CN111640592B - Insulating pad bonding device for capacitor cover plate processing - Google Patents
Insulating pad bonding device for capacitor cover plate processing Download PDFInfo
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- CN111640592B CN111640592B CN202010569323.8A CN202010569323A CN111640592B CN 111640592 B CN111640592 B CN 111640592B CN 202010569323 A CN202010569323 A CN 202010569323A CN 111640592 B CN111640592 B CN 111640592B
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- 239000003990 capacitor Substances 0.000 title claims abstract description 61
- 230000005540 biological transmission Effects 0.000 claims abstract description 82
- 239000003292 glue Substances 0.000 claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000007246 mechanism Effects 0.000 claims description 25
- 238000009434 installation Methods 0.000 claims description 7
- 238000005086 pumping Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 241001232346 Gymnosperma glutinosum Species 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000010062 adhesion mechanism Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G27/00—Jigging conveyors
- B65G27/10—Applications of devices for generating or transmitting jigging movements
- B65G27/16—Applications of devices for generating or transmitting jigging movements of vibrators, i.e. devices for producing movements of high frequency and small amplitude
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/02—Devices for feeding articles or materials to conveyors
- B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
- B65G47/12—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles
- B65G47/14—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to the technical field of capacitor processing, and provides an insulating pad bonding device for capacitor cover plate processing, aiming at solving the problem that when an insulating pad is bonded on a capacitor cover plate, manual bonding is not accurate in positioning of the insulating pad on the one hand, and the mounting effect is influenced; on the other hand, the adhesion efficiency of the insulating gasket is low; the point of bonding glue solution is scribbled simultaneously, and the water clock can pollute and damage the problem of condenser, including the bonding process chamber that fuselage platform and fuselage platform upper end set up, the longitudinal symmetry is equipped with transmission band I and transmission band II of syntropy transmission in the inner chamber of bonding process chamber, and the inside of transmission band I and transmission band II all rotates and installs a plurality of transmission rollers, and the back axle head that is located transmission band I inside transmission roller and is located transmission band II inside transmission roller all extends to the exocoel of bonding process chamber and installs drive sprocket. The invention is particularly suitable for the safe production of the capacitor cover plate and has higher social use value and application prospect.
Description
Technical Field
The invention relates to the technical field of capacitor processing, in particular to an insulating pad bonding device for processing a capacitor cover plate.
Background
Power capacitors, capacitors for power systems and electrical equipment. Any two metal conductors are separated by an insulating medium, and thus a capacitor is formed. The capacitance of the capacitor is determined by its geometrical dimensions and the properties of the insulating medium between the two plates.
The cover plate is a main sealing part of the capacitor, and the existing cover plate is usually formed by compounding and pressure riveting a layer of high-temperature-resistant insulating rubber, a layer of phenolic/epoxy resin plate and a riveting fastener. Along with the expansion of the use temperature range of the capacitor and the continuous improvement of the rated working voltage, the probability of product failure caused by the problems of cover plate sealing and insulation is greatly increased, and if the capacitor is used in a circuit board, the phenomena of short circuit and ignition can occur, so that the safety is reduced.
In order to solve the problems, an insulating gasket is adhered to the inner part of the combination of the capacitor cover plate and the capacitor in the prior art, but when the insulating gasket is adhered, the common method is manual adhesion, on one hand, the insulating gasket is not accurately positioned and cannot be centered, and the installation effect is influenced; on the other hand, the adhesion efficiency of the insulating gasket is low, so that the production efficiency is influenced; meanwhile, the point coating of the adhesive glue solution can cause dripping, pollution and damage to the capacitor under the condition of careless operation.
