CN111599688A - Single chip microcomputer pin convenient to weld and welding method thereof - Google Patents
Single chip microcomputer pin convenient to weld and welding method thereof Download PDFInfo
- Publication number
- CN111599688A CN111599688A CN202010272566.5A CN202010272566A CN111599688A CN 111599688 A CN111599688 A CN 111599688A CN 202010272566 A CN202010272566 A CN 202010272566A CN 111599688 A CN111599688 A CN 111599688A
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- pin
- chip microcomputer
- singlechip
- welding
- single chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
Abstract
The invention discloses a singlechip pin convenient to weld and a welding method thereof, wherein the singlechip pin comprises a mainboard and a singlechip pin, and is characterized in that: the four groups of single-chip microcomputer pins are welded with the mainboard together through the single-chip microcomputer pin holes, and the front and rear groups of single-chip microcomputer pins and the left and right groups of single-chip microcomputer pins are symmetrically distributed; the single chip microcomputer pin comprises a pin body and a welding head, wherein a welding hole which penetrates through the upper end and the lower end of the welding head is formed in the upper end of the welding head, the pin body and the welding head are of an integral structure, and the pin body and the welding head jointly form an S-shaped structure. According to the singlechip pin convenient to weld and the welding method thereof, the singlechip pin is simple in structure and convenient to weld, local high temperature is avoided through a jump welding mode, and the welding quality is improved.
Description
Technical Field
The invention relates to the field of welding of pins of single-chip microcomputers, in particular to a pin of a single-chip microcomputer convenient to weld and a welding method thereof.
Background
The single chip microcomputer is an integrated circuit chip, which is a small and perfect microcomputer system formed by integrating the functions of a central processing unit CPU random access memory RAM, a read only memory ROM, various I/O ports, an interrupt system, a timer/timer and the like (possibly comprising circuits such as a display driving circuit, a pulse width modulation circuit, an analog multiplexer, an A/D converter and the like) with data processing capacity on a silicon chip by adopting a super-large scale integrated circuit technology, and is widely applied to the field of industrial control.
Disclosure of Invention
The invention mainly aims to provide a singlechip pin convenient to weld and a welding method thereof, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a singlechip pin convenient to welding, includes mainboard and singlechip pin, the singlechip pin is provided with four groups and every group is formed by sixteen equidistance distribution's singlechip pin inline, mainboard front end, rear end, left end and right-hand member have all opened sixteen singlechip pin holes, four groups singlechip pin passes through singlechip pin hole and mainboard welding together, and two sets of singlechip pins all distribute in pairs with controlling two sets of singlechip pins around and.
Preferably, the single chip microcomputer pin comprises a pin body and a welding head, a welding hole penetrating through the upper end and the lower end of the welding head is formed in the upper end of the welding head, the pin body and the welding head are of an integral structure, and the pin body and the welding head jointly form an S-shaped structure.
Preferably, the height of the single chip microcomputer pin is smaller than that of the main board.
Preferably, the pin hole of the single chip microcomputer is positioned above a middle secant of the end face of the main board.
Preferably, the upper end face of the single chip microcomputer pin does not exceed the upper end face of the mainboard, and the lower end face of the single chip microcomputer pin is not lower than the lower end face of the mainboard.
Preferably, the method for welding the single chip microcomputer pin convenient to weld is characterized by comprising the following steps:
cleaning a main board, checking pin holes of a single chip microcomputer, and completely processing the periphery of the pin holes of the single chip microcomputer;
secondly, cleaning the pins of the single chip microcomputer, coating a layer of pine oil alcohol solution, and coating soldering tin on a welding head;
thirdly, inserting the welding head of the single chip microcomputer pin with the soldering tin into the cleaned single chip microcomputer pin hole;
fourthly, a clean and constant-temperature soldering bit is adopted, a millimeter soldering tin wire is used for melting for 2 seconds at the installation position of the single chip microcomputer pin, and the single chip microcomputer pin is well welded;
(V) 64 singlechip pins are welded in a jumping manner, firstly, a No. 1 singlechip pin, a No. 17 singlechip pin, a No. 33 singlechip pin and a No. 49 singlechip pin are welded, then, a No. 2 singlechip pin, a No. 18 singlechip pin, a No. 34 singlechip pin and a No. 50 singlechip pin are welded, and the process is repeated, so that 64 singlechip pins are welded in sequence;
and (VI) detecting each singlechip pin through a universal meter until no short circuit exists, and then completing the welding of the singlechip pins.
