CN111679472A

CN111679472A - LCD mother board

Info

Publication number: CN111679472A
Application number: CN202010490011.8A
Authority: CN
Inventors: 沈志英
Original assignee: TCL China Star Optoelectronics Technology Co Ltd
Current assignee: TCL China Star Optoelectronics Technology Co Ltd
Priority date: 2020-06-02
Filing date: 2020-06-02
Publication date: 2020-09-18

Abstract

The application discloses liquid crystal display motherboard includes: a first substrate having at least one cutting line; a second substrate disposed opposite to the first substrate; the supporting piece is positioned between the first substrate and the second substrate, and at least one part of the supporting piece is positioned on one side of the first substrate close to the cutting line so as to improve the supporting force between the second substrate and the first substrate, improve the problem that the first substrate is easy to crack or the slice is not cracked during cutting in the manufacturing process and improve the yield of products.

Description

LCD mother board

Technical Field

The application relates to the technical field of display, in particular to a liquid crystal display mother board.

Background

In a liquid crystal display device, in order to make the liquid crystal react more quickly when it is deflected, a certain pretilt angle is usually set to the liquid crystal in the liquid crystal cell during the process. Specifically, in the manufacturing process, after the array substrate and the color filter substrate are combined into a box, the color filter substrate is cut on the edge of the large plate to expose the high vertical arrangement terminals on the array substrate, and then a curing process is performed by applying a voltage to the high vertical arrangement terminals to make the liquid crystal have a pretilt angle. However, the problem that the chips are cracked or the chips are not cracked easily occurs during the cutting process, which affects the yield of the product.

Disclosure of Invention

The embodiment of the application provides a liquid crystal display mother board, which can solve the problem that a sheet is cracked or a slice is not cracked in the manufacturing process and improve the yield of products.

The embodiment of the application provides a liquid crystal display motherboard, includes:

a first substrate having at least one cutting line;

a second substrate disposed opposite to the first substrate;

a support located between the first substrate and the second substrate, at least a portion of the support being located on a side of the first substrate near the scribe line.

In some embodiments, the support comprises a first support and a second support, the first support partially coinciding with the second support in a top view.

In some embodiments, the first support member comprises a first master support member and a first slave support member, the first master support member having a thickness less than a thickness of the first slave support member, the first master support member being disposed coincident with the second support member in a top view.

In some embodiments, the second support member comprises a second master support member and a second slave support member; the thickness of the second main supporting piece is smaller than that of the second auxiliary supporting piece, and the first main supporting piece and the second main supporting piece are arranged in a superposition mode in a top view.

In some embodiments, the thickness of the first slave support is equal to the distance between the first substrate and the second substrate; the thickness of the second slave support is equal to the distance between the first substrate and the second substrate.

In some embodiments, the first support is at least one of a truncated cone, a cylinder, a truncated pyramid, and a prism.

In some embodiments, the first support is made of a photoresist material and the second support is made of a polyimide material.

In some embodiments, the second support is on the same layer as the alignment layer, and the second support and the alignment layer are disposed discontinuously.

In some embodiments, the support and the cut line have a first spacing, from a top view, that is greater than or equal to 50 microns and less than or equal to 200 microns.

In some embodiments, the first pitch is equal to 150 microns.

The liquid crystal display mother board that this application embodiment provided includes: a first substrate having at least one cutting line; a second substrate disposed opposite to the first substrate; the supporting piece is positioned between the first substrate and the second substrate, and at least one part of the supporting piece is positioned on one side of the first substrate close to the cutting line so as to improve the supporting force between the second substrate and the first substrate, improve the problem that the first substrate is easy to crack or the slice is not cracked during cutting in the manufacturing process and improve the yield of products.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1A is a top view of a mother panel of a liquid crystal display according to an embodiment of the present application;

3 FIGS. 31 3 B 3 to 31 3 G 3 are 3 sectional 3 views 3 of 3 a 3 mother 3 liquid 3 crystal 3 display 3 panel 3 taken 3 along 3 A 3- 3 A 3' 3 in 3 FIG. 31 3 A 3; 3

Fig. 1H is a partially enlarged view of B in fig. 1A.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Specifically, please refer to fig. 1A, which is a top view of a mother board of a liquid crystal display according to an embodiment of the present disclosure; 3 please 3 refer 3 to 3 fig. 31 3 B 3 to 3 fig. 31 3 G 3, 3 which 3 are 3 cross 3- 3 sectional 3 views 3 of 3 the 3 lcd 3 mother 3 substrate 3 taken 3 along 3 a 3- 3 a 3' 3 in 3 fig. 31A 3; 3 Please refer to fig. 1H, which is a partially enlarged view of B in fig. 1A.

a first substrate 101, the first substrate 101 having at least one cutting line 101 a;

a second substrate 102 disposed opposite to the first substrate 101;

the supporting member 103 is located between the first substrate 101 and the second substrate 102, and at least a portion of the supporting member 103 is located on one side of the first substrate 101 close to the cutting line 101a, so as to improve a supporting force between the supporting member 103 and the first substrate 101, prevent the first substrate 101 from being cracked or not cracked when being cut along the cutting line 101a, reduce a breakage rate, and improve a yield of products.

