CN111638579A - Optical fiber base - Google Patents

Optical fiber base Download PDF

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Publication number
CN111638579A
CN111638579A CN202010614407.9A CN202010614407A CN111638579A CN 111638579 A CN111638579 A CN 111638579A CN 202010614407 A CN202010614407 A CN 202010614407A CN 111638579 A CN111638579 A CN 111638579A
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CN
China
Prior art keywords
base
optical fiber
fixing
chip
fiber holder
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CN202010614407.9A
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Chinese (zh)
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刘向宁
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Individual
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Individual
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Publication of CN111638579A publication Critical patent/CN111638579A/en
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236Fixing or mounting methods of the aligned elements
    • G02B6/424Mounting of the optical light guide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236Fixing or mounting methods of the aligned elements
    • G02B6/4245Mounting of the opto-electronic elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention discloses an optical fiber seat which comprises a photoelectric chip, a base, a fixed support and a fixed component, wherein the photoelectric chip is arranged on the base; the photoelectric chip is arranged in an inner concave hole on the lower surface of the base; the fixing support fixedly connects the base with the photoelectric chip; the fixing component fixedly connects the external optical fiber to the base, so that the optical fiber can form optical signal connection with the photoelectric chip through the base. The optical fiber seat can lead the base to be capable of packaging the in-line photoelectric chip and also packaging the patch photoelectric chip by a fixing mode of the base and a fixing component or a plug-in pin card; meanwhile, by means of fixing of the fixing column and the fixing component on the base, when the optical fiber base is fixedly connected with an external optical fiber, any one of a nut, a rubber cap and a columnar buckle can be selected for fixed connection, the universal-matching shared installation design of the optical fiber base and the optical fiber is achieved, and manufacturing cost is greatly saved.

Description

Optical fiber base
Technical Field
The invention relates to the field of photoelectric equipment preparation, in particular to an optical fiber seat.
Background
In the field of photoelectric signal transmission, a photoelectric chip on photoelectric equipment is generally fixed on a PCB (printed circuit board) after being packaged by an optical fiber base, so that external optical fibers and the photoelectric chip can form optical signal connection conveniently. However, the existing optical fiber holder still has some disadvantages, for example, 1, the optical fiber holder cannot be commonly used, and only one of a patch type photoelectric chip and an in-line type photoelectric chip can be selected for packaging; 2. when external optical fibers are fixedly connected with the optical fiber seat, the optical fiber seat cannot be used for assembling different fixing components by packaging different photoelectric chips.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide an optical fiber holder that can be used to commonly use different optoelectronic chips and fixing members.
The technical scheme of the invention is as follows:
an optical fiber seat comprises a photoelectric chip, a base, a fixing bracket and a fixing component; the photoelectric chip is arranged in an inner concave hole on the lower surface of the base; the fixing support fixedly connects the base and the photoelectric chip; the fixing component fixedly connects an external optical fiber to the base, so that the optical fiber can form optical signal connection with the photoelectric chip through the base.
In one embodiment, in the optical fiber holder, the fixing bracket is perpendicular to the surface of the base and fixedly connects the base and the optoelectronic chip.
In one embodiment, in the optical fiber holder, the optoelectronic chip is an in-line optoelectronic chip; correspondingly, the optical fiber base also comprises a plug-in pin card, the plug-in pin card penetrates through two opposite side surfaces of the base and is arranged in parallel with the surface of the base, and the penetrating end of the plug-in pin card and the side wall of the base are exposed.
In one embodiment, in the optical fiber holder, the optical fiber holder further comprises a rear cover, the rear cover is matched with the lower surface of the base to be arranged in the clamping box, and the in-line photoelectric chip is sealed.
In one embodiment, the plug pin card is configured in a U-shape in the fiber holder.
In one embodiment, in the optical fiber holder, the optoelectronic chip is a patch-type optoelectronic chip; correspondingly, the inserting end of the fixed support and the bottom surface of the base are exposed.
In one embodiment, in the optical fiber holder, the base comprises a substrate and a fixing column arranged on the surface of the substrate; the inner concave hole is formed in the lower surface of the substrate, and the photoelectric chip is arranged in the inner concave hole; the fixing component is arranged on the fixing column, a hollow hole is formed in the fixing column, and the optical fiber is in photoelectric connection with the photoelectric chip through the hollow hole.
In one embodiment, in the optical fiber holder, the fixing member is a nut, a rubber cap or a cylindrical buckle, and the nut, the rubber cap or the cylindrical buckle are respectively provided with a central through hole.
In one embodiment, in the optical fiber holder, when the fixing member is a buckle, the optical fiber holder further includes a copper pillar tube disposed in the hollow hole of the fixing column, and the optical fiber is in photoelectric connection with the optoelectronic chip through a lumen of the copper pillar tube.
In one embodiment, in the optical fiber holder, at least two fixing brackets are provided, and the fixing brackets are configured in a U shape.
According to the optical fiber holder provided by the invention, the base can be used for packaging an in-line photoelectric chip and a surface-mounted photoelectric chip in a fixing mode of the base and a fixing component or a plug-in pin card, so that an alternative universal-matching shared packaging mode is realized; meanwhile, by the fixing mode of the fixing column on the base and the fixing component, when the optical fiber seat is fixedly connected with the external optical fiber, any one of a nut, a rubber cap and a columnar buckle can be selected for fixed connection, and the universal-matching shared fixed connection mode of the optical fiber seat and the optical fiber is realized; in a word, the optical fiber seat provided by the invention can realize multi-combination universal sharing on the packaging mode of the photoelectric chip and the fixed connection mode of the photoelectric chip and the optical fiber, and greatly saves the design cost, the manufacturing cost, the transportation and packaging cost and the like.
Drawings
FIGS. 1A, 1B, 1C, 1D, 1E, and 1F are schematic structural diagrams of an optical fiber holder according to six embodiments of the present invention;
FIGS. 2A, 2B, 2C, 2D, 2E, and 2F are exploded views of the corresponding fiber holders of FIGS. 1A, 1B, 1C, 1D, 1E, and 1F, respectively;
FIG. 3 is a rear cover of the fiber holder;
FIG. 4 is a schematic diagram of a plug-in chip structure of an optical fiber holder;
FIG. 5 is a schematic diagram of a chip structure with a surface-mounted optical fiber holder;
FIGS. 6A and 6B are schematic views of a base structure of the optical fiber holder;
FIGS. 7A, 7B, and 7C are schematic views of the fastening structure of the optical fiber holder;
FIG. 8 is a schematic structural view of the fixing member being a rubber cap;
FIG. 9 is a schematic diagram of a copper pillar structure in an optical fiber holder;
FIG. 10 is a schematic view of a fiber holder according to the present invention.
Detailed Description
The present invention is described in further detail below.