Therefore, an insulating pad bonding device for processing a capacitor cover plate is provided.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides an insulating gasket bonding device for capacitor cover plate processing, which overcomes the defects of the prior art, has reasonable design and compact structure and aims to solve the problem that when an insulating gasket is bonded on a capacitor cover plate, the insulating gasket is not accurately positioned on one hand by manual bonding, so that the mounting effect is influenced; on the other hand, the adhesion efficiency of the insulating gasket is low; meanwhile, the adhesive glue solution is applied by spot coating, and the capacitor is polluted and damaged by the leakage.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme:
an insulating pad bonding device for processing a capacitor cover plate comprises a machine body platform and a bonding processing chamber arranged at the upper end of the machine body platform, a transmission belt I and a transmission belt II which are used for transmitting in the same direction are symmetrically arranged in the inner cavity of the bonding processing chamber from top to bottom, a plurality of transmission rollers are rotatably arranged in the transmission belts I and II, the rear shaft ends of one transmission roller positioned in the transmission belt I and one transmission roller positioned in the transmission belt II extend to the outer cavity of the bonding processing chamber and are provided with transmission chain wheels, the two transmission chain wheels are connected through a chain, one of the transmission chain wheels is arranged on the output end of the servo motor, the servo motor is fixedly arranged on the rear wall of the bonding processing chamber, a transfer bonding mechanism is arranged above the conveying belt I and the conveying belt II close to the output end, and a glue dispensing mechanism is arranged at the position of the conveying belt II at the upstream of the transfer bonding mechanism;
the transfer bonding mechanism comprises a sliding block which is slidably mounted on the top wall of the bonding processing chamber, a lead screw is inserted into the middle thread of the sliding block, the lead screw is rotatably mounted on the inner wall of the bonding processing chamber, one end of the lead screw extends to the outer cavity of the bonding processing chamber and is mounted on the output end of a forward and reverse motor, the forward and reverse motor is fixedly mounted on the side wall of the bonding processing chamber, the lower end of the sliding block is provided with a mounting seat, the edge of the lower end of the mounting seat is connected with a mounting plate through a plurality of lifting cylinders I, the middle part of the upper end of the mounting seat is provided with a vacuum pumping machine, and the output end of the vacuum pumping machine penetrates through the mounting seat and is provided with a vacuum chuck;
the glue dispensing mechanism comprises a mounting frame horizontally arranged above the conveying belt II, the mounting frame is fixedly mounted on the inner wall of the bonding processing chamber, a lifting plate is mounted at the lower end of the mounting frame through a plurality of lifting cylinders II, a glue dispensing head is arranged at the lower end of the lifting plate, the glue dispensing head is installed at the output end of the flexible hose in a penetrating mode, the other end of the flexible hose penetrates through the mounting frame and is connected with a glue inlet pipe, the other end of the glue inlet pipe penetrates through the rear wall of the bonding processing chamber and extends to the lower portion of the inner cavity of the glue box, the glue box is mounted on the rear wall of the bonding processing chamber, and a glue pump is mounted on the glue inlet pipe;
still including installing the L shape branch at the lower extreme rear side of lifter plate, and the other end integrated into one piece of L shape branch has trapezoidal propulsion piece, and the hypotenuse of trapezoidal propulsion piece is contradicted and is had the annular lateral wall of catch bar, catch bar horizontal installation is on the lateral wall of axis of rotation, and the axis of rotation rotates and install on the fixing base, the fixing base is installed on the inner wall of bonding process chamber, the cover is equipped with torque spring in the axis of rotation, and torque spring's both ends are connected with the lateral wall of axis of rotation and the upper end of fixing base respectively, be equipped with the glue dripping tray under the point gum head, and the glue dripping tray passes through the bracket to be installed on the lateral wall of axis of rotation.
Preferably, the glue pump is a metering pump for metering and quantitatively delivering the glue solution.
Preferably, the rear sides of the input ends of the transmission band I and the transmission band II are respectively provided with a vibration disc output end used for transmitting the insulation gasket and the capacitor cover plate, and the vibration disc is arranged on the rear side of the machine body platform.
Preferably, the bonding process chamber is close to the vertical flexible hydro-cylinder of installing on the roof of II output one sides of transmission band, and installs the pressure equipment piece on the flexible end of flexible hydro-cylinder, and the below of pressure equipment piece is equipped with the backing plate, and the backing plate is inconsistent with the inner chamber roof of transmission band II.
Preferably, the output end of the second conveying belt extends to the outer cavity of the bonding processing chamber, side plates are arranged on the front side and the rear side of the output end of the second conveying belt, and the two side plates are fixedly arranged at the upper end of the machine body platform.
Preferably, a pressure sensor is installed on the end head of the telescopic end of the lifting cylinder I.
Preferably, a control panel is installed on the front wall of the bonding processing chamber, a display screen and a control button are arranged on the control panel, and a PLC (programmable logic controller) is arranged in the control panel.
