CN111670271B - Surface treatment device and surface treatment method - Google Patents

Surface treatment device and surface treatment method Download PDF

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Publication number
CN111670271B
CN111670271B CN201980010990.8A CN201980010990A CN111670271B CN 111670271 B CN111670271 B CN 111670271B CN 201980010990 A CN201980010990 A CN 201980010990A CN 111670271 B CN111670271 B CN 111670271B
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electrode
hole
treatment
processing hole
processing
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CN111670271A (en
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古川雄贵
山中将裕
佐佐木龙也
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Honda Motor Co Ltd
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Honda Motor Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Abstract

The present invention relates to a surface treatment apparatus and a surface treatment method. The electrodes (30) of the surface treatment device (10) are composed of a 1 st electrode (36) and a 2 nd electrode (38). The 1 st electrode (36) is inserted from one opening (18) of the processing hole (12) having the bent portion (16). The 2 nd electrode (38) is inserted from the other opening (22) of the processing hole (12). A1 st tip portion (40) of the 1 st electrode (36) and a 2 nd tip portion (46) of the 2 nd electrode (38) are brought into contact with each other via an insulating member (52) in the bent portion (16), whereby the 1 st electrode (36) and the 2 nd electrode (38) are integrated in an electrically insulated state.

Description

Surface treatment device and surface treatment method
Technical Field
The present invention relates to a surface treatment apparatus and a surface treatment method for performing surface treatment on an inner wall surface of a treatment hole.
Background
For example, as described in japanese patent laid-open publication No. 2013-159832, an electrolytic treatment liquid is circulated through the inside of a treatment hole into which a tubular electrode is inserted, and electric current is passed between the electrode and the inner wall surface of the treatment hole, thereby performing surface treatment such as plating or anodic oxide film formation on the inner wall surface.
Disclosure of Invention
The present invention has been made in view of the above-described problems, and it is a main object of the present invention to provide a surface treatment apparatus capable of efficiently and highly performing a surface treatment on an inner wall surface of a treatment hole without performing a complicated step such as masking (masking) even in the treatment hole having a plurality of linear portions extending in different directions.
Another object of the present invention is to provide a surface treatment method capable of efficiently and highly-quality surface-treating an inner wall surface of a treatment hole having a plurality of linear portions extending in different directions without a complicated step such as masking, even in the treatment hole.
According to one aspect of the present invention, there is provided a surface treatment apparatus including an electrode, wherein an electrolytic treatment liquid is caused to flow through a treatment hole into which the electrode is inserted, and a surface treatment is performed on the inner wall surface of the treatment hole by passing current between the electrode and the inner wall surface, wherein the electrode is composed of a 1 st electrode and a 2 nd electrode, the 1 st electrode and the 2 nd electrode are integrated in an electrically insulated state with an insulating member interposed therebetween, the 1 st electrode is inserted from one opening of the processing hole having a bent portion, the 2 nd electrode is inserted from the other opening of the processing hole, the 1 st electrode and the 2 nd electrode are integrated by the 1 st distal end portion of the 1 st electrode and the 2 nd distal end portion of the 2 nd electrode coming into contact with each other via the insulating member inside the bent portion.
Here, for example, in a processing hole having a bent portion in the middle of the extending direction, the extending direction is different between a linear portion (1 st linear portion) between one opening and the bent portion and a linear portion (2 nd linear portion) between the other opening and the bent portion. For example, when the inner wall surface of the processing hole is subjected to surface treatment using a general electrode having a linear appearance, first, masking is performed so that the electrolytic processing solution does not contact the inner wall surface of the 1 st linear portion. Next, an electrode is inserted from the other opening of the processing hole so as to face the inner wall surface of the 2 nd linear portion.
Next, an energization step of performing a surface treatment on the inner wall surface is performed, the energization step including: an electrolytic processing liquid is caused to flow through the inside of the processing hole, and an electric current is passed between the electrode and the inner wall surface of the 2 nd linear portion. Next, the mask applied to the inner wall surface of the 1 st linear portion is removed, and the mask applied to the inner wall surface of the 2 nd linear portion subjected to the surface treatment is applied. Next, similarly to the surface treatment applied to the inner wall surface of the 2 nd linear portion, the surface treatment is also applied to the inner wall surface of the 1 st linear portion by the energization step. That is, in order to perform surface treatment on the treatment hole having the bent portion using a general electrode having a linear external shape, a plurality of masking steps and a plurality of energization steps are required.
However, in the surface treatment apparatus according to the present invention including the 1 st electrode and the 2 nd electrode integrated as described above, the energization step can be performed in a state where the 1 st electrode faces the inner wall surface of the 1 st linear portion of the treatment hole and the 2 nd electrode faces the inner wall surface of the 2 nd linear portion. Accordingly, both the inner wall surface of the 1 st linear portion and the inner wall surface of the 2 nd linear portion of the processing hole can be subjected to surface treatment by a common energization step without going through a complicated step such as masking.
Further, since the 1 st electrode and the 2 nd electrode are insulated, current can be independently supplied to the 1 st electrode and the 2 nd electrode to conduct current. Accordingly, for example, compared to a case where the current is supplied from the base end side of the 1 st electrode to the base end side of the 2 nd electrode via the 1 st tip portion and the 2 nd tip portion without insulating the 1 st electrode and the 2 nd electrode, it is possible to suppress a difference in current distribution from occurring between the inner wall surfaces of the 1 st linear portion and the 2 nd linear portion of the processing hole. As a result, the inner wall surfaces of both the 1 st and 2 nd linear portions of the processing hole can be surface-treated substantially uniformly.
As described above, according to the surface treatment apparatus, even when the treatment hole is formed in a shape having a bent portion, the surface treatment can be efficiently performed on the inner wall surface of the treatment hole with high quality.
In the surface treatment apparatus, it is preferable that the 1 st electrode and the 2 nd electrode are hollow bodies having tubular portions, a 1 st closing portion for closing a distal end of the 1 st electrode is provided at the 1 st distal end portion, a 2 nd closing portion for closing a distal end of the 2 nd electrode is provided at the 2 nd distal end portion, a 1 st inner electrode is provided at the 1 st electrode, the 1 st inner electrode extends in the axial direction inside the 1 st electrode and is electrically connected to the 1 st closing portion, and a 2 nd inner electrode is provided at the 2 nd electrode, the 2 nd inner electrode extends in the axial direction inside the 2 nd electrode and is electrically connected to the 2 nd closing portion.
In this case, by supplying a current to the 1 st electrode through the 1 st inner electrode, a current can be made to flow from the 1 st distal end side provided with the 1 st closing portion to the proximal end side. Similarly, the 2 nd electrode can also flow a current from the 2 nd distal end side provided with the 2 nd closing portion to the proximal end side by supplying a current to the 2 nd electrode via the 2 nd internal electrode. Accordingly, since the electric current can be favorably passed between the 1 st and 2 nd closures and the inner wall surface of the bent portion of the processing hole, the surface treatment can be effectively performed also on the inner wall surface of the bent portion of the processing hole.
According to another aspect of the present invention, there is provided a surface treatment apparatus including an electrode for performing a surface treatment on an inner wall surface of a treatment hole into which the electrode is inserted by passing an electrolytic treatment liquid through the inside of the treatment hole, and by passing a current between the electrode and the inner wall surface of the treatment hole, wherein the electrode is composed of a 1 st electrode and a 2 nd electrode, the 1 st electrode and the 2 nd electrode are integrated in an electrically insulated state with an insulating member interposed therebetween, and the treatment hole is composed of a 1 st treatment hole and a 2 nd treatment hole, wherein the 2 nd treatment hole is provided with an opening on the inner wall surface of the 1 st treatment hole, an inserted portion is provided on a portion of the 1 st electrode inserted into the 1 st treatment hole facing the opening of the 2 nd treatment hole, and a distal end portion of the 2 nd electrode is inserted into the inserted portion, the 1 st electrode and the 2 nd electrode are integrated, and the insulating member is interposed between the inserted portion and the distal end portion of the 2 nd electrode.
The processing hole including the 1 st processing hole and the 2 nd processing hole having an opening in an inner wall surface of the 1 st processing hole, in other words, the 2 nd processing hole branched from the 1 st processing hole also has a plurality of linear portions having different extending directions. Even when the inner wall surfaces of such treatment wells are surface-treated using a general electrode having a linear appearance, it is necessary to perform a masking or energization step for each of the 1 st treatment well and the 2 nd treatment well.
In contrast, in the surface treatment apparatus according to the present invention having the 1 st electrode and the 2 nd electrode integrated as described above, the energization step can be performed in a state where the 1 st electrode faces the inner wall surface of the 1 st treatment hole and the 2 nd electrode faces the inner wall surface of the 2 nd treatment hole. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the 1 st processing hole and the 2 nd processing hole in the common energization step without performing a complicated step such as masking. Further, since the 1 st electrode and the 2 nd electrode are insulated, current can be independently supplied to the 1 st electrode and the 2 nd electrode to conduct current. Accordingly, the inner wall surfaces of both the 1 st and 2 nd processing holes can be substantially uniformly surface-treated.
As described above, according to the surface treatment apparatus, even when the treatment hole is formed in a shape having a branch portion, the surface treatment can be efficiently performed on the inner wall surface of the treatment hole with high quality.
In the surface treatment apparatus, it is preferable that the 1 st electrode is a hollow body having a tubular portion, the inserted portion is formed of a hole penetrating through a peripheral wall of the 1 st electrode, the insulating member is provided inside the inserted portion, a female screw is formed in the insulating member, a male screw is formed at the distal end portion of the 2 nd electrode, and the 1 st electrode and the 2 nd electrode are positioned and fixed by screwing the female screw and the male screw. In this case, since the energization step can be performed while maintaining the positional relationship between the inner wall surfaces of the 1 st processing hole and the 2 nd processing hole and the outer peripheral surfaces of the 1 st electrode and the 2 nd electrode in a satisfactory manner, the surface treatment can be performed with further high quality.