As shown in fig. 10, the optical fiber holder provided by the present invention includes an optoelectronic chip 200, a base 400, a fixing bracket 420 and a fixing member 500; the optoelectronic chip 200 is a packaged light emitting and/or light receiving IC chip, and a plurality of conductive pins are arranged outside the package housing in rows. Generally, the package housing of the optoelectronic chip 200 is square, and a plurality of conductive pins extend from the sidewall of the package housing to be exposed. The number of the conductive plug pins can be two, three, four, five, six and the like according to the corresponding arrangement of the requirement. In the present invention, the optoelectronic chip 200 may be an in-line optoelectronic chip or a patch optoelectronic chip.
In the optical fiber holder, the optoelectronic chip 200 is disposed in an inner concave hole of the lower surface of the base 400. The shape structure of the concave hole is matched with the shape structure of the photoelectric chip; if the outline configuration of the optoelectronic chip is square, the outline configuration of the concave hole is also square. The depth of the inner concave hole is equal to or slightly greater than the thickness of the photoelectric chip; the photoelectric chip is designed to be accommodated in the concave hole of the base in a fitting mode.
In the optical fiber holder, the fixing bracket 420 is mainly used to fixedly connect the base 400 and the optoelectronic chip 200, and the inserting end of the fixing bracket is exposed to fixedly weld the base 400 and the optoelectronic chip 200 on the PCB. In the present invention, the fixing brackets 420 are made of metal wires and have a U-shaped structure, and the number of the fixing brackets is at least two, such as two, three, four, five, six, etc., and two fixing brackets are preferred in the present invention.
In the optical fiber holder, the fixing member 500 functions to lock the external optical fiber 600, for example, when the external optical fiber 600 is connected with the optoelectronic chip 200 through the base 400 to form an optical signal connection, the fixing member 500 fixedly connects the optical fiber 600 to the base 400.
The fixing member 500 may be a nut having a cylindrical shape, a rubber cap having a cylindrical shape, or a fastener having a cylindrical shape, and the nut, the rubber cap, or the fastener may have through holes for inserting optical fibers. Generally, the fixing member is disposed on an upper surface of the base; of course, it can be disposed at any position of the base according to the requirement, however, no matter where the fixing member is disposed at the position of the base, when it fixedly connects the optical fiber with the base, the end plane of the optical fiber must be disposed perpendicular to the optical fiber chip, so as to ensure that the optical signal is received or emitted as much as possible, reduce the optical loss, and increase the transmission distance of the optical signal as much as possible.
The preferred embodiments of the present invention will be described in further detail with reference to the accompanying drawings.
Example one
In this embodiment, the optoelectronic chip is an in-line optoelectronic chip, and the fixing member is a nut having a columnar structure.
As shown in fig. 1A, 2A, 3, 4, 6A and 6B, the optical fiber holder includes a photo chip 200, a base 400, a fixing bracket 420 and a fixing member 50.
In this embodiment, as shown in fig. 4, the optoelectronic chip 200 is a square in-line optoelectronic chip, and is provided with four conductive pins (210, 220, 230, 240); the four conductive pins (210, 220, 230, 240) are respectively and symmetrically distributed outside two symmetrical side surfaces of the package casing 201 and need to be extended and exposed outside the package casing 201; wherein, a pair of parallel conductive pins (230, 240) on one side of the package casing 201 is longer than a pair of parallel conductive pins (210, 220) on the other side, that is, the pair of parallel conductive pins (230, 240) becomes a long conductive pin, the pair of parallel conductive pins (210, 220) becomes a short conductive pin, and the part of the long conductive pin exposed outside the package casing 201 is longer, so that when the pair of parallel conductive pins (230, 240) are bent and are parallel to the other pair of parallel conductive pins (210, 220), the end faces of the exposed end parts of the four conductive pins (210, 220, 230, 240) can be on the same plane, that is, are flush; with this arrangement, the optoelectronic chip 200 can be soldered on a PCB in-line, that is, the optoelectronic chip 200 is an in-line optoelectronic chip.
In the optical fiber holder of this embodiment, as shown in fig. 6A and 6B, an inner recess 404 is formed in the lower surface of the base 400 and the in-line optoelectronic chip 200 is received in the inner recess 404. The external shape of the inner concave hole 404 matches the external shape of the in-line photoelectric chip 200, and if the external shape of the in-line photoelectric chip is square, the external shape of the inner concave hole 404 is also square; the depth of the inner concave hole 403 is equal to the thickness of the in-line photoelectric chip 200; wherein, the thickness of the in-line photoelectric chip 200 is the distance between the upper surface of the package casing 201 and the bottom surface of the long conductive pins (230, 240) after bending; by doing so, the in-line optoelectronic chip 200 can be adapted to be received in the inner recess 404 of the base 400.
Preferably, the depth of the inner recess 403 is 1.1 to 1.2 times the thickness of the in-line photoelectric chip 200, so that a buffer pad 410 may be disposed between the inner recess 403 and the in-line photoelectric chip 200, and the sum of the buffer pad 410 and the in-line photoelectric chip 200 is equal to the depth of the inner recess 403. The cushion 410 can play a role in reducing or eliminating internal stress caused by external vibration to the in-line photoelectric chip 200 and protecting the in-line photoelectric chip 200 when the in-line photoelectric chip 200 receives vibration after being accommodated in the concave-shaped hole 403 and fixed.
In this embodiment, as shown in fig. 6A and 6B, preferably, the base 400 includes a substrate 401 and a fixing column 402 disposed on a surface of the substrate 401. The outer shape of the substrate 401 is configured into a square structure, in other embodiments, the outer shape can also be a circle, an ellipse, a regular polygon, etc., and the fixing column 402 is a cylindrical structure and is vertically and fixedly integrated on the upper surface of the substrate 401; the base 401 and the fixing column 402 are provided with through hollow holes 405 for inserting the optical fibers 600, and the inner diameter of each hollow hole 405 is equal to or slightly larger than the outer diameter of each optical fiber, so that the optical fibers can be conveniently inserted and connected in a penetrating manner. After the light receiving or light emitting end face of the optical fiber 600 is ensured to be perpendicular to the in-line photoelectric chip 200, the design modes of the substrate 401 and the fixing column 402 are as follows: the fixing posts 402 may be provided on the upper surface of the substrate 401 and may be disposed in an inclined manner, or the fixing posts 402 may be provided on the side wall surface of the substrate 401. At this time, the inner recess 404 of the base 400 is disposed on the lower surface of the substrate 401 and the in-line optoelectronic chip 200 is disposed in the inner recess 404.
In this embodiment, as shown in fig. 1A, 2A, 6A and 6B, the fixing member 500 is a nut, and is fixedly connected to the fixing post 402 by external threads, that is, after the optical fiber 600 is inserted into the through hole 405 of the fixing post 402, the nut 500 is sleeved on the fixing post 402 and screwed down, so that the optical fiber 600 passes through the base 400 on the fixing post 402. Preferably, the fixed column 402 is provided with a notch 4021 along the longitudinal axis, so that the fixed column 402 is divided into two parts along the longitudinal direction; thus, the nut 500 is sleeved outside the fixed column 402 and screwed downwards, two parts separated by the notch 4021 on the fixed column 402 continuously contract inwards through continuously extruded internal stress, the gap distance of the notch 4021 is reduced, and the inner diameter of the fixed column 402 is reduced, so that the fixed column 402 further fixes and locks the optical fiber 600.
