CN111584741B

CN111584741B - Display substrate, display device and packaging method thereof

Info

Publication number: CN111584741B
Application number: CN202010382879.6A
Authority: CN
Inventors: 马昆松
Original assignee: TCL Huaxing Photoelectric Technology Co Ltd
Current assignee: TCL Huaxing Photoelectric Technology Co Ltd
Priority date: 2020-05-08
Filing date: 2020-05-08
Publication date: 2022-12-23
Anticipated expiration: 2040-05-08
Also published as: CN111584741A

Abstract

The application discloses display substrate has a base plate, set up in a plurality of luminescent device on the base plate, display substrate still includes: a discontinuous organic layer configured to be disposed around an edge of the light emitting device and expose the light emitting device and a portion of the substrate; and the packaging layer is provided with a first inorganic layer which is arranged on the discontinuous organic layer and covers the exposed light-emitting device, the exposed part of the substrate and the discontinuous organic layer.

Description

Display substrate, display device and packaging method thereof

Technical Field

The application relates to the field of organic electroluminescent device displays, in particular to a display substrate, a display device and a packaging method thereof.

Background

Organic electroluminescent displays (OLEDs) are widely researched and applied due to their advantages of self-luminescence, fast response speed, high contrast, lightness, thinness, low power consumption, wide viewing angle, etc., and flexible OLEDs have the advantages of lightness, thinness, and flexibility.

In an OLED display structure, a thin film packaging process is a key factor for realizing a flexible product, and the quality of a packaging effect directly influences the service life of the flexible product. Especially for bendable products, the stability of the film encapsulation is of crucial importance. Referring to fig. 1A to 1D, fig. 1A is a schematic structural diagram of a display device in the prior art; FIG. 1B is a schematic view of the display device shown in FIG. 1A after being bent; FIG. 1C is a schematic diagram of another prior art display device; fig. 1D is a schematic structural view of the display device in fig. 1C after being bent. As shown in fig. 1A to 1D, a conventional display apparatus includes a substrate 100, a plurality of light emitting devices 200 disposed on the substrate 100, and an encapsulation layer 300 disposed on the plurality of organic light emitting devices 200 and covering the plurality of organic light emitting devices 200, in order to implement a flexible display, a typical encapsulation layer 300 currently used is a laminated structure of a first inorganic layer 101/an organic layer 102/a second inorganic layer 103, but in order to ensure good water and oxygen barrier performance, the thicknesses of the first inorganic layer 101 and the second inorganic layer 103 are about 1 μm, which reduces the lifetime of a bent product, and in order to cover impurity particles (particles) possibly existing on the surface of the first inorganic layer 101, the thickness of the organic layer 102 is about 12 μm, which results in a large flexible bending radius, and cracks 1011 may occur in the organic layer 102 at the step of the light emitting device 200.

In order to solve the above problems that may occur in the thin film packaging process, it is urgently needed to provide a new display substrate, a display device and a packaging method thereof.

Disclosure of Invention

The application provides a display substrate, a display device and an encapsulation method thereof, wherein a discontinuous organic layer is arranged, the discontinuous organic layer is configured to be arranged around the edge of a light-emitting device and expose the light-emitting device and a part of the substrate, and a first inorganic layer arranged on the discontinuous organic layer covers the exposed light-emitting device and the exposed part of the substrate and the discontinuous organic layer, the material of the discontinuous organic layer is acrylic resin, the discontinuous organic layer has fluidity and can wrap impurity particles possibly existing in the display substrate, and the discontinuous organic layer can achieve the purpose of reducing the bending stress of the first inorganic layer.

The application provides a display substrate, have a base plate, set up in a plurality of luminescent device on the base plate, display substrate still includes: a discontinuous organic layer configured to be disposed around an edge of the light emitting device and expose the light emitting device and a portion of the substrate; and the packaging layer is provided with a first inorganic layer, and the first inorganic layer is arranged on the discontinuous organic layer and covers the exposed light-emitting device, the exposed part of the substrate and the discontinuous organic layer.