(III) advantageous effects
The embodiment of the invention provides an insulating pad bonding device for processing a capacitor cover plate, which has the following beneficial effects:
1. through the integrated configuration that shifts bonding mechanism and point gum machine structure, point gum machine constructs to the condenser apron of transmission on transmission band II go on the point and scribbles the glue solution, and the cooperation shifts bonding mechanism and is used for corresponding the transfer to the condenser apron with the insulating gasket on the transmission band I in proper order on to accomplish the bonding, guarantee the firm effect after the bonding, be used for the equipment of condenser to use.
2. Through the integrated configuration of dispensing head and dispensing tray, the dispensing head is down, the down of L shape branch terminal trapezoidal propulsion piece along its hypotenuse this moment, conflict and promotion catch bar, thereby stir the axis of rotation and rotate, the dispensing tray that will originally arrange the dispensing head under the position is stirred anticlockwise and is moved away, the cooperation dispensing head down to the stroke after the below, the glue pump starts, glue solution is scribbled to the upper end point of condenser apron through the dispensing head, be convenient for follow-up insulating gasket's combination bonding, the setting of dispensing tray can effectually collect the unnecessary glue solution that drips after the dispensing, prevent the glue solution drippage, contaminated equipment and work piece.
3. Through the integrated configuration of transmission band I, transmission band II and vibration dish, cross the orderly material loading that the vibration dish can realize insulating pad and condenser apron, transmit insulating pad and condenser apron respectively to transmission band I and transmission band II on to carry out bonding processing through shifting bonding mechanism.
4. Through the combined structure of the telescopic oil cylinder, the press mounting block and the base plate, after the capacitor cover plate is bonded with the insulating gasket, the capacitor cover plate is matched with intermittent transmission of the transmission belt II, the telescopic oil cylinder is started to push the press mounting block to move downwards, and the press mounting block and the base plate are combined to apply pressure, so that the capacitor cover plate is ensured to be in full contact with the insulating gasket, and the bonding effect is improved.
Drawings
The above features, technical features, advantages and modes of realisation of an insulating pad bonding apparatus for capacitor cap plate processing will be further described in the following detailed description of preferred embodiments with reference to the accompanying drawings.
FIG. 1 is a schematic external view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic structural view of the bonded state of the present invention;
FIG. 4 is a rear view structural diagram of the present invention;
FIG. 5 is a schematic structural view of a dispensing mechanism of the present invention;
FIG. 6 is a perspective view of a part of the dispensing mechanism of the present invention;
FIG. 7 is a schematic structural view of the capacitor cover plate and the insulating spacer after they are bonded together;
fig. 8 is a schematic structural view of a transfer bonding mechanism according to the present invention.
In the figure: the device comprises a machine body platform 1, an adhesion processing chamber 2, a transmission belt I3, a transmission belt II 4, a transmission roller 5, a transmission chain wheel 51, a chain 52, a servo motor 53, a side plate 6, a vibration disc 7, a transfer adhesion mechanism 8, a sliding block 81, a screw rod 82, a forward and reverse motor 83, a mounting seat 84, a lifting cylinder I85, a mounting plate 86, a vacuum chuck 87, a vacuumizer 88, a pressure sensor 89, a glue dispensing mechanism 9, a mounting frame 91, a lifting cylinder II 92, a lifting plate 93, a glue dispensing head 94, a telescopic hose 95, a glue inlet pipe 96, a glue pump 97, a glue box 98, an L-shaped support rod 99, a trapezoidal propelling block 910, a push rod 911, a rotating shaft 912, a torsion spring 913, a fixing seat 914, a bracket 915, a glue dripping tray 916, a control panel 10, a telescopic oil cylinder 11, a press mounting block 12, a capacitor cover plate a and an insulating gasket b.