In the fiber holder of the present embodiment, as shown in fig. 2A and 6A, the fixing bracket 420 is made of a wire into a U-shaped configuration; the number of the fixing brackets 420 is two (421, 422). The fixing bracket 420 is mainly used for fixing the base 400 and the in-line photoelectric chip 200 together; meanwhile, the insertion end of the fixing bracket 420 is exposed to fix and weld the base 400 and the in-line photocell 200 on the circuit board. During mounting, two U-shaped fixing brackets (421,422) pass through two columns of longitudinal insertion holes (4011,4012) symmetrically arranged on the base 401 of the base 400 to fix the base 400 and the in-line chip 200.
Further, as shown in fig. 1A, 2A and 3, the optical fiber holder further includes a rear cover 100, the rear cover 100 is a box structure having a concave box cavity 110, the rear cover 100 is disposed in a cassette manner with the lower surface of the base 402 of the base 400, and seals the in-line photoelectric chips 200; at this time, the four conductive pins (210, 220, 230, 240) of the in-line photoelectric chip 200 are respectively embedded into four card slots (101, 102, 103, 104) disposed on a pair of symmetric sidewalls of the rear cover 100 to seal the four conductive pins (210, 220, 230, 240), and the insertion ends of the four conductive pins (210, 220, 230, 240) are respectively and independently exposed from one sidewall having the card slot for circuit soldering with the PCB.
In addition, in order to fix the optical fiber holder on the PCB more firmly, in this embodiment, as shown in fig. 2A, the optical fiber holder further includes a plug-in pin card 430, and the plug-in pin card 430 has a U-shaped configuration and is made of metal wires. The card 430 passes through lateral sockets 4013 provided on base 401 of base 400, and lateral sockets 4013 are provided laterally on opposite sides of base 402. The plane of the U-shaped plug-in pin card 430 is parallel to the surface of the substrate 402 of the base 400, and the penetrating end of the plug-in pin card 430 is exposed after penetrating through the substrate 401; when the optical fiber holder needs to be fixed on the PCB in an in-line manner when exposed, the exposed insertion end of the plug-in pin 430 is welded on the PCB for fixing the optical fiber holder.
Example two
In this embodiment, the photoelectric chip is an in-line photoelectric chip, and the fixing member is a rubber cap having a columnar structure.
As shown in fig. 1C, 2C, 3, 4, 6A and 6B, the optical fiber holder includes a photo chip 200, a base 400, a fixing bracket 420 and a fixing member 500.
In this embodiment, as shown in fig. 4, the optoelectronic chip 200 is a square patch-type optoelectronic chip, and is provided with four conductive pins (210, 220, 230, 240); the four conductive pins (210, 220, 230, 240) are respectively and symmetrically distributed outside two symmetrical side surfaces of the package casing 201 and need to be extended and exposed outside the package casing 201; wherein, a pair of parallel conductive pins (230, 240) on one side of the package casing 201 is longer than a pair of parallel conductive pins (210, 220) on the other side, that is, the pair of parallel conductive pins (230, 240) becomes a long conductive pin, the pair of parallel conductive pins (210, 220) becomes a short conductive pin, and the part of the long conductive pin exposed outside the package casing 201 is longer, so that when the pair of parallel conductive pins (230, 240) are bent and are parallel to the other pair of parallel conductive pins (210, 220), the end faces of the exposed end parts of the four conductive pins (210, 220, 230, 240) can be on the same plane, that is, are flush; with this arrangement, the optoelectronic chip 200 can be soldered on a PCB in-line, that is, the optoelectronic chip 200 is an in-line optoelectronic chip.
In the optical fiber holder of this embodiment, as shown in fig. 6A and 6B, an inner recess 404 is formed in the lower surface of the base 400 and the in-line optoelectronic chip 200 is received in the inner recess 404. The external shape of the inner concave hole 404 matches the external shape of the in-line photoelectric chip 200, and if the external shape of the in-line photoelectric chip is square, the external shape of the inner concave hole 404 is also square; the depth of the inner concave hole 403 is equal to the thickness of the in-line photoelectric chip 200; wherein, the thickness of the in-line photoelectric chip 200 is the distance between the upper surface of the package casing 201 and the bottom surface of the long conductive pins (230, 240) after bending; by doing so, the in-line optoelectronic chip 200 can be adapted to be received in the inner recess 404 of the base 400.
Preferably, the depth of the inner recess 403 is 1.1 to 1.2 times the thickness of the in-line photoelectric chip 200, so that a buffer pad 410 may be disposed between the inner recess 403 and the in-line photoelectric chip 200, and the sum of the buffer pad 410 and the in-line photoelectric chip 200 is equal to the depth of the inner recess 403. The cushion 410 can play a role in reducing or eliminating internal stress caused by external vibration to the in-line photoelectric chip 200 and protecting the in-line photoelectric chip 200 when the in-line photoelectric chip 200 receives vibration after being accommodated in the concave-shaped hole 403 and fixed.
In this embodiment, as shown in fig. 6A and 6B, preferably, the base 400 includes a substrate 401 and a fixing column 402 disposed on a surface of the substrate 401. The outer shape of the substrate 401 is configured into a square structure, in other embodiments, the outer shape can also be a circle, an ellipse, a regular polygon, etc., and the fixing column 402 is a cylindrical structure and is vertically and fixedly integrated on the upper surface of the substrate 401; the base 401 and the fixing column 402 are provided with through hollow holes 405 for inserting the optical fibers 600, and the inner diameter of each hollow hole 405 is equal to or slightly larger than the outer diameter of each optical fiber, so that the optical fibers can be conveniently inserted and connected in a penetrating manner. After the light receiving or light emitting end face of the optical fiber 600 is ensured to be perpendicular to the in-line photoelectric chip 200, the design modes of the substrate 401 and the fixing column 402 are as follows: the fixing posts 402 may be provided on the upper surface of the substrate 401 and may be disposed in an inclined manner, or the fixing posts 402 may be provided on the side wall surface of the substrate 401. At this time, the inner recess 404 of the base 400 is disposed on the lower surface of the substrate 401 and the in-line optoelectronic chip 200 is disposed in the inner recess 404.
