CN111621839B - Hardware electroplating automatic production line - Google Patents
Hardware electroplating automatic production line Download PDFInfo
- Publication number
- CN111621839B CN111621839B CN202010673423.5A CN202010673423A CN111621839B CN 111621839 B CN111621839 B CN 111621839B CN 202010673423 A CN202010673423 A CN 202010673423A CN 111621839 B CN111621839 B CN 111621839B
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- CN
- China
- Prior art keywords
- fixed
- electroplating
- plate
- production line
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000009713 electroplating Methods 0.000 title claims abstract description 91
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000004140 cleaning Methods 0.000 claims description 34
- 239000007788 liquid Substances 0.000 claims description 19
- 238000005485 electric heating Methods 0.000 claims description 14
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 238000007747 plating Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 150000001768 cations Chemical class 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 101100520231 Caenorhabditis elegans plc-3 gene Proteins 0.000 description 2
- 239000010406 cathode material Substances 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002198 insoluble material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
- B08B7/026—Using sound waves
- B08B7/028—Using ultrasounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010673423.5A CN111621839B (en) | 2020-07-14 | 2020-07-14 | Hardware electroplating automatic production line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010673423.5A CN111621839B (en) | 2020-07-14 | 2020-07-14 | Hardware electroplating automatic production line |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111621839A CN111621839A (en) | 2020-09-04 |
CN111621839B true CN111621839B (en) | 2021-05-25 |
Family
ID=72258632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010673423.5A Active CN111621839B (en) | 2020-07-14 | 2020-07-14 | Hardware electroplating automatic production line |
Country Status (1)
Country | Link |
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CN (1) | CN111621839B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107385500B (en) * | 2017-07-12 | 2023-09-19 | 信丰迅捷兴电路科技有限公司 | Production equipment of PCB gold-plated fingers and control method thereof |
CN112111777B (en) * | 2020-09-11 | 2021-09-07 | 嘉兴博睿创业服务有限公司 | Hardware rack plating equipment with height self-adaptive adjusting mechanism |
CN112176382B (en) * | 2020-09-17 | 2021-11-02 | 祁东县锋速钻探工具有限公司 | Electroplating device for diamond bit production |
CN112391667A (en) * | 2020-10-29 | 2021-02-23 | 任权月 | Electroplating head chemical cleaning device with mixing function |
CN112458521A (en) * | 2020-11-10 | 2021-03-09 | 深圳市创智联环保设备有限公司 | Electroplating equipment with rotary electroplating hanger |
CN114086095B (en) * | 2021-11-22 | 2023-11-03 | 浙江航峰铁塔有限公司 | Acid-washing-free galvanization process |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000228388A (en) * | 1998-12-01 | 2000-08-15 | Ideya:Kk | Semiconductor equipment |
US20070227901A1 (en) * | 2006-03-30 | 2007-10-04 | Applied Materials, Inc. | Temperature control for ECMP process |
CN205821505U (en) * | 2016-07-04 | 2016-12-21 | 常州广宇蓝天表面技术科技发展有限公司 | A kind of gold-plated equipment of pcb board convenient to operate |
CN207738873U (en) * | 2018-01-03 | 2018-08-17 | 苏州市王氏电路板有限公司 | A kind of pcb board surface gold-plating equipment |
CN110079852A (en) * | 2019-05-17 | 2019-08-02 | 杭州虹妍服饰有限公司 | A kind of electro-plating method |
CN210481546U (en) * | 2019-08-04 | 2020-05-08 | 盐城市金良窗饰有限公司 | Electroplating device for curtain hook |
-
2020
- 2020-07-14 CN CN202010673423.5A patent/CN111621839B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN111621839A (en) | 2020-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210506 Address after: 336300 No.22 Changxin Avenue, industrial park, Yifeng County, Yichun City, Jiangxi Province (self declaration) Applicant after: Yichun Huajin Electronic Technology Co.,Ltd. Address before: 322100 room 602, West unit, No. 330, Pingchuan Road, shilitou community, Baiyun Street, Dongyang City, Jinhua City, Zhejiang Province Applicant before: Dongyang Gonggang Electrical Appliance Sales Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A hardware electroplating automatic production line Effective date of registration: 20211214 Granted publication date: 20210525 Pledgee: Jiangxi Xinda Financial Leasing Co.,Ltd. Pledgor: Yichun Huajin Electronic Technology Co.,Ltd. Registration number: Y2021980015104 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221122 Granted publication date: 20210525 Pledgee: Jiangxi Xinda Financial Leasing Co.,Ltd. Pledgor: Yichun Huajin Electronic Technology Co.,Ltd. Registration number: Y2021980015104 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An automated production line for electroplating of hardware components Granted publication date: 20210525 Pledgee: Industrial Park Branch of Jiangxi Yifeng Rural Commercial Bank Co.,Ltd. Pledgor: Yichun Huajin Electronic Technology Co.,Ltd. Registration number: Y2024980016734 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |