CN111703083A - Preparation method of wave-absorbing composite material component - Google Patents
Preparation method of wave-absorbing composite material component Download PDFInfo
- Publication number
- CN111703083A CN111703083A CN201910201146.5A CN201910201146A CN111703083A CN 111703083 A CN111703083 A CN 111703083A CN 201910201146 A CN201910201146 A CN 201910201146A CN 111703083 A CN111703083 A CN 111703083A
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- CN
- China
- Prior art keywords
- wave
- absorbing
- adhesive film
- composite material
- adhesive
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/03—After-treatments in the joint area
- B29C66/034—Thermal after-treatments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
Abstract
The application discloses a method for preparing a wave-absorbing composite material component, which comprises the steps of preparing an adhesive into an adhesive film, paving a carrier on the surface of the adhesive film to form a carrier adhesive film, and aiming at enhancing the strength of the adhesive film and facilitating the process construction of operators; then laying a wave-absorbing layer prepared by uniformly mixing wave-absorbing powder and adhesive to prepare a wave-absorbing adhesive film with a wave-absorbing function, and attaching the wave-absorbing adhesive film to the laid composite material member for co-curing and forming. The wave-absorbing adhesive film can save special plants, equipment and operators, reduce technological processes and procedures, shorten production period, protect environment, prolong the service life of the wave-absorbing adhesive film after being cured and the service life of the wave-absorbing adhesive film and a composite material component, and greatly improve the reliability and maintainability of the wave-absorbing adhesive film.
Description
Technical Field
The invention relates to the technical field of wave-absorbing materials, in particular to the technical field of wave-absorbing composite material forming.
Background
At present, the known wave-absorbing coating is generally prepared by mixing micro-particle powder and a high-molecular adhesive through a special process to prepare a liquid coating with a certain consistency, and when the wave-absorbing coating is used, the liquid coating is coated on the outer surface of a required object (composite material), and a solid film is formed and attached to the surface of the used object (composite material) after a period of curing. However, in construction: 1) special plants and equipment and trained operators are required; 2) the process is complicated, such as: the surface of an object (composite material) to be coated needs roughening treatment, coating a treating agent, coating a wave-absorbing coating, coating a fabric, and curing to form a solid film; 3) during the surface roughening treatment, the generated dust pollutes the environment and damages the health of operators; 4) during burdening, the coating is prepared by blending a plurality of components, and a proper amount of diluent is required to be added to reach proper viscosity for construction; 5) after the wave-absorbing coating is coated, the adhesive force on the surface of an object (composite material) is limited, and the wave-absorbing coating is easy to fall off in the using process and needs to be maintained by personnel.
Disclosure of Invention
The problems that the existing wave-absorbing coating needs special requirements on environment, equipment, personnel, construction process and the like, and has low adhesive force, maintenance and the like are solved; the application provides a preparation method of a wave-absorbing composite material member, which can solve the problems of wave-absorbing coatings.
The technical scheme adopted by the application for solving the technical problem is as follows:
a method for preparing a wave-absorbing composite material member comprises the following steps,
1) mixing wave-absorbing material with adhesive to prepare a mixture;
2) uniformly coating the mixture on the surface of the first backing, and pressing the mixture on film-making equipment to form a wave-absorbing layer;
3) uniformly coating the adhesive on the surface of the second backing, and pressing the adhesive on film-making equipment to form an adhesive film;
4) spreading the carrier on the surface of the adhesive film and compacting to prepare a carrier adhesive film;
5) laying the carrier adhesive film and the wave-absorbing layer in opposite faces, making the back lining become an upper surface and a lower surface, and pressing the upper surface and the lower surface into the wave-absorbing adhesive film by contacting with a film-making device;
6) laying the composite material on a mould for forming;
7) removing a back lining of the wave-absorbing adhesive film, and attaching the wave-absorbing adhesive film to the surface of the composite material;
8) and packaging the composite material attached with the wave-absorbing adhesive film by using a vacuum bag, vacuumizing, heating and curing to prepare the wave-absorbing composite material member.
The thickness of the glue film in the step 1) is 0.06 mm-0.2 mm after being pressed.
The thickness of the wave absorbing layer in the step 4) is 0.1 mm-0.4 mm after being pressed.
The thickness of the wave-absorbing adhesive film pressed in the step 5) is 0.2 mm-0.6 mm.
The wave-absorbing material is ferrite powder or magnetic alloy powder.