In some embodiments, the material of the discontinuous organic layer is an acrylic resin.

In some embodiments, the encapsulation layer further comprises: at least one buffer layer disposed on the first inorganic layer; the second inorganic layer is arranged on the buffer layer and covers the first inorganic layer and the buffer layer; wherein the buffer layer is made of hexamethyldisiloxane.

In some embodiments, the buffer layer includes a first buffer layer and a second buffer layer, wherein the first buffer layer has a thickness of 2 μm to 4 μm, the second buffer layer has a thickness of 1 μm to 4 μm, and the hardness of the second buffer layer is greater than the hardness of the first buffer layer.

In some embodiments, an edge of each of the light emitting devices forms a step with a surface of the substrate, and the discontinuous organic layer is configured to be disposed at the step.

The application also provides a display device, which comprises the display substrate.

The present application further provides a packaging method of a display substrate, for packaging at least one light emitting device formed on a substrate, the packaging method comprising: a step of forming a discontinuous organic layer, wherein the discontinuous organic layer is configured to be disposed around an edge of the light emitting device and expose the light emitting device and a portion of the substrate, and a material of the discontinuous organic layer is acrylic resin.

In some embodiments, the packaging method further comprises: a step of forming a first inorganic layer on the discontinuous organic layer, the first inorganic layer covering the exposed light emitting device, the exposed portion of the substrate, and the discontinuous organic layer; forming at least one buffer layer on the first inorganic layer, wherein the buffer layer comprises a first buffer layer and a second buffer layer which are sequentially formed, and the buffer layer is made of hexamethyldisiloxane; and a step of forming a second inorganic layer on the buffer layer, the second inorganic layer covering the first inorganic layer and the buffer layer.

In some embodiments, the first inorganic layer and the second inorganic layer are each formed by a chemical vapor deposition method, and the first inorganic layer and the second inorganic layer have a thickness of 0.5 μm to 1 μm.

In some embodiments, the first inorganic layer and the second inorganic layer are each formed by an atomic layer deposition method, and the first inorganic layer and the second inorganic layer have a thickness of 20nm to 50nm.

According to the display substrate, the display device and the packaging method thereof provided by the embodiment of the application, a discontinuous organic layer is arranged, wherein the discontinuous organic layer is configured to be arranged around the edge of a light-emitting device and expose the light-emitting device and a part of the substrate, the material of the discontinuous organic layer is acrylic resin, and the discontinuous organic layer has fluidity and can wrap impurity particles possibly existing in the display substrate; a step is formed between the edge of each light-emitting device and the surface of the substrate, and the discontinuous organic layer is configured to be arranged at the step, so that the purpose of reducing the bending stress of the first inorganic layer of the packaging layer in the bending deformation process is achieved, and the first inorganic layer is prevented from being broken; and at least one buffer layer is arranged, the buffer layer is made of hexamethyldisiloxane, the buffer layer comprises a first buffer layer and a second buffer layer, the hardness of the second buffer layer is greater than that of the first buffer layer, the first buffer layer wraps impurity particles possibly existing in the display substrate to relieve stress, and the second buffer layer plays a role in blocking water and oxygen. Therefore, this application display substrate reaches display device can strengthen encapsulation effect and stability, extension light emitting device's life-span reduces the thickness of encapsulation layer, and then reduces display device's thickness has realized having reduced the radius of buckling of products such as flexible display screen.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1A is a schematic structural diagram of a display substrate in the prior art.

Fig. 1B is a schematic structural view of the display substrate shown in fig. 1A after being bent.

FIG. 1C is a schematic diagram of another prior art display substrate.

Fig. 1D is a schematic structural view of the display substrate shown in fig. 1C after being bent.

Fig. 2A is a schematic structural diagram of a display substrate according to the present application.

Fig. 2B is a diagram illustrating an actual effect of the display substrate of fig. 2A.

Fig. 3A to 3D are flow charts illustrating steps of fabricating a display substrate according to an embodiment.

