out at the position where the metal covers the scanning signal line 21 and the position where the metal covers the high-voltage signal line 22 respectively, and connection between the metal layer and the scanning signal line 21 or connection between the metal layer and the high-voltage signal line 22 is formed at the laser breakdown position, so that the disconnected scanning signal line 21 can be connected through the metal layer and the connected high-voltage signal line to obtain the complete scanning signal line 21, thereby repairing the defects between the transverse scanning signal line and the longitudinal data line and improving the yield.
In practical applications, the defective repair can be performed after the SD layer (data layer of the display data line), and since the gate layer is a metal layer closest to the SD layer, the scanning signal line 21 (i.e., the gate line) and the high voltage signal line 22 are disposed in the same layer in this embodiment, so that the laser fusing range can be reduced in the laser breakdown process, and the product yield can be further improved.
In an alternative implementation, the high voltage signal lines 22 and the scan signal lines 21 may be made of the same material. In practical applications, the high voltage signal line 22 and the scan signal line 21 can be formed in the same layer and process.
When the pixel driving circuit has a 3T1C structure, referring to fig. 4 showing a circuit configuration diagram of the 3T1C pixel driving circuit, the scan signal line 21 may include a first scan signal line G1 and a second scan signal line G2, the display substrate may further include a first transistor SW TFT and a second transistor SEN TFT disposed on the substrate and in the sub-pixel, a gate of the first transistor SW TFT is connected to the first scan signal line G1, and a gate of the second transistor SEN TFT is connected to the second scan signal line G2, as shown in fig. 2. The high voltage signal line 22 is disposed between the first scanning signal line G1 of the previous sub-pixel row and the second scanning signal line G2 of the next sub-pixel row, as shown in fig. 6.
Note that the SW TFT in fig. 2 is T1 in fig. 4, the SEN TFT in fig. 2 is T2 in fig. 4, and the drive transistor DR TFT in fig. 2 is T3 in fig. 4.
In the actual repair process, the laser breakdown process may cause the problem of large contact resistance or even open circuit, so to avoid abnormal repair, the success rate of repair is improved, and the use of the laser breakdown process needs to be reduced. The display substrate provided by this embodiment may further include a plurality of bonding blocks 24, and referring to fig. 2 and 3, each bonding block 24 includes a first bonding layer 33 and a second bonding layer 34, the first bonding layer 33 is disposed on the same layer as the high-voltage signal line 22 and connected to the high-voltage signal line 22, the second bonding layer 34 is disposed on the same layer as the high-voltage data line VDD, and the second bonding layer 34 is connected to the first bonding layer 33 through a second via hole disposed on the insulating layer 32. In this way, during the repair process, the metal layer only needs to cover the second binding layer 34, so that the connection between the metal layer and the high-voltage signal line 22 can be formed, and the use of the laser breakdown process is reduced.
In order to reduce the printing step difference, improve the planarization of the opening region, and improve the display uniformity, the binding blocks 24 connected to the same high voltage signal line 22 may be disposed in one-to-one correspondence with the sub-pixel columns, as shown in fig. 2.
Next, referring to fig. 6, a case where the first scanning signal line G1 is short-circuited to the Data1 and the second scanning signal line G2 is short-circuited to the Data6 will be described as a repair.
When the display substrate includes the bonding blocks, the repairing step of the short circuit between the first scanning signal line G1 and the Data1 is as follows:
cutting off the first scanning signal line G1 at both sides of the short-circuit point by laser to ensure that the first scanning signal line G1 is disconnected at the short-circuit point; the connection between the high-voltage signal line 22 and the high-voltage data line VDD and the connection between the high-voltage signal line 22 and the first pole of the driving transistor DR TFT are cut off by laser, so that the high-voltage signal line connected with the first scanning signal line is ensured not to have the input and the output of high-voltage direct current signals, and the signal interference is avoided; depositing tungsten powder on two sides of the short circuit point respectively to enable the tungsten powder to cover and connect the first scanning signal line G1 and the high-voltage signal line 22; laser breakdown is performed at the position where the tungsten powder covers the first scanning signal line G1 and the position where the tungsten powder covers the high-voltage signal line 22, respectively, so that the disconnected first scanning signal line G1 is turned on, thereby ensuring the integrity of the first scanning signal line G1.
When the display substrate includes the bonding blocks, the repairing step of the short circuit between the first scanning signal line G1 and the Data1 is as follows:
cutting off the first scanning signal line G1 at both sides of the short-circuit point by laser to ensure that the first scanning signal line G1 is disconnected at the short-circuit point; the connection between the high-voltage signal line 22 and the high-voltage data line VDD and the connection between the high-voltage signal line 22 and the first pole of the driving transistor DR TFT are cut off by laser, so that the high-voltage signal line connected with the first scanning signal line is ensured not to have the input and the output of high-voltage direct current signals, and the signal interference is avoided; depositing tungsten powder on two sides of the short circuit point respectively to enable the tungsten powder to cover and connect the first scanning signal line G1 and the second binding layer 34; laser breakdown is performed at a position where the tungsten powder covers the first scanning signal line G1, so that the disconnected first scanning signal line G1 is turned on, thereby ensuring the integrity of the first scanning signal line G1. Laser breakdown is not needed when the position of the second binding layer 34 covered by the tungsten powder, the second binding layer 34 is connected with the first binding layer 33 through the second via hole, and the first binding layer 33 is connected with the high-voltage signal line 22, so that the tungsten powder is deposited on the second binding layer 34 and can be connected with the high-voltage signal line 22.
It should be noted that, the SD layer metal (connecting the second binding layer and the first electrode of the driving transistor) is disposed on the surface of the laser breakdown position on the right side of the short-circuit point of the first scanning signal line G1, so that the laser breakdown can be directly performed at this position without depositing tungsten powder, or the metal layer and the scanning signal line can be connected. In practical application, in order to reduce contact resistance and prevent breakpoints, tungsten powder can be deposited at the laser breakdown position.
When the display substrate includes the bonding blocks, the repairing step of the short circuit between the second scanning signal line G2 and the Data6 is as follows:
cutting off the second scanning signal lines G2 at two sides of the short-circuit point by using laser to ensure that the second scanning signal lines G2 are disconnected at the short-circuit point; the connection between the high-voltage signal line 22 and the high-voltage data line VDD and the connection between the high-voltage signal line 22 and the first pole of the driving transistor DR TFT are cut off by laser, so that the high-voltage signal line connected with the second scanning signal line G2 is ensured not to have the input and the output of high-voltage direct current signals, and the signal interference is avoided; depositing tungsten powder on two sides of the short circuit point respectively to cover and connect the second scanning signal line G2 and the second binding layer 34; laser breakdown is performed at a position where the tungsten powder covers the second scanning signal line G2, so that the disconnected second scanning signal line G2 is turned on, thereby ensuring the integrity of the second scanning signal line G2. And laser breakdown is not needed when the tungsten powder covers the position of the second binding layer.
As shown in fig. 7, which is a cross-sectional view in a dotted line direction in fig. 5, the film layer structure below PVX in fig. 7 may be the same as that shown in fig. 3, and the print Bank region (opening region) may improve the planarization of the print region by providing a binding block. Fig. 8 is a cross-sectional view of a printed Bank area without a binding block after Resin is formed, the film structure below PVX in fig. 8 can be the same as the film structure of fig. 3 without the binding block 24, and as can be seen from fig. 8, the step difference in the Bank area is obvious, the maximum step difference can reach over 1200 angstroms, the step difference can cause the efficiency of the EL device to be reduced, and the printed Mura can be formed at the position with the larger step difference. The method and the device have the advantages that the step difference is reduced by about 60% by arranging the binding blocks, the characteristics of the EL device (especially the top-emitting OLED) are improved, and the display Mura defect caused by large printing step difference can be improved.
To the unable problem of carrying out traditional restoration to scanning signal line because space restriction in the high PPI shows the product, this embodiment is through setting up the high-voltage signal line with the same layer of scanning signal line, realize the restoration of scanning signal line, further through setting up the bonding block, laser breakdown when can reducing the maintenance, shorten the Tack Time, promote the yield of product, and through the setting of bonding block, can optimize the EL device efficiency decline that the printing segment difference brought, show the bad scheduling problem of Mura, show the product and supply technical support for high PPI.
Another embodiment of the present application further provides a display device including the display substrate of any one of the embodiments.
The display device in this embodiment may be: any product or component with a 2D or 3D display function, such as a display panel, electronic paper, a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator and the like.
Another embodiment of the present application further provides a method for repairing a display substrate, which is applied to the display substrate described in any embodiment, and if a short circuit occurs between a scanning signal line and a data line extending along a second direction, referring to fig. 9, the method for repairing a display substrate may include:
step 901: and cutting off the scanning signal lines at two sides of the short-circuit point to obtain a third scanning signal line and a fourth scanning signal line.
Step 902: and disconnecting the high-voltage signal line from the high-voltage data line and disconnecting the high-voltage signal line from the driving transistor.
Step 903: and forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high-voltage signal line.
In an optional implementation manner, step 903 may specifically include: and depositing a tungsten powder layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the tungsten powder layer and the high-voltage signal line.
In an alternative implementation manner, when the display substrate includes a first bonding block corresponding to the third scanning signal line and a second bonding block corresponding to the fourth scanning signal line, the step of forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high voltage signal line includes:
forming a first metal layer on the display substrate, wherein the orthographic projection of the first metal layer on the substrate is overlapped with the orthographic projection of the third scanning signal line on the substrate, and the first metal layer covers the second binding layer of the first binding block;
forming a second metal layer on the display substrate, wherein the orthographic projection of the second metal layer on the substrate is overlapped with the orthographic projection of the fourth scanning signal line on the substrate, and the second metal layer covers a second binding layer of the second binding block;
performing laser breakdown at the overlapping position of the first metal layer and the third scanning signal line to connect the first metal layer and the third scanning signal line;
and performing laser breakdown at the overlapping position of the second metal layer and the fourth scanning signal line to connect the second metal layer and the fourth scanning signal line.
In an alternative implementation manner, when the display substrate does not include the bonding block, the step of forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high voltage signal line includes:
forming a first metal layer on the display substrate, wherein orthographic projections of the first metal layer on the substrate are respectively overlapped with orthographic projections of the third scanning signal lines on the substrate and orthographic projections of the high-voltage signal lines on the substrate;
forming a second metal layer on the display substrate, wherein orthographic projections of the second metal layer on the substrate are respectively overlapped with orthographic projections of the fourth scanning signal lines on the substrate and orthographic projections of the high-voltage signal lines on the substrate;
performing laser breakdown at the overlapping position of the first metal layer and the third scanning signal line to connect the first metal layer and the third scanning signal line;
performing laser breakdown at the overlapping position of the first metal layer and the high-voltage signal line to connect the first metal layer and the high-voltage signal line;
performing laser breakdown at the overlapping position of the second metal layer and the fourth scanning signal line to connect the second metal layer and the fourth scanning signal line;
and carrying out laser breakdown at the overlapping position of the second metal layer and the high-voltage signal line to connect the second metal layer and the high-voltage signal line.
By adopting the repairing method provided by the embodiment, the defects between the horizontal scanning lines and the vertical data lines in the display substrate provided by the embodiment can be repaired, and the specific implementation process of the embodiment is the same as that of the display substrate provided by the embodiment, and is not described again here.
The embodiment of the application provides a repairing method of a display substrate, the display substrate and a display device, wherein the display substrate comprises a substrate and a pixel driving circuit which is arranged on the substrate and positioned in a sub-pixel, and the pixel driving circuit comprises a driving transistor; a scanning signal line and a high-voltage signal line which are arranged on the same layer as the gate of the driving transistor and extend along a first direction; the insulating layer is arranged on one side, away from the substrate, of the scanning signal line and the high-voltage signal line; the high-voltage data line is arranged on one side, away from the substrate, of the insulating layer, the high-voltage data line extends along a second direction, the first direction is intersected with the second direction, and the high-voltage data line is connected with the high-voltage signal line through a first through hole formed in the insulating layer; the first pole of the driving transistor is connected with a high-voltage data line or a high-voltage signal line. When a defect is generated between the scanning signal line and the data line extending along the second direction, the high-voltage signal line can be adopted for maintenance, and the high-voltage signal line is connected with the scanning signal line to avoid a defective point, so that the product yield is improved; and because the high-voltage signal line and the scanning signal line in this application are arranged on the same layer, bad restoration success rate between the transverse scanning signal line and the longitudinal data line can be improved in the restoration process.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The method for repairing a display substrate, the display substrate and the display device provided by the present invention are described in detail above, and the principle and the embodiment of the present invention are explained in detail herein by applying specific examples, and the description of the above examples is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A display substrate, comprising:
the pixel driving circuit comprises a substrate and a pixel driving circuit which is arranged on the substrate and positioned in the sub-pixels, wherein the pixel driving circuit comprises a driving transistor;
the scanning signal line and the high-voltage signal line are arranged on the same layer as the grid electrode of the driving transistor and extend along a first direction;
the insulating layer is arranged on one side, away from the substrate, of the scanning signal line and the high-voltage signal line;
the high-voltage data line is arranged on one side, away from the substrate, of the insulating layer, extends along a second direction, the first direction is intersected with the second direction, and the high-voltage data line is connected with the high-voltage signal line through a first through hole formed in the insulating layer;
wherein the first pole of the driving transistor is connected with the high voltage data line or the high voltage signal line.
2. The display substrate according to claim 1, wherein the scanning signal line comprises a first scanning signal line and a second scanning signal line, the display substrate further comprises a first transistor and a second transistor which are provided over the substrate and located in a sub-pixel, a gate of the first transistor is connected to the first scanning signal line, and a gate of the second transistor is connected to the second scanning signal line;
the high-voltage signal line is arranged between the first scanning signal line of the previous sub-pixel row and the second scanning signal line of the next sub-pixel row.