Compared with the prior art, the invention has the following beneficial effects:
1. in the invention, the upper end surface of the pin of the single chip microcomputer does not exceed the upper end surface of the mainboard, the lower end surface of the pin of the single chip microcomputer is not lower than the lower end surface of the mainboard, and the pin of the single chip microcomputer is in an S-shaped structure and is provided with a welding head with a through hole;
2. before welding, pine oil alcohol solution is adopted to treat and clean the welding ports of the pins of the single chip microcomputer and the pins of the single chip microcomputer on the mainboard, so that the welding quality is ensured, and errors are generated in the welding process.
3. Adopt jump formula welding mode, weld singlechip pin on the different face of mainboard at every turn, utilize the time difference to avoid welding in-process local high temperature, burn components and parts, produce the short circuit between two adjacent singlechip pins when leading to welding.
Drawings
FIG. 1 is an overall structure diagram of a single chip pin convenient for welding according to the present invention;
FIG. 2 is a schematic diagram of the overall structure of a motherboard of a single chip microcomputer convenient for welding according to the present invention;
FIG. 3 is a diagram of a pin structure of a single chip microcomputer for facilitating welding of the pin of the single chip microcomputer according to the present invention;
FIG. 4 is a diagram of the welding steps of the welding method and the welding-facilitated pin of the single chip microcomputer.
In the figure: 1. a main board; 2. a single chip microcomputer pin; 3. a single chip pin hole; 21. a pin body; 22. welding a head; 23. and (6) perforating.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a singlechip pin convenient for welding comprises a mainboard 1 and singlechip pins 2, the singlechip pins 2 are provided with four groups, each group is formed by linearly arranging sixteen singlechip pins 2 distributed at equal intervals, sixteen singlechip pin holes 3 are formed at the front end, the rear end, the left end and the right end of the mainboard 1, the four groups of singlechip pins 2 are welded with the mainboard 1 through the singlechip pin holes 3, and the front and rear groups of singlechip pins 2 and the left and right groups of singlechip pins 2 are symmetrically distributed.
The height of singlechip pin 2 is less than the height of mainboard 1, and singlechip pin 2 all is in unsettled state at the welded in-process with the use, avoids singlechip pin 2 to produce collision or friction with other objects in use or welding process, guarantees its life.
The up end of singlechip pin 2 is no longer than the up end of mainboard 1, and the lower terminal surface of singlechip pin 2 is not less than the lower terminal surface of mainboard 1, makes things convenient for the use in singlechip pin 2 later stage.
A welding method of a singlechip pin convenient for welding is characterized by comprising the following steps:
cleaning the main board 1, checking the pin holes 3 of the single chip microcomputer, and completely processing the periphery of the pin holes 3 of the single chip microcomputer to prevent residues from being left on the main board 1 and the pin holes 3 of the single chip microcomputer to influence welding;
secondly, cleaning the pins 2 of the single chip microcomputer, coating a layer of terpineol solution, and coating soldering tin on the soldering joint 22, wherein the terpineol solution can be used as a disinfection catalyst and a catalyst simultaneously, so that the soldering efficiency is improved;
thirdly, inserting the welding head 22 of the single chip microcomputer pin 2 with soldering tin into the cleaned single chip microcomputer pin hole 3, wherein the hole positions are opposite to each other, the direction of the single chip microcomputer pin 2 does not need to be reversed, and it is confirmed that one end of the welding head 22 on the single chip microcomputer pin 2 is inserted into the single chip microcomputer pin hole 3;
fourthly, a clean and constant-temperature soldering bit is adopted, a millimeter of soldering tin wire is used for melting 2 seconds at the installation position of the single chip microcomputer pin 2, the single chip microcomputer pin 2 is well welded, the soldering point can be reduced through the soldering tin wire, the constant-temperature soldering bit can be placed for 2 seconds, the components can be prevented from being damaged due to overhigh temperature, and short circuit between two adjacent single chip microcomputer pins 2 is prevented;
(V) 64 single-chip microcomputer pins 2 are welded in a jumping mode, firstly, the No. 1 single-chip microcomputer pin 2, the No. 17 single-chip microcomputer pin 2, the No. 33 single-chip microcomputer pin 2 and the No. 49 single-chip microcomputer pin 2 are welded, then, the No. 2 single-chip microcomputer pin 2, the No. 18 single-chip microcomputer pin 2, the No. 34 single-chip microcomputer pin 2 and the No. 50 single-chip microcomputer pin 2 are welded, and by analogy, the 64 single-chip microcomputer pins 2 are welded in sequence, and the jumping welding can avoid damage to a mainboard caused by overhigh local welding temperature, and the welding quality is improved by utilizing space difference and time difference;
and (VI) detecting each singlechip pin 2 through a universal meter until no short circuit occurs, namely completing the welding of the singlechip pins, and ensuring that each singlechip pin 2 is successfully welded and the short circuit phenomenon does not occur.
