CN111584504A - Display panel and preparation method thereof - Google Patents
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- CN111584504A CN111584504A CN202010392319.9A CN202010392319A CN111584504A CN 111584504 A CN111584504 A CN 111584504A CN 202010392319 A CN202010392319 A CN 202010392319A CN 111584504 A CN111584504 A CN 111584504A
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a display panel and a preparation method thereof. The display panel includes: a flexible substrate having a plurality of first regions and a plurality of second regions, wherein the material of the first regions comprises a cross-linked polymer of a flexible material and a photosensitive curing agent; the array film layer is arranged on the flexible substrate and comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area; the Young's modulus of the first region is greater than the Young's modulus of the second region. According to the invention, the first region and the second region which are cross-linked and polymerized are formed on the flexible substrate, and the Young modulus of the first region is greater than that of the second region, so that the deformation of the first region during bending can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, the problems of damage and film layer separation of the thin film transistor are reduced, and the reliability of the display panel is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
Flexible organic light emitting diode (abbreviated as OLED) display screens are now used in the display fields of televisions, mobile phones, mobile wearing, etc. due to their foldable and curled features. However, in the process of folding or bending the flexible display screen, it is necessary to ensure that the thin film transistor is not damaged and to avoid the problem of reliability reduction caused by peeling or cracking of the film layer during bending or bending, and it is also necessary to ensure that the specific area remains rigid after folding or bending to support the screen to be flat.
Disclosure of Invention
In a first aspect, an embodiment of the present invention provides a display panel, including: a flexible substrate having a plurality of first regions and a plurality of second regions, wherein the material of the first regions comprises a cross-linked polymer of a flexible material and a photosensitive curing agent; the array film layer is arranged on the flexible substrate doped with the photosensitive curing agent and comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area; the Young's modulus of the first region is greater than the Young's modulus of the second region.
In one embodiment, the flexible substrate further comprises an organic functional layer, the organic functional layer is arranged on the side of the array film layer far away from the flexible substrate and comprises a plurality of third areas and a plurality of fourth areas, wherein the material of the third areas comprises a cross-linked polymer of an organic material and a photosensitive curing agent; the Young's modulus of the third region is greater than that of the fourth region, and the orthographic projection of the first region overlaps with that of the third region.
In an embodiment, the orthographic projection of the first region is located within the orthographic projection of the third region.
In one embodiment, the young's modulus of the first region is the same as the young's modulus of the third region, and the young's modulus of the second region is the same as the young's modulus of the fourth region.
In one embodiment, the material of the photosensitive curing agent includes at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether, and 2-hydroxy-2-methyl-1-phenyl ketone.
In an embodiment, the young's modulus of the first region ranges from 11000 mpa to 15000 mpa.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including: preparing a flexible substrate to be processed, which is provided with a flexible material and is doped with a photosensitive curing agent; performing illumination treatment on the flexible substrate to be treated to form a flexible substrate, wherein the flexible substrate is provided with a plurality of first areas and a plurality of second areas, the material of the first areas comprises a cross-linked polymer of a flexible material and a photosensitive curing agent, and the Young modulus of the first areas is larger than that of the second areas; preparing an array film layer on the flexible substrate, wherein the array film layer comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area.
In one embodiment, the method further comprises the steps of forming an organic functional layer to be processed, which is provided with an organic material and doped with a photosensitive curing agent, on the array film layer; the organic functional layer to be processed is subjected to light irradiation treatment to form the organic functional layer, the organic functional layer is provided with a plurality of third areas and a plurality of fourth areas, materials of the third areas comprise cross-linked polymers of the organic materials and photosensitive curing agents, the Young modulus of the third areas is larger than that of the fourth areas, and the orthographic projection of the first areas is overlapped with that of the third areas.
In an embodiment, the orthographic projection of the first region is located within the orthographic projection of the third region.
In one embodiment, before the flexible substrate to be processed is irradiated by light to form the flexible substrate, a patterned first light shield is provided; before the organic functional layer to be processed is subjected to illumination processing to form the organic functional layer, providing a patterned second light shield; the first light shield and the second light shield have the same structure.