In the surface treatment apparatus, it is preferable that a closing portion which closes a distal end of the 1 st electrode and faces a bottom surface of the 1 st treatment hole having a bottom is provided at a distal end portion of the 1 st electrode, and an inner electrode which extends in an axial direction of the 1 st electrode and is electrically connected to the closing portion is provided inside the 1 st electrode. In this case, by supplying a current from the inner electrode, the current can be made to flow from the distal end side to the proximal end side of the 1 st electrode provided with the closed portion. Accordingly, since the electric current can be favorably passed between the closing portion and the bottom surface of the 1 st processing hole, the surface treatment can be effectively performed also on the bottom surface.
According to another aspect of the present invention, there is provided a surface treatment apparatus including an electrode for performing a surface treatment on an inner wall surface of a treatment hole into which the electrode is inserted by passing an electrolytic treatment liquid through the inside of the treatment hole, and passing a current between the electrode and the inner wall surface of the treatment hole, wherein the electrode includes a 1 st electrode and a 2 nd electrode, the 1 st electrode and the 2 nd electrode are integrated in an electrically insulated state with an insulating member interposed therebetween, the 1 st electrode and the 2 nd electrode are hollow bodies having a tubular portion, an outer diameter of the 1 st electrode is larger than an outer diameter of the 2 nd electrode, the treatment hole includes a 1 st treatment hole having a bottom and a 2 nd treatment hole having a bottom intersecting the 1 st treatment hole, and a portion of the 1 st electrode inserted into the 1 st treatment hole and disposed at an intersection of the 1 st treatment hole and the 2 nd treatment hole, a penetration hole is formed in the 2 nd processing hole in the extending direction, the 2 nd electrode inserted into the 2 nd processing hole is integrated with the 1 st electrode by being penetrated through the penetration hole, and the insulating member is interposed between the penetration hole and the 2 nd electrode.
The processing well including the 1 st processing well and the 2 nd processing well intersecting with the 1 st processing well also has a plurality of linear portions extending in different directions. Even when the inner wall surfaces of such treatment wells are surface-treated using a general electrode having a linear appearance, it is necessary to perform a masking or energization step for each of the 1 st treatment well and the 2 nd treatment well.
In contrast, in the surface treatment apparatus according to the present invention having the 1 st electrode and the 2 nd electrode integrated as described above, the energization step can be performed in a state where the 1 st electrode faces the inner wall surface of the 1 st treatment hole and the 2 nd electrode faces the inner wall surface of the 2 nd treatment hole. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the 1 st processing hole and the 2 nd processing hole in the common energization step without performing a complicated step such as masking. Further, since the 1 st electrode and the 2 nd electrode are insulated, current can be independently supplied to the 1 st electrode and the 2 nd electrode to conduct current. Accordingly, the inner wall surfaces of both the 1 st and 2 nd processing holes can be substantially uniformly surface-treated.
As described above, according to the surface treatment apparatus, even when the treatment hole has a shape having an intersecting portion, the surface treatment can be efficiently performed on the inner wall surface of the treatment hole with high quality.
In the surface treatment apparatus, it is preferable that the 2 nd electrode is inserted into the 2 nd treatment hole having a smaller diameter than the 1 st treatment hole. In this way, the outer peripheral surface of the 2 nd electrode is opposed to the inner wall surface of the 2 nd processing hole having a smaller diameter than the 1 st processing hole, based on the outer diameter of the 2 nd electrode smaller than the outer diameter of the 1 st electrode. Accordingly, the occurrence of a current density difference in the inner wall surfaces of both the 1 st and 2 nd process holes is suppressed, and the surface treatment is easily performed substantially uniformly on the inner wall surfaces of both the 1 st and 2 nd process holes.
In the surface treatment apparatus, it is preferable that a closing portion that closes a distal end of the 1 st electrode and faces a bottom surface of the 1 st treatment hole is formed at a distal end portion of the 1 st electrode, an inner diameter of the 1 st electrode is larger than an outer diameter of the 2 nd electrode, and an inner electrode that passes between an inner peripheral surface of the 1 st electrode and an outer peripheral surface of the 2 nd electrode, extends in an axial direction of the 1 st electrode, and is electrically connected to the closing portion of the 1 st electrode is provided inside the 1 st electrode.
In this case, since a current can be made to flow from the distal end side to the proximal end side of the 1 st electrode provided with the sealing portion by supplying a current from the inner electrode, the surface treatment can be effectively performed also on the bottom surface of the 1 st treatment hole facing the sealing portion.
In the surface treatment apparatus, it is preferable that a closing portion which is arranged to close a distal end of the 2 nd electrode and face a bottom surface of the 2 nd treatment hole is provided at a distal end portion of the 2 nd electrode, and an inner electrode which extends in an axial direction inside the 2 nd electrode and is electrically connected to the closing portion of the 2 nd electrode is provided at the 2 nd electrode. In this case, the bottom surface of the 2 nd processing hole facing the 2 nd electrode in the closing portion can be effectively subjected to surface treatment.
According to another embodiment of the present invention, there is provided a surface treatment method for performing a surface treatment on an inner wall surface of a treatment hole using an electrode including a 1 st electrode and a 2 nd electrode, the surface treatment method including an integration step of: integrating the 1 st electrode and the 2 nd electrode in an electrically insulated state via an insulating member inside the processing hole; the electrifying process comprises the following steps: in the integrating step, the insulating member is provided at least one of a 1 st distal end portion of the 1 st electrode and a 2 nd distal end portion of the 2 nd electrode, the 1 st electrode is inserted from one opening of the treatment hole having a bent portion, the 2 nd electrode is inserted from the other opening of the treatment hole, and the 1 st distal end portion and the 2 nd distal end portion are brought into contact with each other via the insulating member inside the bent portion.
In the process hole, by the integration step of integrating the 1 st electrode and the 2 nd electrode as described above, the energization step can be performed in a state where the 1 st electrode is opposed to the inner wall surface of the linear portion (1 st linear portion) between one opening and the bent portion of the process hole and the 2 nd electrode is opposed to the inner wall surface of the linear portion (2 nd linear portion) between the other opening and the bent portion. Accordingly, the inner wall surfaces of both the 1 st and 2 nd linear portions can be subjected to surface treatment by a common energization process without going through a complicated process such as masking. Further, since the 1 st electrode and the 2 nd electrode are insulated, current can be independently supplied to the 1 st electrode and the 2 nd electrode to conduct current. Accordingly, the inner wall surfaces of both the 1 st and 2 nd linear portions of the processing hole can be substantially uniformly surface-treated.
As described above, according to the surface treatment method, even when the treatment hole has a shape having a bent portion, the inner wall surface of the treatment hole can be efficiently surface-treated with high quality.
In the surface treatment method, it is preferable that in the energization step, the 1 st electrode is energized via a 1 st inner electrode extending in the axial direction inside the 1 st electrode formed of a hollow body having a tubular portion and electrically connected to a 1 st closing portion closing a tip end of the 1 st electrode, and the 2 nd electrode is energized via a 2 nd inner electrode; the 2 nd inner electrode extends in the axial direction inside the 2 nd electrode formed of a hollow body having a tubular portion, and is electrically connected to a 2 nd closing portion closing a tip end of the 2 nd electrode.
In this case, since the electric current can be favorably passed between the 1 st and 2 nd closures and the inner wall surface of the bent portion of the processing hole, the surface treatment can be effectively performed also on the inner wall surface of the bent portion of the processing hole.
According to another aspect of the present invention, there is provided a surface treatment method for performing a surface treatment on an inner wall surface of a treatment hole using an electrode including a 1 st electrode and a 2 nd electrode, the surface treatment method including an integration step of: integrating the 1 st electrode and the 2 nd electrode in an electrically insulated state via an insulating member inside the processing hole; the electrifying process comprises the following steps: and passing an electrolytic treatment liquid through the inside of the treatment hole, and passing a current between the 1 st electrode and the 2 nd electrode and the inner wall surface of the treatment hole, wherein in the integrating step, the 1 st electrode is inserted into the 1 st treatment hole of the treatment hole composed of the 1 st treatment hole and the 2 nd treatment hole, the 2 nd electrode is inserted into the 2 nd treatment hole, and the distal end portion of the 2 nd electrode is inserted into the inserted portion of the 1 st electrode via the insulating member, wherein the 1 st treatment hole is a treatment hole having a bottom, the 2 nd treatment hole is a treatment hole having an opening formed in the inner wall surface of the 1 st treatment hole, and the inserted portion is provided in a portion of the 1 st electrode facing the opening of the 2 nd treatment hole.
In the process well, by the integration step of integrating the 1 st electrode and the 2 nd electrode as described above, the energization step can be performed in a state where the 1 st electrode is opposed to the inner wall surface of the 1 st process well and the 2 nd electrode is opposed to the inner wall surface of the 2 nd process well. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the 1 st processing hole and the 2 nd processing hole through the common energization step without going through a complicated step such as masking. Further, since the 1 st electrode and the 2 nd electrode are insulated, in the energization step, the 1 st electrode and the 2 nd electrode can be energized by independently supplying current thereto. Accordingly, the inner wall surfaces of both the 1 st and 2 nd processing holes can be substantially uniformly surface-treated.
As described above, even when the treatment hole is formed in a shape having a branch portion, the inner wall surface of the treatment hole can be efficiently surface-treated with high quality.
