CN111640881B - Array substrate and preparation method thereof - Google Patents
Array substrate and preparation method thereof Download PDFInfo
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- CN111640881B CN111640881B CN202010553751.1A CN202010553751A CN111640881B CN 111640881 B CN111640881 B CN 111640881B CN 202010553751 A CN202010553751 A CN 202010553751A CN 111640881 B CN111640881 B CN 111640881B
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- flexible substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention provides an array substrate and a preparation method of the array substrate, wherein the array substrate comprises a display area and a metal wiring area positioned on at least one side of the display area, and the metal wiring area comprises the following components: a flexible substrate; a plurality of metal traces disposed on the flexible substrate; a protective layer covering the flexible substrate and the metal wiring; the metal wire is arranged on the flexible substrate, and the metal wire is arranged on the surface of the flexible substrate, which is close to the edge of the protective layer; the grooves are at least partially filled with hydrophilic materials. By filling hydrophilic materials in the grooves on the flexible substrate, water vapor in the array substrate is absorbed, and the metal wiring between the flexible substrate and the protective layer is prevented from being invalid due to water vapor invasion.
Description
Technical Field
The invention relates to the technical field of display, in particular to an array substrate and a preparation method of the array substrate.
Background
Organic electroluminescent displays (Organic Light Emitting Display, OLED) are a very promising display technology. The OLED display device has the characteristics of excellent display performance, self-luminescence, simple structure, ultra-light weight, high response speed, wide visual angle, low power consumption, flexible display realization and the like, is known as a dream display, is favored by various large display manufacturers, and becomes the master force in the technical field of display.
The existing flexible OLED can be bent, and metal wires in the bending area are easy to be invaded and corroded by water vapor due to bending, so that abnormal display is caused.
Disclosure of Invention
The invention provides an array substrate and a preparation method of the array substrate, which avoid the problem that water vapor invades and corrodes metal wires due to bending when the bending area of the array substrate is bent.
In a first aspect, an embodiment of the present invention provides an array substrate, including a display area and a metal routing area located at least one side of the display area, where the metal routing area includes: a flexible substrate; a plurality of metal traces disposed on the flexible substrate; a protective layer covering the flexible substrate and the metal wiring; the metal wiring structure further comprises a groove, wherein the projection of the groove is close to the edge of the protective layer compared with the projection of the metal wiring in the direction perpendicular to the protective layer; the grooves are at least partially filled with hydrophilic materials.
In another embodiment of the present invention, the hydrophilic material fills a portion of the groove, the protective layer is located on the surface of the flexible substrate and the metal trace, and the protective layer has an extension extending into the groove.
In one aspect of the embodiment of the present invention, a cavity is formed between the hydrophilic material and the protective layer.
In another embodiment of the present invention, the surface of the flexible substrate and the metal routing further includes an intermediate layer, the intermediate layer has a through groove corresponding to the position of the groove, the hydrophilic material completely fills the groove and extends towards the direction of the through groove, and the protective layer covers the intermediate layer and the hydrophilic material;
the protective layer is in contact with the hydrophilic material, or a cavity is formed between the protective layer and the hydrophilic material.
In another embodiment of the present invention, the metal routing area is a GIP routing area on two opposite sides of the display area, the GIP routing area includes a flexible substrate, a plurality of GIP routing lines disposed on the flexible substrate, and a protective layer covering the flexible substrate and the GIP routing lines, the surface of the flexible substrate, which is close to the protective layer, is provided with the groove, and in a direction perpendicular to the protective layer, a projection of the groove is close to an edge of the protective layer compared with a projection of the GIP routing lines.
In another embodiment of the present invention, the metal routing area is a fan-shaped routing area located at one side of the display area of the array substrate, the fan-shaped routing area includes a flexible substrate, a plurality of signal wires disposed on the flexible substrate, and a protective layer covering the flexible substrate and the signal wires, a groove is disposed on a surface of the flexible substrate, which is close to the protective layer, and in a direction perpendicular to the protective layer, a projection of the groove is close to an edge of the protective layer compared with a projection of the signal wires.
In one aspect of the embodiment of the present invention, the hydrophilic material is at least one of a basic metal, a basic oxide, a sulfide, and a molecular sieve.