3. The display substrate according to claim 1, wherein the high voltage signal lines and the scan signal lines are made of the same material.
4. The display substrate according to any one of claims 1 to 3, wherein the display substrate further comprises a plurality of bonding blocks, each bonding block comprises a first bonding layer and a second bonding layer, the first bonding layer is disposed on the same layer as the high-voltage signal line and connected to the high-voltage signal line, the second bonding layer is disposed on the same layer as the high-voltage data line, and the second bonding layer is connected to the first bonding layer through a second via hole disposed on the insulating layer.
5. The display substrate of claim 4, wherein each of the bonding blocks connecting the same high voltage signal line corresponds to a sub-pixel column.
6. A display device comprising the display substrate according to any one of claims 1 to 5.
7. A method for repairing a display substrate, applied to the display substrate according to any one of claims 1 to 5, wherein if a short circuit occurs between the scanning signal line and the data line extending in the second direction, the method comprises:
cutting off the scanning signal lines at two sides of the short-circuit point to obtain a third scanning signal line and a fourth scanning signal line;
connecting the high-voltage signal line with the high-voltage data line, and disconnecting the high-voltage signal line from the driving transistor;
and forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high-voltage signal line.
8. The repairing method according to claim 7, wherein the step of forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high voltage signal line includes:
depositing a tungsten powder layer on the display substrate to connect the third scanning signal line and the fourth scanning signal line through the tungsten powder layer and the high-voltage signal line.
9. The repairing method according to claim 7 or 8, wherein when the display substrate includes a first bonding block corresponding to the third scanning signal line and a second bonding block corresponding to the fourth scanning signal line, the step of forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high voltage signal line includes:
forming a first metal layer on the display substrate, wherein an orthographic projection of the first metal layer on the substrate is overlapped with an orthographic projection of the third scanning signal line on the substrate, and the first metal layer covers the second binding layer of the first binding block;
forming a second metal layer on the display substrate, wherein an orthographic projection of the second metal layer on the substrate is overlapped with an orthographic projection of the fourth scanning signal line on the substrate, and the second metal layer covers a second binding layer of the second binding block;
performing laser breakdown at an overlapping position of the first metal layer and the third scanning signal line to connect the first metal layer and the third scanning signal line;
and performing laser breakdown at the overlapping position of the second metal layer and the fourth scanning signal line to connect the second metal layer and the fourth scanning signal line.
10. The repairing method according to claim 7 or 8, wherein the step of forming a metal layer on the display substrate so that the third scanning signal line and the fourth scanning signal line are connected through the metal layer and the high voltage signal line includes:
forming a first metal layer on the display substrate, wherein orthographic projections of the first metal layer on the substrate are respectively overlapped with orthographic projections of the third scanning signal lines on the substrate, and orthographic projections of the high-voltage signal lines on the substrate;
forming a second metal layer on the display substrate, wherein orthographic projections of the second metal layer on the substrate are respectively overlapped with orthographic projections of the fourth scanning signal lines on the substrate and orthographic projections of the high-voltage signal lines on the substrate;
performing laser breakdown at an overlapping position of the first metal layer and the third scanning signal line to connect the first metal layer and the third scanning signal line;
performing laser breakdown at the overlapping position of the first metal layer and the high-voltage signal line to connect the first metal layer and the high-voltage signal line;
performing laser breakdown at an overlapping position of the second metal layer and the fourth scanning signal line to connect the second metal layer and the fourth scanning signal line;
and carrying out laser breakdown at the overlapping position of the second metal layer and the high-voltage signal line, so that the second metal layer is connected with the high-voltage signal line.
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| US20010013910A1 (en) * | 1999-12-17 | 2001-08-16 | Ahn Byung-Chul | Array substrate for use in LCD device |
| CN106876436A (en) * | 2017-03-06 | 2017-06-20 | 京东方科技集团股份有限公司 | Array base palte and its restorative procedure |
| CN110190108A (en) * | 2019-07-02 | 2019-08-30 | 合肥鑫晟光电科技有限公司 | The restorative procedure and device of display base plate |
| CN110797350A (en) * | 2019-11-01 | 2020-02-14 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and OLED display panel |
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2020
- 2020-06-30 CN CN202010615519.6A patent/CN111710705B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010013910A1 (en) * | 1999-12-17 | 2001-08-16 | Ahn Byung-Chul | Array substrate for use in LCD device |
| CN106876436A (en) * | 2017-03-06 | 2017-06-20 | 京东方科技集团股份有限公司 | Array base palte and its restorative procedure |
| CN110190108A (en) * | 2019-07-02 | 2019-08-30 | 合肥鑫晟光电科技有限公司 | The restorative procedure and device of display base plate |
| CN110797350A (en) * | 2019-11-01 | 2020-02-14 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and OLED display panel |
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