In the surface treatment method, it is preferable that the 1 st electrode is formed of a hollow body having a tubular portion, the inserted portion is formed of a hole penetrating through a peripheral wall of the 1 st electrode, and in the integrating step, a female screw formed in the insulating member provided inside the inserted portion is screwed to a male screw formed in the distal end portion of the 2 nd electrode, thereby positioning and fixing the 1 st electrode and the 2 nd electrode. In this case, since the energization step can be performed while maintaining the positional relationship between the inner wall surfaces of the 1 st processing hole and the 2 nd processing hole and the outer peripheral surfaces of the 1 st electrode and the 2 nd electrode in a satisfactory manner, the surface treatment can be performed with further high quality.
In the surface treatment method, it is preferable that in the energization step, the 1 st electrode is energized via a 1 st inner electrode extending in the axial direction inside the 1 st electrode and electrically connected to the 1 st closed portion in a state where the 1 st closed portion closing the tip of the 1 st electrode faces the bottom surface of the 1 st processing hole. In this case, since the current can be favorably passed between the blocking portion of the 1 st electrode and the bottom surface of the 1 st processing hole, the surface treatment can be effectively performed on the surface.
According to another aspect of the present invention, there is provided a surface treatment method for performing a surface treatment on an inner wall surface of a treatment hole using an electrode comprising a 1 st electrode and a 2 nd electrode, the surface treatment method comprising an integration step of: integrating the 1 st electrode and the 2 nd electrode in an electrically insulated state via an insulating member inside the processing hole; the electrifying process comprises the following steps: passing an electrolytic processing liquid through the inside of the processing hole, and passing a current between the 1 st electrode and the 2 nd electrode, which are hollow bodies having tubular portions, and the inner wall surface of the processing hole, in the integrating step, after the 1 st electrode having an outer diameter larger than that of the 2 nd electrode is inserted into the 1 st processing hole of the processing holes including the 1 st processing hole and the 2 nd processing hole, inserting the 2 nd electrode into the 2 nd processing hole, and inserting the 2 nd electrode into the insertion hole of the 1 st electrode through the insulating member, wherein the 1 st processing well is a bottomed processing well, the 2 nd processing well is a bottomed processing well intersecting the 1 st processing well, the through hole is formed in a portion of the 1 st electrode disposed at an intersection of the 1 st processing hole and the 2 nd processing hole.
In the process well, by the integration step of integrating the 1 st electrode and the 2 nd electrode as described above, the energization step can be performed in a state where the 1 st electrode is opposed to the inner wall surface of the 1 st process well and the 2 nd electrode is opposed to the inner wall surface of the 2 nd process well. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the 1 st processing hole and the 2 nd processing hole through the common energization step without going through a complicated step such as masking. Further, since the 1 st electrode and the 2 nd electrode are insulated, in the energization step, the 1 st electrode and the 2 nd electrode can be energized by independently supplying current thereto. Accordingly, the inner wall surfaces of both the 1 st and 2 nd processing holes can be substantially uniformly surface-treated.
As described above, according to the surface treatment method, even when the treatment hole has a shape having an intersecting portion, the inner wall surface of the treatment hole can be efficiently surface-treated with high quality.
In the surface treatment method, it is preferable that the 2 nd electrode is inserted into the 2 nd processing hole having a smaller diameter than the 1 st processing hole in the integrating step. In this case, the occurrence of a current density difference in the inner wall surfaces of both the 1 st processing hole and the 2 nd processing hole is suppressed, and the surface treatment is easily performed substantially uniformly on the inner wall surfaces of both the 1 st processing hole and the 2 nd processing hole.
In the surface treatment method, it is preferable that the 1 st electrode has an inner diameter larger than an outer diameter of the 2 nd electrode, and in the energization step, the 1 st electrode is energized via an inner electrode which passes through between an inner peripheral surface of the 1 st electrode and an outer peripheral surface of the 2 nd electrode, extends in an axial direction of the 1 st electrode, and is electrically connected to the closed portion of the 1 st electrode, in a state where a closed portion closing a tip end of the 1 st electrode faces a bottom surface of the 1 st treatment hole. In this case, since a current can be supplied from the inner electrode of the 1 st electrode, the current can be flowed from the distal end side to the proximal end side of the 1 st electrode, and thus the bottom surface of the 1 st processing hole facing the closing portion of the 1 st electrode can also be effectively subjected to surface treatment.
In the surface treatment method, it is preferable that in the energization step, the 2 nd electrode is energized via an inner electrode extending in the axial direction inside the 2 nd electrode and electrically connected to the sealing portion of the 2 nd electrode, in a state where the sealing portion sealing the distal end of the 2 nd electrode faces the bottom surface of the 2 nd processing hole. In this case, since a current can be supplied from the inner electrode of the 2 nd electrode to the base end side from the distal end side of the 2 nd electrode, the surface treatment can be effectively performed also on the bottom surface of the 2 nd treatment hole facing the sealing portion of the 2 nd electrode.
Drawings
Fig. 1 is a schematic configuration diagram of a main part of a surface treatment apparatus according to embodiment 1 of the present invention and a treatment hole for performing surface treatment on an inner wall by the surface treatment apparatus.
Fig. 2 is an enlarged view of a main portion of fig. 1.
Fig. 3 is an enlarged view of a main portion of an electrode and a processing hole according to a modification of the surface treatment apparatus of fig. 1.
Fig. 4 is a schematic configuration diagram of a main part of a surface treatment apparatus according to embodiment 2 of the present invention and a treatment hole for performing surface treatment on an inner wall by the surface treatment apparatus.
Fig. 5 is an enlarged view of a main portion of fig. 4.
Fig. 6 is a schematic configuration diagram of a main part of a surface treatment apparatus according to embodiment 3 of the present invention and a treatment hole for performing surface treatment on an inner wall by the surface treatment apparatus.
Fig. 7 is an enlarged view of a main portion of fig. 6.
Fig. 8 is a cross-sectional view taken along line VIII-VIII of the electrode of fig. 7.
Detailed Description
The surface treatment apparatus and the surface treatment method according to the present invention will be described in detail with reference to the drawings. In the following drawings, the same reference numerals are given to constituent elements that perform the same or similar functions and effects, and redundant description may be omitted.
The surface treatment apparatus and the surface treatment method according to the present invention can be suitably applied to, for example, cases where the surface to be treated is subjected to electric surface treatment such as plating, electrolytic etching, electrolytic degreasing, electrodeposition coating, anodic oxidation, cathodic oxidation, electrolytic polishing, or pretreatment or post-treatment of these treatments. The following describes an example of plating performed by the surface treatment apparatus and the surface treatment method, but the present invention is not limited thereto.
As shown in fig. 1, the surface treatment apparatus 10 according to embodiment 1 forms a plating film (not shown) on an inner wall surface of a treatment hole 12. Examples of the plating film include a film made of a zinc alloy such as a zinc-nickel composite plating film. In this case, the plating film can be formed using an electrolytic treatment liquid composed of a plating bath prepared by mixing zinc chloride, nickel chloride, ammonium chloride, and the like.
The treatment hole 12 is a cooling passage to which cooling water for cooling the casting die 14 is supplied, and is formed in the casting die 14, for example, and has a bent portion 16 in the middle of the extending direction. That is, the 1 st linear portion 20 and the 2 nd linear portion 24 of the processing hole 12 are different in extending direction from each other, wherein the 1 st linear portion 20 is a portion from one opening 18 to the bent portion 16; the 2 nd linear portion 24 is a portion from the other opening 22 to the bent portion 16.
The casting die 14 is made of an alloy steel material or the like, and supplies cooling water into the treatment holes 12. Accordingly, temperature control is performed to maintain the casting die 14 at an optimum temperature at the time of molding, or to efficiently cool the casting die 14 after molding. Since corrosion products generated by contact with the cooling water, deposits generated by calcium in the cooling water, and the like (hereinafter, these are collectively referred to as deposits) adhere to the inner wall surfaces of the treatment holes 12, if heat exchange between the cooling water and the casting mold 14 and circulation of the cooling water are hindered, it may be difficult to stably control the temperature of the casting mold 14. Therefore, by forming a plating film on the inner wall surface of the processing hole 12 using the surface treatment apparatus 10, the adhesion of the deposit to the inner wall surface is suppressed. Accordingly, the temperature of the casting die 14 can be maintained at the optimum temperature.
The surface treatment apparatus 10 mainly includes an electrode 30, a liquid supply unit 31, a liquid discharge unit 32, a pump 33, a treatment liquid tank 34, and an external power supply not shown.
The electrode 30 is constituted by a hollow 1 st electrode 36 and a 2 nd electrode 38 having tubular portions formed of, for example, titanium or the like coated with platinum. Further, the 1 st electrode 36 is inserted into the 1 st linear portion 20 of the processing hole 12 at a portion protruding from the liquid supply portion 31, and the 2 nd electrode 38 is inserted into the 2 nd linear portion 24 of the processing hole 12 at a portion protruding from the liquid discharge portion 32. In embodiment 1, the 1 st electrode 36 and the 2 nd electrode 38 inserted into the process hole 12 are explained with the openings 18 and 22 side of the process hole 12 as the base end side and the bent portion 16 side as the tip end side, respectively.
As shown in fig. 2, a 1 st closing portion 42 is provided at a 1 st distal end portion 40 which is a distal end portion of the 1 st electrode 36, and the 1 st closing portion 42 closes a distal end of a tubular portion of the 1 st electrode 36. A 1 st inner electrode 44 is provided inside the 1 st electrode 36, and the 1 st inner electrode 44 extends in the axial direction of the 1 st electrode 36 and has one end side electrically connected to the 1 st closing portion 42. The other end of the 1 st inner electrode 44 extends to the outside of the processing hole 12 through the liquid supply unit 31 and is connected to an external power supply.