In one aspect of the embodiment of the present invention, the number of the grooves is one or more on either side of the two sides of the metal trace;
if the number of the grooves on one side of the metal wire is one, the length direction of the grooves is consistent with the extending direction of the metal wire;
if the number of the grooves on one side of the metal wire is plural, at least part of the grooves are arranged in the same direction as the extending direction of the metal wire.
In a second aspect, an embodiment of the present invention provides a method for preparing an array substrate, where the method includes:
forming a flexible substrate;
forming a plurality of metal wires on the flexible substrate to form a metal wire area of the array substrate;
forming a groove on one side of the flexible substrate close to the metal wire, wherein the projection of the groove is close to the edge of the protective layer compared with the projection of the metal wire in the direction perpendicular to the protective layer; at least partially filling the grooves with hydrophilic material;
and forming a protective layer, wherein the protective layer covers the hydrophilic material, the flexible substrate and the metal wires.
In one aspect of the embodiment of the present invention, before the hydrophilic material is filled in the groove, the method further includes:
forming an intermediate layer on the surfaces of the flexible substrate and the metal wiring, wherein the intermediate layer is provided with a through groove corresponding to the groove;
filling hydrophilic material in the groove, comprising:
completely filling the grooves with the hydrophilic material;
before forming the protective layer, further comprising at least partially filling the through groove with the hydrophilic material;
forming a protective layer covering the hydrophilic material, the flexible substrate and the metal trace, comprising:
a protective layer is formed on the intermediate layer, the protective layer covering the intermediate layer and the hydrophilic material.
According to the array substrate and the preparation method of the array substrate, the array substrate comprises a display area and a metal wiring area positioned on at least one side of the display area, and the metal wiring area comprises: a flexible substrate; a plurality of metal traces disposed on the flexible substrate; a protective layer covering the flexible substrate and the metal wiring; the metal wire is arranged on the flexible substrate, and the metal wire is arranged on the surface of the flexible substrate, which is close to the edge of the protective layer; the grooves are at least partially filled with hydrophilic materials. Through setting up the recess and filling hydrophilic material on the flexible substrate, make hydrophilic material can absorb the steam that invades from array substrate edge, avoid steam further corroding the metal wiring and become invalid.
Drawings
FIG. 1 is a schematic diagram of an array substrate according to an embodiment of the invention;
FIG. 2 is a schematic diagram of an array substrate according to another embodiment of the present invention;
FIG. 3 is a schematic diagram of an array substrate according to another embodiment of the present invention;
FIG. 4 is a schematic diagram of a metal routing area according to any of the embodiments of FIGS. 1-3;
FIG. 5 is another structure of the metal routing area in any of the embodiments of FIGS. 1-3;
FIG. 6 is a structure of a groove in an embodiment;
fig. 7 shows a groove structure in another embodiment.
Reference numerals:
100. 200, 300-metal routing area
101. 301, 401, 501 flexible substrate
102. 302, 602, 702-metal traces
103. 203, 303-protective layer
104. 204, 304, 404, 504, 604, 704-grooves
105. 205, 305 hydrophilic material
106. 206, 306-extension
309-second extension
207-cavity 307-intermediate layer
308-through groove
400-sector routing area
400', 500' -display area
402-signal line
500-GIP wiring area
502-GIP wiring
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
The terms of directions such as "up", "down", "left" and "right" according to the embodiments of the present invention refer to relative positions in coordinate axes, rather than absolute positions. The terms "upper" and "upper" according to the embodiments of the present invention may be understood as being in contact with each other or not in contact with each other, and are not understood as being limiting to the present invention, as will be set by those skilled in the art according to actual circumstances.
As described in the background art, the existing OLED display panel can achieve a higher screen ratio by bending, and provide a better viewing experience for the user, for example, the lower frame and the side frame of the display panel can be bent toward the back of the display surface, so as to realize a narrow frame design. However, the inventors found that when the bending region of the display Panel is bent toward the back of the display surface, the flexible substrate of the bending region and other film layers located on the surface of the flexible substrate are separated by the bending, so that moisture is introduced into and corrodes metal traces, such as corrosion data lines or GIP (Gate in Panel) traces, to cause abnormal display.
