CN111584704B - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
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- CN111584704B CN111584704B CN202010427434.5A CN202010427434A CN111584704B CN 111584704 B CN111584704 B CN 111584704B CN 202010427434 A CN202010427434 A CN 202010427434A CN 111584704 B CN111584704 B CN 111584704B
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- circuit board
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- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 23
- 239000000843 powder Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 44
- 238000004898 kneading Methods 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 description 39
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 27
- 230000000694 effects Effects 0.000 description 7
- 230000002452 interceptive effect Effects 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to the technical field of diodes, in particular to a light emitting diode; the circuit comprises a PN junction and two pins arranged at the bottom of the PN junction, wherein the two pins are respectively a positive electrode and a negative electrode of the PN junction; the middle part of each pin is provided with a main annular groove along the horizontal direction, and the pin at the position of the main annular groove is provided with an auxiliary annular groove; according to the invention, the main annular groove and the auxiliary annular groove are formed in the pins, the mortar layer is sleeved outside the pins at the main annular groove and the auxiliary annular groove, when the length of the pins needs to be shortened before welding, the outer pipe and the mortar layer can be loosened only by twisting the outer pipe, then the outer pipe is pulled out of the pins, the mortar layer slowly falls off in a kneading mode, and the auxiliary annular groove is leaked out, then the pins at the positions are thinner due to the formation of the auxiliary annular groove, and can be broken from the auxiliary annular groove, so that the length of the pins can be shortened, the pins do not need to be pulled after the welding is finished, and the firmness of the welding position is ensured.
Description
Technical Field
The invention belongs to the technical field of diodes, and particularly relates to a light emitting diode.
Background
The light emitting diode is a commonly used light emitting device, emits light by energy released by recombination of electrons and holes, and is widely applied in the field of illumination. The light emitting diode can efficiently convert electric energy into light energy, and has wide application in modern society, such as illumination, flat panel display, medical devices and the like; such electronic devices appeared as early as 1962, and only low-intensity red light was emitted in the early stage, and other versions of monochromatic light were developed later, and the light emitted so far has spread to visible light, infrared light and ultraviolet light, and the light intensity has been improved to a comparable level. The utility model can be used as an indicator light, a display panel and the like at the beginning; with the continuous progress of technology, light emitting diodes have been widely used for displays and lighting.
Some technical solutions related to diodes also appear in the prior art, for example, chinese patent application No. 2013101360141 discloses a frame structure of diodes connected in series in a forward direction, which divides a core carrier board into two independent areas, the core carrier board and two sides form a 45-degree recess, the bending size of the frame is reduced, the area of a lengthened middle rib pin is widened, not only the space of an integrated circuit is greatly saved, but also the pin soldering point is reduced, and simultaneously the risks of insufficient soldering and desoldering are reduced, the reliability of the product use is effectively increased, the plastic package and storage are easy, but in order to be suitable for a thicker circuit board, the length of the pin is longer, when a thinner circuit board is encountered, after the pin is soldered on the circuit board, the longer part of the pin needs to be moved to the soldering position to prevent the longer pin from interfering with other electronic components, when the pin is moved, in view of the fact that solder joints are easy to loosen and welding quality is affected, the invention provides a light emitting diode which can quickly change the length of a pin when a circuit board is thin, prevent the pin from interfering other electronic elements and ensure welding firmness.
Disclosure of Invention
In view of the deficiencies of the prior art, the present invention provides a light emitting diode to solve the problems set forth in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a light emitting diode comprises a PN junction and two pins arranged at the bottom of the PN junction, wherein the two pins are respectively a positive electrode and a negative electrode of the PN junction; the middle part of each pin is provided with a main annular groove along the horizontal direction, and the pin at the position of the main annular groove is provided with an auxiliary annular groove; the pins at the main annular groove are sleeved with outer tubes, and mortar layers are arranged between the outer tubes and the pins; when the LED is in work, the length of the pin of the LED is longer in order to be suitable for a thicker circuit board, but when the LED meets a thinner circuit board, the longer part of the pin needs to be pulled to a welding position after the pin is welded on the circuit board, so that the longer pin is prevented from interfering other electronic elements, and when the pin is pulled, welding spots are easy to loosen, and the welding quality is influenced; the specific measures and the using process are as follows: the pins are provided with the main annular groove and the auxiliary annular groove, the outer sides of the pins at the main annular groove and the auxiliary annular groove are sleeved with the mortar layer, when the length of the pins needs to be shortened before welding, the outer pipe and the mortar layer can be loosened only by twisting the outer pipe, then the outer pipe is pulled out of the pins, the mortar layer slowly falls off in a kneading mode, the auxiliary annular groove is leaked, then the pins at the positions are thin due to the arrangement of the auxiliary annular groove, the pins can be broken from the auxiliary annular groove, the length of the pins can be shortened, the pins do not need to be pulled after welding is completed, and the firmness of the welding position is ensured; the mortar layer is not easy to fall off from the pins before the outer pipe loosens due to the blocking effect of the pins at the main annular groove and the auxiliary annular groove.