Fig. 4A to 4D are diagrams illustrating actual effects of the display substrate according to an embodiment.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically, electrically or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. To simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Further, the present application may repeat reference numerals and/or reference letters in the various examples for simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or arrangements discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Specifically, please refer to fig. 2A and fig. 2B, wherein fig. 2A is a schematic structural diagram of a display substrate according to the present application; fig. 2B is a diagram illustrating an actual effect of the display substrate of fig. 2A. As shown in fig. 2A, in the present embodiment, a display substrate is provided, which includes a substrate 100, a plurality of light emitting devices (OLED devices) 200 disposed on the substrate 100, a discontinuous organic layer 300 disposed on the plurality of light emitting devices 200, and an encapsulation layer 400. Wherein the discontinuous organic layer 300 is configured to be disposed around an edge of the light emitting device 200 and expose the light emitting device 200 and a portion of the substrate 100. And the encapsulation layer 400 is used for encapsulating the light emitting device 200, the encapsulation layer 400 has a first inorganic layer 401, and the first inorganic layer 401 is disposed on the discontinuous organic layer 300 and covers the exposed light emitting device 200, the exposed portion of the substrate 100, and the discontinuous organic layer 300.

In this embodiment, the material of the discontinuous organic layer 300 is acrylic resin, and the discontinuous organic layer 300 has fluidity. As shown in fig. 2A and 2B, since the light emitting devices 200 have a certain height relative to the substrate 100, a step is formed between an edge of each light emitting device 200 and a surface of the substrate 100, and the discontinuous organic layer 300 is configured to be disposed at the step, and since the material of the discontinuous organic layer 300 has fluidity, the discontinuous organic layer 300 is filled at the step, which can reduce the bending stress of a first inorganic layer 401 of the encapsulation layer 400 during the bending deformation process, and prevent the first inorganic layer 401 from being broken.

Due to the process limitation, there may be impurity particles in the display substrate, and due to the flowability of the discontinuous organic layer 300, the discontinuous organic layer 300 may cover a portion of the impurity particles that may be present, for example, the discontinuous organic layer 300 covers the impurity particles on the substrate 100 and the light emitting device 200, and the discontinuous organic layer 300 may reduce the stress generated due to the presence of the impurity particles, and may further reduce the risk of the first inorganic layer 401 breaking during the bending process.

As shown in fig. 2A and 2B, the encapsulation layer 400 further includes at least a buffer layer and a second inorganic layer 404, wherein the buffer layer is disposed on the first inorganic layer 401, the second inorganic layer 404 is disposed on the buffer layer and covers the buffer layer and the first inorganic layer 401, and the material of the buffer layer is preferably hexamethyldisiloxane (HMDSO, alternatively referred to as hexamethyldisiloxane), and the encapsulation layer 400 is used to prevent the plurality of light emitting devices 200 from being exposed to an external water-oxygen environment.

As shown in fig. 2A and 2B, in the present embodiment, the buffer layers of the encapsulation layer 400 include a first buffer layer 402 and a second buffer layer 403, wherein the first buffer layer 402 has a thickness of 2 μm to 4 μm, the second buffer layer 403 has a thickness of 1 μm to 4 μm, and the hardness of the second buffer layer 403 is greater than the hardness of the first buffer layer 402.

In this embodiment, the material of the first buffer layer 402 and the second buffer layer 403 is hexamethyldisiloxane, which has the characteristics of low stress and extremely high light transmittance, can provide good particle coverage, is not easy to form holes or diffusion channels, and can highly meet the requirements of structures, materials, functions, and the like in the fields of flexible display, and the like. Wherein the first buffer layer 402 has the characteristics of small hardness, good flow property, stress buffering, particle coating and flexibility; and the second buffer layer 403 has the properties of high hardness, poor flow property, effective water and oxygen barrier, and the like, and the second buffer layer 403 is used as a barrier layer and has good water and oxygen barrier properties. Secondly, the side of the buffer layer away from the first inorganic layer 401 is a planarized surface, and the buffer layer further planarizes the second inorganic layer 404, so that the packaging effect can be further enhanced.

It is worth mentioning that, in the case of the display substrate having the impurity particles, the impurity particles may be partially exposed to the outside of the first inorganic layer 401, and still have a problem that the first inorganic layer 401 is easily broken when being bent. Due to the characteristics of small hardness and good flow property of the first buffer layer 402, the first buffer layer 402 can be used as a buffer function layer to compensate for the defects of fracture and the like of the first inorganic layer 401, a flat surface is formed on the side of the first buffer layer 402 away from the first inorganic layer 401 due to good fluidity, the first buffer layer 402 can provide good particle coverage as a buffer function film layer, the first buffer layer 402 is used for covering possible impurity particles, and the buffer function film layer has high transmittance.

In this embodiment, the second buffer layer 403 has higher hardness and poorer flowability than the first buffer layer 402, the second buffer layer 403 has a certain water and oxygen barrier capability, the encapsulation effect is enhanced, the first inorganic layer 401 is further covered by the second buffer layer 403, impurity particles possibly existing outside the first inorganic layer 401 are covered, and the second inorganic layer 305 can be planarized.

In addition, the surfaces of the first buffer layer 402 and the second buffer layer 403 on the side of the first inorganic layer 401 away from the substrate 100 are more easily leveled, and the first inorganic layer 401 can be completely covered with only a small amount of material, so that the thicknesses of the first buffer layer 402 and the second buffer layer 403 can be greatly reduced, and the thickness of the encapsulation layer 400 can be further reduced.

It is worth mentioning that in some other embodiments, the material of the first buffer layer 402 and the second buffer layer 403 is hexamethyldisiloxane, which can also be used as an adhesive, and the first buffer layer 402 and the second buffer layer 403 can enhance the adhesive force between the first buffer layer 402 and the second inorganic layer 404, prevent the first inorganic layer 401 and the second inorganic layer 404 from being separated, and further prolong the service life of the light emitting devices 200.

Therefore, in this embodiment, the design of the structure and the material of the discontinuous organic layer 300, the first buffer layer 402, and the second buffer layer 403 can reduce the possibility of the package layer 400 of the light emitting device 200 breaking during the bending process, and play a role in well eliminating the residual stress of the first inorganic layer 401 and the second inorganic layer 404, thereby enhancing the package effect and stability, prolonging the life of the light emitting device 200, reducing the thickness of the package layer 400, and reducing the bending radius of the flexible product.

The following describes in detail a packaging method for a display substrate for packaging at least one light emitting device 200 formed on a substrate 100 with reference to fig. 3A to 3D and fig. 4A to 4D, the packaging method comprising:

and S01, forming a discontinuous organic layer 300, wherein the discontinuous organic layer 300 is configured to be arranged around the edge of the light-emitting device 200 and expose the light-emitting device 200 and a part of the substrate 100, and the discontinuous organic layer 300 is made of acrylic resin.

In this embodiment, the substrate 100 includes a thin film transistor layer (not shown) arranged in an array, and the material of the substrate 100 is Polyimide (PI), which has excellent thermal property, mechanical property, electrical property, stability, film forming property, high optical transparency, lower moisture absorption rate, planarization property and adhesion property, and is helpful for improving the bending property of the substrate 100.

In this embodiment, the plurality of light emitting devices 200 may be formed by a vacuum thermal evaporation method.

As shown in fig. 3A and 4A, in the present embodiment, the discontinuous organic layer 300 is deposited on the light emitting device 200 by a Plasma Enhanced Chemical Vapor Deposition (PECVD) method, the material of the discontinuous organic layer 300 is preferably acrylic resin, and the acrylic resin is one of acrylic materials, has good fluidity, can reduce stress generated during bending, and can reduce the risk of fracture generated by the first inorganic layer 401.

