CN111615314A - Self-monitoring heat dissipation device and heat dissipation method of big data integration equipment - Google Patents
Self-monitoring heat dissipation device and heat dissipation method of big data integration equipment Download PDFInfo
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- CN111615314A CN111615314A CN202010701155.3A CN202010701155A CN111615314A CN 111615314 A CN111615314 A CN 111615314A CN 202010701155 A CN202010701155 A CN 202010701155A CN 111615314 A CN111615314 A CN 111615314A
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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Abstract
The embodiment of the invention discloses a self-monitoring heat dissipation device of large data integration equipment, which comprises an equipment body, wherein a fixed-point temperature measurement mechanism is arranged on the equipment body through a transposition mechanism, an internal and external convection type heat dissipation mechanism capable of dissipating heat synchronously is also arranged on the equipment body, a plurality of edge built-in grooves are arranged on the side surface in the equipment body, the bottoms of all the edge built-in grooves are in conduction connection through annular bottom grooves, the fixed-point temperature measurement mechanism freely moves in the edge built-in grooves and the annular bottom grooves respectively and performs temperature detection, the transposition mechanism is used for carrying out transposition adjustment on the fixed-point temperature measurement mechanism, the heat dissipation method of the large data integration equipment comprises three steps of air guide pre-cooling, secondary degradation cooling and heat dissipation control, the internal heat dissipation of the integration equipment is directly dissipated through the mode of combining the internal and external convection type air cooling and water cooling, and the heat dissipation, the heat dissipation effect and the work efficiency of the integrated equipment are improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of big data equipment, in particular to a self-monitoring heat dissipation device and a heat dissipation method of big data integration equipment.
Background
Big data, which refers to a data set that cannot be captured, managed and processed by a conventional software tool within a certain time range, is a massive, high-growth-rate and diversified information asset that needs a new processing mode to have stronger decision-making power, insight discovery power and process optimization capability.
In the process of processing big data, a plurality of integrated devices are needed to be used for respectively finishing different works, and in the process of working the big data integrated devices, the devices can generate heat to different degrees due to long-time work.
The existing heat dissipation mode of some big data integration devices is that the big data integration devices are cooled by a single built-in fan, but after the heat is accumulated in a large amount, the heat dissipation effect of air cooling is greatly reduced, the condition that the heat is accumulated in a large amount in the device is caused, and the heat is further accelerated after being merged into wind power to heat the inside of the device, so that the heat dissipation effect is influenced.
Disclosure of Invention
Therefore, the embodiment of the invention provides a self-monitoring heat dissipation device and a heat dissipation method for large data integration equipment.
In order to achieve the above object, an embodiment of the present invention provides the following: the utility model provides a big data integration equipment from control formula heat abstractor, includes the equipment body, install fixed point temperature measurement mechanism through transposition mechanism on the equipment body, and still install the inside and outside convection formula heat dissipation mechanism that can dispel the heat in step on the equipment body, the inside side of equipment body is provided with a plurality of edge built-in groove, and all edge built-in tank bottoms portion are through annular kerve turn-on connection, fixed point temperature measurement mechanism is respectively at the inside free activity of edge built-in groove, annular kerve and carries out temperature measurement, transposition mechanism is used for transposing fixed point temperature measurement mechanism and adjusts, edge built-in groove, annular kerve inner wall all are provided with a plurality of heat conduction fin that is used for concentrating the conduction heat.
As a preferable scheme of the invention, the internal and external convection type heat dissipation mechanism comprises an edge conduction piece installed inside the edge built-in groove and a directional concentration piece installed inside the annular bottom groove, wherein the side surface of the edge conduction piece is also uniformly connected with a plurality of reversing pipes, each reversing pipe is provided with a reversing port with different opening directions, the top end of the edge built-in groove is provided with a power fan, and the bottom of the annular bottom groove is provided with an air guide nozzle.