The 2 nd electrode 38 is configured similarly to the 1 st electrode 36. That is, the 2 nd confining portion 48 is provided at the 2 nd tip portion 46 which is the tip portion of the 2 nd electrode 38, and the 2 nd inner electrode 50 having one end electrically connected to the 2 nd confining portion 48 is provided inside the 2 nd electrode 38. The other end of the 2 nd inner electrode 50 extends to the outside of the processing hole 12 through the drain portion 32 and is connected to an external power supply.
The 1 st electrode 36 and the 2 nd electrode 38 are integrated in an electrically insulated state by the 1 st distal end portion 40 and the 2 nd distal end portion 46 of each abutting inside the bent portion 16 via the insulating member 52. That is, the insulating members 52 are provided at the portions of the 1 st and 2 nd distal end portions 40 and 46 that abut against each other inside the bent portion 16.
The positions of the 1 st and 2 nd distal end portions 40 and 46 where the insulating member 52 is provided are adjusted according to the angle θ formed by the 1 st and 2 nd linear portions 20 and 24 of the treatment hole 12, and the like. For example, as in the treatment hole 12 shown in fig. 2, when the angle θ is relatively large, the insulating member 52 may be provided on the tip surface side (the 1 st closing part 42 and the 2 nd closing part 48) of each of the 1 st tip 40 and the 2 nd tip 46.
For example, as in the treatment hole 12 shown in fig. 3, when the angle θ is relatively small, the 1 st closing portion 42 may be disposed so as to face the inner wall surface of the 2 nd linear portion 24, the insulating member 52 may be provided on the outer peripheral surface of the 1 st distal end portion 40, and the insulating member 52 may be provided on the distal end surface side of the 2 nd closing portion 48.
Further, since the insulating member 52 may be provided so as to electrically insulate the 1 st electrode 36 from the 2 nd electrode 38, for example, the insulating member 52 may be provided only at one of the 1 st distal end portion 40 and the 2 nd distal end portion 46.
The liquid supply unit 31 is detachably attached to one opening 18 of the processing well 12, and the liquid discharge unit 32 is detachably attached to the other opening 22 of the processing well 12. The pump 33 supplies the electrolytic processing liquid between the inner wall surface of the 1 st linear portion 20 and the outer peripheral surface of the 1 st electrode 36 through the supply pipe 54 and the liquid supply portion 31. Accordingly, the electrolytic processing liquid flows from the one opening 18 to the other opening 22 of the processing hole 12, passes between the outer peripheral surface of the 1 st electrode 36 and the inner wall surface of the 1 st linear portion 20, and between the outer peripheral surface of the 2 nd electrode 38 and the inner wall surface of the 2 nd linear portion 24, and is then discharged from the processing hole 12 to the recovery pipe 56 through the liquid discharge portion 32.
The treatment liquid tank 34 collects the electrolytic treatment liquid discharged from the treatment hole 12 to the collection pipe 56 through the discharge portion 32 as described above. The recovered electrolytic processing liquid is supplied again to the liquid supply portion 31 by the pump 33, and is circulated between the surface treatment apparatus 10 and the processing hole 12.
When, for example, a degreasing cleaning liquid, an etching liquid, a stain (smut) removing liquid, water, or the like is circulated in the processing holes instead of the electrolytic processing liquid composed of the plating bath, the processing liquid composed of the above-mentioned liquid may be supplied to the processing holes 12 through the liquid supply portion 31 by the pump 33. The liquid discharged from the processing holes 12 through the liquid discharge unit 32 may be collected into the processing liquid tank 34.
An external power supply supplies current to the 1 st electrode 36 and the 2 nd electrode 38 via the 1 st inner electrode 44 and the 2 nd inner electrode 50. That is, as shown by an arrow E in fig. 2, a current from the external power supply flows to the 1 st and 2 nd closures 42 and 48 via the 1 st and 2 nd inner electrodes 44 and 50, respectively. Then, the current flows in a direction from the 1 st and 2 nd closing parts 42 and 48 toward the base end sides of the 1 st and 2 nd electrodes 36 and 38. Accordingly, a potential difference can be generated between the 1 st electrode 36 and the inner wall surface of the 1 st linear portion 20, and between the 2 nd electrode 38 and the inner wall surface of the 2 nd linear portion 24.
The surface treatment apparatus 10 according to embodiment 1 is basically configured as described above. Next, a surface treatment method according to embodiment 1 will be described by taking an example in which the surface treatment apparatus 10 is used to perform plating treatment as a surface treatment on the inner wall surface of the treatment hole 12.
In this surface treatment method, first, an integration step of integrating the 1 st electrode 36 and the 2 nd electrode 38 in an electrically insulated state via the insulating member 52 in the treatment hole 12 is performed. Specifically, the 1 st electrode 36 is inserted into the 1 st linear portion 20 of the processing well 12, and the liquid supply portion 31 is attached to one opening 18 of the processing well 12. Similarly, the 2 nd electrode 38 is inserted into the 2 nd linear portion 24 of the processing well 12, and the drain 32 is attached to the other opening 22 of the processing well 12. Accordingly, the 1 st and 2 nd distal end portions 40 and 46 are brought into contact with each other via the insulating member 52 in the bent portion 16, and the 1 st and 2 nd electrodes 36 and 38 are integrated.
Next, a degreasing cleaning liquid (for example, a water-soluble alkaline cleaning liquid) is passed through the treatment hole 12 by the liquid supply portion 31 and the liquid discharge portion 32, and a degreasing step of removing oil components from the inner wall surface of the treatment hole 12 is performed.
Next, an etching treatment step of removing an oxide film from the inner wall surfaces of the treatment holes 12 is performed by passing an etching liquid (for example, a 10 wt% aqueous hydrochloric acid solution or a 10 wt% aqueous sulfuric acid solution) through the treatment holes 12 via the liquid supply unit 31 and the liquid discharge unit 32. The etching step may be performed by electrolytic etching (anodic electrolysis) by supplying an electric current from an external power source to the 1 st electrode 36 and the 2 nd electrode 38 via the 1 st inner electrode 44 and the 2 nd inner electrode 50.
Next, the stain removing step is performed by allowing a stain removing liquid (for example, a mixed solution of sodium hydroxide and sodium citrate) to flow through the treatment holes 12 via the liquid supply portion 31 and the liquid discharge portion 32. By performing the stain removal step, for example, removing the oxide film in the etching treatment step, even when the metal component (stain) insoluble in water is exposed to the inner wall surface of the treatment hole 12, the stain can be removed from the inside of the treatment hole 12.
The stain removal step may be performed by electrolytic treatment (cathodic electrolysis or anodic electrolysis) in the same manner as the etching treatment step. In this case, the stain removing liquid is electrolyzed in the processing holes 12 to generate oxygen, and therefore, the stains can be more effectively removed.
Next, an energization step is performed in which an electrolytic processing liquid is caused to flow through the processing hole 12 by the liquid supply unit 31 and the liquid discharge unit 32, and an electric current is supplied from an external power supply to the 1 st inner electrode 44 and the 2 nd inner electrode 50, thereby energizing between the 1 st electrode 36 and the 2 nd electrode 38 and the inner wall surface of the processing hole 12. Accordingly, a plating film can be formed on the inner wall surface of the processing hole 12.
Therefore, in embodiment 1, by using the 1 st electrode 36 and the 2 nd electrode 38 integrated as described above, the energization step can be performed in a state where the outer peripheral surface of the 1 st electrode 36 faces the inner wall surface of the 1 st linear portion 20 and the outer peripheral surface of the 2 nd electrode 38 faces the inner wall surface of the 2 nd linear portion 24. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the 1 st linear portion 20 and the 2 nd linear portion 24 of the treatment hole 12 through a common energization step without a complicated step such as masking.
Further, since the 1 st electrode 36 and the 2 nd electrode 38 are insulated, the 1 st electrode 36 and the 2 nd electrode 38 can be energized by independently supplying current to them, respectively. Accordingly, for example, it is possible to suppress the occurrence of a difference in current distribution between the inner wall surface of the 1 st linear portion 20 and the inner wall surface of the 2 nd linear portion 24 of the processing hole 12, as compared with a case where the 1 st electrode 36 and the 2 nd electrode 38 are not insulated and current flows from the 1 st electrode 36 to the base end side of the 2 nd electrode 38 via the 1 st tip portion 40 and the 2 nd tip portion 46. As a result, the inner wall surface of the processing hole 12 can be surface-treated substantially uniformly, and a high-quality plated film having a substantially uniform thickness can be formed.
In summary, according to the surface treatment apparatus 10 and the surface treatment method according to embodiment 1, even in the treatment hole 12 having the bent portion 16, the inner wall surface of the treatment hole 12 can be surface-treated efficiently and with high quality. In this way, the plating film having a substantially uniform thickness is formed on the inner wall surface of the processing hole 12, and the adhesion of the deposit to the inner wall surface can be effectively suppressed. In the treatment holes 12 in which the adhesion of the adhering substances to the inner wall surface or the generation of the adhering substances on the inner wall surface is suppressed, the cooling water can be favorably circulated inside the treatment holes, or the cooling water and the casting mold 14 can be favorably heat-exchanged, so that the temperature of the casting mold 14 can be stably controlled. Further, the temperature of the casting die 14 can be maintained at the optimum temperature.
