CN111640881A

CN111640881A - Array substrate and preparation method thereof

Info

Publication number: CN111640881A
Application number: CN202010553751.1A
Authority: CN
Inventors: 刘同辉
Original assignee: Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2020-06-17
Filing date: 2020-06-17
Publication date: 2020-09-08
Anticipated expiration: 2040-06-17
Also published as: CN111640881B

Abstract

The invention provides an array substrate and a preparation method thereof, the array substrate comprises a display area and a metal wiring area positioned on at least one side of the display area, and the metal wiring area comprises: a flexible substrate; a plurality of metal traces disposed on the flexible substrate; the protective layer covers the flexible substrate and the metal routing; the opening of the groove is formed in the surface, close to the metal wiring, of the flexible substrate, and the projection of the groove is close to the edge of the protective layer compared with the projection of the metal wiring in the direction perpendicular to the protective layer; the groove is at least partially filled with a hydrophilic material. Through filling hydrophilic material in the recess on the flexible substrate, absorb the steam in the array substrate, avoid the metal between flexible substrate and the protective layer to walk the line and become invalid because of the steam invasion.

Description

Array substrate and preparation method thereof

Technical Field

The invention relates to the technical field of display, in particular to an array substrate and a preparation method of the array substrate.

Background

Organic Light Emitting Display (OLED) is a Display technology with great development prospect. The OLED display device not only has excellent display performance, but also has the characteristics of self-luminescence, simple structure, ultra-lightness and thinness, high response speed, wide viewing angle, low power consumption, capability of realizing flexible display and the like, is known as a "dream display", is favored by various display manufacturers, and has become the leading force in the display technology field.

The existing flexible OLED can be bent, and metal wires in a bending area are easy to be corroded by water vapor invasion due to bending, so that abnormal display is caused.

Disclosure of Invention

The invention provides an array substrate and a preparation method thereof, which can avoid the problems of water vapor invasion and metal wiring corrosion caused by bending when the bending area of the array substrate is bent.

In a first aspect, an embodiment of the present invention provides an array substrate, including a display area and a metal routing area located on at least one side of the display area, where the metal routing area includes: a flexible substrate; a plurality of metal traces disposed on the flexible substrate; the protective layer covers the flexible substrate and the metal routing; the projection of the groove is close to the edge of the protective layer compared with the projection of the metal routing in the direction perpendicular to the protective layer; the groove is at least partially filled with a hydrophilic material.

In another embodiment of the present invention, the hydrophilic material fills a portion of the groove, the protective layer is located on the surfaces of the flexible substrate and the metal trace, and the protective layer has an extension extending into the groove.

In one aspect of an embodiment of the present invention, a cavity is formed between the hydrophilic material and the protective layer.

In another embodiment of the present invention, an intermediate layer is further included on the surfaces of the flexible substrate and the metal traces, the intermediate layer has through slots corresponding to the positions of the grooves, the hydrophilic material completely fills the grooves and extends in the direction of the through slots, and the protective layer covers the intermediate layer and the hydrophilic material;

the protective layer is in contact with the hydrophilic material, or a cavity is formed between the protective layer and the hydrophilic material.

In another embodiment of the present invention, the metal routing area is a GIP routing area on two opposite sides of the display area, the GIP routing area includes a flexible substrate, a plurality of GIP routing lines disposed on the flexible substrate, and a protection layer covering the flexible substrate and the GIP routing lines, the surface of the flexible substrate close to the protection layer is provided with the groove, and in a direction perpendicular to the protection layer, a projection of the groove is close to an edge of the protection layer compared with a projection of the GIP routing lines.

In another embodiment of the present invention, the metal routing area is a fan-shaped routing area located on one side of the display area of the array substrate, the fan-shaped routing area includes a flexible substrate, a plurality of signal lines disposed on the flexible substrate, and a protection layer covering the flexible substrate and the signal lines, a groove is disposed on a surface of the flexible substrate close to the protection layer, and a projection of the groove is closer to an edge of the protection layer than a projection of the signal line in a direction perpendicular to the protection layer.

