CN111670271A - Surface treatment device and surface treatment method - Google Patents

Abstract

The present invention relates to a surface treatment apparatus and a surface treatment method. The electrodes (30) of the surface treatment device (10) are composed of a 1 st electrode (36) and a 2 nd electrode (38). The 1 st electrode (36) is inserted from one opening (18) of the processing hole (12) having the bent portion (16). The 2 nd electrode (38) is inserted from the other opening (22) of the processing hole (12). A1 st tip portion (40) of the 1 st electrode (36) and a 2 nd tip portion (46) of the 2 nd electrode (38) are brought into contact with each other via an insulating member (52) in the bent portion (16), whereby the 1 st electrode (36) and the 2 nd electrode (38) are integrated in an electrically insulated state.

Description

Surface treatment device and surface treatment method

technical field

The present invention relates to a surface treatment device and a surface treatment method for performing surface treatment on the inner wall surface of a treatment hole.

Background technique

For example, as described in Japanese Patent Application Laid-Open Publication No. 2013-159832, the electrolytic treatment solution is passed through the inside of the treatment hole in which the tubular electrode is inserted, and the current is passed between the electrode and the inner wall surface of the treatment hole. The inner wall surface is subjected to surface treatment such as electroplating and anodic oxide film formation.

SUMMARY OF THE INVENTION

The present invention has been proposed in relation to such a technique, and the main object of the present invention is to provide a surface treatment apparatus that can not The inner wall surface of the processing hole is surface-treated with high efficiency and high quality through complicated steps such as masking.

In addition, another object of the present invention is to provide a surface treatment method capable of efficiently and efficiently without complicated steps such as masking, even for treatment holes having a plurality of linear portions having different extending directions. The inner wall surface of the processing hole is surface-treated with high quality.

According to one aspect of the present invention, there is provided a surface treatment apparatus including an electrode, and by allowing an electrolytic treatment solution to flow inside a treatment hole into which the electrode is inserted, and between the electrode and the inner wall surface of the treatment hole The inner wall surface is subjected to surface treatment by supplying electricity between the two surfaces. In this surface treatment device, the electrode is composed of a first electrode and a second electrode, and the first electrode and the second electrode are in a state of being electrically insulated via an insulating member. are integrated, the first electrode is inserted from one opening of the processing hole having a bent portion, the second electrode is inserted from the other opening of the processing hole, and passes through the first tip of the first electrode The first electrode and the second electrode are integrated with the first electrode and the second electrode in contact with the second distal end portion of the second electrode inside the bent portion via the insulating member.

Here, for example, for a processing hole having a bent portion in the middle of the extending direction, the linear portion (first linear portion) from one opening to the bent portion and the gap from the other opening to the bent portion The extending directions of the linear portions (second linear portions) between them are different from each other. For example, when the inner wall surface of the processing hole is surface-treated using a general electrode having a linear external shape, first, masking is performed so that the electrolytic treatment solution does not come into contact with the inner wall surface of the first linear portion. Next, the electrode is inserted through the other opening of the processing hole so that the electrode faces the inner wall surface of the second linear portion.

Next, the inner wall surface is surface-treated by an energization step of passing the electrolytic treatment solution through the treatment hole and energizing between the electrode and the inner wall surface of the second linear portion. Next, masking was performed on the inner wall surface of the first linear portion, and masking was performed on the inner wall surface of the surface-treated second linear portion. Next, similarly to the surface treatment performed on the inner wall surface of the second linear portion, the inner wall surface of the first linear portion is also subjected to an electrification step to perform surface treatment. That is, in order to surface-treat the processing hole which has a bending part using the general electrode whose external appearance shape is a linear shape, it is necessary to carry out a plurality of masking steps and a plurality of energization steps.

However, in the surface treatment apparatus according to the present invention having the first electrode and the second electrode integrated as described above, the first electrode and the inner wall surface of the first linear portion of the treatment hole can face each other, and The energization step is performed in a state in which the second electrode faces the inner wall surface of the second linear portion. This makes it possible to perform surface treatment on both the inner wall surface of the first linear portion and the inner wall surface of the second linear portion of the processing hole through a common energization step without going through complicated steps such as masking.

Furthermore, since the first electrode and the second electrode are insulated, the first electrode and the second electrode can be energized by independently supplying current. According to this, for example, compared with the case where the current is supplied from the base end side of the first electrode to the base end side of the second electrode via the first tip portion and the second tip portion without insulating the first electrode and the second electrode. , it is possible to suppress a difference in current distribution from occurring between the inner wall surface of the first linear portion and the inner wall surface of the second linear portion of the processing hole. As a result, the inner wall surfaces of both the first linear portion and the second linear portion of the processing hole can be substantially uniformly surface-treated.

As described above, according to the surface treatment apparatus, even when the treatment hole is formed of a shape having a bent portion, the inner wall surface of the treatment hole can be surface-treated with high efficiency and high quality.

In the above-mentioned surface treatment apparatus, it is preferable that the first electrode and the second electrode are hollow bodies having a tubular portion, and a first sealing member for sealing a distal end of the first electrode is provided in the first distal end portion. A second closing portion for closing the distal end of the second electrode is provided on the second distal end portion, and a first inner electrode is provided on the first electrode, and the first inner electrode is located on the side of the first electrode. The inside extends in the axial direction and is electrically connected to the first closing portion, and a second inside electrode is provided on the second electrode, the second inside electrode extends in the axial direction inside the second electrode, and is connected to the second electrode. The second closing portion is electrically connected.

In this case, by supplying a current to the first electrode via the first inner electrode, the current can flow from the side of the first distal end portion where the first closing portion is provided to the side of the proximal end portion. Similarly, in the second electrode, by supplying a current to the second electrode via the second inner electrode, the current can flow from the second distal end portion side where the second closing portion is provided to the proximal end side. According to this, it is possible to satisfactorily conduct electricity between the first sealing portion and the second sealing portion and the inner wall surface of the bent portion of the processing hole, so that the inner wall surface of the bent portion of the processing hole can also be effectively surface-treated. .

According to another aspect of the present invention, there is provided a surface treatment apparatus including an electrode, and by allowing an electrolytic treatment solution to flow inside a treatment hole into which the electrode is inserted, the electrode and the inner wall surfaces of the treatment hole are formed. The inner wall surface is subjected to surface treatment by energizing between them. In this surface treatment device, the electrode is composed of a first electrode and a second electrode, and the first electrode and the second electrode are electrically insulated via an insulating member. The state is integrated, and the processing hole is composed of a first processing hole and a second processing hole, wherein the second processing hole is provided with an opening on the inner wall surface of the first processing hole, and is inserted into the first processing hole. A portion to be inserted in the processing hole of the first electrode facing the opening of the second processing hole is provided with an inserted portion, and the first electrode is inserted into the inserted portion by inserting the distal end portion of the second electrode. The insulating member is integrated with the second electrode, and the insulating member is interposed between the inserted portion and the distal end portion of the second electrode.

The processing hole formed of the first processing hole and the second processing hole provided with an opening in the inner wall surface of the first processing hole, in other words, the second processing hole branching from the first processing hole also has a plurality of linear shapes with different extending directions. department. When the inner wall surface of such a processing hole is surface-treated using a general electrode having a linear external shape, masking or conduction steps are also required for each of the first processing hole and the second processing hole.

On the other hand, in the surface treatment apparatus according to the present invention having the first electrode and the second electrode integrated as described above, the first electrode and the inner wall surface of the first treatment hole can face each other, and the second electrode can be made to face the inner wall surface of the first treatment hole. The energization step is performed in a state where the electrodes face the inner wall surface of the second processing hole. According to this, it is possible to perform surface treatment on the inner wall surfaces of both the first processing hole and the second processing hole by a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, the first electrode and the second electrode can be energized by independently supplying current. Accordingly, the inner wall surfaces of both the first processing hole and the second processing hole can be substantially uniformly surface-treated.

As described above, according to the surface treatment apparatus, even when the treatment hole is formed of the shape having the branch portion, the inner wall surface of the treatment hole can be efficiently and efficiently surface treated with high quality.

In the above-mentioned surface treatment apparatus, it is preferable that the first electrode is a hollow body having a tubular portion, and the inserted portion is formed of a hole penetrating a peripheral wall of the first electrode, and is provided inside the inserted portion. The insulating member is provided with an internal thread formed on the insulating member, an external thread is formed on the distal end portion of the second electrode, and the first The electrode and the second electrode are positioned and fixed. In this case, since the energization process can be performed in a state in which the positional relationship between the inner wall surfaces of the first processing holes and the second processing holes and the outer peripheral surfaces of the first and second electrodes is well maintained, it is possible to further increase the Quality finish.

In the above-mentioned surface treatment apparatus, it is preferable that a closing portion is provided at the distal end portion of the first electrode, the closing portion closes the distal end of the first electrode and faces the bottom surface of the bottomed first processing hole, An inner electrode is provided inside the first electrode, the inner electrode extends along the axial direction of the first electrode, and is electrically connected to the sealing portion. In this case, by supplying the current from the inner electrode, the current can be caused to flow from the distal end side to the proximal end side of the first electrode in which the closing portion is provided. According to this, since electricity can be satisfactorily conducted between the closed portion and the bottom surface of the first processing hole, the bottom surface can also be effectively surface-treated.