Detailed Description
The invention will be further illustrated with reference to the following figures 1 to 8 and examples:
example 1
An insulating pad bonding device for processing a capacitor cover plate comprises a body platform 1 and a bonding processing chamber 2 arranged at the upper end of the body platform 1, wherein transmission belts I3 and II 4 for transmitting unidirectional transmission are symmetrically arranged in an inner cavity of the bonding processing chamber 2 from top to bottom, the transmission belts I3 are used for transmitting insulating pads b, the transmission belts II 4 are used for transmitting capacitor cover plates a, a plurality of transmission rollers 5 are rotatably arranged in the transmission belts I3 and II 4, the rear shaft ends of one transmission roller 5 in the transmission belt I3 and one transmission roller 5 in the transmission belt II 4 extend to an outer cavity of the bonding processing chamber 2 and are provided with transmission chain wheels 51, the two transmission chain wheels 51 are connected through chains 52, one transmission chain wheel 51 is arranged at the output end of a servo motor 53, and the servo motor 53 is fixedly arranged on the rear wall of the bonding processing chamber 2, a transfer bonding mechanism 8 is arranged above the conveying belt I3 and the conveying belt II 4 close to the output end and used for correspondingly transferring the insulating gaskets b on the conveying belt I3 to the capacitor cover plate a in sequence and completing bonding, and a glue dispensing mechanism 9 is arranged at the position, located at the upstream of the transfer bonding mechanism 8, of the conveying belt II 4 and used for dispensing glue to the capacitor cover plate a conveyed on the conveying belt II 4, so that the stable effect after bonding is ensured;
in this embodiment, as shown in fig. 2, 3 and 8, the transfer bonding mechanism 8 includes a sliding block 81 slidably mounted on the top wall of the bonding processing chamber 2, a screw 82 is inserted into a middle thread of the sliding block 81, the screw 82 is rotatably mounted on the inner wall of the bonding processing chamber 2, one end of the screw 82 extends to the outer cavity of the bonding processing chamber 2 and is mounted on the output end of a forward and reverse motor 83, the forward and reverse motor 83 is fixedly mounted on the side wall of the bonding processing chamber 2, a mounting seat 84 is provided at the lower end of the sliding block 81, the lower end edge of the mounting seat 84 is connected to a mounting plate 86 through a plurality of lifting cylinders i 85, a vacuum extractor 88 is mounted in the middle of the upper end of the mounting seat 84, and the output end of the vacuum extractor 88 penetrates through the mounting seat 84 and is mounted with a vacuum chuck 87.
In the embodiment, a servo motor 53 is intermittently started and stopped, a capacitor cover plate a and an insulating gasket b are intermittently conveyed, when the servo motor 53 is intermittently stopped, a lifting cylinder I85 is started to drive a vacuum chuck 87 to descend, after the vacuum chuck 88 is started to vacuumize the inside of the vacuum chuck 87 after abutting against the insulating gasket b on the output end of a transmission belt I3, the vacuum chuck 87 adsorbs the insulating gasket b under the external atmospheric pressure, the lifting cylinder I85 retracts for a section of stroke, the insulating gasket b is slightly lifted, then a forward and reverse motor 83 is started, the insulating gasket b is driven to move to the position above the capacitor cover plate a on the transmission belt II 4 by combining a sliding block 81 sleeved by threads on a screw rod 82 and the screw rod 82, the lifting cylinder I85 is extended to push the insulating gasket b to contact with the capacitor cover plate a in a descending manner, and the adhesion is completed by matching with the adhesion of glue solution and the pressure applied by the lifting cylinder I85, after bonding, the vacuumizing machine 88 is released from a vacuumizing state, and when the lifting cylinder I85 recovers the vacuum sucker 87 to reach the original height, the forward and reverse motors 83 are started to drive the screw rod 82 to rotate reversely, so that a complete transfer bonding process is completed.