The technical scheme of the invention provides a display panel and a preparation method thereof, wherein the display panel comprises: a flexible substrate having a plurality of first regions and a plurality of second regions, wherein the material of the first regions comprises a cross-linked polymer of a flexible material and a photosensitive curing agent; the array film layer is arranged on the flexible substrate and comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area; the Young's modulus of the first region is greater than the Young's modulus of the second region. According to the invention, the first cross-linked polymerized region and the second cross-linked polymerized region are formed on the flexible substrate, and the Young modulus of the first region is greater than that of the second region, so that the deformation of the first cross-linked polymerized region during bending can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, the problems of damage and film layer separation of the thin film transistor are reduced, and the reliability of the display panel is improved.
Drawings
Other features, objects and advantages of the invention will become apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings in which like or similar reference characters refer to the same or similar parts.
Fig. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of a display panel according to another embodiment of the invention.
Fig. 3 is a schematic cross-sectional view of a display panel according to another embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a display panel according to another embodiment of the invention.
Fig. 5 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the prior art, a display panel includes a flexible substrate, a driving circuit layer, a functional film layer, a light emitting layer, and the like, which are stacked, and in order to meet the requirements of consumers, the display panel is required to be applied to the display fields of televisions, mobile phones, mobile wearing, and the like, with the characteristic of folding or curling. However, in the process of flexible folding or curling, it is necessary to ensure that the thin film transistor in the driving circuit layer is not damaged, to prevent the problem of reliability reduction caused by peeling or cracking of the film layer during bending or curling, and to ensure that the specific area after folding or curling is kept rigid to support the screen to be flat.
In order to solve the problems, the invention is to ensure that the whole thin film transistor is kept flat when being bent, and based on the invention, the invention forms a first region and a second region which are cross-linked and polymerized on a flexible substrate, wherein the Young modulus of the first region is larger than that of the second region, so that the deformation of the first region which is cross-linked and polymerized when being bent can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, the problems of damage and film separation of the thin film transistor are reduced, and the reliability of the display panel is improved.
Fig. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention. As shown in fig. 1, the display panel includes a flexible substrate 100 and an array film layer 200, the flexible substrate 100 has a plurality of first regions 101 and a plurality of second regions 102, the material of the first regions 101 includes a cross-linked polymer of a flexible material and a photosensitive curing agent; the array film layer 200 is arranged on the flexible substrate 100 and comprises a thin film transistor 210, and the orthographic projection of the thin film transistor 210 is positioned in the orthographic projection of the first region 101; the young's modulus of the first region 101 is greater than the young's modulus of the second region 102.
Referring to fig. 1, the flexible material includes polyimide and polydimethylsiloxane. The material of the photosensitive curing agent comprises at least one of benzoin, benzoin ethyl ether and benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone materials. The flexible substrate 100 may be a Polyimide (PI) substrate doped with a photosensitive curing agent, or a Polydimethylsiloxane (PDMS) substrate doped with a photosensitive curing agent. Specifically, the flexible substrate is formed by mixing polyimide or polydimethylsiloxane material and at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone material according to a certain proportion, the mass ratio of the doped photosensitive curing agent is 0.2-1%, specifically 0.4%, 0.65%, 0.8% and the like, and the specific proportion of the photosensitive curing agent is adjusted according to the requirements of products.
The flexible substrate 100 has a thickness in the range of 6.5 to 12 microns, preferably 8, 9.5 and 10.8 microns. The array film layer 200 includes a thin film transistor 210, metal traces, etc., and the thin film transistor 210 includes a source electrode, a drain electrode, a gate electrode, an active layer, a gate insulating layer, an interlayer insulating layer, a silicon nitride layer, a silicon oxide layer, etc.