S02, forming a first inorganic layer 401 on the discontinuous organic layer 300, wherein the first inorganic layer 401 covers the exposed light-emitting device 200, the exposed portion of the substrate 100 and the discontinuous organic layer 300;

as shown in fig. 3B and 4B, the first inorganic layer 401 is deposited on a side of the discontinuous organic layer 300 facing away from the light emitting device 200, in some embodiments, the first inorganic layer 401 is prepared by a method including, but not limited to, at least one of plasma enhanced chemical vapor deposition, atomic layer deposition, and pulsed laser deposition, and the material of the first inorganic layer 401 is at least one selected from silicon oxide (SiO), silicon nitride (SiN), and aluminum oxide (ai O);

as a preferred embodiment, the first inorganic layer 401 is formed by a chemical vapor deposition (PECVD) method, the material of the first inorganic layer 401 is selected from at least one of silicon nitride (SiN) or silicon oxide (SiO, preparation temperature is 350 ℃), and the thickness of the first inorganic layer 401 is formed to be 0.5 μm to 1 μm;

as another alternative embodiment, the first inorganic layer 401 may also be prepared by using an Atomic Layer Deposition (ALD), the material of the first inorganic layer 401 is selected from at least one of silicon oxide (SiO) or aluminum oxide (Al O), and the thickness of the first inorganic layer 401 is 20nm to 50nm.

S03, forming at least one buffer layer on the first inorganic layer 401, wherein the buffer layer includes a first buffer layer 402 and a second buffer layer 403 which are sequentially formed, and the buffer layer is made of hexamethyldisiloxane;

in this embodiment, as shown in fig. 3C and 4C, as a preferred implementation, the first buffer layer 402 and the second buffer layer 403 are deposited first and then on the side of the first inorganic layer 401 facing away from the discontinuous organic layer 300; specifically, the first buffer layer 402 and the second buffer layer 403 are formed by plasma enhanced chemical vapor deposition, and are formed by flowing an oxygen-containing gas and an HMDSO gas in the preparation process, in this embodiment, nitrous oxide (N2O, commonly called laughing gas) is used as the oxygen-containing gas, and the first buffer layer 402 and the second buffer layer 403 are formed first and last by controlling the ratio (flow rate) of N2O/HMDSO and by changing the radio frequency power in the deposition process.

As a preferred embodiment, the thickness of the first buffer layer 402 deposited and formed in the direction perpendicular to the substrate 100 is 2 μm to 4 μm; the second buffer layer 403 is deposited to have a thickness of 1 μm to 4 μm in a direction perpendicular to the substrate 100.

S04, forming a second inorganic layer 404 on the buffer layer, wherein the second inorganic layer 404 covers the first inorganic layer 401 and the buffer layer.

In this step, as shown in fig. 3A to 3D, and as shown in fig. 4A to 4D, the second inorganic layer 404 is deposited and formed on a side of the second buffer layer 403 facing away from the first buffer layer 402; as a preferred embodiment, the preparation method of the second inorganic layer 404 is the same as the preparation method of the first inorganic layer 401, the selection of materials, and the preparation thickness of the film layer, that is: if the second inorganic layer 404 is formed by a chemical vapor deposition method, the material of the second inorganic layer 404 is selected from at least one of silicon nitride (SiN) or silicon oxide (SiO, preparation temperature is 350 ℃), and the thickness of the second inorganic layer 404 is 0.5 μm to 1 μm; or, the second inorganic layer 404 is prepared by an atomic layer deposition method, the material of the second inorganic layer 404 is at least one selected from silicon oxide (SiO) or aluminum oxide (Al O), and the thickness of the second inorganic layer 404 is 20nm to 50nm. The surface of the second inorganic layer 404 facing away from the second buffer layer 403 forms a planarized surface.

In this step, it should be further noted that the whole packaging process adopts Vacuum film formation, and Vacuum-N2 conversion is not needed, so that the generation of impurity particles can be reduced.

It can be understood by those skilled in the art that the display substrate of the above embodiments may be included in a display device, the display device includes the display substrate as described above, and the display substrate and the display device have flexibility and are foldable.