In this embodiment, as shown in fig. 1C, 2C and 8, the fixing member 500 is a rubber cap, the rubber cap includes a cap head 505 and a circular cap pillar 504, the two are integrally formed, and the outer diameter of the cap pillar 504 is equal to or slightly larger than the outer diameter of the hollow hole 405 of the fixing pillar 402 of the base 400, so that the cap pillar 504 is fixedly inserted into the hollow hole 405 of the fixing pillar 402. The lower bottom of the cap 505 is concave inwards to form an annular concave cavity (not shown in the figure), the central axis of the cap pillar 504 is located at the central point of the concave cavity, and the distance from the outer wall of the cap pillar 504 to the inner concave cavity wall of the cap 505 is equal to or slightly less than the wall thickness of the fixing column 402, so that the fixing column 402 is fittingly inserted into the concave cavity and a tightening type fixing plug-in connection is formed between the cap 505 and the cap pillar 504 when the fixing column is installed. The middle through hole 511 passes through the cap head 505 and the cap post 504 of the rubber cap 500, respectively. During installation, the optical fiber 600 penetrates through the middle through hole 511, the cap column 504 is fixedly inserted in the hollow hole 405 of the fixing column 402, the fixing column 402 is fittingly inserted into the inner concave cavity, and a tightening type fixing inserting and sleeving connection is formed between the cap head 505 and the cap column 504, so that the optical fiber 600 is locked.
In the fiber holder of the present embodiment, as shown in fig. 2C and 6A, the fixing bracket 420 is made of a wire into a U-shaped configuration; the number of the fixing brackets 420 is two (421, 422). The fixing bracket 420 is mainly used for fixing the base 400 and the in-line photoelectric chip 200 together; meanwhile, the insertion end of the fixing bracket 420 is exposed to fix and weld the base 400 and the in-line photocell 200 on the circuit board. During mounting, two U-shaped fixing brackets (421,422) pass through longitudinal insertion holes (4011,4012) symmetrically arranged on the base 401 of the base 400 to fix the base 400 and the in-line chip 200.
Further, as shown in fig. 1C, 2C and 3, the optical fiber holder further includes a rear cover 100, the rear cover 100 is a box structure and has a concave box cavity 110, the rear cover 100 is disposed in a cassette manner with the lower surface of the base 402 of the base 400, and seals the in-line photoelectric chips 200; at this time, the four conductive pins (210, 220, 230, 240) of the in-line photoelectric chip 200 are respectively embedded into four card slots (101, 102, 103, 104) disposed on a pair of symmetric sidewalls of the rear cover 100 to seal the four conductive pins (210, 220, 230, 240), and the insertion ends of the four conductive pins (210, 220, 230, 240) are respectively and independently exposed from one sidewall having the card slot for circuit soldering with the PCB.
In addition, in order to fix the optical fiber holder on the PCB more firmly, in this embodiment, as shown in fig. 2A, the optical fiber holder further includes a plug-in pin card 430, and the plug-in pin card 430 has a U-shaped configuration and is made of metal wires. The card 430 passes through lateral sockets 4013 provided on base 401 of base 400, and lateral sockets 4013 are provided laterally on opposite sides of base 402. The plane of the U-shaped plug-in pin card 430 is parallel to the surface of the substrate 402 of the base 400, and the penetrating end of the plug-in pin card 430 is exposed after penetrating through the substrate 401; when the optical fiber holder needs to be fixed on the PCB in an in-line manner when exposed, the exposed insertion end of the plug-in pin 430 is welded on the PCB for fixing the optical fiber holder.
EXAMPLE III
In this embodiment, the optoelectronic chip is an in-line optoelectronic chip, and the fixing member is a clip having a columnar structure.
As shown in fig. 1E, 2E, 3, 4, 6A and 6B, the optical fiber holder includes a photo chip 200, a base 400, a fixing bracket 420 and a fixing member 500.
In this embodiment, as shown in fig. 4, the optoelectronic chip 200 is a square patch-type optoelectronic chip, and is provided with four conductive pins (210, 220, 230, 240); the four conductive pins (210, 220, 230, 240) are respectively and symmetrically distributed outside two symmetrical side surfaces of the package casing 201 and need to be extended and exposed outside the package casing 201; wherein, a pair of parallel conductive pins (230, 240) on one side of the package casing 201 is longer than a pair of parallel conductive pins (210, 220) on the other side, that is, the pair of parallel conductive pins (230, 240) becomes a long conductive pin, the pair of parallel conductive pins (210, 220) becomes a short conductive pin, and the part of the long conductive pin exposed outside the package casing 201 is longer, so that when the pair of parallel conductive pins (230, 240) are bent and are parallel to the other pair of parallel conductive pins (210, 220), the end faces of the exposed end parts of the four conductive pins (210, 220, 230, 240) can be on the same plane, that is, are flush; with this arrangement, the optoelectronic chip 200 can be soldered on a PCB in-line, that is, the optoelectronic chip 200 is an in-line optoelectronic chip.
In the optical fiber holder of this embodiment, as shown in fig. 6A and 6B, an inner recess 404 is formed in the lower surface of the base 400 and the in-line optoelectronic chip 200 is received in the inner recess 404. The external shape of the inner concave hole 404 matches the external shape of the in-line photoelectric chip 200, and if the external shape of the in-line photoelectric chip is square, the external shape of the inner concave hole 404 is also square; the depth of the inner concave hole 403 is equal to the thickness of the in-line photoelectric chip 200; wherein, the thickness of the in-line photoelectric chip 200 is the distance between the upper surface of the package casing 201 and the bottom surface of the long conductive pins (230, 240) after bending; by doing so, the in-line optoelectronic chip 200 can be adapted to be received in the inner recess 404 of the base 400.
Preferably, the depth of the inner recess 403 is 1.1 to 1.2 times the thickness of the in-line photoelectric chip 200, so that a buffer pad 410 may be disposed between the inner recess 403 and the in-line photoelectric chip 200, and the sum of the buffer pad 410 and the in-line photoelectric chip 200 is equal to the depth of the inner recess 403. The cushion 410 can play a role in reducing or eliminating internal stress caused by external vibration to the in-line photoelectric chip 200 and protecting the in-line photoelectric chip 200 when the in-line photoelectric chip 200 receives vibration after being accommodated in the concave-shaped hole 403 and fixed.
In this embodiment, as shown in fig. 6A and 6B, preferably, the base 400 includes a substrate 401 and a fixing column 402 disposed on a surface of the substrate 401. The outer shape of the substrate 401 is configured into a square structure, in other embodiments, the outer shape can also be a circle, an ellipse, a regular polygon, etc., and the fixing column 402 is a cylindrical structure and is vertically and fixedly integrated on the upper surface of the substrate 401; the base 401 and the fixing column 402 are provided with through hollow holes 405 for inserting the optical fibers 600, and the inner diameter of each hollow hole 405 is equal to or slightly larger than the outer diameter of each optical fiber, so that the optical fibers can be conveniently inserted and connected in a penetrating manner. After the light receiving or light emitting end face of the optical fiber 600 is ensured to be perpendicular to the in-line photoelectric chip 200, the design modes of the substrate 401 and the fixing column 402 are as follows: the fixing posts 402 may be provided on the upper surface of the substrate 401 and may be disposed in an inclined manner, or the fixing posts 402 may be provided on the side wall surface of the substrate 401. At this time, the inner recess 404 of the base 400 is disposed on the lower surface of the substrate 401 and the in-line optoelectronic chip 200 is disposed in the inner recess 404.