To ensure that the second substrate 102 and the supporting member 103 have sufficient supporting force when the first substrate 101 is cut along the cutting line 101a, the supporting member 103 is disposed near the cutting line 101a in a top view. Further, to avoid the support member 103 affecting the cutting process of the first substrate 101, the support member 103 and the cutting line 101a have a first distance d from each other in a top view, and the first distance d is greater than or equal to 50 micrometers and less than or equal to 200 micrometers. Further, the first pitch d is equal to 150 μm, as shown in fig. 1H.

Generally, the lcd mother substrate is to maintain a certain cell thickness between the first substrate 101 and the second substrate 102, and a spacer is disposed between the first substrate 101 and the second substrate 102 to support the first substrate 101 and the second substrate 102, so that the spacer disposed between the first substrate 101 and the second substrate 102 inside the scribe line 101a can provide support for the first substrate 101 and the second substrate 102. Thus, in a top view, the support 103 may be located on at least one side of the cutting line 101 a; further, in a top view, the supporting member 103 is located outside the cutting line 101a to improve a supporting force between the first substrate 101 and the second substrate 102, so as to avoid a problem that the first substrate 101 is not supported outside the cutting line 101a when the first substrate 101 is cut along the cutting line 101a, which causes a crack of the liquid crystal display mother board. The outer side of the scribe line 101a and the inner side of the scribe line 101a are defined by the scribe line 101a, the first substrate 101 located at the outer side of the scribe line 101a is cut off after the dicing process, and the first substrate 101 located at the inner side of the scribe line 101 is retained.

Further, since the spacers are located in the display panel 100 formed by the first substrate 101 and the second substrate 102, the spacers are located at a certain distance from the cutting line 101a, and the larger the distance, the smaller the support of the first substrate 101 and the second substrate 102 at the cutting line 101a is. Therefore, to ensure that the first substrate 101 and the second substrate 102 have sufficient supporting force at the cutting line 101a, the supporting members 103 are disposed at both sides of the cutting line 101a and near the cutting line 101 a.

The height of the supporting member 103 is equal to the distance between the first substrate 101 and the second substrate 102, so that when the first substrate 101 is cut along the cutting line 101a, the second substrate 102 and the supporting member 103 can completely support the first substrate 101, thereby reducing the problem of chipping.

At least a portion of the support member 103 is located on a side of the first substrate 101 close to the scribe line 101 a; further, the supporting member 103 may be disposed on a side of the second substrate 102 near the cutting line 101 a. Specifically, referring to fig. 1B to fig. 1G, the support member 103 includes a first support member 1031 and a second support member 1032, and in a top view, the first support member 1031 and the second support member 1032 partially overlap to further improve the supporting force of the support member 103.

Wherein the first support 1031 may be located on a side of the first substrate 101 close to the scribe line 101a, the second support 1032 may be located on a side of the second substrate 102 close to the scribe line 101a, and after the first substrate 101 and the second substrate 102 are combined into a cassette, the first support 1031 and the second support 1032 are directly connected to support the first substrate 101 and the second substrate 102, as shown in fig. 1B.

Further, the second support 1032 may be located at a side of the first substrate 101 and the second substrate 102 near the scribe line 101 a; the first support 1031 is located on one side of the second substrate 102 close to the cutting line 101 a; or the first support 1031 is located on one side of the first substrate 102 close to the cutting line 101 a; after the first substrate 101 and the second substrate 102 are assembled into a cassette, the first support 1031 and the second support 1032 directly interface to support the first substrate 101 and the second substrate 102, as shown in fig. 1C. Similarly, the first support 1031 may be located on one side of the first substrate 101 and the second substrate 102 close to the cutting line 101 a; the second support 1032 is located on a side of the second substrate 102 near the scribe line 101 a; or the second support 1032 is located at a side of the first substrate 102 near the scribe line 101 a.