In order to successfully and efficiently weld the singlechip pin 2 on the mainboard 1, the mainboard 1 is cleaned, the singlechip pin hole 3 is checked, and the periphery of the singlechip pin hole 3 is completely processed, so that the mainboard 1 and the singlechip pin hole 3 are prevented from having residues to influence welding; the method comprises the following steps of cleaning a pin 2 of the single chip microcomputer, coating a layer of terpineol solution, and coating soldering tin on a soldering joint 22, wherein the terpineol solution can be used as a disinfection catalyst and a catalyst simultaneously, so that the soldering efficiency is improved; inserting a welding head 22 of the single chip microcomputer pin 2 with soldering tin into the cleaned single chip microcomputer pin hole 3, wherein the hole positions are opposite to each other, the direction of the single chip microcomputer pin 2 does not need to be reversed, and it is confirmed that one end of the welding head 22 on the single chip microcomputer pin 2 is inserted into the single chip microcomputer pin hole 3; a clean and constant-temperature soldering bit is adopted, a millimeter of solder wire is used for melting 2 seconds at the installation position of the single chip microcomputer pin 2, and the single chip microcomputer pin 2 is well welded, so that a soldering point can be reduced through the solder wire, the constant-temperature soldering bit can be placed for 2 seconds to avoid damage to components due to overhigh temperature, and short circuit between two adjacent single chip microcomputer pins 2 is prevented; the 64 single-chip microcomputer pins 2 are welded in a jumping mode, firstly, the No. 1 single-chip microcomputer pin 2, the No. 17 single-chip microcomputer pin 2, the No. 33 single-chip microcomputer pin 2 and the No. 49 single-chip microcomputer pin 2 are welded, then, the No. 2 single-chip microcomputer pin 2, the No. 18 single-chip microcomputer pin 2, the No. 34 single-chip microcomputer pin 2 and the No. 50 single-chip microcomputer pin 2 are welded, and the like, the 64 single-chip microcomputer pins 2 are welded in sequence, the jumping welding can avoid damage to a main board caused by overhigh local welding temperature, and the welding quality is improved by utilizing space difference and time; the welding of the pins of the single chip microcomputer is completed until no short circuit occurs in each single chip microcomputer pin 2 through the universal meter detection, the fact that each single chip microcomputer pin 2 is welded successfully is guaranteed, the short circuit phenomenon does not occur, and the welding method can be used after 64 single chip microcomputer pins 2 are all checked.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a singlechip pin convenient to welding, includes mainboard (1) and singlechip pin (2), its characterized in that: singlechip pin (2) are provided with four groups and every group is formed by sixteen singlechip pin (2) linear arrangements that the equidistance distributes, mainboard (1) front end, rear end, left end and right-hand member all open sixteen singlechip pin holes (3), four groups singlechip pin (2) are in the same place through singlechip pin hole (3) and mainboard (1) welding, and two sets of singlechip pin (2) all distribute in pairs with controlling two sets of singlechip pin (2) around and.