In addition, as described above, in the surface treatment device 10, the 1 st sealing portion 42 and the 1 st inner electrode 44 are provided on the 1 st electrode 36, and the 2 nd sealing portion 48 and the 2 nd inner electrode 50 are provided on the 2 nd electrode 38. In the energization step, current is supplied to the 1 st electrode 36 via the 1 st inner electrode 44, whereby current flows from the 1 st distal end portion 40 side provided with the 1 st occlusion portion 42 to the proximal end side. Similarly, the 2 nd electrode 38 supplies current to the 2 nd electrode 38 via the 2 nd inner electrode 50, whereby current flows from the 2 nd distal end portion 46 side provided with the 2 nd closing portion 48 to the proximal end side. Accordingly, since the electric current can be favorably passed between the 1 st and 2 nd closing portions 42 and 48 and the inner wall surfaces of the bent portion 16, the surface treatment can be effectively performed also on the inner wall surfaces of the bent portion 16.
Therefore, the plated film having a sufficient film thickness can be formed on the inner wall surface of the bent portion 16, and the adhesion of the deposit to the inner wall surface of the bent portion 16 and the formation of the product can be effectively suppressed. In the casting die 14, the bent portion 16 of the processing hole 12 may be disposed in the vicinity of a cavity forming surface, not shown. In the vicinity of the cavity forming surface, it is preferable to perform temperature control of the casting die 14 particularly stably. As described above, in the bent portion 16 in which the adhesion of the adhering substance to the inner wall surface or the generation of the product on the inner wall surface is suppressed, the cooling water can be favorably circulated inside thereof, or the cooling water can favorably exchange heat with the casting die 14. Therefore, for example, even when the bent portion 16 of the processing hole 12 is disposed in the vicinity of the cavity forming surface, the temperature control in the vicinity of the cavity forming surface of the casting die 14 can be stably performed.
Next, a surface treatment apparatus 60 according to embodiment 2 will be described with reference to fig. 4 and 5. The surface treatment device 60 forms a plating film (not shown) on the inner wall surface of the treatment hole 62.
As shown in fig. 4, the treatment holes 62 are also formed in the casting die 14 in the same manner as the treatment holes 12, and are cooling passages to which cooling water is supplied for cooling the casting die 14. The processing hole 62 includes a 1 st processing hole 64 having a bottom and a 2 nd processing hole 66 having a smaller diameter than the 1 st processing hole 64. In the 2 nd processing hole 66, an opening 68 located on the opposite side of the opening 67 that opens to the outside of the casting die 14 is provided in the inner wall surface of the 1 st processing hole 64. That is, the process hole 62 has a branch portion 70 formed by the 1 st process hole 64 and the 2 nd process hole 66 branched from the 1 st process hole 64. Therefore, the process holes 62 also have linear portions (the 1 st process hole 64 and the 2 nd process hole 66) extending in different directions from each other.
The surface treatment apparatus 60 is configured in the same manner as the surface treatment apparatus 10 according to embodiment 1, except that it includes an electrode 72 instead of the electrode 30. The electrode 72 is constituted by a hollow 1 st electrode 74 and a 2 nd electrode 76 having tubular portions formed of, for example, titanium or the like coated with platinum. The 1 st electrode 74 is inserted into the 1 st processing hole 64, and the 2 nd electrode 76 having an outer diameter smaller than that of the 1 st electrode 74 is inserted into the 2 nd processing hole 66.
In embodiment 2, the 1 st electrode 74 inserted into the 1 st process hole 64 will be described with the opening 77 side of the 1 st process hole 64 being the base end side and the bottom 78 side of the 1 st process hole 64 being the tip end side. The description will be made with respect to the 2 nd electrode 76 inserted into the 2 nd processed hole 66, with the opening 67 side of the 2 nd processed hole 66 being the base end side and the other opening 68 side being the tip end side.
As shown in fig. 5, the 1 st electrode 74 is configured in the same manner as the 1 st electrode 36 except that an inserted portion 80 is provided on the peripheral wall of the opening 68 facing the 2 nd processing hole 66. That is, the 1 st stopper 42 is provided on the 1 st tip 40 which is the tip of the 1 st electrode 74, and the 1 st inner electrode 44 is provided inside the 1 st electrode 74. The inserted portion 80 is formed of a hole penetrating the peripheral wall of the 1 st electrode 74 facing the opening 68 of the 2 nd processing hole 66, and an annular insulating member 82 is provided inside. A female screw 82a is formed on the inner periphery of the insulating member 82.
The 2 nd electrode 76 is formed of a tubular body, and a male screw 84a that can be screwed with the female screw 82a of the insulating member 82 is formed on the outer peripheral surface of the 2 nd tip 84 that is the tip of the 2 nd electrode 76. The base end side of the 2 nd electrode 76 extends to the outside of the processing hole 62 via the liquid discharge portion 32, and is connected to an external power supply.
The 1 st electrode 74 and the 2 nd electrode 76 are integrated by inserting the 2 nd tip portion 84 of the 2 nd electrode 76 into the inserted portion 80 of the 1 st electrode 74. At this time, the 1 st electrode 74 and the 2 nd electrode 76 are positioned and fixed by screwing the female screw 82a of the insulating member 82 disposed in the inserted portion 80 and the male screw 84a of the 2 nd distal end portion 84.
Next, a surface treatment method according to embodiment 2 will be described by taking an example in which the surface treatment apparatus 60 is used to perform plating as a surface treatment on the inner wall surface of the treatment hole 62.
In this surface treatment method, first, an integration step of integrating the 1 st electrode 74 and the 2 nd electrode 76 in an electrically insulated state via the insulating member 82 in the treatment hole 62 is performed. Specifically, the 1 st electrode 74 is inserted into the 1 st processing hole 64 such that the 1 st closing portion 42 faces the bottom surface 78 of the 1 st processing hole 64, and the liquid supply portion 31 is attached to the opening 77 of the 1 st processing hole 64. Next, the 2 nd electrode 76 is inserted into the 2 nd processing hole 66, and the male screw 84a of the 2 nd tip 84 is screwed with the female screw 82a of the insulating member 82. Accordingly, after the 1 st electrode 74 and the 2 nd electrode 76 are integrated, the liquid discharge portion 32 is attached to the opening 67 of the 2 nd processing hole 66.
Next, after the degreasing step, the etching step, and the stain removal step are performed in the same manner as in the surface treatment method according to embodiment 1, an energization step for forming a plating film on the inner wall surface of the treatment hole 62 is performed. In the energization step, the electrolytic processing liquid is caused to flow through the processing holes 62 via the liquid supply portion 31 and the liquid discharge portion 32, and an electric current is supplied from an external power source to the 1 st electrode 74 and the 2 nd electrode 76 via the 1 st inner electrode 44 in a state where the 1 st closing portion 42 faces the bottom surface 78 of the 1 st processing hole 64. Thus, by applying current between the 1 st electrode 74 and the 2 nd electrode 76 and the inner wall surface of the processing hole 62, a plating film can be formed on the inner wall surface of the processing hole 62.
Therefore, in embodiment 2, by using the 1 st electrode 74 and the 2 nd electrode 76 which are integrated as described above, the energization step can be performed in a state where the outer peripheral surface of the 1 st electrode 74 is opposed to the inner wall surface of the 1 st processing hole 64 and the outer peripheral surface of the 2 nd electrode 76 is opposed to the inner wall surface of the 2 nd processing hole 66. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the 1 st processing hole 64 and the 2 nd processing hole 66 through the common energization step without performing a complicated step such as masking.
Further, since the 1 st electrode 74 and the 2 nd electrode 76 are insulated, the inner wall surface of the processing hole 62 can be surface-treated substantially uniformly, and a high-quality plated film having a substantially uniform thickness can be formed.
As described above, according to the surface treatment apparatus 60 and the surface treatment method according to embodiment 2, even in the treatment hole 62 having the branch portion 70, the inner wall surface of the treatment hole 62 can be efficiently surface-treated with high quality. In this way, the plating film having a substantially uniform thickness is formed on the inner wall surface of the processing hole 62, and the adhesion of the deposit to the inner wall surface can be effectively suppressed.
As described above, in the integration step, the 1 st electrode 74 and the 2 nd electrode 76 are positioned and fixed by screwing the female screw 82a and the male screw 84 a. Accordingly, the energization step can be performed while maintaining the positional relationship between the inner wall surfaces of the 1 st processing hole 64 and the 2 nd processing hole 66 and the outer circumferential surfaces of the 1 st electrode 74 and the 2 nd electrode 76 in a satisfactory manner, and thus, the surface treatment can be performed with higher quality.
In the surface treatment apparatus 60 according to embodiment 2, the outer diameter of the 1 st electrode 74 is larger than the outer diameter of the 2 nd electrode 76, and the inserted portion 80 is formed of a hole penetrating the peripheral wall of the 1 st electrode 74. A female screw 82a is formed in an insulating member 82 provided inside the inserted portion 80, and a male screw 84a is formed at the distal end of the 2 nd electrode 76. However, the present invention is not particularly limited thereto. For example, the inserted portion 80 may be configured to be able to insert the 2 nd tip portion 84 so as to integrate the 1 st electrode 74 and the 2 nd electrode 76. The 1 st electrode 74 and the 2 nd electrode 76 may be positioned and fixed by fitting the inserted portion 80 and the 2 nd distal end portion 84 via the insulating member 82.
As described above, in embodiment 2, the 1 st sealing portion 42 and the 1 st inner electrode 44 are provided on the 1 st electrode 74, and a current is supplied to the 1 st electrode 74 via the 1 st inner electrode 44 in a state where the 1 st sealing portion 42 faces the bottom surface 78 of the 1 st processing hole 64. Accordingly, since the electric current can be favorably passed between the 1 st closing part 42 and the bottom surface 78 of the 1 st processing hole 64, the surface treatment can be effectively performed also on the bottom surface 78.