In this embodiment, as shown in fig. 2-4 and 6, the dispensing mechanism 9 includes an installation frame 91 horizontally disposed above the transmission belt ii 4, the installation frame 91 is fixedly installed on the inner wall of the bonding processing chamber 2, a lifting plate 93 is installed at the lower end of the installation frame 91 through a plurality of lifting cylinders ii 92, a dispensing head 94 is installed at the lower end of the lifting plate 93, the dispensing head 94 is installed on the output end of a flexible hose 95 in a penetrating manner, the other end of the flexible hose 95 penetrates through the installation frame 91 and is connected with a glue inlet tube 96, the other end of the glue inlet tube 96 penetrates through the rear wall of the bonding processing chamber 2 and extends to the lower portion of the inner cavity of the glue box 98, the glue box 98 is installed on the rear wall of the bonding processing chamber 2, and a glue pump 97 is installed on the glue inlet tube 96;
the glue dropping device further comprises an L-shaped supporting rod 99 arranged on the rear side of the lower end of the lifting plate 93, a trapezoidal pushing block 910 is integrally formed at the other end of the L-shaped supporting rod 99, the oblique edge of the trapezoidal pushing block 910 is abutted to the annular side wall of the pushing rod 911, the pushing rod 911 is horizontally arranged on the side wall of the rotating shaft 912, the rotating shaft 912 is rotatably arranged on the fixing seat 914, the fixing seat 914 is arranged on the inner wall of the bonding processing chamber 2, a torsion spring 913 is sleeved on the rotating shaft 912, two ends of the torsion spring 913 are respectively connected with the side wall of the rotating shaft 912 and the upper end of the fixing seat 914, a glue dropping tray 916 is arranged right below the glue dropping head 94, and the glue dropping tray 916 is arranged on the side wall of the rotating shaft 912 through a bracket 915;
in this embodiment, when the servo motor 53 stops intermittently, the second lift cylinder 92 starts, the dispensing head 94 is pushed to move downwards, the trapezoidal propelling block 910 at the tail end of the L-shaped supporting rod 99 moves downwards along the inclined edge of the trapezoidal propelling block at the tail end of the trapezoidal propelling block, the trapezoidal propelling block collides with and pushes the pushing rod 911, the rotating shaft 912 is thus stirred to rotate, the glue dripping tray 916 which is originally arranged at the position right below the dispensing head 94 is stirred anticlockwise and moved away, the dispensing head 94 is matched to move downwards to the lowest stroke, the glue pump 97 starts, glue is dispensed to the upper end of the capacitor cover plate a through the dispensing head 94, the subsequent combined bonding of the insulating gaskets b is facilitated, it can be understood that the glue dripping tray 916 can effectively collect redundant glue dripping after dispensing, the glue is prevented from dripping, and the equipment and the workpiece are polluted.
In this embodiment, as shown in fig. 4, the glue pump 97 is a metering pump, and is used for metering and quantitatively delivering glue, so as to meet the requirement when the insulating gasket b and the capacitor cover plate a are bonded, and meanwhile, no waste is caused.
In this embodiment, as shown in fig. 2 and 3, the rear side of transmission band i 3 and the rear side of transmission band ii 4 input are equipped with the vibration dish 7 output that is used for transmitting insulating pad b and condenser cover plate a respectively, and vibration dish 7 sets up the rear side at fuselage platform 1, can realize the orderly material loading of insulating pad b and condenser cover plate a through vibration dish 7, transmit insulating pad b and condenser cover plate a to transmission band i 3 and transmission band ii 4 respectively on to carry out bonding process through shifting bonding mechanism 8.
In this embodiment, as shown in fig. 1 to 4, the output end of the transmission belt ii 4 extends to the outer cavity of the bonding processing chamber 2, side boards 6 are arranged at the front and rear sides of the output end of the transmission belt ii 4, and the two side boards 6 are fixedly mounted at the upper end of the machine body platform 1, so that the transmission belt ii 4 is used for outputting the capacitor cover plate a bonded with the insulating gasket b, and the capacitor cover plate a is convenient to collect.
In this embodiment, as shown in fig. 8, install pressure sensor 89 on the end of the flexible end of lift cylinder i 85, the pressure when effectual assurance is adsorbed to and the pressure control when bonding insulating gasket b and the adhesion pressfitting of condenser apron a can not cause the damage to the work piece.
In this embodiment, as shown in fig. 1, a control panel 10 is installed on the front wall of the bonding processing chamber 2, a display screen and a control button are installed on the control panel 10, and a PLC controller is installed in the control panel 10, in this embodiment, the model of the PLC controller is siemens S7-200, and the control panel 10 is connected with a servo motor 53, a forward and reverse motor 83, a lifting cylinder i 85, a vacuum extractor 88, a pressure sensor 89, a lifting cylinder ii 92, and a glue pump 97 through an electric control line;