In this embodiment, as shown in fig. 1E, 2E, 7A, 7B and 7C, the fixing member 500 is a clip including a cylinder 510 and a clip 520. A catch 520 is provided on the outer wall of the cylinder 510. The cylinder 510 is provided with a middle through hole 511 for inserting the optical fiber 600, and the diameter of the middle through hole 511 is slightly smaller than the outer diameter of the optical fiber 600, so that the optical fiber 600 can be locked by the internal stress formed between the optical fiber 600 and the cylinder 510. The clip 520 is divided into a pressing portion 521 and a locking portion 522, a connecting portion 501 is arranged between the pressing portion 521 and the locking portion 522, the cylinder 510 is connected with the clip 520 through the connecting portion 501, a lock catch 5221 which is bent inward and faces the cylinder 510 is arranged at the tail end of the locking portion 522, and the distance from the tail end of the lock catch 5221 to the corresponding outer wall of the cylinder 510 is greater than the distance from the lock catch portion 522 to the corresponding outer wall of the cylinder 510. The lock 5221 at the end of the locking portion 522 is located under the cylinder 510, and the distance from the lock 5221 to the lower end surface of the cylinder 510 is equal to the thickness of the base 401 of the base 400; thus, when the optical fiber 600 is installed, after passing through the through hole 511 of the cylinder 510, the lower end surface of the cylinder 510 is tightly attached to the upper surface of the base 401 of the base 400, and since the tail end of the locking portion 522 is provided with the lock catch 5221 bent inward toward the cylinder 510 and the distance from the tail end of the lock catch 5221 to the corresponding outer wall of the cylinder 510 is greater than the distance from the lock catch 522 to the corresponding outer wall of the cylinder 510, the clip 520 can be locked on the lower surface and the upper surface of the base 401 by the lock catch 5221.
Further, as shown in fig. 2E, 7C and 9, the fiber holder further includes a copper pillar 300, wherein the copper pillar 300 includes a cap 310 and a pillar 320; the cap 310 and the stem 320 are integrally formed, or formed by a welder design. The outer diameter of the pipe string 320 corresponds to the inner diameter of the hollow hole 405 of the fixing post 402 of the base 400. The tube cap 310 and the tube column 320 are internally provided with tube cavities 311 for being matched with the inserted optical fibers 600; the outer wall of the buckle 500 is provided with a clamping hole 530, and the inner wall of the cylinder 510 and the position of the clamping hole 530 is provided with a locking hook 531 pointing to the center of the through hole 511. During installation, the pipe column 320 of the copper pipe column 300 is inserted into the hollow hole 405 of the fixing column 402 of the pedestal 400 in a matching manner to form interference contact fit, and the optical fiber 600 penetrates through the inner hole 310 of the copper pipe column 300 to form optical information signal receiving and/or transmitting with the in-line photoelectric chip 200; next, the lower end surface of the cylinder 510 of the buckle 500 is tightly attached to the upper surface of the base 401 of the base 400, and since the tail end of the locking portion 522 is provided with a lock catch 5221 which is bent inward and faces the cylinder 510, and the distance from the tail end of the lock catch 5221 to the corresponding outer wall of the cylinder 510 is greater than the distance from the lock catch portion 522 to the corresponding outer wall of the cylinder 510, the clip 520 can be clamped on the lower upper surface of the base 401 through the lock catch 5221; at this time, the tube cap 310 of the copper cylinder 300 just falls into the tube cavity 311 of the buckle 500, and the locking hook 531 of the buckle 500 is adapted to be clamped into the annular groove 312 disposed on the outer wall of the tube cap 310 of the copper cylinder 300, further locking the connection between the optical fiber 600 and the base 400, preventing the optical fiber from being loosened.
In the fiber holder of the present embodiment, as shown in fig. 2E and 6A, the fixing bracket 420 is made of a wire into a U-shaped configuration; the number of the fixing brackets 420 is two (421, 422). The fixing bracket 420 is mainly used for fixing the base 400 and the in-line photoelectric chip 200 together; meanwhile, the insertion end of the fixing bracket 420 is exposed to fix and weld the base 400 and the in-line photocell 200 on the circuit board. During mounting, two U-shaped fixing brackets (421,422) pass through longitudinal insertion holes (4011,4012) symmetrically arranged on the base 401 of the base 400 to fix the base 400 and the in-line chip 200.
Further, as shown in fig. 1A, 2A and 3, the optical fiber holder further includes a rear cover 100, the rear cover 100 is a box structure having a concave box cavity 110, the rear cover 100 is disposed in a cassette manner with the lower surface of the base 402 of the base 400, and seals the in-line photoelectric chips 200; at this time, the four conductive pins (210, 220, 230, 240) of the in-line photoelectric chip 200 are respectively embedded into four card slots (101, 102, 103, 104) disposed on a pair of symmetric sidewalls of the rear cover 100 to seal the four conductive pins (210, 220, 230, 240), and the insertion ends of the four conductive pins (210, 220, 230, 240) are respectively and independently exposed from one sidewall having the card slot for circuit soldering with the PCB.
In addition, in order to fix the optical fiber holder on the PCB more firmly, in this embodiment, as shown in fig. 2A, the optical fiber holder further includes a plug-in pin card 430, and the plug-in pin card 430 has a U-shaped configuration and is made of metal wires. The card 430 passes through lateral sockets 4013 provided on base 401 of base 400, and lateral sockets 4013 are provided laterally on opposite sides of base 402. The plane of the U-shaped plug-in pin card 430 is parallel to the surface of the substrate 402 of the base 400, and the penetrating end of the plug-in pin card 430 is exposed after penetrating through the substrate 401; when the optical fiber holder needs to be fixed on the PCB in an in-line manner when exposed, the exposed insertion end of the plug-in pin 430 is welded on the PCB for fixing the optical fiber holder.
Example four
In this embodiment, the optoelectronic chip is a patch-type optoelectronic chip, and the fixing member is a nut having a columnar structure.
As shown in fig. 1B, 2B, 5, 6A and 6B, the optical fiber holder includes a photo chip 200, a base 400, a fixing bracket 420 and a fixing member 500.
In this embodiment, as shown in fig. 5, the optoelectronic chip 200 is a square patch-type optoelectronic chip, and is provided with four conductive pins (210, 220, 230, 240); the four conductive pins (210, 220, 230, 240) are respectively and symmetrically distributed outside two symmetrical side surfaces of the package casing 201 and need to be extended and exposed outside the package casing 201; the lengths of the extended parts of the four conductive pins (210, 220, 230, 240) are basically consistent and are bent downwards, and the four bent-downwards conductive pins (210, 220, 230, 240) are positioned on the same horizontal plane; with this arrangement, the optoelectronic chip 200 can be soldered on the PCB in-line, that is, the optoelectronic chip 200 is a chip-on-chip optoelectronic chip.
