CN111613695B - 一种晶体硅光伏组件智能化焊接加工设备 - Google Patents
一种晶体硅光伏组件智能化焊接加工设备 Download PDFInfo
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- CN111613695B CN111613695B CN202010500840.XA CN202010500840A CN111613695B CN 111613695 B CN111613695 B CN 111613695B CN 202010500840 A CN202010500840 A CN 202010500840A CN 111613695 B CN111613695 B CN 111613695B
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- 238000003466 welding Methods 0.000 title claims abstract description 193
- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 60
- 230000005540 biological transmission Effects 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 22
- 238000006073 displacement reaction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 239000003921 oil Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Silicon Compounds (AREA)
- Battery Electrode And Active Subsutance (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
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CN202010500840.XA CN111613695B (zh) | 2020-06-04 | 2020-06-04 | 一种晶体硅光伏组件智能化焊接加工设备 |
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CN202010500840.XA CN111613695B (zh) | 2020-06-04 | 2020-06-04 | 一种晶体硅光伏组件智能化焊接加工设备 |
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CN111613695A CN111613695A (zh) | 2020-09-01 |
CN111613695B true CN111613695B (zh) | 2021-09-14 |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110546862A (zh) * | 2017-03-31 | 2019-12-06 | 日本电产株式会社 | 汇流条单元及具有该汇流条单元的马达 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102509744B (zh) * | 2011-10-14 | 2013-12-25 | 苏州日和科技有限公司 | 一种输送机构 |
CN202367354U (zh) * | 2011-12-06 | 2012-08-08 | 刘博� | 太阳能电池片单通道串焊机 |
CN103182579A (zh) * | 2011-12-29 | 2013-07-03 | 深圳市晶拓光伏自动化设备有限公司 | 太阳能电池晶硅片串焊机 |
CN103258890A (zh) * | 2013-06-03 | 2013-08-21 | 常州比太科技有限公司 | 一种在太阳能电池片上形成锡电极线的装置 |
CN203679471U (zh) * | 2013-11-29 | 2014-07-02 | 无锡先导自动化设备股份有限公司 | 一种太阳能电池片串焊设备 |
CN104439799B (zh) * | 2014-12-31 | 2016-04-13 | 苏州格林电子设备有限公司 | 一种太阳能电池汇流条焊接生产线 |
CN105436730B (zh) * | 2015-12-30 | 2017-12-15 | 宁夏小牛自动化设备有限公司 | 红外线加热焊接装置及其方法和串焊机 |
CN109693011A (zh) * | 2019-02-21 | 2019-04-30 | 江西宝群电子科技有限公司 | 一种用于硅片焊接焊带的设备 |
CN110977224A (zh) * | 2019-12-19 | 2020-04-10 | 苏州晟成光伏设备有限公司 | 一种电池片用叠瓦串焊装置 |
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2020
- 2020-06-04 CN CN202010500840.XA patent/CN111613695B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110546862A (zh) * | 2017-03-31 | 2019-12-06 | 日本电产株式会社 | 汇流条单元及具有该汇流条单元的马达 |
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Effective date of registration: 20240621 Address after: No.13, 3rd floor, building 1, No.1, Tidu street, Qingyang District, Chengdu, Sichuan 610000 Patentee after: Chengdu yishenrui Technology Co.,Ltd. Country or region after: China Address before: Weidu District Bayi Road Xuchang city Henan province 461000 No. 88 Patentee before: XUCHANG University Country or region before: China |
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Effective date of registration: 20240710 Address after: 533000 In the courtyard of Pingguo Industrial Park Management Service Center, Pingguo City, Baise City, Guangxi Zhuang Autonomous Region Patentee after: Guangxi Dasheng New Energy Technology Co.,Ltd. Country or region after: China Address before: No.13, 3rd floor, building 1, No.1, Tidu street, Qingyang District, Chengdu, Sichuan 610000 Patentee before: Chengdu yishenrui Technology Co.,Ltd. Country or region before: China |
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