In order to solve the problem, the invention provides an array substrate and a preparation method thereof, wherein the array substrate is provided with a display area and a non-display area, the array substrate also comprises a metal wiring area, the metal wiring area is positioned in the non-display area on at least one side of the display area, and the metal wiring area of the array substrate comprises a flexible substrate, metal wirings and a protective layer which are arranged in a laminated mode. The flexible substrate is also provided with a groove, an opening of the groove is positioned on the surface of the flexible substrate, which is close to the metal wire, and the projection of the groove is close to the edge of the protective layer compared with the projection of the metal wire in the direction perpendicular to the protective layer; the grooves are at least partially filled with hydrophilic materials.
The flexible substrate may be a Polyimide (PI) substrate, or may be another organic substrate, such as a PET substrate, a PMMA substrate, etc., which is only schematically illustrated in this embodiment, but not limited thereto, and may be reasonably set according to needs in practical applications.
The metal wire is located in the non-display area of the array substrate and is disposed on a side of the flexible substrate close to the display surface, and in one embodiment, the metal wire is in direct contact with the flexible substrate. In other embodiments, the metal trace and the flexible substrate may not be in direct contact, e.g., a buffer layer, an insulating layer, etc., may also be included between the metal trace and the flexible substrate. In one embodiment, the metal wires may be data signal wires, touch signal wires, fingerprint identification signal wires, and in other embodiments, the metal wires may be gate wires, scan wires, GIP wires, and the like.
The protective layer can cover the metal wiring and the flexible substrate, and the metal wiring is located in a closed environment, so that wiring failure caused by water vapor erosion is avoided. In one embodiment, the protective layer material may be the same as the flexible substrate material. In other embodiments, the protective layer material and the flexible substrate material may also be different. The protective layer may be made of Polyimide (PI), or may be made of other organic materials, such as PET substrate, PMMA, etc., which is only schematically illustrated in this embodiment, but not limited thereto, and may be reasonably set according to needs in practical applications.
The non-display area of the flexible substrate is also provided with a groove, hydrophilic materials are at least partially filled in the groove, an opening of the groove is positioned on the surface of the flexible substrate, which is close to the metal wiring, the groove is positioned in the edge area of the flexible substrate, and the length or arrangement direction of the groove extends along the direction of the metal wiring. The grooves formed at the periphery of the metal wiring region are thus disposed around the metal wiring, and the protective layer covers the grooves, the flexible substrate, and the metal wiring. The hydrophilic material in the groove can absorb water vapor invaded from the edge of the array substrate, so that the water vapor is prevented from further invading inwards to corrode the metal wiring.
Furthermore, when the grooves and the hydrophilic material are arranged, the hydrophilic material and/or the protective layer material can also be provided with extension parts, and the extension parts of the hydrophilic material and/or the protective layer can extend into other film layers along the lamination direction of the film layers, so that the contact area between the hydrophilic material and/or the protective layer and the other film layers is increased, and the adhesion between the film layers is increased.
More specifically, the adhesion between the flexible substrate film layer having the groove structure and the film layer adjacent thereto is increased.
Example 1
In one embodiment of the invention, the array substrate comprises a display area and a metal wiring area positioned on at least one side of the display area, wherein the metal wiring area comprises a flexible substrate which is arranged in a laminated mode, the metal wiring and a protective layer, the flexible substrate is further provided with a groove, and hydrophilic materials are at least partially filled in the groove. The opening of recess is located the surface that the flexible substrate was close to the metal and walks the line, in the direction of perpendicular to protective layer, the projection of recess on the protective layer is closer to the edge of protective layer than the metal and walks the line, simultaneously, the recess is also closer to the edge of flexible substrate, consequently in the direction on a parallel with the protective layer, when outside steam invasion array substrate, compare in the metal and walk line position, steam can reach the recess position earlier, hydrophilic material in the recess is through absorbing steam, the steam has been avoided further inwards to extend to the metal to walk the line, thereby avoid the metal to walk the line and become invalid because of steam corruption.
The hydrophilic material and/or the protective layer material can form an extension portion, and the extension portion of the hydrophilic material and/or the protective layer can extend into other film layers along the lamination direction of the film layers, so that the contact area between the film layers is increased, and the adhesion between the film layers is increased.