Therefore, since the plated film having a sufficient film thickness is formed on the bottom surface 78 of the 1 st processed hole 64, and the adhesion of the deposit to the bottom surface 78 can be effectively suppressed, even when the bottom surface 78 of the 1 st processed hole 64 is disposed in the vicinity of the cavity forming surface of the casting die 14, for example, the temperature control in the vicinity of the cavity forming surface can be stably performed.
Next, a surface treatment apparatus 90 according to embodiment 3 will be described with reference to fig. 6 to 8. The surface treatment apparatus 90 forms a plating film (not shown) on the inner wall surface of the treatment hole 92.
As shown in fig. 6, the treatment holes 92 are cooling passages formed in the casting die 14, as in the treatment holes 12, and through which cooling water is supplied for cooling the casting die 14. The processing well 92 includes a plurality of (5 in the present embodiment) 1 st processing wells 94 and a plurality of (2 in the present embodiment) 2 nd processing wells 96 intersecting the 1 st processing wells 94. That is, the processing well 92 has an intersection 98 of the 1 st processing well 94 and the 2 nd processing well 96. Therefore, the process holes 92 also have linear portions (the 1 st process hole 94 and the 2 nd process hole 96) extending in different directions from each other.
Each of the 1 st processing holes 94 is a bottomed hole extending in the direction of the arrow X1X2 in fig. 6 and having a bottom surface 100 provided on one end side (the arrow X1 side). Each of the 2 nd processing holes 96 is a bottomed hole extending in the direction of the arrow Y1Y2 in fig. 6 and having a bottom surface 102 provided on one end side (arrow Y1 side). The diameter of the 2 nd processing hole 96 is smaller than that of the 1 st processing hole 94, and the 2 nd processing hole 96 is disposed so as to intersect with the 1 st processing hole 94 at a position close to the bottom surface 100 of the 1 st processing hole 94. In the present embodiment, the diameter of the 2 nd processing hole 96 is made smaller than the diameter of the 1 st processing hole 94, but the present invention is not limited thereto, and the diameter of the 2 nd processing hole 96 may be the same as the diameter of the 1 st processing hole 94.
The surface treatment apparatus 90 is configured in the same manner as the surface treatment apparatus 10 according to embodiment 1, except that: the electrode 104 is provided in place of the electrode 30, the 1 st supply/discharge units 106 having the same number as the 1 st processing holes 94 and the 2 nd supply/discharge units 108 having the same number as the 2 nd processing holes 96 are provided in place of the liquid supply unit 31 and the liquid discharge unit 32, and a processing liquid supply/discharge mechanism, not shown, is provided in place of the pump 33 and the processing liquid tank 34.
The electrodes 104 are composed of the 1 st electrodes 110 as many as the 1 st process wells 94 and the 2 nd electrodes 112 as many as the 2 nd process wells 96. The 1 st electrode 110 and the 2 nd electrode 112 are each a hollow body having a tubular portion formed of, for example, titanium coated with platinum or the like. The 1 st electrode 110 is inserted into the 1 st processing hole 94, and the 2 nd electrode 112 having an outer diameter smaller than the inner diameter of the 1 st electrode 110 is inserted into the 2 nd processing hole 96.
In the third embodiment, the 1 st electrode 110 and the 2 nd electrode 112 inserted into the 1 st process hole 94 and the 2 nd process hole 96, respectively, will be described with the openings 114 and 116 side of the 1 st process hole 94 and the 2 nd process hole 96 as the base end side and the bottoms 100 and 102 side as the tip end side.
As shown in fig. 6 to 8, the 1 st electrode 110 is configured in the same manner as the 1 st electrode 36 except that a treatment liquid inlet 118 and a through hole 120 are provided. That is, the 1 st stopper 42 is provided in the 1 st tip 40 which is the tip of the 1 st electrode 110, and the 1 st inner electrode 44 is provided inside the 1 st electrode 110.
The treatment liquid inlet 118 penetrates a peripheral wall formed on the 1 st electrode 110 on the base end side of the 1 st closing portion 42, and is provided in plurality at intervals in the circumferential direction. The penetration hole 120 is provided to penetrate the 1 st electrode 110 inserted into the 1 st processing hole 94 in the extending direction of the 2 nd processing hole 96 at a portion disposed at the intersection 98.
The 2 nd electrode 112 is configured in the same manner as the 2 nd electrode 38 except that the treatment liquid inlet 122 is provided. That is, the 2 nd closing portion 48 is provided at the 2 nd tip portion 46 which is the tip portion of the 2 nd electrode 112, and the 2 nd inner electrode 50 is provided inside the 2 nd electrode 112. The treatment liquid flow inlets 122 are provided in plurality at intervals in the circumferential direction so as to penetrate through the circumferential wall formed on the 2 nd electrode 112 on the base end side with respect to the 2 nd closing portion 48.
The 1 st electrode 110 and the 2 nd electrode 112 are integrated by inserting the 2 nd electrode 112 into the through hole 120 of the 1 st electrode 110. At this time, the outer circumferential surface of the portion of the 2 nd electrode 112 inserted into the through-hole 120 is covered with the insulating member 124. That is, the 1 st electrode 110 and the 2 nd electrode 112 are electrically insulated from each other by interposing the cylindrical insulating member 124 between the inner peripheral surface of the through hole 120 and the outer peripheral surface of the 2 nd electrode 112.
As shown in fig. 8, the 1 st inner electrode 44 of the 1 st electrode 110 is disposed between the inner circumferential surface of the 1 st electrode 110 and the outer circumferential surface of the 2 nd electrode 112 so as to avoid the 2 nd electrode 112 inserted into the 1 st electrode 110 through the insertion hole 120 and the insulating member 124.
The 1 st supply and discharge unit 106 is detachably attached to an opening 114 of the 1 st processing well 94, and the 2 nd supply and discharge unit 108 is detachably attached to an opening 116 of the 2 nd processing well 96. The treatment liquid supply and discharge mechanism supplies the electrolytic treatment liquid between the inner wall surface of the 1 st treatment hole 94 and the outer peripheral surface of the 1 st electrode 110 via the 1 st supply and discharge portion 106. Similarly, the electrolytic processing liquid is supplied between the inner wall surface of the 2 nd processing hole 96 and the outer peripheral surface of the 2 nd electrode 112 through the 2 nd supply/discharge portion 108. The processing liquid supply and discharge mechanism, the 1 st supply and discharge unit 106, and the 2 nd supply and discharge unit 108 can be configured as described in, for example, japanese patent laid-open publication No. 2015-30897, and therefore, detailed description thereof will be omitted.
Thus, the electrolytic processing liquid supplied to the 1 st processing hole 94 and the 2 nd processing hole 96 passes between the outer peripheral surfaces of the 1 st electrode 110 and the 2 nd electrode 112 and the inner peripheral surface of the processing hole 92, and flows toward the tip sides of the 1 st electrode 110 and the 2 nd electrode 112. Then, as shown by arrows F in fig. 7, the treatment liquid flows into the 1 st electrode 110 and the 2 nd electrode 112 from the treatment liquid inlets 118 and 122, flows through the 1 st electrode 110 and the 2 nd electrode 112 to the proximal end side, and is then discharged from the treatment hole 92 through the 1 st supply/discharge unit 106 and the 2 nd supply/discharge unit 108.
The electrolytic processing liquid may be supplied from the 1 st supply/discharge unit 106 and the 2 nd supply/discharge unit 108 to the 1 st electrode 110 and the 2 nd electrode 112, and may be discharged to the 1 st processing well 94 and the 2 nd processing well 96 outside the 1 st electrode 110 and the 2 nd electrode 112 through the processing liquid inlet ports 118 and 122.
Next, a surface treatment method according to embodiment 3 will be described by taking an example in which the surface treatment apparatus 90 is used to perform plating as a surface treatment on the inner wall surface of the treatment hole 92.
In this surface treatment method, first, an integration step of integrating the 1 st electrode 110 and the 2 nd electrode 112 in an electrically insulated state via the insulating member 124 in the treatment hole 92 is performed. Specifically, the 1 st electrode 110 is inserted into each of the 1 st processing holes 94 such that the 1 st closing part 42 faces the bottom surface 100 of the 1 st processing hole 94 and the 1 st supply and discharge part 106 is attached to the opening 114 of the 1 st processing hole 94. At this time, the plurality of through holes 120 provided in the plurality of 1 st electrodes 110 are coaxially arranged inside the intersection portion 98 along the extending direction of the 2 nd processed hole 96.
Next, the 2 nd electrode 112 is inserted into each of the 2 nd processing holes 96, whereby the 2 nd electrode 112 is inserted into the insertion hole 120 of the 1 st electrode 110. At this time, the insulating member 124 is provided inside the through hole 120 of the 1 st electrode 110 or in a portion of the outer circumferential surface of the 2 nd electrode 112 inserted into the through hole 120. Accordingly, the 2 nd electrode 112 and the 1 st electrodes 110 are integrated in an electrically insulated state with the insulating member 124 interposed therebetween, and thereafter, the 2 nd supply/discharge portion 108 is attached to the opening 116 of the 2 nd processing well 96.
Next, similarly to the surface treatment method according to embodiment 1, after the degreasing step, the etching step, and the stain removal step are performed, the energization step for forming the plating film on the inner wall surface of the treatment hole 92 is performed. In the energization step, the electrolytic processing liquid is caused to flow through the 1 st processing well 94 and the 2 nd processing well 96 via the 1 st supply/discharge unit 106 and the 2 nd supply/discharge unit 108. At the same time, current is supplied from the external power supply to the 1 st inner electrode 44 and the 2 nd inner electrode 50 in a state where the 1 st closing part 42 and the 2 nd closing part 48 face the bottom surfaces 100 and 102 of the 1 st processing hole 94 and the 2 nd processing hole 96, respectively. In this way, by applying current between the 1 st and 2 nd electrodes 110 and 112 and the inner wall surfaces of the 1 st and 2 nd process holes 94 and 96, respectively, a plated film can be formed on the inner wall surfaces of the process holes 92.