As a preferred scheme of the invention, the edge conduction piece comprises a side hollow cavity arranged in the edge built-in groove, the inner wall of the side hollow cavity is connected with a snake-shaped elbow, the top of the snake-shaped elbow is also provided with a concentration hopper, the upper end and the lower end of the snake-shaped elbow are both connected with circulation pools, the circulation pools at the upper end and the lower end are connected through a backflow pipe group to realize water flow circulation, a plurality of air deflectors are arranged at the hollow part of the side surface of the snake-shaped elbow, each air deflector is respectively connected with a reversing pipe, the surface of each air deflector is also provided with an airflow retention sheet, and the directional concentration piece is connected with the bottom of the side hollow cavity through.
As a preferable scheme of the invention, the directional concentration piece comprises a flow chamber arranged in an annular bottom groove, a central groove is arranged at the center of the flow chamber, the outer wall of the central groove is uniformly connected with a plurality of extension plates, an outer expansion area is formed between adjacent extension plates, a plurality of radiating fins are connected in each outer expansion area, the outermost ends of all the outer expansion areas are connected through a collecting ring, the bottom of the collecting ring is connected with a flow cell through an outer conduit, and a regenerator is arranged in the central groove.
As a preferable scheme of the invention, the cold accumulator comprises a diffusion copper cylinder arranged in the central groove, the diffusion copper cylinder is uniformly connected with a plurality of semiconductor refrigerating sheets, the outer wall of the diffusion copper cylinder is also connected with an extension cold pipe inserted into the external expansion area, the extension cold pipe is spiral, and the bottom of the diffusion copper cylinder is also connected with a plurality of stirring curved sheets through a motor shaft.
As a preferable scheme of the invention, the fixed-point temperature measuring mechanism comprises a vertical temperature measuring plate which is slidably arranged in the edge built-in groove and a horizontal temperature measuring plate which is slidably arranged in the annular bottom groove, wherein a plurality of heat sensitive pieces are respectively arranged on the horizontal temperature measuring plate and the vertical temperature measuring plate, the plurality of heat sensitive pieces are distributed in a cross shape, and the transposition mechanisms are arranged at two ends of the horizontal temperature measuring plate.
As a preferable scheme of the invention, the transposition mechanism comprises sliding seats connected to the bottom surface of the horizontal temperature measuring plate and the side surface of the vertical temperature measuring plate, two ends of each sliding seat are connected with electric push rods, two ends of the side wall of the edge built-in groove are provided with side buffer seats, two ends of the annular bottom groove are provided with bottom buffer seats, the electric push rods at two sides are connected with the side buffer seats, and the electric push rods at the bottom are connected with the bottom buffer seats at the bottom.
The invention also provides a heat dissipation method of the big data integration equipment, which comprises the following steps:
s100, starting power fans on two sides inside the integrated equipment to form a primary air circulation loop until airflow inside the integrated equipment is completely circulated, and completing air guide pre-cooling;
s200, starting a water pipe cooling mode to circulate cooling water in a loop of air flow circulation in a pipeline circulation mode, and simultaneously starting a refrigerating device to carry out secondary cooling on the cooling water to realize secondary degradation cooling;
and S300, measuring the temperature of the corresponding area of the integrated equipment through the detection device, and controlling the air guide pre-cooling and secondary degradation cooling processes through judging the temperature change until the temperature of the device is reduced to the set temperature.
As a preferable mode of the present invention, in the step S100, the preliminary air circulation circuit is formed under a condition that an air flow speed inside the integrated equipment reaches 25m/S or more.
In a preferred embodiment of the present invention, in the step S300, the device temperature is based on an average value of the device airflow outlet temperature and the device internal temperature, and the set range temperature is set by an external computer.