In one aspect of an embodiment of the present invention, the hydrophilic material is at least one of a basic metal, a basic oxide, a sulfide, and a molecular sieve.

In one aspect of the embodiment of the present invention, the number of the grooves is one or more on either side of the metal trace;

if the number of the grooves on one side of the metal routing is one, the length direction of the grooves is consistent with the extending direction of the metal routing;

if the grooves on one side of the metal routing are multiple, the arrangement direction of at least part of the grooves is consistent with the extension direction of the metal routing.

In a second aspect, an embodiment of the present invention provides a method for manufacturing an array substrate, where the method includes:

forming a flexible substrate;

forming a plurality of metal wires on the flexible substrate to form a metal wire routing area of the array substrate;

forming a groove on one side of the flexible substrate close to the metal wire, wherein the projection of the groove is close to the edge of the protective layer compared with the projection of the metal wire in the direction vertical to the protective layer; at least partially filling the groove with a hydrophilic material;

and forming a protective layer, wherein the protective layer covers the hydrophilic material, the flexible substrate and the metal wire.

In an aspect of the embodiment of the present invention, before filling the hydrophilic material in the groove, the method further includes:

forming an intermediate layer on the surfaces of the flexible substrate and the metal routing, wherein the intermediate layer is provided with a through groove corresponding to the groove;

filling a hydrophilic material in the groove, comprising:

completely filling the grooves with the hydrophilic material;

before forming the protective layer, at least partially filling the through groove with the hydrophilic material;

forming a protective layer covering the hydrophilic material, the flexible substrate, and the metal trace, including:

forming a protective layer on the intermediate layer, the protective layer covering the intermediate layer and the hydrophilic material.

According to the array substrate and the preparation method of the array substrate provided by the embodiment of the invention, the array substrate comprises a display area and a metal wiring area positioned on at least one side of the display area, wherein the metal wiring area comprises: a flexible substrate; a plurality of metal traces disposed on the flexible substrate; the protective layer covers the flexible substrate and the metal routing; the opening of the groove is formed in the surface, close to the metal wiring, of the flexible substrate, and the projection of the groove is close to the edge of the protective layer compared with the projection of the metal wiring in the direction perpendicular to the protective layer; the groove is at least partially filled with a hydrophilic material. Through set up the recess on flexible substrate and fill hydrophilic material, make hydrophilic material can absorb the steam of following the invasion of array substrate edge, avoid steam further to corrode the metal and walk the line and become invalid.

Drawings

Fig. 1 is a structure of an array substrate according to an embodiment of the invention;

fig. 2 is a structure of an array substrate according to another embodiment of the present invention;

fig. 3 is a structure of an array substrate according to another embodiment of the present invention;

FIG. 4 is a structure of a metal routing area in any of the embodiments of FIGS. 1-3;

FIG. 5 is another structure of a metal routing area in any of the embodiments of FIGS. 1-3;

FIG. 6 illustrates a groove structure according to an embodiment;

fig. 7 shows the structure of a groove in another embodiment.

Reference numerals:

100. 200, 300-metal wiring area

101. 301, 401, 501-Flexible substrate

102. 302, 602, 702-Metal traces

103. 203, 303-protective layer

104. 204, 304, 404, 504, 604, 704-grooves

105. 205, 305-hydrophilic materials

106. 206, 306-extension

309-second extension

207-cavity 307-intermediate layer

308-through groove

400-sector wiring area

400 ', 500' -display area

402-signal line

500-GIP routing area

502-GIP routing

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

The directional terms such as "up", "down", "left" and "right" related to the embodiments of the present invention refer to relative positions in a coordinate axis, not absolute positions. The terms "upper" and "upper" in the embodiments of the present invention may be understood as contacting or not contacting each other, and those skilled in the art can set the conditions according to the actual situation, and should not be construed as limiting the present invention.