As shown in fig. 2A and 2B, embodiments of the present application provide a display substrate, a display device, and a method for encapsulating the same, by providing a discontinuous organic layer 300, wherein the discontinuous organic layer 300 is configured to be disposed around an edge of a light emitting device 200 and expose the light emitting device 200 and a portion of a substrate 100, the material of the discontinuous organic layer 300 is acrylic resin, and the discontinuous organic layer 300 has fluidity and is capable of encapsulating impurity particles that may be present in the display substrate; moreover, a step is formed between the edge of each light-emitting device 200 and the surface of the substrate 100, and the discontinuous organic layer 300 is configured to be disposed at the step, so as to achieve the purpose of reducing the bending stress of the first inorganic layer 401 of the encapsulation layer 400 during the bending deformation process, and avoid the first inorganic layer 401 from being broken; and providing at least one buffer layer, wherein the material of the buffer layer is hexamethyldisiloxane, the buffer layer comprises a first buffer layer 402 and a second buffer layer 403, the hardness of the second buffer layer 403 is greater than that of the first buffer layer 402, the first buffer layer 402 wraps impurity particles possibly existing in the display substrate to relieve stress, and the second buffer layer 403 plays a role of water-oxygen barrier. Therefore, the display substrate, the display device and the packaging method thereof can enhance the packaging effect and stability, prolong the service life of the light-emitting device 200, reduce the thickness of the packaging layer 400, further reduce the thickness of the display device, and reduce the bending radius of products such as flexible display screens.

The display substrate, the display device and the packaging method thereof provided by the embodiments of the present application are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the embodiments is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. A display substrate having a substrate, a plurality of light emitting devices disposed on the substrate, wherein an edge of each of the light emitting devices forms a step with a surface of the substrate, the display substrate further comprising:

a discontinuous organic layer made of a flowable acrylic-based material, the discontinuous organic layer being configured to expose the light emitting device and a portion of the substrate, and the portion of the discontinuous organic layer being disposed around an edge of the light emitting device and at the step;

and the packaging layer is provided with a first inorganic layer which is arranged on the discontinuous organic layer and covers the exposed light-emitting device, the exposed part of the substrate and the discontinuous organic layer.

2. The display substrate according to claim 1, wherein the material of the discontinuous organic layer is an acrylic resin.

3. The display substrate of claim 2, wherein the encapsulation layer further comprises:

at least one buffer layer disposed on the first inorganic layer; and (c) a second step of,

a second inorganic layer disposed on the buffer layer and covering the first inorganic layer and the buffer layer;

wherein the buffer layer is made of hexamethyldisiloxane.

4. The display substrate of claim 3, wherein the buffer layer comprises a first buffer layer and a second buffer layer, wherein the first buffer layer has a thickness of 2 μm to 4 μm, the second buffer layer has a thickness of 1 μm to 4 μm, and the second buffer layer has a hardness greater than the hardness of the first buffer layer.

5. A display device comprising the display substrate according to any one of claims 1 to 4.

6. A packaging method of a display substrate is used for packaging at least one light-emitting device formed on a substrate, and the edge of each light-emitting device and the surface of the substrate form a step, and the packaging method comprises the following steps:

forming a discontinuous organic layer, wherein the discontinuous organic layer is configured to expose the light-emitting device and a part of the substrate, and a part of the discontinuous organic layer is arranged around the edge of the light-emitting device and is positioned at the step, and the material of the discontinuous organic layer is acrylic resin;

a step of forming a first inorganic layer on the discontinuous organic layer, the first inorganic layer covering the exposed light emitting device, the exposed portion of the substrate, and the discontinuous organic layer;

forming at least one buffer layer on the first inorganic layer, wherein the buffer layer comprises a first buffer layer and a second buffer layer which are sequentially formed, and the buffer layer is made of hexamethyldisiloxane;

and a step of forming a second inorganic layer on the buffer layer, the second inorganic layer covering the first inorganic layer and the buffer layer.

7. The method of claim 6, wherein the first inorganic layer and the second inorganic layer are formed by chemical vapor deposition, and the first inorganic layer and the second inorganic layer each have a thickness of 0.5 μm to 1 μm.

8. The method for encapsulating a display substrate according to claim 6, wherein the first inorganic layer and the second inorganic layer are formed by an atomic layer deposition method, and a thickness of each of the first inorganic layer and the second inorganic layer is 20nm to 50nm.