The embodiment of the invention has the following advantages:
the temperature measurement device comprises a fixed point temperature measurement mechanism, an internal convection type heat dissipation mechanism, an external convection type heat dissipation mechanism, an internal heat convection circulation mechanism, a water cooling mechanism and a heat dissipation mechanism, wherein the fixed point temperature measurement mechanism is movably arranged on the internal heating portion of the equipment main body, and is used for measuring the temperature of the internal heating portion of the equipment main body.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
FIG. 1 is a block diagram of the overall structure in an embodiment of the present invention;
FIG. 2 is a schematic top view of a flow cell according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an internal structure of a regenerator according to an embodiment of the present invention;
FIG. 4 is a schematic view of a reversing tube structure according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a working flow of a heat dissipation method according to an embodiment of the present invention.
In the figure:
1-an equipment body; 2-a transposition mechanism; 3-a fixed-point temperature measuring mechanism; 4-internal and external convection type heat dissipation mechanism; 5-a cold accumulator; 6-a power fan; 7-heat conducting fins; 8-air guide nozzle;
101-edge built-in groove; 102-an annular bottom groove;
201-sliding seat; 202-electric push rod; 203-side buffer seat; 204-a base buffer seat;
301-vertical temperature measuring plate; 302-horizontal temperature measurement plate; 303-a heat sensitive member;
401-edge vias; 402-directed centralizers; 403-an outer catheter; 404-a reversing tube; 405-a commutation port; 406-side hollow cavity; 407-snake bend; 408-a centralized bucket; 409-a flow-through cell; 410-a return tube set; 411-air deflectors; 412-gas flow retention sheet; 413-a flow connection pipe; 414-a flow chamber; 415-a central slot; 416-an epitaxial plate; 417-an extension region; 418-a heat sink; 419-a collecting ring;
501-diffusion copper cylinder; 502-semiconductor chilling plates; 503-extension cold pipe; 504-a motor shaft; 505-agitating the koji.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 4, the invention provides a self-monitoring heat dissipation device for large data integration equipment, which includes an equipment body 1, wherein a fixed-point temperature measurement mechanism 3 is installed on the equipment body 1 through a transposition mechanism 2, and an internal and external convection type heat dissipation mechanism 4 capable of dissipating heat synchronously is also installed on the equipment body 1, a plurality of edge built-in grooves 101 are arranged on the inner side surface of the equipment body 1, the bottoms of all the edge built-in grooves 101 are connected in a conduction manner through an annular bottom groove 102, the fixed-point temperature measurement mechanism 3 freely moves and performs temperature detection in the edge built-in grooves 101 and the annular bottom groove 102 respectively, the transposition mechanism 2 is used for carrying out transposition adjustment on the fixed-point temperature measurement mechanism 3, and a plurality of heat conduction fins 7 for conducting heat intensively are arranged on the inner walls of the edge built-in grooves 101 and the annular bottom groove 102.
When equipment body 1 is used for big data processing, carry out the temperature measurement to equipment body 1 inside through fixed point temperature measurement mechanism 3, be convenient for know the inside temperature condition of equipment body 1, utilize transposition mechanism 2's regulating action to adjust fixed point temperature measurement mechanism 3 simultaneously, make fixed point temperature measurement mechanism 3 can detect the different positions of equipment body 1 inside, utilize inside and outside convection formula heat dissipation mechanism 4 to carry out the convection formula cooling to equipment body 1 inside simultaneously, cool off with the form that air-cooled and water-cooling combine step by step, thereby reach good cooling effect, direct effectual reduction equipment body 1 inside temperature, from inside to outside directly dispels the heat to equipment itself, play good guard action to equipment itself.
As shown in fig. 1, the internal and external convection type heat dissipation mechanism 4 includes an edge conduction piece 401 installed inside the edge built-in slot 101 and a directional concentration piece 402 installed inside the annular bottom slot 102, the side surface of the edge conduction piece 401 is further uniformly connected with a plurality of reversing pipes 404, each reversing pipe 404 is provided with a reversing port 405 with different opening directions, the top end of the edge built-in slot 101 is provided with a power fan 6, and the bottom of the annular bottom slot 102 is provided with a gas guide nozzle 8.