According to another aspect of the present invention, there is provided a surface treatment apparatus including an electrode, and by allowing an electrolytic treatment solution to flow inside a treatment hole into which the electrode is inserted, the electrode and the inner wall surfaces of the treatment hole The inner wall surface is subjected to surface treatment by energizing between them. In this surface treatment device, the electrode is composed of a first electrode and a second electrode, and the first electrode and the second electrode are electrically insulated via an insulating member. The state is integrated, the first electrode and the second electrode are hollow bodies having a tubular portion, the outer diameter of the first electrode is larger than the outer diameter of the second electrode, and the processing hole is made of a bottomed A first processing hole and a bottomed second processing hole intersecting the first processing hole are constituted, and between the first processing hole and the second processing hole of the first electrode inserted into the first processing hole A through hole is formed at the intersection of the second processing hole along the extending direction of the second processing hole, and the second electrode inserted into the second processing hole is inserted through the through hole so as to be integrated with the first electrode, and the insulating member is sandwiched between the through hole and the second electrode.

The processing hole composed of the first processing hole and the second processing hole intersecting with the first processing hole also has a plurality of linear portions having different extending directions. When the inner wall surface of such a processing hole is surface-treated using a general electrode having a linear external shape, masking or conduction steps are also required for each of the first processing hole and the second processing hole.

On the other hand, in the surface treatment apparatus according to the present invention having the first electrode and the second electrode integrated as described above, the first electrode and the inner wall surface of the first treatment hole can face each other, and the second electrode can be made to face the inner wall surface of the first treatment hole. The energization step is performed in a state where the electrodes face the inner wall surface of the second processing hole. According to this, it is possible to perform surface treatment on the inner wall surfaces of both the first processing hole and the second processing hole by a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, the first electrode and the second electrode can be energized by independently supplying current. Accordingly, the inner wall surfaces of both the first processing hole and the second processing hole can be substantially uniformly surface-treated.

In summary, according to this surface treatment apparatus, even when the treatment hole is formed of a shape having an intersecting portion, the inner wall surface of the treatment hole can be surface-treated with high efficiency and high quality.

In the above-described surface treatment apparatus, preferably, the second electrode is inserted into the second treatment hole having a diameter smaller than that of the first treatment hole. In this way, according to the outer diameter of the second electrode smaller than the outer diameter of the first electrode, the outer peripheral surface of the second electrode is made to face the inner wall surface of the second treatment hole having a diameter smaller than that of the first treatment hole. Thereby, the difference in current density between the inner wall surfaces of the first processing hole and the second processing hole is suppressed, and the inner wall surfaces of both the first processing hole and the second processing hole can be easily surface-treated substantially uniformly.

In the above-mentioned surface treatment apparatus, preferably, a closing portion is formed at a distal end portion of the first electrode, the closing portion closes the distal end of the first electrode and faces a bottom surface of the first processing hole, and the first The inner diameter of the electrode is larger than the outer diameter of the second electrode, and an inner electrode is provided inside the first electrode, and the inner electrode passes between the inner peripheral surface of the first electrode and the outer peripheral surface of the second electrode , which extends along the axial direction of the first electrode and is electrically connected to the closing portion of the first electrode.

In this case, by supplying the current from the inner electrode, the current can be made to flow from the distal end side to the proximal end side of the first electrode in which the closing portion is provided, and therefore, the bottom surface of the first processing hole facing the closing portion can also be effective. surface treatment.

In the above-mentioned surface treatment apparatus, it is preferable that a closing portion is provided at the distal end portion of the second electrode, the closing portion is arranged to close the distal end of the second electrode and face the bottom surface of the second processing hole, The second electrode is provided with an inner electrode that extends axially inside the second electrode and is electrically connected to the closing portion of the second electrode. Also in this case, the bottom surface of the closed portion of the second processing hole facing the second electrode can be effectively surface-treated.

According to another embodiment of the present invention, there is provided a surface treatment method for subjecting the inner wall surface of a treatment hole to a surface treatment using an electrode composed of a first electrode and a second electrode, the surface treatment method including an integration step and energization step, wherein the integration step includes: integrating the first electrode and the second electrode in a state of being electrically insulated via an insulating member in the inside of the processing hole; and the energization step includes electrolytic treatment The liquid flows in the inside of the processing hole, and at the same time, electricity is energized between the first electrode and the second electrode and the inner wall surface of the processing hole. In the integration step, the first electrode is The insulating member is provided in at least one of the first distal end portion and the second distal end portion of the second electrode, the first electrode is inserted through one opening of the processing hole having a bent portion, and the first electrode is inserted from the The second electrode is inserted into the other opening of the processing hole, and the first distal end portion is brought into contact with the second distal end portion via the insulating member inside the bent portion.

Inside the treatment hole, through the integration process of integrating the first electrode and the second electrode as described above, the first electrode and the linear portion (the first electrode) between the one opening of the treatment hole and the bent portion can be formed. The energization step is performed in a state in which the inner wall surfaces of the linear portion (1) face each other and the second electrode faces the inner wall surface of the linear portion (second linear portion) from the other opening to the bent portion. According to this, it is possible to perform surface treatment on the inner wall surfaces of both the first linear portion and the second linear portion through a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, the first electrode and the second electrode can be energized by independently supplying current. Accordingly, the inner wall surfaces of both the first linear portion and the second linear portion of the processing hole can be substantially uniformly surface-treated.

In conclusion, according to this surface treatment method, even when the treatment hole is formed of a shape having a bent portion, the inner wall surface of the treatment hole can be surface-treated with high efficiency and high quality.

In the above-mentioned surface treatment method, preferably, in the energization step, electricity is supplied to the first electrode through a first inner electrode, and electricity is supplied to the second electrode through a second inner electrode, wherein the first electrode is energized. The inner electrode extends in the axial direction inside the first electrode composed of a hollow body having a tubular portion, and is electrically connected to a first closing portion that closes the tip of the first electrode; the second inner electrode is formed by The inside of the second electrode formed of a hollow body having a tubular portion extends in the axial direction, and is electrically connected to a second closing portion that closes the distal end of the second electrode.

In this case, since electricity can be favorably conducted between the first and second closing portions and the inner wall surface of the bent portion of the treatment hole, it can also be effectively applied to the inner wall surface of the bent portion of the treatment hole. Surface treatment.

According to another aspect of the present invention, there is provided a surface treatment method for subjecting an inner wall surface of a treatment hole to a surface treatment using an electrode composed of a first electrode and a second electrode, the surface treatment method including an integration step and energization step, wherein the integration step includes: integrating the first electrode and the second electrode in a state of being electrically insulated via an insulating member in the inside of the processing hole; and the energization step includes electrolytic treatment The liquid flows through the inside of the processing hole, and electricity is energized between the first electrode and the second electrode and the inner wall surface of the processing hole, and in the integration step, the first electrode is inserted into the The first treatment hole of the treatment hole constituted by the first treatment hole and the second treatment hole, the second electrode is inserted into the second treatment hole, and the tip portion of the second electrode is inserted through the first treatment hole. The insulating member is inserted into the inserted portion of the first electrode, wherein the first treatment hole is a treatment hole with a bottom, and the second treatment hole is provided with an opening in an inner wall surface of the first treatment hole of the processing hole, the inserted portion is provided on a portion of the first electrode facing the opening of the second processing hole.

In the inside of the treatment hole, through the integration process of integrating the first electrode and the second electrode as described above, the first electrode and the inner wall surface of the first treatment hole can face each other, and the second electrode and the second treatment hole can be made to face each other. The energization step is performed in a state where the inner wall surfaces of the holes face each other. According to this, it is possible to perform surface treatment on the inner wall surfaces of both the first processing hole and the second processing hole by a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, in the energization step, the first electrode and the second electrode can be energized by independently supplying current. Accordingly, the inner wall surfaces of both the first processing hole and the second processing hole can be substantially uniformly surface-treated.

In conclusion, even when the processing hole is formed of a shape having a branch, the inner wall surface of the processing hole can be surface-treated with high efficiency and high quality.

In the above surface treatment method, preferably, the first electrode is formed of a hollow body having a tubular portion, the inserted portion is formed of a hole penetrating a peripheral wall of the first electrode, and in the integration step, The internal thread formed on the insulating member provided inside the inserted portion is screwed with the external thread formed on the distal end portion of the second electrode, and the first electrode and the The second electrode is positioned and fixed. In this case, the energization process can be performed in a state in which the positional relationship between the inner wall surfaces of the first processing hole and the second processing hole and the outer peripheral surfaces of the first electrode and the second electrode is maintained favorably, so that the high quality can be further improved. Surface treatment.