In one embodiment, the material of the photosensitive curing agent includes at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether, and 2-hydroxy-2-methyl-1-phenyl ketone. Specifically, the photosensitive curing agent can be prepared from any one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone, or 3 materials of benzoin, benzoin ethyl ether and benzoin butyl ether, or 2 materials of benzoin, benzoin ethyl ether or benzoin ethyl ether and benzoin butyl ether, and the selection of the photosensitive curing agent material is not particularly limited.
In an embodiment, the young's modulus of the first region ranges from 11000 mpa to 15000 mpa. Preferably 12000 MPa, 13000 MPa or 14300 MPa. The second region has a young's modulus in the range of 2000 mpa to 8000 mpa. Preferably 3000 MPa, 4500 MPa, 6400 MPa or 7600 MPa.
In one embodiment, the first region has a rectangular, trapezoidal, inverted trapezoidal, and stepped shape in cross section in a direction perpendicular to the flexible substrate.
According to the invention, the first region and the second region which are cross-linked and polymerized are formed on the flexible substrate, and the Young modulus of the first region is greater than that of the second region, so that the deformation of the first region during bending can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, the problems of damage and film layer separation of the thin film transistor are reduced, and the reliability of the display panel is improved.
Fig. 2 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. As shown in fig. 2, the display panel includes a flexible substrate 100 and an array film layer 200, the flexible substrate 100 has a plurality of first regions 101 and a plurality of second regions 102, the material of the first regions 101 includes a cross-linked polymer of a flexible material and a photosensitive curing agent; the array film layer 200 is arranged on the flexible substrate 100 and comprises a thin film transistor 210, and the orthographic projection of the thin film transistor 210 is positioned in the orthographic projection of the first region 101; the Young modulus of the first region 101 is larger than that of the second region 102, the flexible substrate further comprises an organic functional layer 300, the organic functional layer 300 is arranged on the side, away from the flexible substrate 100, of the array film layer 200, the organic functional layer 300 comprises a plurality of third regions 301 and a plurality of fourth regions 302, and the material of the third regions 301 comprises a cross-linked polymer of an organic material and a photosensitive curing agent; the young's modulus of the third region 301 is larger than that of the fourth region 302, and the orthographic projection of the first region 101 overlaps with that of the third region 301.
The organic material comprises at least one of polyethylene naphthalate, polyethylene terephthalate, polyarylate, polycarbonate, or polyetherimide polymer material. The material of the photosensitive curing agent comprises at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether or 2-hydroxy-2-methyl-1-phenyl ketone. The organic functional layer 300 may be a planarization layer or a pixel defining layer, and specifically, is an organic functional layer formed by mixing at least one of polyethylene naphthalate, polyethylene terephthalate, polyarylate, polycarbonate, or polyetherimide polymer materials with at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether, and 2-hydroxy-2-methyl-1-phenyl ketone materials at a certain ratio.
In one embodiment, the young modulus of the first region is the same as that of the third region, and the young modulus of the second region is the same as that of the fourth region, so that the process can be simplified, the time can be saved, and the production efficiency can be improved.
In one embodiment, the young's modulus of the first region is the same as the young's modulus of the third region, and the young's modulus of the second region is greater than the young's modulus of the fourth region. Or the Young's modulus of the first region is the same as that of the third region, and the Young's modulus of the second region is smaller than that of the fourth region.
In one embodiment, the Young's modulus of the first region is the same as that of the third region, and the Young's modulus of the second region is smaller than that of the fourth region. Or the Young's modulus of the first region is smaller than that of the third region, and the Young's modulus of the second region is larger than that of the fourth region.
It should be noted that, the bending of the screen body is divided into inward bending and outward bending, and when the display panel is folded inward, the flexible substrate provides a main anti-deformation function; when the display panel is folded outwards, the organic functional layer provides a main anti-deformation effect; meanwhile, the flexible substrate and the organic function are partitioned, so that the modulus of different areas is different, the deformation of the array film layer is reduced, the service life of the display panel is prolonged, the requirements of consumers are met, and different bending modes are selected according to the requirements of different customers.