According to the condition of generating heat of equipment body 1, it generates heat and bottom generate heat to mainly divide into the side with its inside interval of generating heat, utilize a plurality of heat conduction fins 7 that set up to concentrate the heat, be convenient for to marginal built-in groove 101, the inside heat of annular kerve 102 carries out centralized processing, the distributed structure design through marginal built-in groove 101 and annular kerve 102, directly carry out interval division to the inside heat of equipment, and carry out marginal heat dissipation through marginal conduction piece 401, directional centralized piece 402 carries out the bottom heat dissipation, and the diffusion bonding effect through route diffusion group 403 switches on both, realize combining the heat dissipation when stepping the heat dissipation.
Further, the power fan 6 arranged in the edge built-in groove 101 is used for fixing air flow, so that the air flow speed inside the edge built-in groove 101 is accelerated, the air flow inside the edge built-in groove 101 flows rapidly and enters the annular bottom groove 102 through the path diffusion group 403, and is discharged through the air guide nozzle 8 at the bottom, the internal and external convection process is completed, and heat dissipation is conveniently completed.
The edge conduction piece 401 comprises a side hollow cavity 406 arranged in the edge built-in groove 101, the inner wall of the side hollow cavity 406 is connected with a snake-shaped bent pipe 407, the top of the snake-shaped bent pipe 407 is further provided with a concentration hopper 408, the upper end and the lower end of the snake-shaped bent pipe 407 are both connected with a circulation pool 409, the circulation pools 409 at the upper end and the lower end are connected through a return pipe group 410 to realize water circulation, the hollow part on the side surface of the snake-shaped bent pipe 407 is provided with a plurality of air deflectors 411, each air deflector 411 is respectively connected with a reversing pipe 404, the surface of each air deflector 411 is further provided with an airflow retention sheet 412, the directional concentration piece 402 is connected with the bottom of the side hollow cavity 406 through a flow connection pipe 413, firstly, the top concentration hopper 408 has a hollow structure of the side hollow cavity 406, so that the gas in the edge built-in groove 101 can directly enter the side hollow cavity 406 and enter, the airflow firstly passes through the serpentine bent pipe 407, due to the serpentine bent structure of the serpentine bent pipe 407, when the airflow passes through, the surface contact area of the serpentine bent pipe 407 is greatly increased, and the cooling contact area of the airflow is increased, on the other hand, when the airflow contacts the surface of the serpentine bent pipe 407, especially when the airflow contacts the side surface, the airflow also contacts a plurality of air deflectors 411 on the side surface of the serpentine bent pipe 407, and due to the conduction effect of the reversing pipe 404 connected to the side surface of the air deflectors 411, the airflow located outside can enter the side hollow cavity 406 through the reversing pipe 404, on the one hand, the air flow inside the side hollow cavity 406 is enhanced, on the other hand, the contact time between the flowing air and the serpentine bent pipe 407 inside the side hollow cavity 406 is increased, and the cooling effect is improved.
Further, the flow cell 409 that connects both ends about serpentine return bend 407 is equipped with the cooling water, because the effect of upper and lower gravity potential difference, the cooling water that leads to the flow cell 409 of top can constantly flow downwards along serpentine return bend 407, thereby realize the continuous flow of cooling water, when making the air current that has the heat pass serpentine return bend 407, good cooling effect has, and on the other hand passes through the circulation effect of return pipe group 410, the continuous suction that will be located the cooling water of the flow cell 409 of bottom is inside the flow cell 409 that is located the top, thereby accomplish continuous circulation flow process, make the inside air current of marginal built-in groove 101 can carry out primary cooling, later under the diffusion effect of route diffusion group, the air current enters into the annular kerve 102 of bottom inside, carry out secondary cooling through directional concentration piece 402 and handle 403.