Preferably, the positions of two sides of the outer pipe, which are close to the top, are fixedly connected with top plates, and the end parts of the top plates are inclined downwards; the bottom plates are fixedly connected to the positions, close to the top, of the two sides of the outer pipe, and the end parts of the bottom plates incline upwards; the inner wall of the outer pipe is subjected to frosting treatment; when the hole that welds of circuit board is great, and the pin is less, can be when inserting the pin in the hole that welds, make the outer tube be located hole department, at this moment, the roof that makes on the outer tube is located the circuit board top, make the bottom plate on the outer tube be located the circuit board bottom, make roof and bottom plate chucking on the circuit board, then to outer tube top welding round soldering tin, with the pin through soldering tin, outer tube and circuit board welding together, the use of soldering tin has been reduced, and the bottom plate can play fixed effect to the pin, prevent that the pin from upwards becoming flexible, cause the not hard up of soldering tin and circuit board.
Preferably, a groove is arranged at the bottom of the bottom plate close to the end part of the bottom plate, a rubber hollow ball is arranged in the groove, and a part of the rubber hollow ball is positioned at the top of the bottom plate; when the bottom plate pastes tight circuit board bottom, the rubber empty ball can have certain elasticity to the bottom plate, and then the bottom plate has decurrent thrust to the pin, and then the pin can drive the tight adhesion of the soldering of outer tube top department on the circuit board surface, the welded fastness has been improved, and simultaneously, if need improve during welded intensity, can carry out the soldering in rubber empty ball department, make the rubber empty ball melt, and then can deposit a certain amount of soldering in the recess, soldering and circuit board bottom welding back together, the soldering in the recess can play certain effect of blockking to the horizontal migration of bottom plate, when the PN junction has the trend of slope, can reduce the ascending removal of bottom plate horizontal direction, and then improved the stability after the tin welding.
Preferably, the end part of the bottom plate is inserted with an inclined rod, one end of the inclined rod is positioned in the rubber hollow ball, and one end of the inclined rod positioned in the rubber hollow ball is connected with the bottom plate through an elastic rope; when the bottom plate is attached to the bottom of the circuit board tightly, the rubber hollow ball has certain elasticity for the bottom plate, and the rubber hollow ball is extruded to a certain degree, so that the gas in the rubber hollow ball expands, the inclined rod can be pushed to move, the inclined rod stretches the elastic rope, the end part of the inclined rod is abutted to the bottom of the circuit board tightly, and when the inclined rod is abutted to the bottom of the circuit board tightly, a certain friction effect can be achieved between the inclined rod and the circuit board, so that the movement of the bottom plate in the horizontal direction can be reduced, and the stability after tin welding is improved.
Preferably, the top plate and the bottom plate are both provided with sawtooth openings; stainless steel powder is bonded at the sawtooth opening; after all seted up the sawtooth mouth on roof and the bottom plate, after here tin welding, the partly soldering tin of welding on the circuit board can get into the sawtooth mouth, and then can make the area of contact grow of soldering tin and roof and bottom plate, prevent to produce between soldering and roof and bottom plate not hard up, bond in sawtooth mouth department simultaneously and have the stainless steel powder after, can make the roughness grow of sawtooth mouth department, further reduced and produced not hard up probability between soldering and roof and bottom plate.
Preferably, a plurality of through holes are formed in the end part of the top plate, the through holes are arranged in the vertical direction, and the diameter of the top end of each through hole is smaller than that of the bottom end of each through hole; a plurality of through-holes of seting up on the roof can also have soldering tin to get into in the through-hole when welding the roof in circuit board bottom, and then the soldering tin that gets into in the through-hole can paste tightly with the circuit board, has improved the area of contact of soldering tin with the circuit board, and then has improved welded intensity.