Therefore, in the third embodiment, by using the 1 st electrode 110 and the 2 nd electrode 112 integrated as described above, the energization step can be performed in a state where the outer peripheral surface of the 1 st electrode 110 is opposed to the inner wall surface of the 1 st processing hole 94 and the outer peripheral surface of the 2 nd electrode 112 is opposed to the inner wall surface of the 2 nd processing hole 96. Accordingly, the surface treatment can be performed on the inner wall surfaces of both the 1 st processing hole 94 and the 2 nd processing hole 96 through the common energization step without performing a complicated step such as masking.
Further, since the 1 st electrode 110 and the 2 nd electrode 112 are insulated, the inner wall surface of the processing hole 92 can be surface-treated substantially uniformly, and a high-quality plated film having a substantially uniform thickness can be formed.
As described above, according to the surface treatment apparatus 90 and the surface treatment method according to embodiment 3, even in the treatment hole 92 having the intersection 98, the inner wall surface of the treatment hole 92 can be efficiently surface-treated with high quality. In this way, the plating film having a substantially uniform thickness is formed on the inner wall surface of the processing hole 92, and the adhesion of the deposit to the inner wall surface can be effectively suppressed.
As described above, in the third embodiment, the outer peripheral surface of the 2 nd electrode 112 is opposed to the inner wall surface of the 2 nd processed hole 96 having a smaller diameter than the 1 st processed hole 94 in accordance with the outer diameter of the 2 nd electrode 112 smaller than the outer diameter of the 1 st electrode 110. Thus, the distance between the inner wall surface of the 1 st processing hole 94 and the outer peripheral surface of the 1 st electrode 110 and the distance between the inner wall surface of the 2 nd processing hole 96 and the outer peripheral surface of the 2 nd electrode 112 can be made substantially constant. Therefore, the occurrence of a current density difference in the inner wall surfaces of both the 1 st processing hole 94 and the 2 nd processing hole 96 is suppressed, and the surface treatment is easily performed substantially uniformly on the inner wall surfaces of both the 1 st processing hole 94 and the 2 nd processing hole 96.
As described above, in the third embodiment, the 1 st sealing portion 42 and the 1 st inner electrode 44 are provided in the 1 st electrode 110, and the current is supplied to the 1 st electrode 110 via the 1 st inner electrode 44 in a state where the 1 st sealing portion 42 faces the bottom surface 100 of the 1 st processing hole 94. Accordingly, since the electric current can be favorably passed between the 1 st closing part 42 and the bottom surface 100 of the 1 st processing hole 94, the bottom surface 100 can also be effectively subjected to the surface treatment.
In addition, since the 2 nd electrode 112 is also configured in the same manner, electric current can be favorably passed between the 2 nd closing portion 48 and the bottom surface 102 of the 2 nd processing hole 96, and therefore, the bottom surface 102 can be effectively subjected to surface processing.
Therefore, the plating films having sufficient thickness are formed on the bottom surfaces 100 and 102 of the 1 st process hole 94 and the 2 nd process hole 96, and the adhesion of the deposit to the bottom surfaces 100 and 102 can be effectively suppressed. Therefore, for example, by disposing the bottom surface 100 of the 1 st processing hole 94 in the vicinity of the cavity forming surface of the casting die 14, the temperature control in the vicinity of the cavity forming surface can be stably performed.
The present invention is not particularly limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.
For example, in the above embodiment, the 1 st inner electrode 44 is provided on the 1 st electrodes 36, 74, and 110, and the 2 nd inner electrode 50 is provided on the 2 nd electrodes 38 and 112, but the present invention is not particularly limited thereto, and the 1 st electrodes 36, 74, and 110 and the 2 nd electrodes 38 and 112 may not have the 1 st inner electrode 44 and the 2 nd inner electrode 50. In this case, the 1 st electrodes 74 and 110 may not have the 1 st sealing portion 42, and the 2 nd electrode 112 may not have the 2 nd sealing portion 48.
[ description of reference numerals ]
10. 60, 90: a surface treatment device; 12. 62, 92: processing the hole; 14: a mold for casting; 16: a bending section; 18. 22, 67, 68, 77, 114, 116: an opening; 20: a 1 st linear portion; 24: a 2 nd linear portion; 30. 72, 104: an electrode; 31: a liquid supply section; 32: a liquid discharge section; 36. 74, 110: a 1 st electrode; 38. 76, 112: a 2 nd electrode; 40: a first tip portion 1; 42: a 1 st closing part; 44: 1 st inner side electrode; 46. 84: a 2 nd tip portion; 48: a 2 nd closing part; 50: a 2 nd inner side electrode; 52. 82, 124: an insulating member;
64. 94: 1, processing the hole; 66. 96: processing the hole 2; 70: a branching section; 78. 100, 102: a bottom surface; 80: an inserted portion; 82 a: an internal thread; 84 a: an external thread; 98: an intersection portion; 106: the 1 st supply and discharge part; 108: a 2 nd supply and discharge part; 118. 122: a process liquid stream inlet; 120: and a through hole.

Claims (18)

1. A surface treatment device (10) having an electrode (30) for performing surface treatment on an inner wall surface of a treatment hole (12) into which the electrode (30) is inserted by causing an electrolytic treatment liquid to flow inside the treatment hole and causing electric current to flow between the electrode (30) and the inner wall surface of the treatment hole (12),
the electrode (30) is composed of a 1 st electrode (36) and a 2 nd electrode (38), the 1 st electrode (36) and the 2 nd electrode (38) are integrated in an electrically insulated state with an insulating member (52) interposed therebetween,
the 1 st electrode (36) is inserted from one opening (18) of the processing hole (12) having the bent portion (16),
the 2 nd electrode (38) is inserted from the other opening (22) of the processing hole (12),
the 1 st electrode (36) and the 2 nd electrode (38) are integrated while being electrically insulated from each other by the 1 st tip portion (40) of the 1 st electrode (36) and the 2 nd tip portion (46) of the 2 nd electrode (38) abutting via the insulating member (52) inside the bent portion (16),
the surface treatment device is capable of independently supplying current to the first electrode and the second electrode.
2. Surface treatment device (10) according to claim 1,
the 1 st electrode (36) and the 2 nd electrode (38) are hollow bodies having tubular portions,
a 1 st closing part (42) for closing the top end of the 1 st electrode (36) is provided at the 1 st top end part (40),
a 2 nd closing part (48) for closing the tip of the 2 nd electrode (38) is provided at the 2 nd tip part (46),
a 1 st inner electrode (44) is provided on the 1 st electrode (36), the 1 st inner electrode (44) extending in the axial direction inside the 1 st electrode (36) and being electrically connected to the 1 st closing section (42),
a2 nd inner electrode (50) is provided on the 2 nd electrode (38), and the 2 nd inner electrode (50) extends in the axial direction inside the 2 nd electrode (38) and is electrically connected to the 2 nd closing section (48).
3. A surface treatment device (60) having an electrode (72) for performing surface treatment on an inner wall surface of a treatment hole (62) into which the electrode (72) is inserted by causing an electrolytic treatment liquid to flow inside the treatment hole and causing electric current to flow between the electrode (72) and the inner wall surface of the treatment hole (62),
the electrode (72) is composed of a 1 st electrode (74) and a 2 nd electrode (76), the 1 st electrode (74) and the 2 nd electrode (76) are integrated in an electrically insulated state through an insulating member (82),
the processing hole (62) is composed of a 1 st processing hole (64) and a 2 nd processing hole (66), wherein the 2 nd processing hole (66) is provided with an opening (68) on the inner wall surface of the 1 st processing hole (64),
an inserted portion (80) is provided at a portion of the 1 st electrode (74) inserted into the 1 st processing hole (64) facing the opening (68) of the 2 nd processing hole (66),
the 1 st electrode (74) and the 2 nd electrode (76) are integrated by inserting a tip portion (84) of the 2 nd electrode (76) into the inserted portion (80),
the insulating member (82) is interposed between the inserted portion (80) and the distal end portion (84) of the 2 nd electrode (76) to electrically insulate the first electrode from the second electrode,
the surface treatment device is capable of independently supplying current to the first electrode and the second electrode.
4. The surface treatment device (60) according to claim 3,
the 1 st electrode (74) is a hollow body having a tubular portion,
the inserted portion (80) is formed of a hole penetrating the peripheral wall of the 1 st electrode (74),
the insulating member (82) is provided inside the inserted portion (80),
an internal thread (82a) is formed in the insulating member (82),
a male screw (84a) is formed on the tip portion (84) of the 2 nd electrode (76),
the 1 st electrode (74) and the 2 nd electrode (76) are positioned and fixed through screwing of the internal thread (82a) and the external thread (84 a).
5. The surface treatment device (60) according to claim 4,
a sealing part (42) is provided at the top end part (40) of the 1 st electrode (74), the sealing part (42) seals the top end of the 1 st electrode (74) and faces the bottom surface (78) of the 1 st processing hole (64) with a bottom,
an inner electrode (44) is provided inside the 1 st electrode (74), and the inner electrode (44) extends in the axial direction of the 1 st electrode (74) and is electrically connected to the sealing section (42).