As shown in fig. 1 and fig. 2, the directional concentration piece 402 includes a flow chamber 414 disposed inside the annular bottom groove 102, a central groove 415 is disposed at the center inside the flow chamber 414, a plurality of extension plates 416 are uniformly connected to the outer wall of the central groove 415, an outer expansion area 417 is formed between adjacent extension plates 416, a plurality of cooling fins 418 are connected to the inside of each outer expansion area 417, the outermost ends of all the outer expansion areas 417 are connected by a collecting ring 419, the bottom of the collecting ring 419 is connected to the flow cell 409 through an outer conduit 403, after the gas flow enters the annular bottom groove 102, the gas first enters the central groove 415 of the flow chamber 414 and is diffused to the outside through the outer expansion area 417 formed by the extension plates 416 of the central groove 415, and during the diffusion process, the plurality of cooling fins 418 located at the outer expansion area 417 have good heat conduction effect, thereby performing secondary heat dissipation on the gas, and the gas after passing through the outer expansion area 417 continues to be diffused to the outside, and finally collected in the collection ring 419, while the whole collection ring 419 is filled with cooling water, on one hand, the cooling water is exchanged with the flow cell 409, on the other hand, secondary water cooling can be performed when the final hot gas passes through, so as to realize further heat dissipation and temperature reduction treatment, and in the above process, after the gas flow finally passes through the outward expansion area 417, the gas flow is collected at the collection ring 419 and cooled by the secondary temperature reduction of the cooling water.
Furthermore, in the above scheme, the inside of the whole flow chamber 414 is also filled with cooling water, under such an action, when the airflow passes through the whole flow chamber 414, the airflow passes through the central groove 415, the outward expansion area 417 and the collection ring 419 in sequence, not only the whole heat dissipation process is performed step by step, but also the step by step water cooling is realized, so that the passing airflow is synchronously cooled by the water cooling and air cooling modes, and the cooling effect of the whole directional concentration piece 402 is improved.
The inside regenerator 5 that still is provided with of central groove 415, regenerator 5 is including setting up the diffusion copper section of thick bamboo 501 in central groove 415 inside, diffusion copper section of thick bamboo 501 inside evenly is connected with a plurality of semiconductor refrigeration piece 502, and diffusion copper section of thick bamboo 501 outer wall still is connected with the extension cold tube 503 that inserts outer expanding area 417, extension cold tube 503 is the heliciform, and diffusion copper section of thick bamboo 501 bottom still is connected with a plurality of through motor shaft 504 and stirs bent piece 505, on the other hand, the air current through central groove 415 carries the heat, can make the heat of cooling water increase, the refrigeration effect through regenerator 5 this moment, constantly produce the heat, improve the cooling effect.
In addition, the outer conduit 403 connects the flow cell 409 with the collecting ring 419, so that on one hand, cooling water in the flow cell 409 is conveniently transmitted to the inside of the collecting ring 419, on the other hand, after cold energy generated by refrigeration of the cold accumulator 5 is transmitted to the inside of the collecting ring 419, under the action of the water pump, the cooling water in the collecting ring 419 is transmitted back to the flow cell 409 at the bottom through the outer conduit 403, which is beneficial to realizing circulation exchange of the cold energy, improving the cold energy of the whole flow cell 409, and further enhancing the cooling effect of the serpentine elbow 407.
The refrigeration capacity is generated under the refrigeration effect of the semiconductor refrigeration piece 502, then the refrigeration capacity is transmitted by extending the cold pipe 503 into the outward expansion areas 417, the cold guide efficiency of the extended cold pipe 503 is improved, and on the other hand, the stirring curved piece 505 is driven to rotate under the effect of the motor shaft 504, the refrigeration capacity transmission process inside the whole diffusion copper cylinder 501 is accelerated, so that the refrigeration capacity can be uniformly distributed inside the whole central groove 415, and the cooling effect is improved.