In the optical fiber holder of this embodiment, as shown in fig. 6A and 6B, an inner concave hole 404 is formed in the lower surface of the base 400, and the patch type optoelectronic chip 200 is received in the inner concave hole 404. The shape structures of the concave holes 404 are matched with the shape structures of the patch type photoelectric chips 200, and if the shape structures of the patch type photoelectric chips are square, the shape structures of the concave holes 404 are also square; the depth of the concave hole 403 is equal to the thickness of the patch type photoelectric chip 200; wherein, the thickness of the patch type photoelectric chip 200 is the distance between the upper surface of the packaging shell 201 and the bottom surface of the long conductive pins (230, 240) after bending; by such design, the patch-type optoelectronic chip 200 can be adapted to be received in the inner concave hole 404 of the base 400.
Preferably, the depth of the inner concave hole 403 is 1.1 to 1.2 times the thickness of the patch-type optoelectronic chip 200, so that a cushion 410 can be arranged between the inner concave hole 403 and the patch-type optoelectronic chip 200, and the sum of the cushion 410 and the patch-type optoelectronic chip 200 is equal to the depth of the inner concave hole 403. This blotter 410 can receive after putting the word indent hole 403 and fixed the back at play SMD photoelectric chip 200, when receiving the vibration, plays the internal stress effect that reduces or eliminate to SMD photoelectric chip 200 and cause because of external vibration, plays the guard action to SMD photoelectric chip 200.
In this embodiment, as shown in fig. 6A and 6B, preferably, the base 400 includes a substrate 401 and a fixing column 402 disposed on a surface of the substrate 401. The outer shape of the substrate 401 is configured into a square structure, in other embodiments, the outer shape can also be a circle, an ellipse, a regular polygon, etc., and the fixing column 402 is a cylindrical structure and is vertically and fixedly integrated on the upper surface of the substrate 401; the base 401 and the fixing column 402 are provided with through hollow holes 405 for inserting the optical fibers 600, and the inner diameter of each hollow hole 405 is equal to or slightly larger than the outer diameter of each optical fiber, so that the optical fibers can be conveniently inserted and connected in a penetrating manner. After the light receiving or light emitting end face of the optical fiber 600 is ensured to be perpendicular to the surface mount type photoelectric chip 200, the design modes of the substrate 401 and the fixing column 402 are as follows: the fixing posts 402 may be provided on the upper surface of the substrate 401 and may be disposed in an inclined manner, or the fixing posts 402 may be provided on the side wall surface of the substrate 401. At this time, the inner recess 404 of the base 400 is disposed on the lower surface of the substrate 401, and the patch-type optoelectronic chip 200 is disposed in the inner recess 404.
In this embodiment, as shown in fig. 1B, 2B, 6A and 6B, the fixing member 500 is a nut, and is fixedly connected to the fixing post 402 by external threads, that is, after the optical fiber 600 is inserted into the through hole 405 of the fixing post 402, the nut 500 is sleeved on the fixing post 402 and screwed down, so that the optical fiber 600 passes through the base 400 on the fixing post 402. Preferably, the fixed column 402 is provided with a notch 4021 along the longitudinal axis, so that the fixed column 402 is divided into two parts along the longitudinal direction; thus, the nut 500 is sleeved outside the fixed column 402 and screwed downwards, two parts separated by the notch 4021 on the fixed column 402 continuously contract inwards through continuously extruded internal stress, the gap distance of the notch 4021 is reduced, and the inner diameter of the fixed column 402 is reduced, so that the fixed column 402 further fixes and locks the optical fiber 600.
In the fiber holder of this embodiment, as shown in fig. 2B, the fixing bracket 420 is made of a metal wire into a U-shaped configuration; the number of the fixing brackets 420 is two (421, 422). The fixing bracket 420 is mainly used for fixing the base 400 and the patch type optoelectronic chip 200 together; meanwhile, the insertion end of the fixing bracket 420 is exposed to fix and weld the base 400 and the in-line photocell 200 on the circuit board. During mounting, two U-shaped fixing brackets (421,422) pass through longitudinal insertion holes (4011,4012) symmetrically arranged on the base 401 of the base 400 to fix the base 400 and the in-line chip 200. At this time, four conductive pins (210, 220, 230, 240) of the patch-type optoelectronic chip 200 are respectively soldered to corresponding circuit connection points on the PCB, and four insertion ends of two U-shaped fixing brackets (421,422) are respectively soldered to the PCB, thereby stabilizing the optical fiber holder.
EXAMPLE five
In this embodiment, the photoelectric chip is a patch type photoelectric chip, and the fixing member is a rubber cap having a columnar structure.
As shown in fig. 1D, 2D, 5, 6A and 6B, the optical fiber holder includes a photo chip 200, a base 400, a fixing bracket 420 and a fixing member 50.
In this embodiment, as shown in fig. 5, the optoelectronic chip 200 is a square patch-type optoelectronic chip, and is provided with four conductive pins (210, 220, 230, 240); the lengths of the extended parts of the four conductive pins (210, 220, 230, 240) are basically consistent and are bent downwards, and the four bent-downwards conductive pins (210, 220, 230, 240) are positioned on the same horizontal plane; with this arrangement, the optoelectronic chip 200 can be soldered on the PCB in-line, that is, the optoelectronic chip 200 is a chip-on-chip optoelectronic chip.
In the optical fiber holder of this embodiment, as shown in fig. 6A and 6B, an inner concave hole 404 is formed in the lower surface of the base 400, and the patch type optoelectronic chip 200 is received in the inner concave hole 404. The shape structures of the concave holes 404 are matched with the shape structures of the patch type photoelectric chips 200, and if the shape structures of the patch type photoelectric chips are square, the shape structures of the concave holes 404 are also square; the depth of the concave hole 403 is equal to the thickness of the patch type photoelectric chip 200; wherein, the thickness of the patch type photoelectric chip 200 is the distance between the upper surface of the packaging shell 201 and the bottom surface of the long conductive pins (230, 240) after bending; by such design, the patch-type optoelectronic chip 200 can be adapted to be received in the inner concave hole 404 of the base 400.
Preferably, the depth of the inner concave hole 403 is 1.1 to 1.2 times the thickness of the patch-type optoelectronic chip 200, so that a cushion 410 can be arranged between the inner concave hole 403 and the patch-type optoelectronic chip 200, and the sum of the cushion 410 and the patch-type optoelectronic chip 200 is equal to the depth of the inner concave hole 403. This blotter 410 can receive after putting the word indent hole 403 and fixed the back at play SMD photoelectric chip 200, when receiving the vibration, plays the internal stress effect that reduces or eliminate to SMD photoelectric chip 200 and cause because of external vibration, plays the guard action to SMD photoelectric chip 200.