Example 2
The second embodiment of the present invention is further configured, based on the first embodiment, that the array substrate includes a display area and a metal routing area located on at least one side of the display area, and a cross-sectional view of the metal routing area 100 is shown in fig. 1, where the metal routing area 100 includes a flexible substrate 101, a metal routing 102 formed on a surface of the flexible substrate, and a protective layer 103 formed on surfaces of the flexible substrate and the metal routing, and the flexible substrate further includes a groove 104, and a hydrophilic material 105 is partially filled in the groove. The opening of the groove 104 is located on the surface of the flexible substrate, which is close to the metal wire 102, in the direction perpendicular to the protective layer, the projection of the groove 104 on the protective layer is closer to the edge of the protective layer than the metal wire, meanwhile, the groove 104 is also closer to the edge of the flexible substrate 101, so when external vapor invades the array substrate in the direction parallel to the protective layer 103, compared with the position of the metal wire 102, the vapor can reach the groove position first, hydrophilic materials in the groove absorb the vapor, and the vapor is prevented from extending inwards further to the metal wire, so that the metal wire is prevented from being invalid due to vapor corrosion.
Wherein the hydrophilic material 105 fills only a part of the recess, the protective layer 103 is located on the surface of the flexible substrate 101 and the metal trace 102, and the protective layer has an extension 106 extending into the recess 104. Therefore, on one hand, the inside of the groove is partially filled with the hydrophilic material 105 to absorb the water vapor in the array substrate, so as to avoid the metal wiring 102 from being invalid due to the corrosion of the water vapor; on the other hand, the groove 104 is partially filled with the protective layer 103, and the protective layer 103 extends into the film layer of the flexible substrate 101 where the groove is located through the extension part 106, so that the adhesion between the protective layer 103 and the flexible substrate 101 is increased, and when the metal wiring area is bent, the protective layer 103 and the flexible substrate 101 are prevented from being separated due to stress, and water vapor enters the array substrate from the separation part of the film layer to corrode the metal wiring 102.
In some embodiments, the extension of the protective layer fills into the recess and contacts the hydrophilic material; in other embodiments, as shown in fig. 2, fig. 2 is another cross-sectional view of the metal routing area 200, the protection layer 203 has an extension 206, the extension 206 enters the groove 204 to fill, the protection layer 203 is not in direct contact with the hydrophilic material 205, and a cavity 207 is formed between the protection layer and the hydrophilic material. The cavity 207 can provide a certain space for the water absorbing material to expand after absorbing water vapor, so that the separation of the flexible substrate and the protective layer caused by the expansion of the water absorbing material is avoided, and the corrosion of the metal wiring caused by the invasion of external water vapor is avoided.
Example 3
The third embodiment of the present invention is further configured, based on the first embodiment, that the array substrate includes a display area and a metal routing area 300 located on at least one side of the display area, and a cross-sectional view of the metal routing area 300 is shown in fig. 3, where the metal routing area includes a flexible substrate 301, a metal routing 302 formed on a surface of the flexible substrate, an intermediate layer 307 formed on surfaces of the flexible substrate and the metal routing, and a protective layer 303 formed on a surface of the intermediate layer 307. Wherein the protective layer 303 covers the intermediate layer and the hydrophilic material 305.
The flexible substrate 301 also has a recess 304, the recess 304 being partially filled with a hydrophilic material 305. The opening of the groove 304 is located on the surface of the flexible substrate close to the metal trace, and the projection of the groove on the protective layer is closer to the edge of the protective layer than the metal trace in the direction perpendicular to the protective layer.
The intermediate layer is provided with a through groove 308, the position of the through groove 308 corresponding to the position of the recess 304 of the flexible substrate. In a direction perpendicular to the protective layer, the projection of the through groove coincides at least partially with the projection of the recess of the flexible substrate, more specifically the projection of the through groove coincides with the recess.
The hydrophilic material 305 completely fills the groove 304, and the hydrophilic material has a second extension 309 extending toward the through groove 308, and the second extension 309 at least partially fills the through groove. The protective layer 303 has an extension 306 extending in the direction of the through groove 308, and the protective layer 303 covers the hydrophilic material and the intermediate layer. On the one hand, the grooves 304 and part of the through grooves 308 are filled with hydrophilic materials 305, and the hydrophilic materials absorb water vapor in the array substrate, so that the metal wires are prevented from being invalid due to water vapor corrosion; on the other hand, the hydrophilic material 305 extends into the intermediate layer 307 film layer where the through groove 308 is located through the second extension 309, so that the adhesion between the intermediate layer 307 and the flexible substrate is increased, and the protective layer 303 extends into the intermediate layer 307 film layer where the through groove 308 is located through the extension 306, so that the adhesion between the intermediate layer and the protective layer is increased. In the embodiment, when the metal wiring area is bent, the film layers are separated due to stress, so that water vapor enters the array substrate from the separation part of the film layers to corrode the metal wiring.