In the above-mentioned surface treatment method, preferably, in the energization step, the first inner electrode is passed through the first inner electrode in a state in which the first closing portion that closes the distal end of the first electrode faces the bottom surface of the first treatment hole. The first electrode is energized, wherein the first inner electrode extends in the axial direction inside the first electrode, and is electrically connected to the first closing portion. In this case, since electricity can be satisfactorily conducted between the closed portion of the first electrode and the bottom surface of the first processing hole, the surface is also effectively surface-treated.

According to another aspect of the present invention, there is provided a surface treatment method for subjecting an inner wall surface of a treatment hole to a surface treatment using an electrode consisting of a first electrode and a second electrode, the surface treatment method including an integration step and an electrification step. , wherein the integration step is: in the inside of the processing hole, the first electrode and the second electrode are integrated in a state of electrical insulation via an insulating member; It circulates inside the processing hole, and conducts electricity between the first electrode and the second electrode having a tubular portion and the inner wall surface of the processing hole. A hollow body, wherein in the integration step, a first electrode having an outer diameter larger than an outer diameter of the second electrode is inserted into the first processing hole composed of a first processing hole and a second processing hole After processing the hole, the second electrode is inserted into the second processing hole, and the second electrode is inserted into the through hole of the first electrode via the insulating member, wherein the first processing The hole is a bottomed processing hole, the second processing hole is a bottomed processing hole intersecting with the first processing hole, and the through hole is formed in the first electrode and disposed between the first processing hole and the first processing hole. The portion of the intersection of the second processing hole.

In the inside of the treatment hole, through the integration process of integrating the first electrode and the second electrode as described above, the first electrode and the inner wall surface of the first treatment hole can face each other, and the second electrode and the second treatment hole can be made to face each other. The energization step is performed in a state where the inner wall surfaces of the holes face each other. According to this, it is possible to perform surface treatment on the inner wall surfaces of both the first processing hole and the second processing hole by a common energization step without going through complicated steps such as masking. In addition, since the first electrode and the second electrode are insulated, in the energization step, the first electrode and the second electrode can be energized by independently supplying current. Accordingly, the inner wall surfaces of both the first processing hole and the second processing hole can be substantially uniformly surface-treated.

In summary, according to this surface treatment method, even when the treatment hole is formed of a shape having an intersecting portion, the inner wall surface of the treatment hole can be surface-treated with high efficiency and high quality.

In the above-described surface treatment method, preferably, in the integration step, the second electrode is inserted into the second treatment hole having a diameter smaller than that of the first treatment hole. In this case, the difference in current density between the inner wall surfaces of the first and second treatment holes is suppressed, and the inner wall surfaces of both the first and second treatment holes can be easily surface-treated substantially uniformly.

In the above-mentioned surface treatment method, it is preferable that the inner diameter of the first electrode is larger than the outer diameter of the second electrode, and in the energization step, a sealing portion for sealing a distal end of the first electrode faces the first electrode. 1. In the state where the bottom surface of the hole is processed, the first electrode is energized through the inner electrode passing between the inner peripheral surface of the first electrode and the outer peripheral surface of the second electrode along the first electrode. The first electrode extends in the axial direction and is electrically connected to the closing portion of the first electrode. In this case, by supplying the current from the inner electrode of the first electrode, the current can be made to flow from the distal end side of the first electrode to the proximal end side, so that the surface of the first processing hole facing the first electrode can also be effectively closed The bottom surface of the part is surface-treated.

In the above-described surface treatment method, preferably, in the energization step, the second electrode is directed to the second electrode via the inner electrode in a state in which the closing portion that closes the tip of the second electrode faces the bottom surface of the second treatment hole. energization, wherein the inner electrode extends in the axial direction inside the second electrode, and is electrically connected to the closed portion of the second electrode. In this case, by supplying the current from the inner electrode of the second electrode, the current can be made to flow from the distal end side of the second electrode to the proximal end side, and therefore, it is also possible to control the sealing portion of the second processing hole facing the second electrode. The bottom surface is effectively surface treated.

Description of drawings

FIG. 1 is a schematic configuration diagram of a main part of a surface treatment apparatus according to a first embodiment of the present invention and a treatment hole for surface treatment of an inner wall by the surface treatment apparatus.

FIG. 2 is an enlarged view of a main part of FIG. 1 .

FIG. 3 is an enlarged view of a main part of an electrode and a processing hole according to a modification of the surface treatment apparatus of FIG. 1 .

4 is a schematic configuration diagram of a main part of a surface treatment apparatus according to a second embodiment of the present invention and a treatment hole for surface treatment of an inner wall by the surface treatment apparatus.

FIG. 5 is an enlarged view of the main part of FIG. 4 .

6 is a schematic configuration diagram of a main part of a surface treatment apparatus according to a third embodiment of the present invention and a treatment hole for surface treatment of an inner wall by the surface treatment apparatus.

FIG. 7 is an enlarged view of the main part of FIG. 6 .

FIG. 8 is a cross-sectional view of the electrode of FIG. 7 taken along arrow VIII-VIII.

Detailed ways

The surface treatment apparatus and the surface treatment method according to the present invention will be described in detail with reference to the accompanying drawings by citing preferred embodiments. In addition, in the following drawings, the same code|symbol is attached|subjected to the component which has the same or the same function and effect, and the overlapping description may be abbreviate|omitted.

The surface treatment apparatus and the surface treatment method according to the present invention can be suitably applied to, for example, electroplating, electrolytic etching, electrolytic degreasing, electrodeposition coating, anodizing, cathodic oxidation, electropolishing, or pretreatment or posttreatment of these treatments, etc. The case where electrical surface treatment is performed on the surface to be treated. Hereinafter, an example in which electroplating is performed by a surface treatment apparatus and a surface treatment method will be described, but of course, it is not limited to this.

As shown in FIG. 1 , the surface treatment apparatus 10 according to the first embodiment forms a plating film (not shown) on the inner wall surface of the treatment hole 12 . As an example of the electroplating film, a film composed of a zinc alloy, such as a zinc-nickel composite electroplating film, can be mentioned. In this case, the electroplating film can be formed using an electrolytic treatment solution composed of an electroplating bath prepared by mixing zinc chloride, nickel chloride, ammonium chloride, or the like.

The processing hole 12 is formed in, for example, the casting mold 14 , is a cooling passage for supplying cooling water for cooling the casting mold 14 , and has a bent portion 16 in the middle of the extending direction. That is, the extending directions of the first linear portion 20 and the second linear portion 24 of the processing hole 12 are different from each other, wherein the first linear portion 20 is a portion from one opening 18 to the bent portion 16; the second The straight portion 24 is a portion from the other opening 22 to the bent portion 16 .

The casting mold 14 is formed of an alloy steel or the like, and cooling water is supplied into the processing hole 12 . Accordingly, temperature control is performed to keep the casting mold 14 at an optimum temperature during molding, or to efficiently cool the casting mold 14 after molding. Corrosion products caused by contact with cooling water, deposits caused by calcium in the cooling water, etc. (hereinafter, these are collectively referred to as deposits) are attached to the inner wall surface of the processing hole 12. Therefore, when cooling The heat exchange between water and the casting mold 14 and the flow of cooling water are hindered, and there is a fear that it will be difficult to stably control the temperature of the casting mold 14 . Therefore, by using the surface treatment apparatus 10 to form a plated film on the inner wall surface of the processing hole 12 , it is possible to suppress the adhesion of the adherents to the inner wall surface. Accordingly, the temperature of the casting mold 14 can be maintained at the optimum temperature.

The surface treatment apparatus 10 mainly includes an electrode 30 , a liquid supply part 31 , a liquid discharge part 32 , a pump 33 , a treatment liquid tank 34 , and an external power source (not shown).

The electrode 30 is composed of a hollow first electrode 36 and a second electrode 38 having tubular portions formed of, for example, platinum-coated titanium or the like. In addition, the portion of the first electrode 36 protruding from the liquid supply portion 31 is inserted into the first linear portion 20 of the processing hole 12 , and the portion of the second electrode 38 protruding from the liquid discharge portion 32 is inserted into the first linear portion 20 of the processing hole 12 . 2. Linear portion 24. In the first embodiment, for the first electrode 36 and the second electrode 38 inserted into the treatment hole 12 , the openings 18 and 22 of the treatment hole 12 are the base end side, and the bent portion 16 side is the distal end side, respectively. Be explained.

As shown in FIG. 2 , the distal end portion of the first electrode 36 , that is, the first distal end portion 40 is provided with a first closing portion 42 , which closes the distal end of the tubular portion of the first electrode 36 . A first inner electrode 44 is provided inside the first electrode 36 , and the first inner electrode 44 extends in the axial direction of the first electrode 36 and is electrically connected to the first closing portion 42 at one end side. The other end side of the first inner electrode 44 extends to the outside of the processing hole 12 through the liquid supply unit 31 and is connected to an external power source.

The second electrode 38 is configured in the same manner as the first electrode 36 . That is, a second closing portion 48 is provided at the distal end portion of the second electrode 38 , that is, the second distal end portion 46 , and a second inner electrode whose one end side is electrically connected to the second closing portion 48 is provided inside the second electrode 38 . 50. The other end side of the second inner electrode 50 extends to the outside of the processing hole 12 through the liquid discharge portion 32, and is connected to an external power source.