In this embodiment, as shown in fig. 6A and 6B, preferably, the base 400 includes a substrate 401 and a fixing column 402 disposed on a surface of the substrate 401. The outer shape of the substrate 401 is configured into a square structure, in other embodiments, the outer shape can also be a circle, an ellipse, a regular polygon, etc., and the fixing column 402 is a cylindrical structure and is vertically and fixedly integrated on the upper surface of the substrate 401; the base 401 and the fixing column 402 are provided with through hollow holes 405 for inserting the optical fibers 600, and the inner diameter of each hollow hole 405 is equal to or slightly larger than the outer diameter of each optical fiber, so that the optical fibers can be conveniently inserted and connected in a penetrating manner. After the light receiving or light emitting end face of the optical fiber 600 is ensured to be perpendicular to the surface mount type photoelectric chip 200, the design modes of the substrate 401 and the fixing column 402 are as follows: the fixing posts 402 may be provided on the upper surface of the substrate 401 and may be disposed in an inclined manner, or the fixing posts 402 may be provided on the side wall surface of the substrate 401. At this time, the inner recess 404 of the base 400 is disposed on the lower surface of the substrate 401, and the patch-type optoelectronic chip 200 is disposed in the inner recess 404.
In this embodiment, as shown in fig. 1D, 2D and 8, the fixing member 500 is a rubber cap, the rubber cap includes a cap head 505 and a circular cap pillar 504, the two are integrally formed, and the outer diameter of the cap pillar 504 is equal to or slightly larger than the outer diameter of the hollow hole 405 of the fixing pillar 402 of the base 400, so that the cap pillar 504 is fixedly inserted into the hollow hole 405 of the fixing pillar 402. The lower bottom of the cap 505 is concave inwards to form an annular concave cavity (not shown in the figure), the central axis of the cap pillar 504 is located at the central point of the concave cavity, and the distance from the outer wall of the cap pillar 504 to the inner concave cavity wall of the cap 505 is equal to or slightly less than the wall thickness of the fixing column 402, so that the fixing column 402 is fittingly inserted into the concave cavity and a tightening type fixing plug-in connection is formed between the cap 505 and the cap pillar 504 when the fixing column is installed. The middle through hole 511 passes through the cap head 505 and the cap post 504 of the rubber cap 500, respectively. During installation, the optical fiber 600 penetrates through the middle through hole 511, the cap column 504 is fixedly inserted in the hollow hole 405 of the fixing column 402, the fixing column 402 is fittingly inserted into the inner concave cavity, and a tightening type fixing inserting and sleeving connection is formed between the cap head 505 and the cap column 504, so that the optical fiber 600 is locked.
In the fiber holder of this embodiment, as shown in fig. 2D, the fixing bracket 420 is made of a metal wire into a U-shaped configuration; the number of the fixing brackets 420 is two (421, 422). The fixing bracket 420 is mainly used for fixing the base 400 and the patch type optoelectronic chip 200 together; meanwhile, the insertion end of the fixing bracket 420 is exposed to fix and weld the base 400 and the in-line photocell 200 on the circuit board. During mounting, two U-shaped fixing brackets (421,422) pass through longitudinal insertion holes (4011,4012) symmetrically arranged on the base 401 of the base 400 to fix the base 400 and the in-line chip 200. At this time, four conductive pins (210, 220, 230, 240) of the patch-type optoelectronic chip 200 are respectively soldered to corresponding circuit connection points on the PCB, and four insertion ends of two U-shaped fixing brackets (421,422) are respectively soldered to the PCB, thereby stabilizing the optical fiber holder.
EXAMPLE six
In this embodiment, the optoelectronic chip is a patch-type optoelectronic chip, and the fixing member is a buckle having a columnar structure.
As shown in fig. 1F, 2F, 5, 6A and 6B, the optical fiber holder includes a photo chip 200, a base 400, a fixing bracket 420 and a fixing member 50.
In this embodiment, as shown in fig. 5, the optoelectronic chip 200 is a square patch-type optoelectronic chip, and is provided with four conductive pins (210, 220, 230, 240); the lengths of the extended parts of the four conductive pins (210, 220, 230, 240) are basically consistent and are bent downwards, and the four bent-downwards conductive pins (210, 220, 230, 240) are positioned on the same horizontal plane; with this arrangement, the optoelectronic chip 200 can be soldered on the PCB in-line, that is, the optoelectronic chip 200 is a chip-on-chip optoelectronic chip.
In the optical fiber holder of this embodiment, as shown in fig. 6A and 6B, an inner concave hole 404 is formed in the lower surface of the base 400, and the patch type optoelectronic chip 200 is received in the inner concave hole 404. The shape structures of the concave holes 404 are matched with the shape structures of the patch type photoelectric chips 200, and if the shape structures of the patch type photoelectric chips are square, the shape structures of the concave holes 404 are also square; the depth of the concave hole 403 is equal to the thickness of the patch type photoelectric chip 200; wherein, the thickness of the patch type photoelectric chip 200 is the distance between the upper surface of the packaging shell 201 and the bottom surface of the long conductive pins (230, 240) after bending; by such design, the patch-type optoelectronic chip 200 can be adapted to be received in the inner concave hole 404 of the base 400.
Preferably, the depth of the inner concave hole 403 is 1.1 to 1.2 times the thickness of the patch-type optoelectronic chip 200, so that a cushion 410 can be arranged between the inner concave hole 403 and the patch-type optoelectronic chip 200, and the sum of the cushion 410 and the patch-type optoelectronic chip 200 is equal to the depth of the inner concave hole 403. This blotter 410 can receive after putting the word indent hole 403 and fixed the back at play SMD photoelectric chip 200, when receiving the vibration, plays the internal stress effect that reduces or eliminate to SMD photoelectric chip 200 and cause because of external vibration, plays the guard action to SMD photoelectric chip 200.
In this embodiment, as shown in fig. 6A and 6B, preferably, the base 400 includes a substrate 401 and a fixing column 402 disposed on a surface of the substrate 401. The outer shape of the substrate 401 is configured into a square structure, in other embodiments, the outer shape can also be a circle, an ellipse, a regular polygon, etc., and the fixing column 402 is a cylindrical structure and is vertically and fixedly integrated on the upper surface of the substrate 401; the base 401 and the fixing column 402 are provided with through hollow holes 405 for inserting the optical fibers 600, and the inner diameter of each hollow hole 405 is equal to or slightly larger than the outer diameter of each optical fiber, so that the optical fibers can be conveniently inserted and connected in a penetrating manner. After the light receiving or light emitting end face of the optical fiber 600 is ensured to be perpendicular to the surface mount type photoelectric chip 200, the design modes of the substrate 401 and the fixing column 402 are as follows: the fixing posts 402 may be provided on the upper surface of the substrate 401 and may be disposed in an inclined manner, or the fixing posts 402 may be provided on the side wall surface of the substrate 401. At this time, the inner recess 404 of the base 400 is disposed on the lower surface of the substrate 401, and the patch-type optoelectronic chip 200 is disposed in the inner recess 404.