As described in the background art, the conventional OLED display panel can achieve a higher screen occupation ratio by bending, so as to provide a better viewing experience for a user, for example, a lower frame and a side frame of the display panel can be bent toward the back of a display surface, thereby implementing a narrow frame design. However, the inventor found that when the bending region of the display Panel is bent toward the back of the display surface, film separation occurs between the flexible substrate of the bending region and other films on the surface of the flexible substrate due to bending, so that water vapor invades and corrodes metal traces, such as data lines or GIP (Gate in Panel technology) traces, to cause abnormal display.

In order to solve the problem, the invention provides an array substrate and a preparation method thereof, the array substrate is provided with a display area and a non-display area, the array substrate further comprises a metal wiring area, the metal wiring area is positioned in the non-display area on at least one side of the display area, and the metal wiring area of the array substrate comprises a flexible substrate, a metal wiring and a protective layer which are arranged in a stacked mode. A groove is further formed in the flexible substrate, an opening of the groove is located on the surface, close to the metal wiring, of the flexible substrate, and the projection of the groove is close to the edge of the protective layer in comparison with the projection of the metal wiring in the direction perpendicular to the protective layer; the groove is at least partially filled with a hydrophilic material.

The flexible substrate may be a Polyimide (PI) substrate, or may also be other organic substrates, such as a PET substrate, a PMMA substrate, and the like, which is only schematically illustrated in this embodiment, but not limited thereto, and may be reasonably arranged as required in practical applications.

The metal wire is located in the non-display area of the array substrate and is disposed on one side of the flexible substrate close to the display surface. In other embodiments, the metal traces and the flexible substrate may not be in direct contact, for example, a buffer layer, an insulating layer, etc. may also be included between the metal traces and the flexible substrate. In one embodiment, the metal traces may be data signal lines, touch signal lines, and fingerprint identification signal lines, and in other embodiments, the metal traces may also be gate lines, scan lines, GIP traces, and the like.

The protective layer can cover the metal wiring and the flexible substrate, and the metal wiring is located in a closed environment, so that wiring failure caused by water vapor corrosion is avoided. In one embodiment, the protective layer material may be the same as the flexible substrate material. In other embodiments, the protective layer material and the flexible substrate material may not be the same. The protection layer may be made of Polyimide (PI), or may be made of other organic materials, such as a PET substrate, PMMA, etc., and this embodiment is merely illustrative, and not limited thereto, and may be reasonably set as needed in practical applications.

The non-display area of the flexible substrate is further provided with a groove, at least part of the groove is filled with hydrophilic materials, the opening of the groove is located on the surface, close to the metal wiring, of the flexible substrate, the groove is located in the edge area of the flexible substrate, and the length or arrangement direction of the groove extends along the direction of the metal wiring. Therefore, the groove formed on the periphery of the metal wiring area is arranged around the metal wiring, and the protective layer covers the groove, the flexible substrate and the metal wiring. The hydrophilic material in the groove can absorb water vapor invading from the edge of the array substrate, and the water vapor is prevented from further invading inwards to corrode the metal wiring.

Further, when setting up recess and hydrophilic material, hydrophilic material and/or protective layer material can also have the extension, and the extension of hydrophilic material and/or protective layer can extend into other retes along the range upon range of direction of rete to increase the area of contact of hydrophilic material and/or protective layer and other retes, increase adhesion between the rete.

More specifically, the adhesion between a flexible substrate film layer having a groove structure and a film layer adjacent thereto is increased.

Example 1

In an embodiment of the invention, the array substrate includes a display area and a metal routing area located on at least one side of the display area, the metal routing area includes a flexible substrate, a metal routing and a protection layer, the flexible substrate is stacked, the flexible substrate further has a groove, and at least part of the groove is filled with a hydrophilic material. The opening of recess is located the surface that the metal was walked to the flexible substrate, in the direction of perpendicular to protective layer, the projection of recess on the protective layer is compared and is walked the edge that is closer to the protective layer in the metal, and simultaneously, the recess also is closer to the edge of flexible substrate, consequently on the direction that is on a parallel with the protective layer, during outside steam invasion array substrate, compare in the metal and walk the line position, steam can arrive the groove position earlier, hydrophilic material in the recess is through absorbing steam, it further inwards extends to the metal and walks the line to have avoided steam, thereby avoid the metal to walk the line and lose efficacy because of steam corrodes.