The first electrode 36 and the second electrode 38 are integrated in an electrically insulated state by contacting the first tip portion 40 and the second tip portion 46 inside the bent portion 16 via the insulating member 52 . That is, the insulating members 52 are respectively provided in the portions of the first distal end portion 40 and the second distal end portion 46 that are in contact with each other inside the bent portion 16 .

The positions at which the insulating member 52 is provided in the first distal end portion 40 and the second distal end portion 46 are adjusted according to the angle θ formed by the first linear portion 20 and the second linear portion 24 of the processing hole 12 , and the like. For example, as in the processing hole 12 shown in FIG. 2 , when the angle θ is relatively large, on the distal end surface side of each of the first distal end portion 40 and the second distal end portion 46 (the first closed portion 42 and the second closed portion 48) The insulating member 52 may be provided.

In addition, for example, as in the processing hole 12 shown in FIG. 3 , when the angle θ is relatively small, the first closing portion 42 is arranged so as to face the inner wall surface of the second linear portion 24 , and the first end portion 40 The insulating member 52 may be provided on the outer peripheral surface, and the insulating member 52 may be provided on the distal end surface side of the second closing portion 48 .

In addition, since the insulating member 52 may be provided so as to be able to electrically insulate the first electrode 36 and the second electrode 38, for example, the insulating member 52 may be provided only on the first tip portion 40 and the second tip portion 46. either party.

The liquid supply part 31 is detachably attached to one opening 18 of the processing hole 12 , and the liquid discharge part 32 is detachably attached to the other opening 22 of the processing hole 12 . The pump 33 supplies the electrolytic treatment liquid between the inner wall surface of the first linear portion 20 and the outer peripheral surface of the first electrode 36 through the supply pipe 54 and the liquid supply portion 31 . According to this, the electrolytic treatment solution flows from one opening 18 of the treatment hole 12 toward the other opening 22, between the outer peripheral surface of the first electrode 36 and the inner wall surface of the first linear portion 20, and between the outer peripheral surface of the second electrode 38 and the second electrode 38. After flowing between the inner wall surfaces of the linear portion 24, the liquid is discharged from the processing hole 12 to the recovery pipe 56 through the liquid discharge portion 32.

The processing liquid tank 34 recovers the electrolytic processing liquid discharged from the processing hole 12 to the recovery piping 56 through the discharge portion 32 as described above. In addition, the recovered electrolytic treatment liquid is supplied to the liquid supply unit 31 again by the pump 33 and circulated between the surface treatment apparatus 10 and the treatment hole 12 .

In addition, in the case where, for example, a degreasing cleaning liquid, an etching liquid, a smut removal liquid, water, etc., are circulated in the processing hole instead of the electrolytic treatment liquid composed of a plating bath, the treatment composed of the above-mentioned liquid can be carried out by the pump 33. The liquid may be supplied to the processing hole 12 through the liquid supply unit 31 . In addition, the above-mentioned liquid discharged from the processing hole 12 by the liquid discharge part 32 may be recovered in the processing liquid tank 34 .

The external power supply supplies current to the first electrode 36 and the second electrode 38 via the first inner electrode 44 and the second inner electrode 50 . That is, as indicated by the arrow E in FIG. 2 , the current from the external power source flows to the first sealing portion 42 and the second sealing portion 48 via the first inner electrode 44 and the second inner electrode 50 , respectively. Then, the current flows in the direction from the first closing portion 42 and the second closing portion 48 toward the proximal ends of the first electrode 36 and the second electrode 38 . Accordingly, potential differences can be generated between the first electrode 36 and the inner wall surface of the first linear portion 20 and between the second electrode 38 and the inner wall surface of the second linear portion 24, respectively.

The surface treatment apparatus 10 according to the first embodiment is basically configured as described above. Hereinafter, the surface treatment method according to the first embodiment will be described by taking an example in which the inner wall surface of the treatment hole 12 is subjected to electroplating treatment as a surface treatment using the surface treatment apparatus 10 .

In this surface treatment method, first, an integration step is performed, that is, the first electrode 36 and the second electrode 38 are integrated in a state of being electrically insulated through the insulating member 52 in the inside of the processing hole 12 . Specifically, the first electrode 36 is inserted into the first linear portion 20 of the processing hole 12 , and the liquid supply portion 31 is attached to one opening 18 of the processing hole 12 . Similarly, the second electrode 38 is inserted into the second linear portion 24 of the processing hole 12 , and the drain portion 32 is attached to the other opening 22 of the processing hole 12 . Accordingly, the first electrode 36 and the second electrode 38 are integrated by bringing the first distal end portion 40 and the second distal end portion 46 into contact with each other through the insulating member 52 inside the bent portion 16 .

Next, a degreasing step of removing oil components from the inner wall surface of the processing hole 12 is performed by circulating a degreasing cleaning liquid (eg, a water-soluble alkaline cleaning agent, etc.) through the processing hole 12 through the liquid supply part 31 and the liquid discharge part 32 .

Next, an etching solution (for example, a 10 wt % hydrochloric acid aqueous solution or a 10 wt % sulfuric acid aqueous solution, etc.) is circulated through the processing hole 12 through the liquid supply part 31 and the liquid discharge part 32 , and removal from the inner wall surface of the processing hole 12 is performed. Etching process of oxide film. This etching treatment step may be performed by electrolytic etching (anodic electrolysis) by supplying electric current from an external power source to the first electrode 36 and the second electrode 38 via the first inner electrode 44 and the second inner electrode 50 .

Next, the stain removal step is performed by circulating a stain removing liquid (eg, a mixed solution of sodium hydroxide and sodium citrate, etc.) through the processing hole 12 via the liquid supply unit 31 and the liquid drain unit 32 . By performing the stain removal step, for example, the oxide film is removed in the above-mentioned etching treatment step, and even if the water-insoluble metal component (stain) is exposed on the inner wall surface of the processing hole 12, the stain can be removed from the processing hole 12.

In addition, the stain removal process can also be performed by electrolytic treatment (cathode electrolysis or anodic electrolysis) similarly to the etching treatment process. In this case, since the stain removing liquid is electrolyzed in the processing hole 12 to generate oxygen, the stain can be removed more effectively.

Next, an energization step is performed, that is, the electrolytic treatment liquid is circulated through the treatment hole 12 through the liquid supply part 31 and the liquid discharge part 32, and current is supplied from an external power source to the first inner electrode 44 and the second inner electrode 50, so that the first inner electrode 44 and the second inner electrode 50 are Electricity is passed between the first electrode 36 and the second electrode 38 and the inner wall surface of the processing hole 12 . Accordingly, a plated film can be formed on the inner wall surface of the processing hole 12 .

Therefore, in the first embodiment, by using the first electrode 36 and the second electrode 38 integrated as described above, it is possible to make the outer peripheral surface of the first electrode 36 and the inner wall surface of the first linear portion 20 face each other, Then, the energization step is performed in a state in which the outer peripheral surface of the second electrode 38 and the inner wall surface of the second linear portion 24 face each other. Accordingly, the inner wall surfaces of both the first linear portion 20 and the second linear portion 24 of the processing hole 12 can be surface-treated through a common energization step without going through complicated steps such as masking.

Furthermore, since the first electrode 36 and the second electrode 38 are insulated, the first electrode 36 and the second electrode 38 can be energized by independently supplying current. According to this, it is possible to suppress a difference in current distribution from occurring between the inner wall surface of the first linear portion 20 and the inner wall surface of the second linear portion 24 of the processing hole 12 compared to the case where, for example, , without insulating the first electrode 36 and the second electrode 38 , a current flows from the first electrode 36 to the proximal end side of the second electrode 38 via the first tip portion 40 and the second tip portion 46 . As a result, the inner wall surface of the processing hole 12 can be surface-treated substantially uniformly, and a high-quality plated film with a substantially uniform thickness can be formed.

In conclusion, according to the surface treatment apparatus 10 and the surface treatment method according to the first embodiment, even for the treatment hole 12 having the bent portion 16 , the inner wall surface of the treatment hole 12 can be efficiently and efficiently surface-treated with high quality . In this way, a plated film having a substantially uniform thickness is formed on the inner wall surface of the processing hole 12 , and it is possible to effectively suppress adhesion of deposits to the inner wall surface. In the processing hole 12 in which the adhesion of the deposits to the inner wall surface or the generation of the products on the inner wall surface is suppressed, the cooling water can be circulated well in the inside, or the cooling water and the casting mold 14 can be well connected. Because of heat exchange, the temperature control of the casting mold 14 can be performed stably. Furthermore, the temperature of the casting mold 14 can be maintained at the optimum temperature.