6. A surface treatment device (90) having an electrode (104) for performing surface treatment on an inner wall surface of a treatment hole (92) into which the electrode (104) is inserted by causing an electrolytic treatment liquid to flow inside the treatment hole and causing electric current to flow between the electrode (104) and the inner wall surface of the treatment hole (92),
the electrode (104) is composed of a 1 st electrode (110) and a 2 nd electrode (112), the 1 st electrode (110) and the 2 nd electrode (112) are integrated in an electrically insulated state with an insulating member (124) interposed therebetween,
the 1 st electrode (110) and the 2 nd electrode (112) are hollow bodies having tubular portions,
the outer diameter of the 1 st electrode (110) is larger than the outer diameter of the 2 nd electrode (112),
the processing hole (92) is composed of a first processing hole (94) with a bottom and a second processing hole (96) with a bottom intersecting the first processing hole (94),
a through-hole (120) is formed in a portion of the 1 st electrode (110) inserted into the 1 st processing hole (94), the portion being disposed at an intersection (98) of the 1 st processing hole (94) and the 2 nd processing hole (96), along an extending direction of the 2 nd processing hole (96),
the 2 nd electrode (112) inserted into the 2 nd processing hole (96) is inserted through the through hole (120) to be integrated with the 1 st electrode (110),
the insulating member (124) is interposed between the through hole (120) and the 2 nd electrode (112) to electrically insulate the first electrode from the second electrode,
the surface treatment device is capable of independently supplying current to the first electrode and the second electrode.
7. The surface treatment device (90) according to claim 6,
the 2 nd electrode (112) is inserted into the 2 nd processing hole (96) having a smaller diameter than the 1 st processing hole (94).
8. The surface treatment device (90) according to claim 6,
a sealing part (42) is formed at the top end part (40) of the 1 st electrode (110), the sealing part (42) seals the top end of the 1 st electrode (110) and faces the bottom surface (100) of the 1 st processing hole (94),
the 1 st electrode (110) has an inner diameter larger than an outer diameter of the 2 nd electrode (112),
an inner electrode (44) is provided inside the 1 st electrode (110), and the inner electrode (44) passes between the inner peripheral surface of the 1 st electrode (110) and the outer peripheral surface of the 2 nd electrode (112), extends in the axial direction of the 1 st electrode (110), and is electrically connected to the sealing portion (42) of the 1 st electrode (110).
9. The surface treatment device (90) according to any one of claims 6 to 8,
a sealing part (48) is provided at the tip part (46) of the 2 nd electrode (112), the sealing part (48) is configured to seal the tip of the 2 nd electrode (112) and face the bottom surface (102) of the 2 nd processing hole (96),
an inner electrode (50) is provided on the 2 nd electrode (112), and the inner electrode (50) extends in the axial direction inside the 2 nd electrode (112) and is electrically connected to the sealing section (48) of the 2 nd electrode (112).
10. A surface treatment method for performing surface treatment on the inner wall surface of a treatment hole (12) by using an electrode (30) composed of a 1 st electrode (36) and a 2 nd electrode (38),
has an integration process and an electrifying process,
wherein the integration process comprises: integrating the 1 st electrode (36) and the 2 nd electrode (38) in an electrically insulated state via an insulating member (52) inside the processing hole (12);
the electrifying process comprises the following steps: passing an electrolytic treatment liquid through the inside of the treatment hole (12) while passing a current between the 1 st electrode (36) and the 2 nd electrode (38) and the inner wall surface of the treatment hole (12),
in the integration step, the insulating member (52) is provided on at least one of the 1 st distal end portion (40) of the 1 st electrode (36) and the 2 nd distal end portion (46) of the 2 nd electrode (38), the 1 st electrode (36) is inserted from one opening (18) of the treatment hole (12) having a bent portion (16), the 2 nd electrode (38) is inserted from the other opening (22) of the treatment hole (12), and the 1 st distal end portion (40) and the 2 nd distal end portion (46) are brought into contact with each other in an electrically insulated state via the insulating member (52) inside the bent portion (16),
in the energization step, current can be independently supplied to the first electrode and the second electrode.
11. The surface treatment method according to claim 10,
in the energization step, the 1 st electrode (36) is energized via a 1 st inner electrode (44) and the 2 nd electrode (38) is energized via a 2 nd inner electrode (50), wherein the 1 st inner electrode (44) extends in the axial direction inside the 1 st electrode (36) composed of a hollow body having a tubular portion and is electrically connected to a 1 st closing portion (42) closing the tip of the 1 st electrode (36); the 2 nd inner electrode (50) extends in the axial direction inside the 2 nd electrode (38) formed of a hollow body having a tubular portion, and is electrically connected to a 2 nd closing portion (48) that closes the tip of the 2 nd electrode (38).
12. A surface treatment method for performing surface treatment on the inner wall surface of a treatment hole (62) by using an electrode (72) composed of a 1 st electrode (74) and a 2 nd electrode (76),
has an integration step and an energization step, wherein,
the integrated working procedure is as follows: integrating the 1 st electrode (74) and the 2 nd electrode (76) in an electrically insulated state via an insulating member (82) inside the processing hole (62);
the electrifying process comprises the following steps: passing an electrolytic treatment liquid through the inside of the treatment hole (62), and passing current between the 1 st electrode (74) and the 2 nd electrode (76) and the inner wall surface of the treatment hole (62),
in the integration step, a 1 st electrode (74) is inserted into the 1 st processing hole (64) of the processing hole (62) composed of a 1 st processing hole (64) and a 2 nd processing hole (66), the 2 nd electrode (76) is inserted into the 2 nd processing hole (66), and a tip portion (84) of the 2 nd electrode (76) is inserted into an inserted portion (80) of the 1 st electrode (74) via the insulating member (82), thereby integrating the first electrode and the second electrode in an electrically insulated state, wherein the 1 st processing hole (64) is a processing hole having a bottom, the 2 nd processing hole (66) is a processing hole having an opening (68) formed in an inner wall surface of the 1 st processing hole (64), and the inserted portion (80) is provided in a portion of the 1 st electrode (74) facing the opening (68) of the 2 nd processing hole (66),
in the energization step, current can be independently supplied to the first electrode and the second electrode.
13. The surface treatment method according to claim 12,
the 1 st electrode (74) is constituted by a hollow body having a tubular portion,
the inserted portion (80) is formed of a hole penetrating the peripheral wall of the 1 st electrode (74),
in the integration step, a female screw (82a) formed in the insulating member (82) provided inside the inserted portion (80) is screwed to a male screw (84a) formed in the distal end portion (84) of the 2 nd electrode (76), thereby positioning and fixing the 1 st electrode (74) and the 2 nd electrode (76).
14. The surface treatment method according to claim 12 or 13,
in the energization step, the 1 st electrode (74) is energized via a 1 st inner electrode (44) in a state where a 1 st closing portion (42) closing a tip of the 1 st electrode (74) faces a bottom surface (78) of the 1 st processing hole (64), wherein the 1 st inner electrode (44) extends in the axial direction inside the 1 st electrode (74) and is electrically connected to the 1 st closing portion (42).
15. A surface treatment method for performing surface treatment on the inner wall surface of a treatment hole (92) by using an electrode (104) composed of a 1 st electrode (110) and a 2 nd electrode (112),
has an integration step and an energization step, wherein,
the integrated working procedure is as follows: integrating the 1 st electrode (110) and the 2 nd electrode (112) in an electrically insulated state via an insulating member (124) inside the processing hole (92);
the electrifying process comprises the following steps: passing an electrolytic treatment liquid through the inside of the treatment hole (92), and passing current between the 1 st electrode (110) and the 2 nd electrode (112) and the inner wall surface of the treatment hole (92),
the 1 st electrode (110) and the 2 nd electrode (112) are hollow bodies having tubular portions,
in the integration step, the 1 st electrode (110) having an outer diameter larger than that of the 2 nd electrode (112) is inserted into the 1 st process hole (94) of the process hole (92) composed of the 1 st process hole (94) and the 2 nd process hole (96), the 2 nd electrode (112) is inserted into the 2 nd process hole (96), and the 2 nd electrode (112) is inserted into a through hole (120) of the 1 st electrode (110) via the insulating member (124), thereby integrating the first electrode and the second electrode in an electrically insulated state, wherein the 1 st process hole (94) is a bottomed process hole, the 2 nd process hole (96) is a bottomed process hole intersecting the 1 st process hole (94), and the through hole (120) is formed in a portion of the 1 st electrode (110) disposed at an intersection (98) of the 1 st process hole (94) and the 2 nd process hole (96),
in the energization step, current can be independently supplied to the first electrode and the second electrode.
16. The surface treatment method according to claim 15,
in the integration step, the 2 nd electrode (112) is inserted into the 2 nd processing hole (96) having a smaller diameter than the 1 st processing hole (94).
17. The surface treatment method according to claim 15,
the 1 st electrode (110) has an inner diameter larger than an outer diameter of the 2 nd electrode (112),
in the energization step, the 1 st electrode (110) is energized via an inner electrode (44) in a state where a closing portion (42) closing the tip of the 1 st electrode (110) faces the bottom surface (100) of the 1 st processing hole (94), wherein the inner electrode (44) passes between the inner peripheral surface of the 1 st electrode (110) and the outer peripheral surface of the 2 nd electrode (112), extends in the axial direction of the 1 st electrode (110), and is electrically connected to the closing portion (42) of the 1 st electrode (110).
18. A surface treatment method according to any one of claims 15 to 17,
in the energization step, the 2 nd electrode (112) is energized via an inner electrode (50) in a state where a sealing portion (48) sealing a distal end of the 2 nd electrode (112) faces a bottom surface (102) of the 2 nd processing hole (96), wherein the inner electrode (50) extends in an axial direction inside the 2 nd electrode (112) and is electrically connected to the sealing portion (48) of the 2 nd electrode (112).
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