The hydrophilic material and/or the protective layer material can form an extension, and the extension of the hydrophilic material and/or the protective layer can extend into other film layers along the lamination direction of the film layers, so that the contact area between the film layers is increased, and the adhesion between the film layers is increased.

Example 2

The second embodiment of the present invention is further configured on the basis of the first embodiment, in which the array substrate includes a display area and a metal routing area located on at least one side of the display area, a cross-sectional view of the metal routing area 100 is shown in fig. 1, the metal routing area 100 includes a flexible substrate 101, a metal trace 102 formed on a surface of the flexible substrate, and a protective layer 103 formed on the surface of the flexible substrate and the metal trace, the flexible substrate further has a groove 104, and a portion of the groove is filled with a hydrophilic material 105. The opening of recess 104 is located the surface that flexible substrate is close to metal and walks line 102, in the direction of perpendicular to protective layer, the projection of recess 104 on the protective layer is compared and is walked the edge that is closer to the protective layer in metal, and simultaneously, recess 104 also is closer to the edge of flexible substrate 101, consequently in the direction that is on a parallel with protective layer 103, during outside steam invasion array substrate, compare in metal and walk line 102 position, steam can arrive the groove position earlier, hydrophilic material in the recess is through absorbing steam, avoided steam further inwards to extend to metal and walked the line, thereby avoid metal to walk the line and lose efficacy because of steam corrodes.

The hydrophilic material 105 fills only a part of the groove, the protective layer 103 is located on the surfaces of the flexible substrate 101 and the metal trace 102, and the protective layer has an extension 106 extending into the groove 104. Therefore, on one hand, the hydrophilic material 105 is filled in the groove, so that water vapor in the array substrate is absorbed, and the metal wire 102 is prevented from being failed due to water vapor corrosion; on the other hand, the protective layer 103 is partially filled in the groove 104, the protective layer 103 extends into the film layer of the flexible substrate 101 where the groove is located through the extension portion 106, so that the adhesion between the protective layer 103 and the flexible substrate 101 is increased, and when the metal wiring area is bent, the protective layer 103 and the flexible substrate 101 are separated due to stress, so that water vapor enters the array substrate from the film layer separation position to corrode the metal wiring 102.

In some embodiments, the extension of the protective layer fills into the recess and contacts the hydrophilic material; in some other embodiments, as shown in fig. 2, fig. 2 is another cross-sectional view of the metal routing region 200, the protection layer 203 has an extension 206, the extension 206 enters the groove 204 for filling, the protection layer 203 and the hydrophilic material 205 are not in direct contact, and a cavity 207 is formed between the protection layer and the hydrophilic material. The cavity 207 can provide certain space for the water-absorbing material to expand after absorbing water vapor, and the separation of the flexible substrate and the protective layer caused by the expansion of the water-absorbing material is avoided, so that the corrosion of the metal wiring caused by the invasion of the external water vapor is avoided.

Example 3

The third embodiment of the present invention is further configured, based on the first embodiment, that the array substrate includes a display area and a metal routing area 300 located on at least one side of the display area, a cross-sectional view of the metal routing area 300 is shown in fig. 3, the metal routing area includes a flexible substrate 301, a metal routing 302 formed on a surface of the flexible substrate, an intermediate layer 307 formed on surfaces of the flexible substrate and the metal routing, and a protection layer 303 formed on a surface of the intermediate layer 307. Wherein the protective layer 303 covers the intermediate layer and the hydrophilic material 305.

The flexible substrate 301 also has a recess 304, the recess 304 being partially filled with a hydrophilic material 305. The opening of the groove 304 is located on the surface of the flexible substrate close to the metal trace, and in the direction perpendicular to the protection layer, the projection of the groove on the protection layer is closer to the edge of the protection layer than the metal trace.

The middle layer is provided with through slots 308, the positions of the through slots 308 correspond to the positions of the grooves 304 of the flexible substrate. In a direction perpendicular to the protective layer, a projection of the through-groove coincides at least partially with a projection of the recess of the flexible substrate, more specifically with a projection of the through-groove.

Wherein the hydrophilic material 305 completely fills the recess 304 and the hydrophilic material has a second extension 309 extending in the direction of the through-slot 308, the second extension 309 at least partially filling the through-slot. The protective layer 303 has an extension 306 extending in the direction of the through-groove 308, and the protective layer 303 covers the hydrophilic material and the intermediate layer. On one hand, the grooves 304 and part of the through grooves 308 are filled with hydrophilic materials 305, and the hydrophilic materials absorb water vapor inside the array substrate, so that the metal routing is prevented from losing efficacy due to water vapor corrosion; on the other hand, the hydrophilic material 305 extends into the middle layer 307 film layer where the through groove 308 is located through the second extension 309, so that the adhesion force between the middle layer 307 and the flexible substrate is increased, and the protective layer 303 extends into the middle layer 307 film layer where the through groove 308 is located through the extension 306, so that the adhesion force between the middle layer and the protective layer is increased. When the metal wiring area is prevented from being bent, the film layers are separated from each other due to stress, and water vapor enters the array substrate from the film layer separation position to corrode the metal wiring.

The material of the intermediate layer may be the same as the material of the flexible substrate or the protective layer, and may be made of Polyimide (PI), or may be other organic materials, such as a PET substrate, PMMA, and the like.

In some embodiments, a hydrophilic material fills a portion of the through-trench, the hydrophilic material being in direct contact with the protective layer; in other embodiments, the hydrophilic material fills a portion of the through-groove, and a cavity is formed between the hydrophilic material and the protective layer to provide space for the water-absorbing material to expand after absorbing water vapor.

In other some embodiments, the extension of hydrophilic material further extends to logical inslot, makes hydrophilic material fill recess and logical inslot completely, and the protective layer forms in the surface of hydrophilic material and intermediate level, further increases the adhesion between flexible substrate and the protective layer, avoids leading to flexible substrate and intermediate level rete separation because of buckling, leads to the steam invasion to corrode the metal and walks the line.

Example four

Based on any of embodiments 1 to 3, further, the metal routing area of this embodiment is a fan-shaped routing area 400 of the array substrate, as shown in fig. 4, the array substrate includes a display area 400 ' and a fan-shaped routing area 400, the fan-shaped routing area 400 is located on one side of the display area 400 ', in this embodiment, the fan-shaped routing area 400 is located on one side of a short side of the display area 400 ', the fan-shaped routing area 400 is provided with a signal line 402, and the signal line 402 may be in a fan shape.

The fan-shaped wiring area comprises a flexible substrate 401, a plurality of signal lines 402 arranged on the flexible substrate 401, and a protective layer (not shown) covering the flexible substrate and the signal lines, wherein a groove 404 is arranged on the surface of the flexible substrate 401 close to the protective layer, and in a direction perpendicular to the protective layer, the projection of the groove 404 is close to the edge of the protective layer compared with the projection of the signal lines.

The signal line can be one or more of a data signal line, a touch signal line or a fingerprint identification signal line. Of course, in other embodiments, the fan-shaped routing area may be located on one side of the long side of the display area. If the display area is in other shapes, the fan-shaped wiring area can be at least positioned on at least one part of any side of the display area.

In the embodiment, the groove and the hydrophilic material are arranged on the periphery of the signal wire in the fan-shaped wiring area, so that on one hand, the hydrophilic material in the groove absorbs water vapor in the array substrate, and the metal wiring is prevented from losing efficacy due to water vapor corrosion; on the other hand, the extension part of the hydrophilic material and/or the protective layer can extend into other film layers along the laminating direction of the film layers, so that the contact area between the flexible substrate where the hydrophilic material is located and/or the protective layer and other film layers is increased, the adhesion force between the film layers is increased, and the phenomena that water vapor invades due to the separation of the film layers and the signal lines are corroded to cause failure are prevented.