The invention has the technical effects and advantages that:
1. according to the LED provided by the invention, the main annular groove and the auxiliary annular groove are formed in the pin, the mortar layer is sleeved outside the pin at the main annular groove and the auxiliary annular groove, when the length of the pin needs to be shortened before welding, the outer tube and the mortar layer can be loosened only by twisting the outer tube, then the outer tube is pulled out of the pin, the mortar layer slowly falls off in a kneading mode, and the auxiliary annular groove is leaked out, then the pin is thinner due to the formation of the auxiliary annular groove, and the pin can be broken from the auxiliary annular groove, so that the length of the pin can be shortened, the pin does not need to be pulled after welding is finished, and the firmness of the welding position is ensured.
2. According to the LED provided by the invention, the top plate on the outer tube is positioned at the top of the circuit board, the bottom plate on the outer tube is positioned at the bottom of the circuit board, the top plate and the bottom plate are clamped on the circuit board, then a circle of soldering tin is welded at the top of the outer tube, and the pins, the outer tube and the circuit board are welded together through the soldering tin, so that the use of the soldering tin is reduced, the bottom plate can play a role in fixing the pins, and the pins are prevented from loosening upwards to cause the loosening of the soldering tin and the circuit board.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1 according to the present invention;
FIG. 3 is a cross-sectional view of a mortar layer of the invention;
FIG. 4 is an enlarged view of portion B of FIG. 3 according to the present invention;
FIG. 5 is a perspective view of the base plate of the present invention;
FIG. 6 is a schematic diagram of the structure of the lead of the present invention;
in the figure: PN knot 1, pin 2, main annular groove 21, vice annular groove 22, outer tube 3, mortar layer 4, roof 5, bottom plate 6, recess 7, rubber cavity 8, down tube 9, stretch cord 10, sawtooth mouth 11, through-hole 12.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the effects of the invention easy to understand, the invention is further described below with reference to the specific embodiments, and the front, the back, the left, the right, the upper and the lower of the invention are based on the view direction of fig. 6.
As shown in fig. 1 to 6, the light emitting diode according to the present invention includes a PN junction 1 and two pins 2 installed at the bottom of the PN junction 1, where the two pins 2 are respectively an anode and a cathode of the PN junction 1; a main annular groove 21 is formed in the middle of the pin 2 along the horizontal direction, and an auxiliary annular groove 22 is formed in the pin 2 at the position of the main annular groove 21; the pins 2 at the main annular groove 21 are sleeved with outer tubes 3, and mortar layers 4 are arranged between the outer tubes 3 and the pins 2; when the LED works, the length of the pin 2 of the existing LED is longer in order to be suitable for a thicker circuit board, but when the LED meets a thinner circuit board, after the pin 2 is welded on the circuit board, the longer part of the pin 2 needs to be pulled to a welding position to prevent the longer pin 2 from interfering other electronic elements, and when the pin 2 is pulled, welding spots are easy to loosen to influence the welding quality, so that the invention mainly solves the problem of how to quickly change the length of the pin 2 when the circuit board is thinner, prevent the pin 2 from interfering other electronic elements and ensure the firmness after welding; the specific measures and the using process are as follows: the main annular groove 21 and the auxiliary annular groove 22 are formed in the pin 2, the mortar layer 4 is sleeved outside the pin 2 of the main annular groove 21 and the auxiliary annular groove 22, when the length of the pin 2 needs to be shortened before welding, the outer tube 3 and the mortar layer 4 can be loosened only by twisting the outer tube 3, then the outer tube 3 is pulled out of the pin 2, the mortar layer 4 slowly falls off in a kneading mode, and then the auxiliary annular groove 22 leaks out, and then the pin 2 is thinner due to the arrangement of the auxiliary annular groove 22, so that the pin 2 can be broken from the auxiliary annular groove 22, the length of the pin 2 can be shortened, the pin 2 does not need to be pulled after welding is completed, and the firmness of a welding position is guaranteed; the mortar layer 4 is not easily detached from the pins 2 before the outer tube 3 is loosened due to the blocking effect of the pins 2 at the main annular groove 21 and the auxiliary annular groove 22.
The top plates 5 are fixedly connected to the positions, close to the top, of the two sides of the outer pipe 3, and the end parts of the top plates 5 are inclined downwards; the bottom plates 6 are fixedly connected to the positions, close to the tops, of the two sides of the outer pipe 3, and the end parts of the bottom plates 6 are inclined upwards; the inner wall of the outer pipe 3 is subjected to sanding treatment; when the hole that welds of circuit board is great, and pin 2 is less, can be when inserting pin 2 in the hole that welds, make outer tube 3 be located the hole that welds, at this moment, make roof 5 on the outer tube 3 be located the circuit board top, make bottom plate 6 on the outer tube 3 be located the circuit board bottom, make roof 5 and 6 chucking of bottom plate on the circuit board, then to 3 top welding round soldering tins of outer tube, with pin 2 through soldering tin, outer tube 3 and circuit board welding together, the use of soldering tin has been reduced, and bottom plate 6 can play fixed effect to pin 2, prevent that pin 2 from upwards becoming flexible, cause the not hard up of soldering tin and circuit board.
A groove 7 is formed in the bottom of the bottom plate 6 close to the end of the bottom plate, a rubber hollow ball 8 is arranged in the groove 7, and a part of the rubber hollow ball 8 is located at the top of the bottom plate 6; when 6 pastes tight circuit board bottom at the bottom plate, rubber empty ball 8 can have certain elasticity to bottom plate 6, and then bottom plate 6 has decurrent thrust to pin 2, and then pin 2 can drive the tight adhesion on the circuit board surface of the soldering of 3 tops departments of outer tube, the welded fastness has been improved, and simultaneously, if need improve welded intensity, can carry out the soldering in rubber empty ball 8 departments, make rubber empty ball 8 melt, and then can deposit a certain amount of soldering in recess 7, soldering and circuit board bottom welding back together, the soldering in the recess 7 can play certain effect of blockking to the horizontal migration of bottom plate 6, when PN junction 1 has the trend of slope, can reduce the ascending removal of 6 horizontal directions of bottom plate, and then improved the stability after the tin welding.
An inclined rod 9 is inserted into the end part of the bottom plate 6, one end of the inclined rod 9 is positioned inside the rubber hollow ball 8, and one end of the inclined rod 9 positioned inside the rubber hollow ball 8 is connected with the bottom plate 6 through an elastic rope 10; when bottom plate 6 pastes tight circuit board bottom, rubber blank ball 8 has certain elasticity to bottom plate 6, because rubber blank ball 8 receives certain extrusion, and then the gas expansion in the rubber blank ball 8, and then can promote down tube 9 and remove, down tube 9 lengthens stretch cord 10, down tube 9 tip supports tightly in the circuit board bottom, when down tube 9 supports tight circuit board bottom, can and the circuit board between have certain friction, and then can reduce the removal of bottom plate 6 on the horizontal direction, and then improved the stability after the tin welding.
The top plate 5 and the bottom plate 6 are both provided with sawtooth openings 11; stainless steel powder is bonded at the sawtooth opening 11; after the sawtooth opening 11 has all been seted up on roof 5 and bottom plate 6, after here tin welding, some soldering tin of welding on the circuit board can get into sawtooth opening 11, and then can make the area of contact grow of soldering tin and roof 5 and bottom plate 6, it is not hard up to prevent to produce between soldering and roof 5 and bottom plate 6, after the stainless steel powder of bonding in sawtooth opening 11 department simultaneously, can make the roughness grow of sawtooth opening 11 department, the probability that produces not hard up between soldering and roof 5 and bottom plate 6 has further been reduced.
A plurality of through holes 12 are formed in the end part of the top plate 5, the through holes 12 are arranged in the vertical direction, and the diameter of the top end of each through hole 12 is smaller than that of the bottom end; a plurality of through-holes 12 of seting up on roof 5 can also have soldering tin to get into in the through-hole 12 when welding roof 5 in the circuit board bottom, and then the soldering tin that gets into in the through-hole 12 can paste tightly with the circuit board, has improved the area of contact of soldering tin with the circuit board, and then has improved welded intensity.