With continued reference to fig. 1D to 1G, the first support 1031 includes a first master support 1031a and a first slave support 1031b, and the thickness of the first master support 1031a is smaller than that of the first slave support 1031b, as shown in fig. 1D; the first main support 1031a is disposed in superposition with the second support 1032 in a top view; so that the first main support 1031a is closely connected to the second support 1032, and the first substrate 101 is supported by the first main support 1031a, the second support 1032 and the second substrate 102 when the first substrate 101 is cut along the cutting line 101 a. In order to increase the supporting force of the supporting members 103, the sum of the heights of the second supporting members 1032, with which the first main supporting members 1031a are overlapped, is equal to the distance between the first substrate 101 and the second substrate 102. A plurality of through holes for accommodating the first slave supporters 1031b are disposed in the second supporters 1032, as shown in fig. 1D and 1F to 1G.

Further, the second support 1032 comprises a second master support 1032a and a second slave support 1032 b; the thickness of the second master support 1032a is less than the thickness of the second slave support 1032b, as shown in fig. 1E-1G; in a top view, the first main support 1031a and the second main support 1032a are disposed in a superposition manner.

Further, the thickness of the first slave support 1031b is equal to the distance between the first substrate 101 and the second substrate 102; the thickness of the second slave supporter 1032b is equal to the distance between the first substrate 101 and the second substrate 102, as shown in fig. 1F to 1G.

The first support 1031 is at least one of a circular truncated cone, a cylinder, a truncated pyramid and a prism, and the second support 1032 is a continuous structure; specifically, the second support 1032 is at least one of a prism and a rectangular parallelepiped disposed along the extending direction of the cutting line 101 a.

With reference to fig. 1H, the first support 1032 is a cylinder, and the diameter of the first support 1031 is greater than or equal to 90 microns and less than or equal to 120 microns. The size of the first support 1031 close to the dicing line 101a is larger than the size of the first support 1031 far from the dicing line 101a to ensure that the first substrate 101 has a sufficient supporting force at the dicing line 101 a. The distribution of the first support 1031 and the second support 1032 in the top view can be set according to actual requirements, and as an exemplary illustration only in the partially enlarged view shown in fig. 1H, the distribution can be set by those skilled in the art according to actual requirements.

The first support 1031 is made of a photoresist material, and the second support 1032 is made of a polyimide material.

Further, the second supporting member 1032 is disposed on the same layer as the alignment layer, and the second supporting member 1032 and the alignment layer are disposed discontinuously, so as to prevent the supporting member 103 from interfering with the alignment layer. Wherein the alignment layer is located in the display panel 100 formed by the first substrate 101 and the second substrate 102.

Specifically, the first support 1031 and the second support 1032 can be completed in synchronization with the first substrate 101 process or the second substrate 102 process; that is, if the first support 1031 is located on one side of the first substrate 101 close to the cutting line 101a, one of the processes of the first support 1031 and the first substrate 101 is completed simultaneously, for example, when the first substrate 101 includes a process of preparing a spacer, the first support 1031 and the spacer are prepared on the same layer; further, when the first substrate 101 includes a process of preparing a black matrix, the first support 1031 and the black matrix are prepared on the same layer; similarly, if the first support 1031 is located on one side of the second substrate 102 close to the cutting line 101a, the first support 1031 and the second substrate 102 are completed simultaneously, such as when the second substrate 102 includes a spacer preparation process; the first support 1031 and the spacer are prepared on the same layer; further, when the second substrate 102 includes a process of preparing a black matrix or a black Spacer (BPS), the first support 1031 and the black matrix or the black Spacer are prepared in the same layer.

Similarly, if the second support 1032 is located at a side of the first substrate 101 and/or the second substrate 102 near the cutting line 101a, the second support 103 is completed in synchronization with one of the processes of the first substrate 101 and/or the second substrate 102, for example, when the first substrate 101 and/or the second substrate 102 includes a process for preparing an alignment layer, the second support 1032 may be prepared in the same layer as the alignment layer, so as to reduce the number of process steps.

In addition, the first support 1031 and the second support 1032 may not be completed simultaneously with the first substrate 101 process and/or the second substrate 102 process, but may be completed by separate processes, which is not described herein again.

In addition to the lcd mother board shown in fig. 1B to 1G, all of the supporters 103 in the lcd mother board may be located on a side of the first substrate 101 close to the cutting lines 101a, so as to reduce the number of manufacturing processes. Similarly, the plurality of supporting members 103 may be all located on one side of the second substrate 102 close to the cutting line 101a, and the description thereof is omitted here.