EXAMPLE five

Based on any of embodiments 1-3, further, the metal routing area of this embodiment is a GIP routing area 500 located on two opposite sides of the display area 500', as shown in fig. 5, the GIP routing area 500 includes a flexible substrate 501, a plurality of GIP routing lines 502 disposed on the flexible substrate, and a protection layer (not shown) covering the flexible substrate and the GIP routing lines, a groove 504 is disposed on a surface of the flexible substrate close to the protection layer, and a projection of the groove 504 is closer to an edge of the flexible substrate than a projection of the GIP routing lines 502 in a direction perpendicular to the flexible substrate. The GIP routing lines can be gate lines and scan lines.

In the embodiment, the groove and the hydrophilic material are arranged on the periphery of the GIP routing, so that on one hand, the hydrophilic material in the groove absorbs water vapor in the array substrate, and the metal routing is prevented from losing efficacy due to water vapor corrosion; on the other hand, the extension of hydrophilic material and/or protective layer can extend into other retes along the range upon range of direction extension of rete to increase the area of contact of the flexible substrate and/or protective layer and other retes that hydrophilic material is located, increase adhesion between the rete, prevent to make steam invasion because of the rete separation, corrode the GIP and walk the line and lead to failing.

EXAMPLE six

The fourth embodiment and the fifth embodiment can be combined, that is, the groove and the hydrophilic material are simultaneously arranged on the fan-shaped wiring area and the GIP wiring area of the array substrate. The signal wires in the fan-shaped wiring area and the GIP wiring in the GIP wiring area are prevented from losing effectiveness due to water vapor corrosion, meanwhile, the adhesion force between the film layers of the fan-shaped wiring area and the GIP wiring area is increased, and the possibility of separation caused by bending between the film layers is reduced.

EXAMPLE seven

In any of embodiments 1-6, further, in this embodiment, the hydrophilic material may be a material that chemically reacts with water vapor, such as at least one of a basic metal, a basic oxide, and a sulfide. Or may be a material having physical adsorption, such as a molecular sieve.

The number of the grooves is one or more on either side of the metal routing. As shown in fig. 6, if there is one groove 604 on one side of the metal trace 602, the length direction of the groove 604 is the same as the extending direction of the metal trace 602; as shown in fig. 7, if there are a plurality of grooves 704 on one side of the metal trace 702, the arrangement direction of the grooves 704 is the same as the extending direction of the metal trace 702.

In the above embodiments, the protection layer may be made of Polyimide (PI), or may be made of other organic materials, such as a PET substrate, PMMA, etc., and this embodiment is only schematically illustrated, and is not limited thereto, and may be reasonably arranged as required in practical applications. Further, the material of the intermediate layer may be the same as that of the protective layer.

In some embodiments, the array substrate further includes a driving circuit board electrically connected to the signal lines to provide driving signals to the display area. It should be noted that the protective layer on the flexible substrate does not cover the driving circuit board.

Example eight

The embodiment provides a preparation method of an array substrate, which comprises the following steps:

s101, forming a flexible substrate;

s102, forming a plurality of metal wires on a flexible substrate to form a metal wire routing area of the array substrate;

s103, forming a groove on one side, close to the metal wire, of the flexible substrate, wherein in the direction perpendicular to the flexible substrate, the projection of the groove is close to the edge of the flexible substrate compared with the projection of the metal wire;

s104, filling at least part of the groove with a hydrophilic material;

s105, forming a protective layer, wherein the protective layer covers the groove, the flexible substrate and the metal wiring.

In other embodiments, the method for preparing the array substrate includes:

s201, forming a flexible substrate;

s202, forming a plurality of metal wires on a flexible substrate to form a metal wire routing area of the array substrate;

s203, forming an intermediate layer on the surfaces of the flexible substrate and the metal routing;

s204, punching the middle layer, wherein in the direction perpendicular to the flexible substrate, the projection of the punching position is close to the edge of the flexible substrate compared with the projection of the metal routing, the hole completely penetrates through the middle layer to form a through hole in the middle layer, and the hole penetrates through the flexible substrate to form a groove in the flexible substrate layer;

s205, filling hydrophilic materials in the grooves and the through holes, wherein the grooves are completely filled with the hydrophilic materials, and the through grooves are at least partially filled with the hydrophilic materials;

and S206, forming a protective layer on the surfaces of the intermediate layer and the hydrophilic material.