The material of the intermediate layer may be the same as that of the flexible substrate or the protective layer, may be Polyimide (PI), or may be other organic materials, such as PET substrate, PMMA, etc., which are only schematically illustrated, but not limited thereto, and may be reasonably set as required in practical application.
In some embodiments, the hydrophilic material fills a portion of the through-slot, the hydrophilic material being in direct contact with the protective layer; in other embodiments, the hydrophilic material fills a portion of the through-slot, and a cavity is formed between the hydrophilic material and the protective layer to provide space for the water-absorbent material to expand after absorbing water vapor.
In other embodiments, the extension portion of the hydrophilic material further extends into the through groove, so that the hydrophilic material completely fills the groove and the through groove, the protective layer is formed on the surfaces of the hydrophilic material and the intermediate layer, the adhesion between the flexible substrate and the protective layer is further increased, and separation of the flexible substrate and the intermediate layer film layer caused by bending is avoided, so that water vapor is prevented from invading and corroding the metal wiring.
Example IV
Further, on the basis of any one of embodiments 1 to 3, the metal routing area in this embodiment is a fan-shaped routing area 400 of the array substrate, as shown in fig. 4, the array substrate includes a display area 400' and a fan-shaped routing area 400, the fan-shaped routing area 400 is located at one side of the display area 400', in this embodiment, the fan-shaped routing area 400 is located at one side of a short side of the display area 400', the fan-shaped routing area 400 is provided with a signal wire 402, and the signal 402 may be fan-shaped.
The fan-shaped wiring region includes a flexible substrate 401, a plurality of signal lines 402 disposed on the flexible substrate 401, and a protective layer (not shown) covering the flexible substrate and the signal lines, a groove 404 is disposed on a surface of the flexible substrate 401 near the protective layer, and a projection of the groove 404 is close to an edge of the protective layer compared with a projection of the signal lines in a direction perpendicular to the protective layer.
The signal line may be one or more of a data signal line, a touch signal line, or a fingerprint identification signal line. Of course, in other embodiments, the fan-shaped trace area may be located on one side of the long side of the display area. If the display area is of other shapes, the fan-shaped trace area may be located at least in a portion of either side of the display area.
According to the embodiment, the grooves and the hydrophilic materials are arranged on the periphery of the signal wires in the fan-shaped wiring areas, so that on one hand, the hydrophilic materials in the grooves absorb water vapor in the array substrate, and the metal wires are prevented from being invalid due to water vapor corrosion; on the other hand, the extension part of the hydrophilic material and/or the protective layer can extend into other film layers along the lamination direction of the film layers, so that the contact area between the flexible substrate where the hydrophilic material is positioned and/or the protective layer and the other film layers is increased, the adhesion force between the film layers is increased, and the invasion of water vapor caused by the separation of the film layers and the failure caused by the corrosion of the signal line are prevented.
Example five
Further, in the embodiment 1-3, the metal routing area in this embodiment is a GIP routing area 500 located on two opposite sides of the display area 500', as shown in fig. 5, where the GIP routing area 500 includes a flexible substrate 501, a plurality of GIP routing lines 502 disposed on the flexible substrate, and a protective layer (not shown) covering the flexible substrate and the GIP routing lines, the surface of the flexible substrate, which is close to the protective layer, is provided with a groove 504, and in a direction perpendicular to the flexible substrate, a projection of the groove 504 is close to an edge of the flexible substrate compared to a projection of the GIP routing lines 502. The GIP trace may be a gate line, a scan line.
According to the embodiment, the grooves and the hydrophilic materials are arranged on the periphery of the GIP wires, so that on one hand, the hydrophilic materials in the grooves absorb water vapor in the array substrate, and the metal wires are prevented from being invalid due to water vapor corrosion; on the other hand, the extension part of the hydrophilic material and/or the protective layer can extend into other film layers along the lamination direction of the film layers, so that the contact area between the flexible substrate where the hydrophilic material is positioned and/or the protective layer and the other film layers is increased, the adhesion force between the film layers is increased, and the water vapor invasion caused by the separation of the film layers is prevented, and the failure caused by the corrosion of the GIP wiring is prevented.