The adhesive is one of epoxy resin, phenolic resin, polyurethane and bismaleimide resin.
The backing is kraft paper or plastic film. The backing is used for manufacturing the adhesive film and plays a role of protecting the adhesive film.
The carrier is one of a fabric, a non-woven fabric and a unidirectional fiber fabric.
The invention firstly prepares the adhesive into an adhesive film, and lays a carrier (fabric or non-woven cloth or unidirectional fiber cloth) on the surface of the adhesive film to form a carrier adhesive film, so as to enhance the strength of the adhesive film and facilitate the process construction of operators; then laying a wave-absorbing layer prepared by uniformly mixing wave-absorbing powder and adhesive to prepare a wave-absorbing adhesive film with a wave-absorbing function, and attaching the wave-absorbing adhesive film to the laid composite material member for co-curing and forming.
The invention has the advantages of saving workshop, equipment and operators for spraying, reducing process flow, shortening production period, protecting environment, prolonging the service life of the cured wave-absorbing adhesive film and the composite material, and improving the reliability of the member.
Drawings
FIG. 1 is a schematic view of an adhesive film.
FIG. 2 is a schematic view of an adhesive pressed onto the surface of a backing to form an adhesive film.
Fig. 3 is a schematic view of the pressing of the carrier adhesive film.
Figure 4 is a schematic view of a pressed wave-absorbing adhesive film.
Figure 5 is a schematic view of a wave-absorbing adhesive film with a backing.
Figure 6 is a schematic view of a wave absorbing composite member.
Detailed Description
For further illustration and not limitation of the described embodiments of the invention, reference is made to the following description of the invention taken in conjunction with the accompanying drawings and embodiments, but not intended to limit the invention thereto. All such concepts are intended to be within the scope of the present disclosure and the present invention.
Example 1
The invention relates to a method for preparing a wave-absorbing composite material member, which comprises the following steps:
1) the bismaleimide resin adhesive is uniformly coated on the surface of a back lining after being prepared, and the back lining is kraft paper; the adhesive is in a soft solid state and is pressed into a glue film on film-making equipment, and the thickness of the glue film is 0.06 mm-0.2 mm;
2) spreading a carrier on the surface of the adhesive film and compacting, wherein the carrier is unidirectional fiber cloth to form a carrier adhesive film;
3) mixing ferrite wave-absorbing powder and bismaleimide resin adhesive in proportion to form a mixture;
4) uniformly coating the mixture on the surface of a backing, cooling to make the adhesive become soft solid, pressing on film-making equipment to form a wave-absorbing layer, wherein the thickness of a film is 0.1 mm;
5) the carrier adhesive film is opposite to the wave-absorbing layer, the surfaces of the two back linings are respectively contacted with the surface of the equipment to be pressed into a wave-absorbing adhesive film, and the thickness of the wave-absorbing adhesive film is 0.2 mm;
6) laying the composite material on a mould for forming;
7) removing a back lining of the wave-absorbing adhesive film, and attaching the wave-absorbing adhesive film to the surface of the composite material;
8) and packaging the composite material attached with the wave-absorbing adhesive film by using a vacuum bag, vacuumizing, heating and curing to prepare the wave-absorbing composite material member.
Example 2
The invention relates to a method for preparing a wave-absorbing composite material member, which comprises the following steps:
1) preparing an epoxy resin adhesive to enable the adhesive to be soft and solid, uniformly coating the adhesive on the surface of a back lining, cooling, and pressing the adhesive on film-making equipment to form an adhesive film layer 1, wherein the thickness of the adhesive film layer 1 is 0.2 mm; the back lining 4 is a plastic film;
2) spreading and compacting a carrier 2 on the surface of the adhesive film layer 1, wherein the carrier 2 is a fabric to form a carrier adhesive film;
3) mixing the magnetic alloy wave-absorbing powder with an epoxy resin adhesive in proportion to form a mixture;
4) uniformly coating the mixture on the surface of a plastic film of a backing 4, cooling, pressing into a wave-absorbing layer 3 on film-making equipment, wherein the thickness of the wave-absorbing layer 3 is 0.4 mm;
5) the carrier adhesive film and the wave-absorbing layer 3 face to face, the surfaces of the two back linings 4 are respectively contacted with the surface of equipment to be pressed into a wave-absorbing adhesive film, and the thickness of the wave-absorbing adhesive film is 0.6 mm;
6) laying the composite material on a mould for forming;
7) removing a back lining of the wave-absorbing adhesive film, and attaching the wave-absorbing adhesive film to the surface of the composite material 5;
8) and packaging the composite material 5 attached with the wave-absorbing adhesive film by using a vacuum bag, vacuumizing, heating and curing to prepare the wave-absorbing composite material member.
Claims (6)
1. A method for preparing a wave-absorbing composite material member is characterized by comprising the following steps:
1) mixing wave-absorbing material with adhesive to prepare a mixture;
2) uniformly coating the mixture on the surface of the first backing, and pressing the mixture on film-making equipment to form a wave-absorbing layer;
3) uniformly coating the adhesive on the surface of the second backing, and pressing the adhesive on film-making equipment to form an adhesive film layer;
4) spreading the carrier on the surface of the adhesive film and compacting to prepare a carrier adhesive film;
5) laying the carrier adhesive film and the wave-absorbing layer in opposite faces, making the back lining become an upper surface and a lower surface, and pressing the upper surface and the lower surface into the wave-absorbing adhesive film by contacting with a film-making device;
6) laying the composite material on a mould for forming;
7) removing a back lining of the wave-absorbing adhesive film, and attaching one side of an adhesive film layer of the wave-absorbing adhesive film to the surface of the composite material;
8) and packaging the composite material attached with the wave-absorbing adhesive film by using a vacuum bag, vacuumizing, heating and curing to prepare the wave-absorbing composite material member.
2. The method for preparing a wave-absorbing composite material member according to claim 1, wherein the thickness of the adhesive film layer in the step 1) is 0.06 mm-0.2 mm after being pressed, the thickness of the wave-absorbing layer in the step 4) is 0.1 mm-0.4 mm after being pressed, and the thickness of the wave-absorbing adhesive film pressed in the step 5) is 0.2 mm-0.6 mm.
3. The method for preparing a wave-absorbing composite material member according to claim 1, wherein the wave-absorbing material is ferrite powder or magnetic alloy powder.
4. The method for preparing a wave-absorbing composite material member according to claim 1, wherein the adhesive is one of epoxy resin, phenolic resin, polyurethane and bismaleimide resin.
5. The method for preparing a wave-absorbing composite member according to claim 1, wherein the backing is kraft paper or plastic film.
6. The method for preparing the wave-absorbing composite material member according to claim 1, wherein the carrier is one of a fabric, a non-woven fabric and a unidirectional fiber fabric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910201146.5A CN111703083A (en) | 2019-03-18 | 2019-03-18 | Preparation method of wave-absorbing composite material component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910201146.5A CN111703083A (en) | 2019-03-18 | 2019-03-18 | Preparation method of wave-absorbing composite material component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111703083A true CN111703083A (en) | 2020-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910201146.5A Pending CN111703083A (en) | 2019-03-18 | 2019-03-18 | Preparation method of wave-absorbing composite material component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113650389A (en) * | 2021-08-24 | 2021-11-16 | 航天特种材料及工艺技术研究所 | Adhesive curing wave-absorbing composite material and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008059925A1 (en) * | 2006-11-16 | 2008-05-22 | Mitsubishi Plastics, Inc. | Gas barrier film laminate |
| CN204391284U (en) * | 2015-02-02 | 2015-06-10 | 成都飞机工业（集团）有限责任公司 | One inserts type Wave suction composite material structure |
| CN108575079A (en) * | 2017-03-08 | 2018-09-25 | 上海量子绘景电子股份有限公司 | Electromagnetic shielding composite laminate magnetic material structures and preparation method thereof |
-
2019
- 2019-03-18 CN CN201910201146.5A patent/CN111703083A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008059925A1 (en) * | 2006-11-16 | 2008-05-22 | Mitsubishi Plastics, Inc. | Gas barrier film laminate |
| CN204391284U (en) * | 2015-02-02 | 2015-06-10 | 成都飞机工业（集团）有限责任公司 | One inserts type Wave suction composite material structure |
| CN108575079A (en) * | 2017-03-08 | 2018-09-25 | 上海量子绘景电子股份有限公司 | Electromagnetic shielding composite laminate magnetic material structures and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113650389A (en) * | 2021-08-24 | 2021-11-16 | 航天特种材料及工艺技术研究所 | Adhesive curing wave-absorbing composite material and preparation method thereof |
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Application publication date: 20200925 |