In addition, as described above, in the surface treatment apparatus 10 , the first sealing portion 42 and the first inner electrode 44 are provided on the first electrode 36 , and the second sealing portion 48 and the second inner electrode 50 are provided on the second electrode 38 . . Then, in the energization step, by supplying current to the first electrode 36 via the first inner electrode 44 , the current flows from the first distal end portion 40 side where the first closing portion 42 is provided to the proximal end side. Also, in the second electrode 38 , by supplying current to the second electrode 38 via the second inner electrode 50 similarly, the current flows from the second distal end portion 46 side where the second closing portion 48 is provided to the proximal end side. Thereby, electricity can be satisfactorily conducted between the first closing portion 42 and the second closing portion 48 and the inner wall surface of the bent portion 16 , so that the inner wall surface of the bent portion 16 can also be effectively surface-treated.

Therefore, a plating film having a sufficient thickness can be formed on the inner wall surface of the folded portion 16 , and it is possible to effectively suppress adhesion of deposits to the inner wall surface of the folded portion 16 or generation of products. In the casting mold 14, the bent portion 16 in the processing hole 12 may be arranged in the vicinity of the cavity forming surface (not shown). In the vicinity of the cavity forming surface, the temperature control of the casting mold 14 is preferably performed particularly stably. As described above, in the bent portion 16 in which the adhesion of the deposits to the inner wall surface or the generation of the products on the inner wall surface is suppressed, the cooling water can be circulated well in the inside, or the cooling water can be caused to be mixed with the casting mold. 14 Good heat exchange. Therefore, for example, even when the bent portion 16 in the processing hole 12 is arranged in the vicinity of the cavity formation surface, the temperature control in the vicinity of the cavity formation surface of the casting mold 14 can be stably performed.

Next, the surface treatment apparatus 60 according to the second embodiment will be described with reference to FIGS. 4 and 5 . The surface treatment apparatus 60 forms a plating film (not shown) on the inner wall surface of the treatment hole 62 .

As shown in FIG. 4 , the processing hole 62 is also formed in the casting mold 14 similarly to the above-described processing hole 12 , and is a cooling passage for supplying cooling water for cooling the casting mold 14 . The processing hole 62 includes a bottomed first processing hole 64 and a second processing hole 66 having a diameter smaller than that of the first processing hole 64 . In the second processing hole 66 , an opening 68 located on the opposite side of the opening 67 that opens to the outside of the casting mold 14 is provided on the inner wall surface of the first processing hole 64 . That is, the processing hole 62 has the branch portion 70 formed by the first processing hole 64 and the second processing hole 66 branched from the first processing hole 64 . Therefore, the processing hole 62 also has linear portions (the first processing hole 64 and the second processing hole 66 ) whose extending directions are different from each other.

The surface treatment apparatus 60 has the same configuration as the surface treatment apparatus 10 according to the first embodiment, except that the electrode 72 is provided instead of the electrode 30 . The electrode 72 is composed of a hollow first electrode 74 and a second electrode 76 having tubular portions formed of, for example, platinum-coated titanium or the like. The first electrode 74 is inserted into the first processing hole 64 , and the second electrode 76 whose outer diameter is smaller than that of the first electrode 74 is inserted into the second processing hole 66 .

In the second embodiment, for the first electrode 74 inserted into the first processing hole 64 , the opening 77 side of the first processing hole 64 is regarded as the proximal end side, and the bottom surface 78 side of the first processing hole 64 is regarded as the distal end. side to explain. The second electrode 76 inserted into the second processing hole 66 will be described with the opening 67 side of the second processing hole 66 as the proximal end side and the other opening 68 side as the distal end side.

As shown in FIG. 5 , the first electrode 74 is configured in the same manner as the first electrode 36 described above, except that the inserted portion 80 is provided on the peripheral wall facing the opening 68 of the second processing hole 66 . That is, the first closing portion 42 is provided on the first distal end portion 40 serving as the distal end portion of the first electrode 74 , and the first inner electrode 44 is provided inside the first electrode 74 . The inserted portion 80 is formed of a hole penetrating through the peripheral wall of the first electrode 74 facing the opening 68 of the second processing hole 66 , and an annular insulating member 82 is provided inside. A female screw 82a is formed on the inner circumference of the insulating member 82 .

The second electrode 76 is formed of a tubular body, and a male thread 84a that can be screwed with the female thread 82a of the insulating member 82 is formed on the outer peripheral surface of the second distal end portion 84 serving as the distal end portion of the second electrode 76 . The proximal end side of the second electrode 76 extends to the outside of the processing hole 62 via the liquid discharge portion 32 , and is connected to an external power source.

The first electrode 74 and the second electrode 76 are integrated by inserting the second distal end portion 84 of the second electrode 76 into the inserted portion 80 of the first electrode 74 . At this time, the first electrode 74 and the second electrode 76 are positioned and fixed by screwing the female screw 82a of the insulating member 82 arranged in the inserted portion 80 with the male screw 84a of the second distal end portion 84 .

Next, the surface treatment method according to the second embodiment will be described by taking an example in which the inner wall surface of the treatment hole 62 is subjected to electroplating treatment as a surface treatment using the surface treatment apparatus 60 .

In this surface treatment method, first, an integration step is performed, that is, the first electrode 74 and the second electrode 76 are integrated in a state of being electrically insulated through the insulating member 82 in the inside of the processing hole 62 . Specifically, the first electrode 74 is inserted into the first processing hole 64 so that the first closing portion 42 faces the bottom surface 78 of the first processing hole 64 , and the liquid supply portion 31 is attached to the opening 77 of the first processing hole 64 . Next, the second electrode 76 is inserted into the second processing hole 66 , and the male thread 84 a of the second distal end portion 84 and the female thread 82 a of the insulating member 82 are screwed together. Accordingly, after the first electrode 74 and the second electrode 76 are integrated, the liquid drain 32 is attached to the opening 67 of the second processing hole 66 .

Next, a degreasing step, an etching treatment step, and a stain removal step are performed in the same manner as in the surface treatment method according to the first embodiment, and then an energization step for forming a plated film on the inner wall surface of the processing hole 62 is performed. In the energization step, the electrolytic treatment liquid is circulated through the treatment hole 62 via the liquid supply part 31 and the liquid discharge part 32 , and the first closing part 42 faces the bottom surface 78 of the first treatment hole 64 . Current is supplied to the first electrode 74 and the second electrode 76 via the first inner electrode 44 . In this way, by energizing between the first electrode 74 and the second electrode 76 and the inner wall surface of the processing hole 62 , a plated film can be formed on the inner wall surface of the processing hole 62 .

Therefore, in the second embodiment, by using the first electrode 74 and the second electrode 76 integrated as described above, it is possible to make the outer peripheral surface of the first electrode 74 face the inner wall surface of the first processing hole 64 , and The energization step is performed in a state in which the outer peripheral surface of the second electrode 76 faces the inner wall surface of the second processing hole 66 . According to this, it is possible to perform surface treatment on the inner wall surfaces of both the first processing hole 64 and the second processing hole 66 by a common energization step without going through complicated steps such as masking.

Furthermore, since the first electrode 74 and the second electrode 76 are insulated from each other, the inner wall surface of the processing hole 62 can be surface-treated substantially uniformly to form a plated film with substantially uniform thickness and high quality.

In conclusion, according to the surface treatment apparatus 60 and the surface treatment method according to the second embodiment, even for the treatment hole 62 having the branch portion 70 , the inner wall surface of the treatment hole 62 can be efficiently and efficiently surface treated with high quality. In this way, a plated film having a substantially uniform thickness is formed on the inner wall surface of the processing hole 62 , and it is possible to effectively suppress adhesion of deposits to the inner wall surface.

As described above, in the integration process, the first electrode 74 and the second electrode 76 are positioned and fixed by screwing the female screw 82a and the male screw 84a. According to this, the energization process can be performed in a state in which the positional relationship between the inner wall surface of each of the first processing hole 64 and the second processing hole 66 and the outer peripheral surface of the first electrode 74 and the second electrode 76 is well maintained. Therefore, it is possible to further Finished with high quality.

In addition, in the surface treatment apparatus 60 according to the second embodiment, the outer diameter of the first electrode 74 is larger than the outer diameter of the second electrode 76 , and the inserted portion 80 is constituted by a hole penetrating the peripheral wall of the first electrode 74 . In addition, a female screw 82 a is formed on the insulating member 82 provided inside the inserted portion 80 , and a male screw 84 a is formed on the distal end portion of the second electrode 76 . However, it is not particularly limited to these. For example, in order to integrate the first electrode 74 and the second electrode 76 , the inserted portion 80 may be configured to be capable of being inserted into the second distal end portion 84 . In addition, the first electrode 74 and the second electrode 76 may be positioned and fixed by fitting the inserted portion 80 and the second distal end portion 84 via the insulating member 82 or the like.

In addition, as described above, in the second embodiment, the first sealing portion 42 and the first inner electrode 44 are provided on the first electrode 74 , and the first sealing portion 42 faces the bottom surface 78 of the first processing hole 64 . In this state, current is supplied to the first electrode 74 via the first inner electrode 44 . According to this, since electricity can be satisfactorily conducted between the first closing portion 42 and the bottom surface 78 of the first processing hole 64 , the bottom surface 78 can also be effectively surface-treated.