Example six
The fourth and fifth embodiments can be combined, that is, grooves and hydrophilic materials are simultaneously provided in the fan-shaped wiring region and the GIP wiring region of the array substrate. The signal wires of the fan-shaped wiring areas and the GIP wiring of the GIP wiring areas are prevented from being invalid due to water vapor corrosion, meanwhile, the adhesive force between the film layers of the fan-shaped wiring areas and the GIP wiring areas is increased, and the possibility of separation caused by bending between the film layers is reduced.
Example seven
In any of embodiments 1-6, further in this embodiment, the hydrophilic material may be a material that chemically reacts with water vapor, such as at least one of an alkaline metal, an alkaline oxide, and a sulfide. But also materials with physical adsorption such as molecular sieves.
The number of grooves is one or more on either side of the metal trace. As shown in fig. 6, if the number of the grooves 604 on one side of the metal trace 602 is one, the length direction of the grooves 604 is identical to the extending direction of the metal trace 602; as shown in fig. 7, if there are a plurality of grooves 704 on one side of the metal wire 702, the arrangement direction of the grooves 704 is identical to the extending direction of the metal wire 702.
In the above embodiment, the protective layer may be made of Polyimide (PI), or may be made of other organic materials, such as PET substrate, PMMA, etc., which is only schematically illustrated, but not limited thereto, and may be reasonably set according to needs in practical applications. Further, the material of the intermediate layer may be the same as that of the protective layer.
In some embodiments, the array substrate further includes a driving circuit board, and the driving circuit board is electrically connected to the signal lines to provide driving signals for the display area. It should be noted that the protective layer on the flexible substrate does not cover the drive circuit board.
Example eight
The embodiment provides a preparation method of an array substrate, which comprises the following steps:
s101, forming a flexible substrate;
s102, forming a plurality of metal wires on a flexible substrate to form a metal wire area of the array substrate;
s103, forming a groove on one side of the flexible substrate close to the metal wire, wherein the projection of the groove is close to the edge of the flexible substrate compared with the projection of the metal wire in the direction perpendicular to the flexible substrate;
s104, at least partially filling hydrophilic materials in the grooves;
s105, forming a protective layer, wherein the protective layer covers the groove, the flexible substrate and the metal wire.
In other embodiments, the method for manufacturing the array substrate includes:
s201, forming a flexible substrate;
s202, forming a plurality of metal wires on a flexible substrate to form a metal wire area of the array substrate;
s203, forming an intermediate layer on the surfaces of the flexible substrate and the metal wiring;
s204, punching the middle layer, wherein the projection of the punching position is close to the edge of the flexible substrate compared with the projection of the metal wiring in the direction perpendicular to the flexible substrate, the hole penetrates through the middle layer completely to form a through hole in the middle layer, and the hole penetrates through the flexible substrate partially to form a groove in the flexible substrate layer;
s205, filling hydrophilic materials in the grooves and the through holes, wherein the hydrophilic materials completely fill the grooves, and the hydrophilic materials at least partially fill the through grooves;
s206, forming a protective layer on the surfaces of the intermediate layer and the hydrophilic material.
By forming the through holes in the intermediate layer and filling the hydrophilic material, the hydrophilic material is located in both the flexible substrate and the intermediate layer, so that the hydrophilic material is greater in height in the direction perpendicular to the flexible substrate than in the depth of the grooves of the flexible substrate, and the hydrophilic material forms a retaining wall structure around the metal tracks. On the one hand, the contact area between the film layers is increased, the film layers are prevented from falling off when the film layers are bent, on the other hand, the hydrophilic material forms a retaining wall structure, the metal wiring is enclosed inside, the invasion path of water and oxygen is effectively blocked, and the service life of the metal wiring is prolonged.
It should be noted that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, modifications and substitutions may be made therein without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, it is to be understood that the invention is not limited to the specific embodiments disclosed and that many other equivalent embodiments may be made without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. The utility model provides an array substrate, includes display area and is located the metal wire area of at least one side of display area, its characterized in that, the metal wire area includes:
a flexible substrate;
a plurality of metal traces disposed on the flexible substrate;
a protective layer covering the flexible substrate and the metal wiring;
the metal wire is arranged on the flexible substrate, and the metal wire is arranged on the surface of the flexible substrate, which is close to the edge of the protective layer; the grooves are at least partially filled with hydrophilic materials;
the hydrophilic material fills a part of the groove, the protective layer is positioned on the surfaces of the flexible substrate and the metal wires, and the protective layer is provided with an extension part extending into the groove;
a cavity is formed between the hydrophilic material and the protective layer.