After the air flow passes through the annular bottom groove 102, the heat in the edge built-in groove 101 is processed, enters the annular bottom groove 102 in the form of air flow, is finally cooled and then is discharged outwards through the air guide nozzle 8, so that the air cannot remain in the equipment, the possibility of heat remaining is further reduced, and the cooling process of the whole equipment is completed.
Fixed point temperature measurement mechanism 3 sets up at the inside vertical temperature measurement board 301 of edge built-in groove 101, slides and sets up the horizontal temperature measurement board 302 at annular kerve 102 inside including sliding, all install a plurality of temperature sensing piece 303 on horizontal temperature measurement board 302 and the vertical temperature measurement board 301, and be the fork distribution between a plurality of temperature sensing piece 303, at above-mentioned in-process, carry out synchronous temperature measurement through horizontal temperature measurement board 302 and vertical temperature measurement board 301, adjust position between them through the sliding action, make its measured temperature data more accurate, be difficult for appearing the deviation, the temperature sensing piece 303 that the fork distributes of crossing simultaneously is used for direct perception temperature, through the structure of cross distribution, make when the perception heat, make thermal monitoring point position more comprehensive diversified, improve the temperature detection accuracy.
The transposition mechanism 2 comprises sliding seats 201 connected to the bottom surface of a horizontal temperature measuring plate 302 and the side surface of a vertical temperature measuring plate 301, two ends of each sliding seat 201 are connected with electric push rods 202, two ends of the side wall of an edge built-in groove 101 are provided with side buffer seats 203, two ends of an annular bottom groove 102 are provided with bottom buffer seats 204, the electric push rods 202 on two sides are connected with the side buffer seats 203, the electric push rods 202 on the bottom are connected with the bottom buffer seats 204, and in order to improve the efficiency of temperature detection, the temperature measuring positions of different fixed-point temperature measuring mechanisms 3 are adjusted through the transposition effect of the transposition mechanism 2 so as to complete temperature measurement of different positions.
During the specific use, through the telescopic motion of the electric putter 202 of side and bottom, promote horizontal temperature measurement board 302 bottom surface and vertical temperature measurement board 301 respectively and remove, under the effect of sliding seat 201, horizontal temperature measurement board 302 bottom surface and vertical temperature measurement board 301 remove different positions respectively to carry out temperature detection to different positions, realize omnidirectional temperature detection to device inside.
And further judging whether the current cooling meets the requirement or not according to the numerical value of the detected temperature, and continuing working until the cooling requirement is met.
As shown in fig. 5, the present invention further provides a heat dissipation method for a big data integration device, including the following steps:
s100, starting power fans on two sides inside the integrated equipment to form a primary air circulation loop until airflow inside the integrated equipment is completely circulated, completing air guide pre-cooling, and preprocessing the loop inside the equipment in a primary air cooling mode to enable the temperature inside the equipment to be more balanced and avoid locally absorbing excessive heat;
the condition for forming the primary air circulation loop is that the air flow speed inside the integrated equipment reaches more than 25m/s, so that the circulation loop of the equipment has certain air flow speed, and each corner inside the equipment is ensured to form a circulation loop;
s200, starting a water pipe cooling mode to circulate cooling water in a loop of air flow circulation in a pipeline circulation mode, simultaneously starting a refrigerating device to carry out secondary cooling on the cooling water, realizing secondary degradation cooling, and combining water cooling and air cooling to finish combined cooling;
s300, measuring the temperature of the corresponding area of the integrated equipment through the detection device, and finishing control over the air guide pre-cooling and secondary degradation cooling processes by judging the temperature change until the temperature of the device is reduced to a set temperature;
in order to better judge the temperature of the cooled equipment, the temperature of the device is based on the mean value of the temperature of the airflow outlet of the device and the temperature inside the device, the condition of incomplete cooling caused by local temperature measurement is avoided, and the temperature in the set range is set by an external computer.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (10)
1. A self-monitoring heat dissipation device of big data integration equipment is characterized by comprising an equipment body (1), a fixed-point temperature measuring mechanism (3) is arranged on the equipment body (1) through a transposition mechanism (2), and the equipment body (1) is also provided with an internal and external convection type heat dissipation mechanism (4) which can synchronously dissipate heat, the side surface in the equipment body (1) is provided with a plurality of edge built-in grooves (101), the bottoms of all the edge built-in grooves (101) are connected in a conduction way through annular bottom grooves (102), the fixed-point temperature measuring mechanism (3) is respectively and freely movable in the edge built-in groove (101) and the annular bottom groove (102) and is used for temperature detection, the transposition mechanism (2) is used for carrying out transposition adjustment on the fixed-point temperature measuring mechanism (3), the inner walls of the edge built-in groove (101) and the annular bottom groove (102) are provided with a plurality of heat conduction fins (7) for conducting heat in a concentrated manner.