Therefore, since a plated film with a sufficient film thickness is formed on the bottom surface 78 of the first processing hole 64, it is possible to effectively suppress adhesion of the deposits on the bottom surface 78. Therefore, even if the bottom surface 78 of the first processing hole 64 is disposed in the casting process, for example, Even in the case of using the vicinity of the cavity forming surface of the mold 14, the temperature control in the vicinity of the cavity forming surface can be stably performed.

Next, the surface treatment apparatus 90 according to the third embodiment will be described with reference to FIGS. 6 to 8 . The surface treatment apparatus 90 forms a plating film (not shown) on the inner wall surface of the treatment hole 92 .

As shown in FIG. 6 , the processing hole 92 is also formed in the casting mold 14 similarly to the above-described processing hole 12 , and is a cooling passage for supplying cooling water for cooling the casting mold 14 . The processing holes 92 are composed of a plurality of (five in the present embodiment) first processing holes 94 and a plurality of (two in the present embodiment) second processing holes 96 intersecting with the first processing holes 94 . That is, the processing hole 92 has the intersection 98 of the first processing hole 94 and the second processing hole 96 . Therefore, the processing hole 92 also has linear portions (the first processing hole 94 and the second processing hole 96 ) whose extending directions are different from each other.

Each of the first processing holes 94 is a bottomed hole extending in the direction of arrow X1X2 in FIG. 6 and provided with a bottom surface 100 on one end side (the side of arrow X1 ). Each second processing hole 96 is a bottomed hole extending in the direction of arrow Y1 Y2 in FIG. 6 and provided with a bottom surface 102 on one end side (the side of arrow Y1 ). The diameter of the second processing hole 96 is smaller than that of the first processing hole 94 , and the second processing hole 96 is arranged to intersect with the first processing hole 94 at a position close to the bottom surface 100 of the first processing hole 94 . In addition, in this embodiment, the diameter of the second processing hole 96 is made smaller than the diameter of the first processing hole 94 , but the diameter of the second processing hole 96 is not limited to this, and the diameter of the second processing hole 96 may be the same as the diameter of the first processing hole 94 .

The surface treatment apparatus 90 is configured in the same manner as the surface treatment apparatus 10 of the first embodiment except that the electrode 104 is provided instead of the electrode 30 described above, and the liquid supply part 31 and the liquid discharge part 32 are provided with the same The first supply and discharge parts 106 with the same number of first processing holes 94 and the second supply and discharge parts 108 with the same number as the second processing holes 96 have a processing liquid supply and discharge mechanism not shown in place of the pump 33 and the processing liquid tank 34 .

The electrodes 104 are composed of the same number of first electrodes 110 as the number of the first processing holes 94 and the same number of the second electrodes 112 as the number of the second processing holes 96 . The first electrode 110 and the second electrode 112 are each a hollow body having a tubular portion formed of, for example, platinum-coated titanium or the like. The first electrode 110 is inserted into the first processing hole 94 , and the second electrode 112 having an outer diameter smaller than the inner diameter of the first electrode 110 is inserted into the second processing hole 96 .

In the third embodiment, for the first electrode 110 and the second electrode 112 inserted into the first processing hole 94 and the second processing hole 96, respectively, the openings 114 of the first processing hole 94 and the second processing hole 96 , 116 side is the base end side, and the bottom surfaces 100 and 102 sides are the distal end side for description.

As shown in FIGS. 6 to 8 , the first electrode 110 is configured in the same manner as the first electrode 36 described above, except that the processing liquid inlet 118 and the through hole 120 are provided. That is, the first closing portion 42 is provided on the first distal end portion 40 serving as the distal end portion of the first electrode 110 , and the first inner electrode 44 is provided inside the first electrode 110 .

The processing liquid inflow port 118 penetrates the peripheral wall which is formed in the 1st electrode 110 slightly on the proximal end side rather than the 1st sealing part 42, and is provided in multiple numbers at intervals in the circumferential direction. The through hole 120 is provided so as to penetrate the portion of the first electrode 110 inserted into the first processing hole 94 and arranged at the intersection 98 along the extending direction of the second processing hole 96 .

The second electrode 112 is configured in the same manner as the second electrode 38 described above, except that the processing liquid inlet 122 is provided. That is, the second closing portion 48 is provided on the second distal end portion 46 serving as the distal end portion of the second electrode 112 , and the second inner electrode 50 is provided inside the second electrode 112 . The processing liquid inflow port 122 penetrates the peripheral wall formed in the second electrode 112 slightly on the proximal end side of the second closing portion 48 , and is provided in plural at intervals in the circumferential direction.

The first electrode 110 and the second electrode 112 are integrated by inserting the second electrode 112 into the through hole 120 of the first electrode 110 . At this time, the outer peripheral surface of the portion of the second electrode 112 inserted into the through hole 120 is covered with the insulating member 124 . That is, by interposing the cylindrical insulating member 124 between the inner peripheral surface of the through hole 120 and the outer peripheral surface of the second electrode 112 , the first electrode 110 and the second electrode 112 are electrically insulated.

In addition, as shown in FIG. 8 , the first inner electrode 44 of the first electrode 110 is disposed on the first electrode 112 and the insulating member 124 which are inserted into the first electrode 110 through the through hole 120 so as to avoid the second electrode 112 and the insulating member 124 . Between the inner peripheral surface of the first electrode 110 and the outer peripheral surface of the second electrode 112 .

The first supply and discharge part 106 is detachably attached to the opening 114 of the first processing hole 94 , and the second supply and discharge part 108 is detachably attached to the opening 116 of the second processing hole 96 . The processing liquid supply and discharge mechanism supplies the electrolytic processing liquid between the inner wall surface of the first processing hole 94 and the outer peripheral surface of the first electrode 110 via the first supply and discharge portion 106 . Similarly, the electrolytic treatment solution is supplied between the inner wall surface of the second treatment hole 96 and the outer peripheral surface of the second electrode 112 through the second supply and discharge portion 108 . In addition, as the processing liquid supply and discharge mechanism, the first supply and discharge part 106 and the second supply and discharge part 108, the structures described in, for example, Japanese Patent Application Laid-Open Publication No. 2015-30897 can be used, and therefore detailed descriptions thereof are omitted.

In this way, the electrolytic treatment solution supplied to the first processing hole 94 and the second processing hole 96 passes between the outer peripheral surfaces of the first electrode 110 and the second electrode 112 and the inner peripheral surface of the processing hole 92, and flows toward the first electrode 110 and the second electrode 112. The distal ends of the electrode 110 and the second electrode 112 . Then, as indicated by the arrow F in FIG. 7 , the treatment liquid flows into each of the first electrode 110 and the second electrode 112 from the treatment liquid inlets 118 and 122 , and flows to the base in the first electrode 110 and the second electrode 112 . After the end side, it is discharged from the processing hole 92 via the first supply and discharge part 106 and the second supply and discharge part 108 .

In addition, the electrolytic treatment liquid may be supplied from the first supply and discharge portion 106 and the second supply and discharge portion 108 to the inside of the first electrode 110 and the second electrode 112 , and may be configured to flow out to the first electrode through the treatment liquid inflow ports 118 and 122 110 and the first processing hole 94 and the second processing hole 96 outside the second electrode 112 .

Hereinafter, the surface treatment method according to the third embodiment will be described by taking an example in which the inner wall surface of the treatment hole 92 is subjected to electroplating treatment as a surface treatment using the surface treatment apparatus 90 .

In this surface treatment method, first, an integration step is performed, that is, the first electrode 110 and the second electrode 112 are integrated in a state of being electrically insulated through the insulating member 124 in the inside of the processing hole 92 . Specifically, the first electrode 110 is inserted into each of the plurality of first processing holes 94 so that the first closing portion 42 faces the bottom surface 100 of the first processing hole 94 , and the first processing hole 94 is mounted on the opening 114 of the first processing hole 94 . 1 supply and discharge part 106. At this time, the plurality of through holes 120 respectively provided in the plurality of first electrodes 110 are arranged inside the intersection portion 98 so as to be coaxial along the extending direction of the second processing hole 96 .

Next, the second electrode 112 is inserted into the through hole 120 of the first electrode 110 by inserting the second electrode 112 into each of the second processing holes 96 . At this time, an insulating member 124 is provided inside the through-hole 120 of the first electrode 110 or a portion of the outer peripheral surface of the second electrode 112 inserted into the through-hole 120 . Accordingly, each of the second electrodes 112 and the plurality of first electrodes 110 are integrated in an electrically insulated state via the insulating member 124 , and thereafter, the second supply and discharge portion 108 is attached to the opening 116 of the second processing hole 96 . .

Next, similarly to the surface treatment method according to the first embodiment, after the degreasing step, the etching treatment step, and the stain removal step, an energization step for forming a plated film on the inner wall surface of the processing hole 92 is performed. In the energization step, the electrolytic treatment solution is made to flow through the first treatment hole 94 and the second treatment hole 96 via the first supply and discharge portion 106 and the second supply and discharge portion 108 . At the same time, the first inner electrode 44 and the first inner electrode 44 and the second inner electrode 44 and the 2. The inner electrode 50 supplies current. In this way, by energizing between the first electrode 110 and the second electrode 112 and the inner wall surfaces of the first processing hole 94 and the second processing hole 96 , respectively, a plated film can be formed on the inner wall surface of the processing hole 92 .

Therefore, in the third embodiment, by using the first electrode 110 and the second electrode 112 integrated as described above, it is possible to make the outer peripheral surface of the first electrode 110 face the inner wall surface of the first processing hole 94 , and The energization step is performed with the outer peripheral surface of the second electrode 112 facing the inner wall surface of the second processing hole 96 . According to this, it is possible to perform surface treatment on the inner wall surfaces of both the first processing hole 94 and the second processing hole 96 by a common energization step without going through complicated steps such as masking.

Furthermore, since the first electrode 110 and the second electrode 112 are insulated, the inner wall surface of the processing hole 92 can be surface-treated substantially uniformly, thereby forming a plated film with substantially uniform thickness and high quality.

In conclusion, according to the surface treatment apparatus 90 and the surface treatment method according to the third embodiment, even for the treatment hole 92 having the intersecting portion 98, the inner wall surface of the treatment hole 92 can be efficiently and efficiently surface treated with high quality. In this way, a plated film having a substantially uniform thickness is formed on the inner wall surface of the processing hole 92 , and it is possible to effectively suppress adhesion of deposits to the inner wall surface.

As described above, in the third embodiment, the outer peripheral surface and diameter of the second electrode 112 are made smaller than the first processing hole 94 in accordance with the outer diameter of the second electrode 112 that is smaller than the outer diameter of the first electrode 110 . 2. The inner wall surfaces of the processing holes 96 face each other. Accordingly, the distance between the inner wall surface of the first processing hole 94 and the outer peripheral surface of the first electrode 110 and the distance between the inner wall surface of the second processing hole 96 and the outer peripheral surface of the second electrode 112 can be made substantially constant. Therefore, the difference in current density between the inner wall surfaces of the first processing hole 94 and the second processing hole 96 is suppressed, and the inner wall surfaces of the first processing hole 94 and the second processing hole 96 can be easily surface-treated substantially uniformly.

As described above, in the third embodiment, the first closing portion 42 and the first inner electrode 44 are provided in the first electrode 110 , and the first closing portion 42 faces the bottom surface 100 of the first processing hole 94 . The first inner electrode 44 supplies current to the first electrode 110 . According to this, electricity can be satisfactorily conducted between the first closing portion 42 and the bottom surface 100 of the first processing hole 94 , so that the bottom surface 100 can also be effectively surface-treated.

In addition, since the second electrode 112 is also configured in the same way, it is possible to satisfactorily conduct electricity between the second closing portion 48 and the bottom surface 102 of the second processing hole 96 , so that the bottom surface 102 can also be effectively surface-treated.

Therefore, plating films with sufficient film thicknesses are formed on the bottom surfaces 100 and 102 of the first processing hole 94 and the second processing hole 96 , and it is possible to effectively suppress adhesion of deposits on the bottom surfaces 100 and 102 . Therefore, for example, by arranging the bottom surface 100 of the first processing hole 94 in the vicinity of the cavity forming surface of the casting mold 14, the temperature control in the vicinity of the cavity forming surface can be stably performed.

The present invention is not particularly limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.

For example, in the above-described embodiment, the first inner electrode 44 is provided on the first electrodes 36 , 74 , and 110 , and the second inner electrode 50 is provided on the second electrodes 38 and 112 , but the first electrode 36 is not particularly limited to this. , 74 , 110 , and the second electrodes 38 , 112 may not have the first inner electrode 44 and the second inner electrode 50 . In this case, the first electrodes 74 and 110 may not have the first closing portion 42 , and the second electrode 112 may not have the second closing portion 48 .

[Description of reference numerals]

10, 60, 90: surface treatment device; 12, 62, 92: processing hole; 14: casting mold; 16: bending part; 18, 22, 67, 68, 77, 114, 116: opening; 20: No. 1 linear part; 24: second linear part; 30, 72, 104: electrode; 31: liquid supply part; 32: liquid discharge part; 36, 74, 110: first electrode; 38, 76, 112: first electrode 2 electrodes; 40: first tip portion; 42: first closing portion; 44: first inner electrode; 46, 84: second tip portion; 48: second closing portion; 50: second inner electrode; 52, 82 , 124: insulating parts;

64, 94: 1st processing hole; 66, 96: 2nd processing hole; 70: branch part; 78, 100, 102: bottom surface; 80: inserted part; 82a: female thread; 84a: male thread; 98: cross part; 106: first supply and discharge part; 108: second supply and discharge part; 118, 122: treatment liquid inlet; 120: through hole.

Claims (18)

1. A surface treatment device (10) having an electrode (30) for performing surface treatment on an inner wall surface of a treatment hole (12) into which the electrode (30) is inserted by causing an electrolytic treatment liquid to flow inside the treatment hole and causing electric current to flow between the electrode (30) and the inner wall surface of the treatment hole (12),

the electrode (30) is composed of a 1 st electrode (36) and a 2 nd electrode (38), the 1 st electrode (36) and the 2 nd electrode (38) are integrated in an electrically insulated state with an insulating member (52) interposed therebetween,

the 1 st electrode (36) is inserted from one opening (18) of the processing hole (12) having the bent portion (16),

the 2 nd electrode (38) is inserted from the other opening (22) of the processing hole (12),

the 1 st electrode (36) and the 2 nd electrode (38) are integrated by the 1 st tip portion (40) of the 1 st electrode (36) and the 2 nd tip portion (46) of the 2 nd electrode (38) abutting inside the bent portion (16) via the insulating member (52).

2. Surface treatment device (10) according to claim 1,

the 1 st electrode (36) and the 2 nd electrode (38) are hollow bodies having tubular portions,

a 1 st closing part (42) for closing the top end of the 1 st electrode (36) is provided at the 1 st top end part (40),

a 2 nd closing part (48) for closing the tip of the 2 nd electrode (38) is provided at the 2 nd tip part (46),

a 1 st inner electrode (44) is provided on the 1 st electrode (36), the 1 st inner electrode (44) extending in the axial direction inside the 1 st electrode (36) and being electrically connected to the 1 st closing section (42),

a2 nd inner electrode (50) is provided on the 2 nd electrode (38), and the 2 nd inner electrode (50) extends in the axial direction inside the 2 nd electrode (38) and is electrically connected to the 2 nd closing section (48).

3. A surface treatment device (60) having an electrode (72) for performing surface treatment on an inner wall surface of a treatment hole (62) into which the electrode (72) is inserted by causing an electrolytic treatment liquid to flow inside the treatment hole and causing electric current to flow between the electrode (72) and the inner wall surface of the treatment hole (62),

the electrode (72) is composed of a 1 st electrode (74) and a 2 nd electrode (76), the 1 st electrode (74) and the 2 nd electrode (76) are integrated in an electrically insulated state through an insulating member (82),

the processing hole (62) is composed of a 1 st processing hole (64) and a 2 nd processing hole (66), wherein the 2 nd processing hole (66) is provided with an opening (68) on the inner wall surface of the 1 st processing hole (64),

an inserted portion (80) is provided at a portion of the 1 st electrode (74) inserted into the 1 st processing hole (64) facing the opening (68) of the 2 nd processing hole (66),

the 1 st electrode (74) and the 2 nd electrode (76) are integrated by inserting a tip portion (84) of the 2 nd electrode (76) into the inserted portion (80),

the insulating member (82) is interposed between the inserted portion (80) and the distal end portion (84) of the 2 nd electrode (76).

4. The surface treatment device (60) according to claim 3,

the 1 st electrode (74) is a hollow body having a tubular portion,

the inserted portion (80) is formed of a hole penetrating the peripheral wall of the 1 st electrode (74),

the insulating member (82) is provided inside the inserted portion (80),

an internal thread (82a) is formed in the insulating member (82),

a male screw (84a) is formed on the tip portion (84) of the 2 nd electrode (76),

the 1 st electrode (74) and the 2 nd electrode (76) are positioned and fixed through screwing of the internal thread (82a) and the external thread (84 a).

5. The surface treatment device (60) according to claim 4,

a sealing part (42) is provided at the top end part (40) of the 1 st electrode (74), the sealing part (42) seals the top end of the 1 st electrode (74) and faces the bottom surface (78) of the 1 st processing hole (64) with a bottom,

an inner electrode (44) is provided inside the 1 st electrode (74), and the inner electrode (44) extends in the axial direction of the 1 st electrode (74) and is electrically connected to the sealing section (42).