a processing worker effectively controls the intermittent start and stop of the servo motor 53 by controlling a control button on the control panel 10 and combining a PLC (programmable logic controller) to intermittently transmit the capacitor cover plate a and the insulating gasket b, and simultaneously starts the transmission capacitor cover plate a and the insulating gasket b in the intermittence by matching with the transfer bonding mechanism 8 and the dispensing mechanism 9 to transfer the static insulating gasket b, glue the capacitor cover plate a and bond the insulating gasket b and the capacitor cover plate a, so that the bonding effect is ensured;
the coordination operation of a forward and reverse motor 83, a lifting cylinder I85 and a vacuumizing machine 88 is effectively controlled, the lifting cylinder I85 is started to drive a vacuum chuck 87 to move downwards, the vacuumizing machine 88 is started to vacuumize the interior of the vacuum chuck 87 to adsorb an insulating gasket b, the lifting cylinder I85 retracts for a section of stroke, the insulating gasket b is slightly lifted, the lifting cylinder I85 is started in cooperation with the forward and reverse motor 83 to drive the insulating gasket b to move to the position above a capacitor cover plate a on a transmission belt II 4, the lifting cylinder I85 extends to push the insulating gasket b to move downwards to be in contact with the capacitor cover plate a, the adhesion is completed in cooperation with the adhesion of glue and the pressure applied by the lifting cylinder I85, the pressure during adsorption is effectively guaranteed in cooperation with a pressure sensor 89, the pressure control during the adhesion and pressing of the adhesive insulating gasket b and the capacitor cover plate a is realized, and the workpiece cannot be damaged;
the coordinated operation of II 92 of effectual control lift cylinder and gluey pump 97, II 92 starts in the lift cylinder, it is down to promote dispensing head 94, trapezoidal propulsion piece 910 is down along its hypotenuse, conflict and promote catch bar 911, thereby stir axis of rotation 912 and rotate, will place originally in and dial the glue dripping tray 916 of gluing head 94 under the position anticlockwise and stir and remove, gluey pump 97 starts, glue solution is scribbled to the upper end point of condenser apron a through dispensing head 94, be convenient for follow-up insulating gasket b's combination bonding.
Example 2
The difference between the embodiment and the embodiment 1 is that, as shown in fig. 2 and 3, a telescopic cylinder 11 is vertically installed on the top wall of the bonding processing chamber 2 close to the output end side of the conveyor belt ii 4, and the telescopic end of the telescopic oil cylinder 11 is provided with a press mounting block 12, a backing plate is arranged below the press mounting block 12, and the backing plate is abutted against the top wall of the inner cavity of the conveying belt II 4, the backing plate is horizontally arranged on the inner wall of the bonding processing chamber 2, considering that the middle part of the vacuum chuck 87 is of an annular hollow structure, the capacitor cover plate a and the insulating gasket b can be bonded insecurely, therefore, the press-mounting block 12 is arranged at the downstream of the vacuum chuck, after the capacitor cover plate a is bonded with the insulating gasket b, the telescopic oil cylinder 11 is started to push the press mounting block 12 to move downwards by matching with the intermittent transmission of the transmission belt II 4, and the capacitor cover plate a is pressed by combining with the backing plate, so that the full contact between the capacitor cover plate a and the insulating gasket b is ensured, and the bonding effect is improved.
Other undescribed structures refer to example 1.
The embodiments of the present invention are disclosed as the preferred embodiments, but not limited thereto, and those skilled in the art can easily understand the spirit of the present invention and make various extensions and changes without departing from the spirit of the present invention.
Claims (7)
1. An insulating pad bonding device for processing a capacitor cover plate comprises a machine body platform and a bonding processing chamber arranged at the upper end of the machine body platform, it is characterized in that a transmission belt I and a transmission belt II which are used for transmitting in the same direction are symmetrically arranged in the inner cavity of the bonding processing chamber from top to bottom, a plurality of transmission rollers are rotatably arranged in the transmission belts I and II, the rear shaft ends of one transmission roller positioned in the transmission belt I and one transmission roller positioned in the transmission belt II extend to the outer cavity of the bonding processing chamber and are provided with transmission chain wheels, the two transmission chain wheels are connected through a chain, one of the transmission chain wheels is arranged on the output end of the servo motor, the servo motor is fixedly arranged on the rear wall of the bonding processing chamber, a transfer bonding mechanism is arranged above the conveying belt I and the conveying belt II close to the output end, and a glue dispensing mechanism is arranged at the position of the conveying belt II at the upstream of the transfer bonding mechanism;