2. The self-monitoring heat dissipation device of large data integration equipment according to claim 1, wherein the internal and external convection type heat dissipation mechanisms (4) comprise an edge conduction piece (401) installed inside the edge built-in groove (101) and a directional concentration piece (402) installed inside the annular bottom groove (102), the side surface of the edge conduction piece (401) is further uniformly connected with a plurality of reversing pipes (404), each reversing pipe (404) is provided with a reversing port (405) with different opening directions, the top end of the edge built-in groove (101) is provided with the power fan (6), and the bottom of the annular bottom groove (102) is provided with the air guide nozzle (8).
3. The self-monitoring heat sink of big data integration device as claimed in claim 2, characterized in that the edge conduction member (401) comprises a side hollow cavity (406) arranged inside the edge built-in groove (101), the inner wall of the side hollow cavity (406) is connected with a snake-shaped bent pipe (407), the top of the snake-shaped bent pipe (407) is also provided with a centralized hopper (408), the upper end and the lower end of the snake-shaped bent pipe (407) are both connected with a flow cell (409), and the flow-through tanks (409) at the upper and lower ends are connected by a reflux pipe group (410) to realize water flow circulation, a plurality of air deflectors (411) are arranged at the hollow part of the side surface of the snake-shaped bent pipe (407), each air deflector (411) is respectively connected with the reversing pipe (404), the surface of the air deflector (411) is also provided with an airflow retention sheet (412), and the directional concentration piece (402) is connected with the bottom of the side hollow cavity (406) through a flow connection pipe (413).
4. The self-monitoring heat dissipation device of large data integration equipment according to claim 3, wherein the directional concentration piece (402) comprises a flow chamber (414) arranged inside the annular bottom groove (102), a central groove (415) is arranged at the center inside the flow chamber (414), a plurality of extension plates (416) are uniformly connected to the outer wall of the central groove (415), outward expansion areas (417) are formed between adjacent extension plates (416), a plurality of cooling fins (418) are connected inside each outward expansion area (417), the outermost ends of all outward expansion areas (417) are collected through a ring (419) to be connected, the bottom of the collection ring (419) is connected with the flow cell (409) through an outer conduit (403), and a cold accumulator (5) is further arranged inside the central groove (415).
5. The self-monitoring heat dissipation device of large data integration equipment according to claim 4, wherein the cold accumulator (5) comprises a diffusion copper cylinder (501) arranged inside the central groove (415), the inside of the diffusion copper cylinder (501) is uniformly connected with a plurality of semiconductor cooling fins (502), the outer wall of the diffusion copper cylinder (501) is further connected with an extension cold pipe (503) inserted into an outward expansion area (417), the extension cold pipe (503) is spiral, and the bottom of the diffusion copper cylinder (501) is further connected with a plurality of stirring curved fins (505) through a motor shaft (504).