In addition, the support member 103 positioned at a side of the first substrate 101 close to the cutting line 101a may be positioned outside the cutting line 101a, and the support member 103 positioned at a side of the second substrate 102 close to the cutting line 101a may be positioned inside the cutting line 101 a; similarly, the supporting element 103 on the side of the first substrate 101 close to the cutting line 101a may be located inside the cutting line 101a, and the supporting element 103 on the side of the second substrate 102 close to the cutting line 101a may be located outside the cutting line 101a, which is not described herein again.

With reference to fig. 1A, the lcd mother board further includes a plurality of display panels 100 and alignment terminals 104 disposed on the second substrate 102; in a top view, the alignment terminal 104 is located outside the cutting line 101 a; the first substrate 101 and the second substrate 102 have liquid crystals disposed in regions corresponding to the display panel 100; after the first substrate 101 is cut along the cutting line 101a, the alignment terminal 104 is exposed, so that a voltage is applied to the alignment terminal 104 to perform a curing process, thereby generating a pretilt angle for the liquid crystal and increasing a deflection reaction speed of the liquid crystal.

In order to prevent the support member 103 from interfering with the alignment terminal 104, the support member 103 is located between the cutting line 101a and the alignment terminal 104 in a top view.

The first substrate 101 is one of a color filter substrate and an array substrate, and the second substrate 102 is the other one of the color filter substrate and the array substrate. Further, the first substrate 101 is a color filter substrate, and the second substrate 102 is an array substrate. Further, the second substrate includes a portion not shown such as a thin film transistor. In order to realize the full-color display of the display panel 100, the display panel 100 further includes a color film layer, and the color film layer may be located on the first substrate 101 side or on the second substrate 102 side, which is not described herein again.

It can be understood that the greater the number of the supporting members 103, the more beneficial the supporting force between the first substrate 101 and the second substrate 102 is, and the number and the distribution of the supporting members 103 can be set according to actual requirements, which is not described herein again.

In the present application, the cutting line 101a is disposed on the first substrate 101 for example, and it is understood that the cutting line 101a may also be disposed on the second substrate 102, and the support member 103 may also be disposed in the above manner, which is not described herein again.

The liquid crystal display mother board that this application embodiment provided includes: a first substrate 101, the first substrate 101 having at least one cutting line 101 a; a second substrate 102 disposed opposite to the first substrate 101; the supporting member 103 is located between the first substrate 101 and the second substrate 102, and at least a portion of the supporting member 103 is located on a side of the first substrate 101 close to the cutting line 101a, so as to improve a supporting force of the second substrate 102 on the first substrate 101, improve a problem that a crack or a non-crack of a cut piece is likely to occur when the first substrate 101 is cut in a manufacturing process, and improve a yield of products.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The liquid crystal display mother board provided by the embodiment of the present application is described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understanding the technical scheme and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. A liquid crystal display mother panel, comprising:

a first substrate having at least one cutting line;

a second substrate disposed opposite to the first substrate;

2. The lcd mother panel of claim 1, wherein the support member comprises a first support member and a second support member, and the first support member and the second support member partially overlap in a top view.

3. The lcd motherboard of claim 2, wherein the first support comprises a first main support and a first slave support, the first main support has a thickness smaller than that of the first slave support, and the first main support and the second support are disposed in a manner of being overlapped in a top view.

4. The lcd motherboard of claim 3, wherein the second support member comprises a second master support member and a second slave support member; the thickness of the second main supporting piece is smaller than that of the second auxiliary supporting piece, and the first main supporting piece and the second main supporting piece are arranged in a superposition mode in a top view.

5. The mother liquid crystal display panel according to claim 4, wherein the thickness of the first slave supporter is equal to a distance between the first substrate and the second substrate; the thickness of the second slave support is equal to the distance between the first substrate and the second substrate.

6. The mother liquid crystal display panel according to claim 2, wherein the first support member is at least one of a circular truncated cone, a cylinder, a truncated pyramid, and a prism.

7. The liquid crystal display mother panel according to claim 2, wherein the preparation material of the first support member comprises a photoresist material, and the preparation material of the second support member comprises a polyimide.

8. The LCD mother board of claim 7, wherein the second supporting member is disposed on the same layer as the alignment layer, and the second supporting member is disposed intermittently with respect to the alignment layer.

9. The lcd motherboard of claim 1, wherein the support member has a first spacing from the cutting line in a top view, the first spacing being greater than or equal to 50 microns and less than or equal to 200 microns.

10. The liquid crystal display mother panel of claim 9, wherein the first pitch is equal to 150 microns.