2. The singlechip pin convenient to weld of claim 1, which is characterized in that: the single chip microcomputer pin (2) comprises a pin main body (21) and a welding head (22), the upper end of the welding head (22) is provided with a welding hole (23) which penetrates through the upper end and the lower end, the pin main body (21) and the welding head (22) are of an integral structure, and the pin main body (21) and the welding head (22) jointly form an S-shaped structure.
3. The singlechip pin convenient to weld of claim 1, which is characterized in that: the height of the single chip microcomputer pin (2) is smaller than that of the main board (1).
4. The singlechip pin convenient to weld of claim 1, which is characterized in that: the pin hole (3) of the single chip microcomputer is positioned above a middle secant of the end face of the main board (1).
5. The singlechip pin convenient to weld of claim 1, which is characterized in that: the upper end face of the single chip microcomputer pin (2) does not exceed the upper end face of the mainboard (1), and the lower end face of the single chip microcomputer pin (2) is not lower than the lower end face of the mainboard (1).
6. The method for welding the pins of the single chip microcomputer conveniently welded according to the claims 1-5, is characterized by comprising the following steps:
cleaning a main board (1), checking pin holes (3) of a single chip microcomputer, and completely processing the periphery of the pin holes (3) of the single chip microcomputer;
secondly, cleaning the pins (2) of the single chip machine, coating a layer of pine oil alcohol solution, and coating soldering tin on the soldering joint (22);
thirdly, inserting a welding head (22) of the single chip microcomputer pin (2) with the soldering tin into the cleaned single chip microcomputer pin hole (3);
fourthly, a clean and constant-temperature soldering bit is adopted, a millimeter of soldering tin wire is used for melting for 2 seconds at the installation position of the single chip microcomputer pin (2), and the single chip microcomputer pin (2) is well welded;
fifthly, 64 single-chip microcomputer pins (2) are welded in a jumping mode, firstly, the No. 1 single-chip microcomputer pin (2), the No. 17 single-chip microcomputer pin (2), the No. 33 single-chip microcomputer pin (2) and the No. 49 single-chip microcomputer pin (2) are welded, then, the No. 2 single-chip microcomputer pin (2), the No. 18 single-chip microcomputer pin (2), the No. 34 single-chip microcomputer pin (2) and the No. 50 single-chip microcomputer pin (2) are welded, and by analogy, the 64 single-chip microcomputer pins (2) are welded in sequence;
and (VI) detecting each singlechip pin (2) through a universal meter until no short circuit exists, and then completing the welding of the singlechip pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010272566.5A CN111599688A (en) | 2020-04-09 | 2020-04-09 | Single chip microcomputer pin convenient to weld and welding method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010272566.5A CN111599688A (en) | 2020-04-09 | 2020-04-09 | Single chip microcomputer pin convenient to weld and welding method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111599688A true CN111599688A (en) | 2020-08-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010272566.5A Pending CN111599688A (en) | 2020-04-09 | 2020-04-09 | Single chip microcomputer pin convenient to weld and welding method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111599688A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008027713A (en) * | 2006-07-20 | 2008-02-07 | Matsushita Electric Works Ltd | Inter-substrate connector |
| CN201667411U (en) * | 2010-03-31 | 2010-12-08 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN103943984A (en) * | 2013-01-18 | 2014-07-23 | 株式会社竹内技术研究所 | Substrate connector and female header thereof |
| CN210075713U (en) * | 2019-03-18 | 2020-02-14 | 惠州市东日电子有限公司 | Pcba |
-
2020
- 2020-04-09 CN CN202010272566.5A patent/CN111599688A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008027713A (en) * | 2006-07-20 | 2008-02-07 | Matsushita Electric Works Ltd | Inter-substrate connector |
| CN201667411U (en) * | 2010-03-31 | 2010-12-08 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN103943984A (en) * | 2013-01-18 | 2014-07-23 | 株式会社竹内技术研究所 | Substrate connector and female header thereof |
| CN210075713U (en) * | 2019-03-18 | 2020-02-14 | 惠州市东日电子有限公司 | Pcba |
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Application publication date: 20200828 |