2. The array substrate of claim 1, further comprising an intermediate layer on the surface of the flexible substrate and the metal trace, wherein the intermediate layer has a through groove corresponding to the groove, the hydrophilic material completely fills the groove and extends toward the through groove, and the protective layer covers the intermediate layer and the hydrophilic material;
the protective layer is in contact with the hydrophilic material, or a cavity is formed between the protective layer and the hydrophilic material.
3. The array substrate of claim 1 or 2, wherein the metal routing area is a GIP routing area on opposite sides of the display area, the GIP routing area includes a flexible substrate, a plurality of GIP routing lines disposed on the flexible substrate, and a protective layer covering the flexible substrate and the GIP routing lines, the surface of the flexible substrate near the protective layer is provided with the groove, and in a direction perpendicular to the protective layer, a projection of the groove is near an edge of the protective layer compared with a projection of the GIP routing lines.
4. The array substrate according to claim 1 or 2, wherein the metal routing area is a fan-shaped routing area located at one side of the display area of the array substrate, the fan-shaped routing area comprises a flexible substrate, a plurality of signal wires arranged on the flexible substrate, and a protective layer covering the flexible substrate and the signal wires, a groove is formed in a surface, close to the protective layer, of the flexible substrate, and in a direction perpendicular to the protective layer, a projection of the groove is close to an edge of the protective layer compared with a projection of the signal wires.
5. The array substrate of claim 1 or 2, wherein the hydrophilic material is at least one of a basic metal, a basic oxide, a sulfide, and a molecular sieve.
6. The array substrate of claim 1 or 2, wherein the number of grooves is one or more on either side of the metal trace;
if the number of the grooves on one side of the metal wire is one, the length direction of the grooves is consistent with the extending direction of the metal wire;
if the number of the grooves on one side of the metal wire is plural, at least part of the grooves are arranged in the same direction as the extending direction of the metal wire.
7. The preparation method of the array substrate is characterized by comprising the following steps:
forming a flexible substrate;
forming a plurality of metal wires on the flexible substrate to form a metal wire area of the array substrate;
forming a groove on one side of the flexible substrate close to the metal wire, wherein the projection of the groove is close to the edge of the flexible substrate compared with the projection of the metal wire in the direction perpendicular to the flexible substrate;
at least partially filling the grooves with hydrophilic material;
forming a protective layer, wherein the protective layer covers the hydrophilic material, the flexible substrate and the metal wire;
wherein the hydrophilic material fills a part of the groove, the protective layer is positioned on the surfaces of the flexible substrate and the metal wires, and the protective layer is provided with an extension part extending into the groove;
a cavity is formed between the hydrophilic material and the protective layer.
8. The method for manufacturing an array substrate according to claim 7, further comprising, before filling the grooves with a hydrophilic material:
forming an intermediate layer on the surfaces of the flexible substrate and the metal wiring, wherein the intermediate layer is provided with a through groove corresponding to the groove;
filling hydrophilic material in the groove, comprising:
completely filling the grooves with the hydrophilic material;
before forming the protective layer, further comprising at least partially filling the through groove with the hydrophilic material;
forming a protective layer covering the hydrophilic material, the flexible substrate and the metal trace, comprising:
a protective layer is formed on the intermediate layer, the protective layer covering the intermediate layer and the hydrophilic material.
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| CN112786620B (en) * | 2021-01-08 | 2023-03-21 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113363304B (en) * | 2021-06-03 | 2022-09-13 | 武汉天马微电子有限公司 | Display panel and display device |
| WO2023272426A1 (en) * | 2021-06-28 | 2023-01-05 | 欧菲光集团股份有限公司 | Flexible circuit board, camera module, and electronic device |
| WO2023130201A1 (en) * | 2022-01-04 | 2023-07-13 | 京东方科技集团股份有限公司 | Phase shifter and preparation method therefor |
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| CN107910336B (en) * | 2017-11-30 | 2019-07-02 | 昆山国显光电有限公司 | Array substrate and its manufacturing method and display screen |
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