6. The self-monitoring heat dissipation device of the big data integration equipment as claimed in claim 1, wherein the fixed-point temperature measurement mechanism (3) comprises a vertical temperature measurement plate (301) slidably disposed inside the edge built-in groove (101), and a horizontal temperature measurement plate (302) slidably disposed inside the annular bottom groove (102), wherein a plurality of heat sensitive members (303) are mounted on the horizontal temperature measurement plate (302) and the vertical temperature measurement plate (301), the plurality of heat sensitive members (303) are distributed in a cross manner, and the transposition mechanisms (2) are mounted at two ends of the horizontal temperature measurement plate (302).
7. The self-monitoring heat dissipation device of the big data integration equipment as claimed in claim 6, wherein the transposing mechanism (2) comprises a sliding seat (201) connected to the bottom surface of the horizontal temperature measurement plate (302) and the side surface of the vertical temperature measurement plate (301), the two ends of the sliding seat (201) are both connected with electric push rods (202), the two ends of the side wall of the edge built-in groove (101) are both provided with side buffer seats (203), the two ends of the annular bottom groove (102) are both provided with bottom buffer seats (204), the electric push rods (202) on the two sides are connected with the side buffer seats (203), and the electric push rods (202) on the bottom are connected with the bottom buffer seats (204).
8. A heat dissipation method of big data integration equipment is characterized by comprising the following steps:
s100, starting power fans on two sides inside the integrated equipment to form a primary air circulation loop until airflow inside the integrated equipment is completely circulated, and completing air guide pre-cooling;
s200, starting a water pipe cooling mode to circulate cooling water in a loop of air flow circulation in a pipeline circulation mode, and simultaneously starting a refrigerating device to carry out secondary cooling on the cooling water to realize secondary degradation cooling;
and S300, measuring the temperature of the corresponding area of the integrated equipment through the detection device, and controlling the air guide pre-cooling and secondary degradation cooling processes through judging the temperature change until the temperature of the device is reduced to the set temperature.
9. The heat dissipation method of claim 8, wherein in step S100, the preliminary air circulation loop is formed under a condition that an air flow speed inside the integrated device is 25m/S or more.
10. The method for dissipating heat from a big data integration apparatus according to claim 8, wherein in the step S300, the device temperature is based on an average value of the device airflow outlet temperature and the device internal temperature, and the set range temperature is set by an external computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104345825A (en) * | 2013-08-01 | 2015-02-11 | 上海同悦信息科技有限公司 | Server cabinet with mobile fan |
| CN206773638U (en) * | 2017-06-13 | 2017-12-19 | 倪晓阳 | A kind of computer hardware test heat sink |
| CN208752607U (en) * | 2018-09-13 | 2019-04-16 | 辽宁建筑职业学院 | A kind of computer box detection device |
| CN209461877U (en) * | 2019-01-07 | 2019-10-01 | 青岛黄海电器设备有限公司 | A kind of split type water-cooling power distribution cabinet easy to maintain |
| CN111190795A (en) * | 2019-12-30 | 2020-05-22 | 常州工学院 | Hardware temperature detection device |
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2020
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104345825A (en) * | 2013-08-01 | 2015-02-11 | 上海同悦信息科技有限公司 | Server cabinet with mobile fan |
| CN206773638U (en) * | 2017-06-13 | 2017-12-19 | 倪晓阳 | A kind of computer hardware test heat sink |
| CN208752607U (en) * | 2018-09-13 | 2019-04-16 | 辽宁建筑职业学院 | A kind of computer box detection device |
| CN209461877U (en) * | 2019-01-07 | 2019-10-01 | 青岛黄海电器设备有限公司 | A kind of split type water-cooling power distribution cabinet easy to maintain |
| CN111190795A (en) * | 2019-12-30 | 2020-05-22 | 常州工学院 | Hardware temperature detection device |
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| CN111615314B (en) | 2021-01-01 |
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