6. A surface treatment device (90) having an electrode (104) for performing surface treatment on an inner wall surface of a treatment hole (92) into which the electrode (104) is inserted by causing an electrolytic treatment liquid to flow inside the treatment hole and causing electric current to flow between the electrode (104) and the inner wall surface of the treatment hole (92),

the electrode (104) is composed of a 1 st electrode (110) and a 2 nd electrode (112), the 1 st electrode (110) and the 2 nd electrode (112) are integrated in an electrically insulated state with an insulating member (124) interposed therebetween,

the 1 st electrode (110) and the 2 nd electrode (112) are hollow bodies having tubular portions,

the outer diameter of the 1 st electrode (110) is larger than the outer diameter of the 2 nd electrode (112),

the processing hole (92) is composed of a first processing hole (94) with a bottom and a second processing hole (96) with a bottom intersecting the first processing hole (94),

a through-hole (120) is formed in a portion of the 1 st electrode (110) inserted into the 1 st processing hole (94), the portion being disposed at an intersection (98) of the 1 st processing hole (94) and the 2 nd processing hole (96), along an extending direction of the 2 nd processing hole (96),

the 2 nd electrode (112) inserted into the 2 nd processing hole (96) is inserted through the through hole (120) to be integrated with the 1 st electrode (110),

the insulating member (124) is interposed between the through hole (120) and the 2 nd electrode (112).

7. The surface treatment device (90) according to claim 6,

the 2 nd electrode (112) is inserted into the 2 nd processing hole (96) having a smaller diameter than the 1 st processing hole (94).

8. The surface treatment device (90) according to claim 6 or 7,

a sealing part (42) is formed at the top end part (40) of the 1 st electrode (110), the sealing part (42) seals the top end of the 1 st electrode (110) and faces the bottom surface (100) of the 1 st processing hole (94),

the 1 st electrode (110) has an inner diameter larger than an outer diameter of the 2 nd electrode (112),

an inner electrode (44) is provided inside the 1 st electrode (110), and the inner electrode (44) passes between the inner peripheral surface of the 1 st electrode (110) and the outer peripheral surface of the 2 nd electrode (112), extends in the axial direction of the 1 st electrode (110), and is electrically connected to the sealing portion (42) of the 1 st electrode (110).

9. The surface treatment device (90) according to any one of claims 6 to 8,

a sealing part (48) is provided at the tip part (46) of the 2 nd electrode (112), the sealing part (48) is configured to seal the tip of the 2 nd electrode (112) and face the bottom surface (102) of the 2 nd processing hole (96),

an inner electrode (50) is provided on the 2 nd electrode (112), and the inner electrode (50) extends in the axial direction inside the 2 nd electrode (112) and is electrically connected to the sealing section (48) of the 2 nd electrode (112).

10. A surface treatment method for performing surface treatment on the inner wall surface of a treatment hole (12) by using an electrode (30) composed of a 1 st electrode (36) and a 2 nd electrode (38),

has an integration process and an electrifying process,

wherein the integration process comprises: integrating the 1 st electrode (36) and the 2 nd electrode (38) in an electrically insulated state via an insulating member (52) inside the processing hole (12);

the electrifying process comprises the following steps: passing an electrolytic treatment liquid through the inside of the treatment hole (12) while passing a current between the 1 st electrode (36) and the 2 nd electrode (38) and the inner wall surface of the treatment hole (12),

in the integration step, the insulating member (52) is provided on at least one of a 1 st distal end portion (40) of the 1 st electrode (36) and a 2 nd distal end portion (46) of the 2 nd electrode (38), the 1 st electrode (36) is inserted from one opening (18) of the treatment hole (12) having a bent portion (16), the 2 nd electrode (38) is inserted from the other opening (22) of the treatment hole (12), and the 1 st distal end portion (40) is brought into contact with the 2 nd distal end portion (46) via the insulating member (52) inside the bent portion (16).

11. The surface treatment method according to claim 10,

in the energization step, the 1 st electrode (36) is energized via a 1 st inner electrode (44) and the 2 nd electrode (38) is energized via a 2 nd inner electrode (50), wherein the 1 st inner electrode (44) extends in the axial direction inside the 1 st electrode (36) composed of a hollow body having a tubular portion and is electrically connected to a 1 st closing portion (42) closing the tip of the 1 st electrode (36); the 2 nd inner electrode (50) extends in the axial direction inside the 2 nd electrode (38) formed of a hollow body having a tubular portion, and is electrically connected to a 2 nd closing portion (48) that closes the tip of the 2 nd electrode (38).

12. A surface treatment method for performing surface treatment on the inner wall surface of a treatment hole (62) by using an electrode (72) composed of a 1 st electrode (74) and a 2 nd electrode (76),

has an integration step and an energization step, wherein,

the integrated working procedure is as follows: integrating the 1 st electrode (74) and the 2 nd electrode (76) in an electrically insulated state via an insulating member (82) inside the processing hole (62);

the electrifying process comprises the following steps: passing an electrolytic treatment liquid through the inside of the treatment hole (62), and passing current between the 1 st electrode (74) and the 2 nd electrode (76) and the inner wall surface of the treatment hole (62),

in the integration step, a 1 st electrode (74) is inserted into the 1 st treatment hole (64) of the treatment hole (62) composed of a 1 st treatment hole (64) and a 2 nd treatment hole (66), the 2 nd electrode (76) is inserted into the 2 nd treatment hole (66), and a distal end portion (84) of the 2 nd electrode (76) is inserted into an inserted portion (80) of the 1 st electrode (74) via the insulating member (82), wherein the 1 st treatment hole (64) is a treatment hole having a bottom, the 2 nd treatment hole (66) is a treatment hole having an opening (68) provided in an inner wall surface of the 1 st treatment hole (64), and the inserted portion (80) is provided in a portion of the 1 st electrode (74) facing the opening (68) of the 2 nd treatment hole (66).

13. The surface treatment method according to claim 12,

the 1 st electrode (74) is constituted by a hollow body having a tubular portion,

the inserted portion (80) is formed of a hole penetrating the peripheral wall of the 1 st electrode (74),

in the integration step, a female screw (82a) formed in the insulating member (82) provided inside the inserted portion (80) is screwed to a male screw (84a) formed in the distal end portion (84) of the 2 nd electrode (76), thereby positioning and fixing the 1 st electrode (74) and the 2 nd electrode (76).

14. The surface treatment method according to claim 12 or 13,

in the energization step, the 1 st electrode (74) is energized via a 1 st inner electrode (44) in a state where a 1 st closing portion (42) closing a tip of the 1 st electrode (74) faces a bottom surface (78) of the 1 st processing hole (64), wherein the 1 st inner electrode (44) extends in the axial direction inside the 1 st electrode (74) and is electrically connected to the 1 st closing portion (42).

15. A surface treatment method for performing surface treatment on the inner wall surface of a treatment hole (92) by using an electrode (104) composed of a 1 st electrode (110) and a 2 nd electrode (112),

has an integration step and an energization step, wherein,

the integrated working procedure is as follows: integrating the 1 st electrode (110) and the 2 nd electrode (112) in an electrically insulated state via an insulating member (124) inside the processing hole (92);

the electrifying process comprises the following steps: passing an electrolytic treatment liquid through the inside of the treatment hole (92), and passing current between the 1 st electrode (110) and the 2 nd electrode (112) and the inner wall surface of the treatment hole (92),

the 1 st electrode (110) and the 2 nd electrode (112) are hollow bodies having tubular portions,

in the integration step, the 1 st electrode (110) having an outer diameter larger than that of the 2 nd electrode (112) is inserted into the 1 st processing hole (94) of the processing hole (92) composed of the 1 st processing hole (94) and the 2 nd processing hole (96), the 2 nd electrode (112) is inserted into the 2 nd processing hole (96), and the 2 nd electrode (112) is inserted into the insertion hole (120) of the 1 st electrode (110) through the insulating member (124), wherein the 1 st processing hole (94) is a bottomed processing hole, the 2 nd processing hole (96) is a bottomed processing hole intersecting the 1 st processing hole (94), and the insertion hole (120) is formed in a portion of the 1 st electrode (110) disposed at an intersection (98) of the 1 st processing hole (94) and the 2 nd processing hole (96).

16. The surface treatment method according to claim 15,

in the integration step, the 2 nd electrode (112) is inserted into the 2 nd processing hole (96) having a smaller diameter than the 1 st processing hole (94).

17. The surface treatment method according to claim 15 or 16,

the 1 st electrode (110) has an inner diameter larger than an outer diameter of the 2 nd electrode (112),

in the energization step, the 1 st electrode (110) is energized via an inner electrode (44) in a state where a closing portion (42) closing the tip of the 1 st electrode (110) faces the bottom surface (100) of the 1 st processing hole (94), wherein the inner electrode (44) passes between the inner peripheral surface of the 1 st electrode (110) and the outer peripheral surface of the 2 nd electrode (112), extends in the axial direction of the 1 st electrode (110), and is electrically connected to the closing portion (42) of the 1 st electrode (110).

18. A surface treatment method according to any one of claims 15 to 17,

in the energization step, the 2 nd electrode (112) is energized via an inner electrode (50) in a state where a sealing portion (48) sealing a distal end of the 2 nd electrode (112) faces a bottom surface (102) of the 2 nd processing hole (96), wherein the inner electrode (50) extends in an axial direction inside the 2 nd electrode (112) and is electrically connected to the sealing portion (48) of the 2 nd electrode (112).

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