the transfer bonding mechanism comprises a sliding block which is slidably mounted on the top wall of the bonding processing chamber, a lead screw is inserted into the middle thread of the sliding block, the lead screw is rotatably mounted on the inner wall of the bonding processing chamber, one end of the lead screw extends to the outer cavity of the bonding processing chamber and is mounted on the output end of a forward and reverse motor, the forward and reverse motor is fixedly mounted on the side wall of the bonding processing chamber, the lower end of the sliding block is provided with a mounting seat, the edge of the lower end of the mounting seat is connected with a mounting plate through a plurality of lifting cylinders I, the middle part of the upper end of the mounting seat is provided with a vacuum pumping machine, and the output end of the vacuum pumping machine penetrates through the mounting seat and is provided with a vacuum chuck;
the glue dispensing mechanism comprises a mounting frame horizontally arranged above the conveying belt II, the mounting frame is fixedly mounted on the inner wall of the bonding processing chamber, a lifting plate is mounted at the lower end of the mounting frame through a plurality of lifting cylinders II, a glue dispensing head is arranged at the lower end of the lifting plate, the glue dispensing head is installed at the output end of the flexible hose in a penetrating mode, the other end of the flexible hose penetrates through the mounting frame and is connected with a glue inlet pipe, the other end of the glue inlet pipe penetrates through the rear wall of the bonding processing chamber and extends to the lower portion of the inner cavity of the glue box, the glue box is mounted on the rear wall of the bonding processing chamber, and a glue pump is mounted on the glue inlet pipe;
still including installing the L shape branch at the lower extreme rear side of lifter plate, and the other end integrated into one piece of L shape branch has trapezoidal propulsion piece, and the hypotenuse of trapezoidal propulsion piece is contradicted and is had the annular lateral wall of catch bar, catch bar horizontal installation is on the lateral wall of axis of rotation, and the axis of rotation rotates and install on the fixing base, the fixing base is installed on the inner wall of bonding process chamber, the cover is equipped with torque spring in the axis of rotation, and torque spring's both ends are connected with the lateral wall of axis of rotation and the upper end of fixing base respectively, be equipped with the glue dripping tray under the point gum head, and the glue dripping tray passes through the bracket to be installed on the lateral wall of axis of rotation.
2. The insulating mat bonding apparatus for processing a capacitor cap plate as claimed in claim 1, wherein: the glue pump is a metering pump and is used for metering and quantitatively conveying glue solution.
3. The insulating mat bonding apparatus for processing a capacitor cap plate as claimed in claim 1, wherein: the rear sides of the input ends of the transmission band I and the transmission band II are respectively provided with a vibration disc output end used for transmitting the insulating gasket and the capacitor cover plate, and the vibration disc is arranged on the rear side of the machine body platform.
4. The insulating mat bonding apparatus for processing a capacitor cap plate as claimed in claim 1, wherein: the bonding process chamber is close to on the roof of II output one sides of transmission band vertically installs flexible hydro-cylinder, and installs the pressure equipment piece on the flexible end of flexible hydro-cylinder, and the below of pressure equipment piece is equipped with the backing plate, and the backing plate is inconsistent with the inner chamber roof of transmission band II.
5. The insulating mat bonding apparatus for processing a capacitor cap plate as claimed in claim 1, wherein: the output end of the transmission belt II extends to an outer cavity of the bonding processing chamber, side plates are arranged on the front side and the rear side of the output end of the transmission belt II, and the two side plates are fixedly arranged at the upper end of the machine body platform.
6. The insulating mat bonding apparatus for processing a capacitor cap plate as claimed in claim 1, wherein: and a pressure sensor is arranged on the end head of the telescopic end of the lifting cylinder I.
7. The insulating mat bonding apparatus for processing a capacitor cap plate as claimed in claim 1, wherein: install control panel on the antetheca of bonding process chamber, and be equipped with display screen and control button on the control panel, control panel embeds there is the PLC controller.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010569323.8A CN111640592B (en) | 2020-06-20 | 2020-06-20 | Insulating pad bonding device for capacitor cover plate processing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010569323.8A CN111640592B (en) | 2020-06-20 | 2020-06-20 | Insulating pad bonding device for capacitor cover plate processing |
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| CN111640592B true CN111640592B (en) | 2021-10-26 |
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| CN115440512B (en) * | 2021-10-28 | 2023-09-22 | 陕西航天机电环境工程设计院有限责任公司 | Full-automatic liner bonding machine |
| CN116768330B (en) * | 2023-07-13 | 2024-01-30 | 四川红杉岭环保科技有限公司 | Microchannel processor for sewage treatment, microchannel module and manufacturing method thereof |
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| FR3044370B1 (en) * | 2015-11-26 | 2018-01-05 | Cold Pad | GLUE ASSEMBLY AND METHOD OF COLLAGE |
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| CN104806610A (en) * | 2015-03-03 | 2015-07-29 | 深圳市固诺泰科技有限公司 | Automatic bonding device for assembling decoration strip on mobile phone |
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