Through forming the through hole in the middle layer and filling the hydrophilic material, because the hydrophilic material is located in the flexible substrate and the middle layer, the height of the hydrophilic material in the direction perpendicular to the flexible substrate is greater than the depth of the groove of the flexible substrate, and the hydrophilic material forms a retaining wall structure on the periphery of the metal wiring. On the one hand, area of contact between the increase rete prevents that it from taking place the rete when buckling and droing, and on the other hand, hydrophilic material forms barricade structure, walks the metal and encloses inside, has effectively kept off the invasion way of water oxygen, prolongs the life-span of metal wiring.

It should be noted that the foregoing is only a preferred embodiment of the invention and technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in more detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An array substrate, includes the display area and is located the metal wiring area of at least one side of display area, its characterized in that, the metal wiring area includes:

a flexible substrate;

a plurality of metal traces disposed on the flexible substrate;

the protective layer covers the flexible substrate and the metal routing;

the opening of the groove is formed in the surface, close to the metal wiring, of the flexible substrate, and the projection of the groove is close to the edge of the protective layer compared with the projection of the metal wiring in the direction perpendicular to the protective layer; the groove is at least partially filled with a hydrophilic material.

2. The array substrate as claimed in claim 1, wherein the hydrophilic material fills a portion of the recess, the passivation layer is disposed on the surface of the flexible substrate and the metal trace, and the passivation layer has an extension extending into the recess.

3. The array substrate of claim 2, wherein a cavity is formed between the hydrophilic material and the protective layer.

4. The array substrate according to claim 1, further comprising an intermediate layer on the surface of the flexible substrate and the metal traces, wherein the intermediate layer has through slots corresponding to the positions of the slots, the hydrophilic material completely fills the slots and extends in the direction of the through slots, and the protective layer covers the intermediate layer and the hydrophilic material;

5. An array substrate according to any one of claims 1 to 4, wherein the metal routing area is a GIP routing area on two opposite sides of the display area, the GIP routing area includes a flexible substrate, a plurality of GIP routing lines disposed on the flexible substrate, and a protection layer covering the flexible substrate and the GIP routing lines, the surface of the flexible substrate close to the protection layer is provided with the groove, and a projection of the groove is closer to an edge of the protection layer than a projection of the GIP routing lines in a direction perpendicular to the protection layer.

6. An array substrate according to any one of claims 1 to 4, wherein the metal routing area is a fan-shaped routing area located on one side of a display area of the array substrate, the fan-shaped routing area includes a flexible substrate, a plurality of signal lines disposed on the flexible substrate, and a protective layer covering the flexible substrate and the signal lines, a surface of the flexible substrate close to the protective layer is provided with a groove, and a projection of the groove is closer to an edge of the protective layer than a projection of the signal lines in a direction perpendicular to the protective layer.

7. The array substrate as claimed in claims 1-4, wherein the hydrophilic material is at least one of alkali metal, alkali oxide, sulfide and molecular sieve.

8. The array substrate according to claims 1-4, wherein the number of the grooves is one or more on either side of the metal trace;

9. A preparation method of an array substrate is characterized by comprising the following steps:

forming a flexible substrate;

forming a groove on one side of the flexible substrate close to the metal wire, wherein in the direction perpendicular to the flexible substrate, the projection of the groove is close to the edge of the flexible substrate compared with the projection of the metal wire;

at least partially filling the groove with a hydrophilic material;

10. The method for preparing the array substrate according to claim 9, wherein before filling the hydrophilic material in the groove, the method further comprises:

filling a hydrophilic material in the groove, comprising:

completely filling the grooves with the hydrophilic material;