In this embodiment, as shown in fig. 1F, 2F, 7A, 7B and 7C, the fixing member 500 is a buckle, and the buckle includes a column 510 and a clip 520. A catch 520 is provided on the outer wall of the cylinder 510. The cylinder 510 is provided with a middle through hole 511 for inserting the optical fiber 600, and the diameter of the middle through hole 511 is slightly smaller than the outer diameter of the optical fiber 600, so that the optical fiber 600 can be locked by the internal stress formed between the optical fiber 600 and the cylinder 510. The clip 520 is divided into a pressing portion 521 and a locking portion 522, a connecting portion 501 is arranged between the pressing portion 521 and the locking portion 522, the cylinder 510 is connected with the clip 520 through the connecting portion 501, a lock catch 5221 which is bent inward and faces the cylinder 510 is arranged at the tail end of the locking portion 522, and the distance from the tail end of the lock catch 5221 to the corresponding outer wall of the cylinder 510 is greater than the distance from the lock catch portion 522 to the corresponding outer wall of the cylinder 510. The lock 5221 at the end of the locking portion 522 is located under the cylinder 510, and the distance from the lock 5221 to the lower end surface of the cylinder 510 is equal to the thickness of the base 401 of the base 400; thus, when the optical fiber 600 is installed, after passing through the through hole 511 of the cylinder 510, the lower end surface of the cylinder 510 is tightly attached to the upper surface of the base 401 of the base 400, and since the tail end of the locking portion 522 is provided with the lock catch 5221 bent inward toward the cylinder 510 and the distance from the tail end of the lock catch 5221 to the corresponding outer wall of the cylinder 510 is greater than the distance from the lock catch 522 to the corresponding outer wall of the cylinder 510, the clip 520 can be locked on the lower surface and the upper surface of the base 401 by the lock catch 5221.
Further, as shown in fig. 2F, 7C and 9, the fiber holder further includes a copper pillar 300, wherein the copper pillar 300 includes a cap 310 and a pillar 320; the cap 310 and the stem 320 are integrally formed, or formed by a welder design. The outer diameter of the pipe string 320 corresponds to the inner diameter of the hollow hole 405 of the fixing post 402 of the base 400. The tube cap 310 and the tube column 320 are internally provided with tube cavities 311 for being matched with the inserted optical fibers 600; the outer wall of the buckle 500 is provided with a clamping hole 530, and the inner wall of the cylinder 510 and the position of the clamping hole 530 is provided with a locking hook 531 pointing to the center of the through hole 511. During installation, the pipe column 320 of the copper pipe column 300 is inserted into the hollow hole 405 of the fixing column 402 of the base 400 in a matching manner to form interference contact fit, and the optical fiber 600 penetrates through the inner hole 310 of the copper pipe column 300 to form optical information signal receiving and/or transmitting with the patch type photoelectric chip 200; next, the lower end surface of the cylinder 510 of the buckle 500 is tightly attached to the upper surface of the base 401 of the base 400, and since the tail end of the locking portion 522 is provided with a lock catch 5221 which is bent inward and faces the cylinder 510, and the distance from the tail end of the lock catch 5221 to the corresponding outer wall of the cylinder 510 is greater than the distance from the lock catch portion 522 to the corresponding outer wall of the cylinder 510, the clip 520 can be clamped on the lower upper surface of the base 401 through the lock catch 5221; at this time, the tube cap 310 of the copper cylinder 300 just falls into the tube cavity 311 of the buckle 500, and the locking hook 531 of the buckle 500 is adapted to be clamped into the annular groove 312 disposed on the outer wall of the tube cap 310 of the copper cylinder 300, further locking the connection between the optical fiber 600 and the base 400, preventing the optical fiber from being loosened.
In the fiber holder of this embodiment, as shown in fig. 2F, the fixing bracket 420 is made of a metal wire into a U-shaped configuration; the number of the fixing brackets 420 is two (421, 422). The fixing bracket 420 is mainly used for fixing the base 400 and the patch type optoelectronic chip 200 together; meanwhile, the insertion end of the fixing bracket 420 is exposed to fix and weld the base 400 and the in-line photocell 200 on the circuit board. During mounting, two U-shaped fixing brackets (421,422) pass through longitudinal insertion holes (4011,4012) symmetrically arranged on the base 401 of the base 400 to fix the base 400 and the in-line chip 200. At this time, four conductive pins (210, 220, 230, 240) of the patch-type optoelectronic chip 200 are respectively soldered to corresponding circuit connection points on the PCB, and four insertion ends of two U-shaped fixing brackets (421,422) are respectively soldered to the PCB, thereby stabilizing the optical fiber holder.
It should be understood that the above description is illustrative of the preferred embodiment of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.

Claims (10)

1. An optical fiber seat is characterized by comprising a photoelectric chip, a base, a fixing support and a fixing component; the photoelectric chip is arranged in an inner concave hole on the lower surface of the base; the fixing support fixedly connects the base and the photoelectric chip; the fixing component fixedly connects an external optical fiber to the base, so that the optical fiber can form optical signal connection with the photoelectric chip through the base.
2. The fiber holder of claim 1, wherein the fixing bracket is disposed perpendicular to the surface of the base and fixedly connects the base to the optoelectronic chip.
3. The fiber holder of claim 1, wherein the optoelectronic chip is an in-line optoelectronic chip; correspondingly, the optical fiber base also comprises a plug-in pin card, the plug-in pin card penetrates through two opposite side surfaces of the base and is arranged in parallel with the surface of the base, and the penetrating end of the plug-in pin card and the side wall of the base are exposed.
4. The fiber holder of claim 3, further comprising a rear cover that fits over the bottom surface of the base and seals the in-line optoelectronic chip.
5. The fiber holder of claim 3, wherein the pin card has a U-shaped configuration.
6. The optical fiber holder according to claim 1, wherein the optoelectronic chip is a patch-type optoelectronic chip; correspondingly, the inserting end of the fixed support and the bottom surface of the base are exposed.
7. The fiber holder according to claim 1, wherein the base comprises a base and a fixing post disposed on a surface of the base; the inner concave hole is formed in the lower surface of the substrate, and the photoelectric chip is arranged in the inner concave hole; the fixing component is arranged on the fixing column, a hollow hole is formed in the fixing column, and the optical fiber is in photoelectric connection with the photoelectric chip through the hollow hole.
8. The fiber holder according to claim 8, wherein the fixing member is a nut, a rubber cap or a cylindrical clip, and the nut, the rubber cap or the cylindrical clip is provided with a through hole.
9. The optical fiber holder according to claim 9, wherein when the fixing member is a snap, the optical fiber holder further comprises a copper pillar tube disposed in the hollow hole of the fixing post, and the optical fiber is connected to the optoelectronic chip through a lumen of the copper pillar tube.
10. The fiber holder according to any one of claims 1 to 9, wherein the fixing brackets are at least two, and the outer shape of the fixing brackets is U-shaped.
CN202010614407.9A 2020-06-18 2020-06-30 Optical fiber base Pending CN111638579A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010557319X 2020-06-18
CN202010557319 2020-06-18

Publications (1)

Publication Number Publication Date
CN111638579A true CN111638579A (en) 2020-09-08

Family

ID=72333408

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010614407.9A Pending CN111638579A (en) 2020-06-18 2020-06-30 Optical fiber base

Country Status (1)

Country Link
CN (1) CN111638579A (en)

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