When the LED works, the length of the pin 2 of the existing LED is longer in order to be suitable for a thicker circuit board, but when the LED meets a thinner circuit board, after the pin 2 is welded on the circuit board, the longer part of the pin 2 needs to be pulled to a welding position to prevent the longer pin 2 from interfering other electronic elements, and when the pin 2 is pulled, welding spots are easy to loosen to influence the welding quality, so that the invention mainly solves the problem of how to quickly change the length of the pin 2 when the circuit board is thinner, prevent the pin 2 from interfering other electronic elements and ensure the firmness after welding; the specific measures and the using process are as follows: the main annular groove 21 and the auxiliary annular groove 22 are formed in the pin 2, the mortar layer 4 is sleeved outside the pin 2 at the positions of the main annular groove 21 and the auxiliary annular groove 22, when the length of the pin 2 needs to be shortened before welding, the outer tube 3 and the mortar layer 4 can be loosened only by twisting the outer tube 3, then the outer tube 3 is pulled out of the pin 2, the mortar layer 4 slowly falls off in a kneading mode, and then the auxiliary annular groove 22 leaks out, and then the pin 2 is thinner due to the arrangement of the auxiliary annular groove 22, so that the pin 2 can be broken from the auxiliary annular groove 22, the length of the pin 2 can be shortened, the pin 2 does not need to be pulled after welding is completed, and the firmness of a welding position is guaranteed; the mortar layer 4 is not easily detached from the pins 2 before the outer tube 3 is loosened due to the blocking effect of the pins 2 at the main annular groove 21 and the auxiliary annular groove 22.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. A light emitting diode, characterized by: the circuit comprises a PN junction (1) and two pins (2) arranged at the bottom of the PN junction (1), wherein the two pins (2) are respectively a positive electrode and a negative electrode of the PN junction (1); a main annular groove (21) is formed in the middle of each pin (2) along the horizontal direction, and an auxiliary annular groove (22) is formed in each pin (2) at the position of each main annular groove (21); an outer pipe (3) is sleeved on the pin (2) at the position of the main annular groove (21), and a mortar layer (4) is arranged between the outer pipe (3) and the pin (2);
the positions of two sides of the outer pipe (3) close to the top are fixedly connected with top plates (5), and the end parts of the top plates (5) are inclined downwards; the bottom plates (6) are fixedly connected to the positions, close to the tops, of the two sides of the outer pipe (3), and the end parts of the bottom plates (6) incline upwards; the inner wall of the outer pipe (3) is subjected to sanding treatment;
a groove (7) is formed in the bottom of the bottom plate (6) close to the end of the bottom plate, a rubber hollow ball (8) is arranged in the groove (7), and one part of the rubber hollow ball (8) is located at the top of the bottom plate (6);
the end part of the bottom plate (6) is spliced with an inclined rod (9), one end of the inclined rod (9) is positioned inside the rubber hollow ball (8), and the end of the inclined rod (9) positioned inside the rubber hollow ball (8) is connected with the bottom plate (6) through an elastic rope (10).
2. A light emitting diode according to claim 1, wherein: the top plate (5) and the bottom plate (6) are both provided with sawtooth openings (11); stainless steel powder is bonded at the sawtooth opening (11).
3. A light emitting diode according to claim 2, wherein: a plurality of through holes (12) are formed in the end portion of the top plate (5), the through holes (12) are arranged in the vertical direction, and the diameter of the top end of each through hole (12) is smaller than that of the bottom end of each through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010427434.5A CN111584704B (en) | 2020-05-19 | 2020-05-19 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010427434.5A CN111584704B (en) | 2020-05-19 | 2020-05-19 | Light emitting diode |
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| Publication Number | Publication Date |
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| CN111584704A CN111584704A (en) | 2020-08-25 |
| CN111584704B true CN111584704B (en) | 2021-12-17 |
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| CN202010427434.5A Active CN111584704B (en) | 2020-05-19 | 2020-05-19 | Light emitting diode |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115394735B (en) * | 2022-10-27 | 2023-03-24 | 广东汇芯半导体有限公司 | Semiconductor circuit module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7494247B2 (en) * | 2007-04-12 | 2009-02-24 | Chin-Sheng Wen | Hid searchlight module |
| CN204011438U (en) * | 2014-06-30 | 2014-12-10 | 常州佳盟电子科技有限公司 | Silicon bidirectional trigger diode |
| CN207474464U (en) * | 2017-09-22 | 2018-06-08 | 泉州市君健智能家居设备有限公司 | A kind of transistor of fast quick-detach |
| CN209804701U (en) * | 2019-05-29 | 2019-12-17 | 绍兴市旭晨光电科技有限公司 | LED infrared transmitting tube |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210035389U (en) * | 2019-04-29 | 2020-02-07 | 深圳市蓝威灵光电有限公司 | Clamping device for light-emitting diode |
| CN209709017U (en) * | 2019-05-13 | 2019-11-29 | 深圳市晶宏欣光电有限公司 | A kind of improved LED protection structure |
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2020
- 2020-05-19 CN CN202010427434.5A patent/CN111584704B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7494247B2 (en) * | 2007-04-12 | 2009-02-24 | Chin-Sheng Wen | Hid searchlight module |
| CN204011438U (en) * | 2014-06-30 | 2014-12-10 | 常州佳盟电子科技有限公司 | Silicon bidirectional trigger diode |
| CN207474464U (en) * | 2017-09-22 | 2018-06-08 | 泉州市君健智能家居设备有限公司 | A kind of transistor of fast quick-detach |
| CN209804701U (en) * | 2019-05-29 | 2019-12-17 | 绍兴市旭晨光电科技有限公司 | LED infrared transmitting tube |
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| CN111584704A (en) | 2020-08-25 |
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