According to the embodiment of the invention, the third region and the fourth region of cross-linking polymerization are formed on the organic functional layer, the Young modulus of the third region is greater than that of the fourth region, so that the deformation of other film layers on the third region can be reduced during bending, the first region and the second region of cross-linking polymerization are formed on the flexible substrate, the Young modulus of the first region is greater than that of the second region, and the deformation of the first region of the thin film transistor during bending is reduced.
Fig. 3 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. As shown in fig. 3, the display panel includes a flexible substrate 100 and an array film layer 200, the flexible substrate 100 has a plurality of first regions 101 and a plurality of second regions 102, the material of the first regions 101 includes a cross-linked polymer of a flexible material and a photosensitive curing agent; the array film layer 200 is arranged on the flexible substrate 100 and comprises a thin film transistor 210, and the orthographic projection of the thin film transistor 210 is positioned in the orthographic projection of the first region 101; the Young modulus of the first region 101 is larger than that of the second region 102, the flexible substrate further comprises an organic functional layer 300, the organic functional layer 300 is arranged on the side, away from the flexible substrate 100, of the array film layer 200, the organic functional layer 300 comprises a plurality of third regions 301 and a plurality of fourth regions 302, and the material of the third regions 301 comprises a cross-linked polymer of an organic material and a photosensitive curing agent; the young's modulus of the third region 301 is greater than the young's modulus of the fourth region 302, and the orthographic projection of the first region 101 is within the orthographic projection of the third region 301.
In an embodiment, the projection of the first region in the direction perpendicular to the flexible substrate and the projection of the third region in the direction perpendicular to the flexible substrate are completely overlapped, so that the design is favorable for reducing the cost, simplifying the process and improving the production efficiency.
In an embodiment, a projection of the first region in a direction perpendicular to the flexible substrate partially overlaps a projection of the third region in a direction perpendicular to the flexible substrate.
According to the embodiment of the invention, the orthographic projection of the first area is positioned in the orthographic projection of the third area, so that the deformation of the thin film transistor during bending can be reduced, the damage of the thin film transistor during bending can be reduced, and the service life of the display panel can be prolonged.
Fig. 4 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. As shown in fig. 4, the display panel further includes a light emitting layer 400 and an encapsulation layer 500, wherein the light emitting layer 400 is disposed on a side of the organic functional layer 300 away from the array film layer 200, and the encapsulation layer 500 is disposed on a side of the light emitting layer 400 away from the organic functional layer 300. The light emitting layer includes a hole injection layer, a hole transport layer, an ion injection layer, an organic light emitting layer, and the like. The encapsulation layer includes an inorganic layer, an organic layer, an inorganic layer, and the like. The packaging layer prevents external water and oxygen from entering the light-emitting layer to influence the normal light emission of the display panel. The invention can also carry out partition treatment on the film layer of the luminous layer, so that the Young modulus of different areas is different, and the requirement of a product is met.
The embodiment of the invention provides a preparation method of a display panel, and fig. 5 is a flow chart of the preparation method of the display panel provided by the embodiment of the invention. The method comprises the following steps:
step 200: preparing a flexible substrate to be processed, which is provided with a flexible material and is doped with a photosensitive curing agent;
step 210: carrying out illumination treatment on a flexible substrate to be treated to form a flexible substrate, wherein the flexible substrate is provided with a plurality of first areas and a plurality of second areas, the material of the first areas comprises a cross-linked polymer of a flexible material and a photosensitive curing agent, and the Young modulus of the first areas is larger than that of the second areas;
step 220: preparing an array film layer on the flexible substrate, wherein the array film layer comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area.
In one embodiment, a glass substrate is provided, a peeling layer is prepared on the glass substrate, a to-be-processed flexible substrate which is provided with a flexible material and doped with a photosensitive curing agent is prepared on the peeling layer, a patterned first light shield is provided to cover the to-be-processed flexible substrate, under the irradiation of ultraviolet light, the flexible material and the photosensitive curing agent at the position, irradiated by the ultraviolet light, of the to-be-processed flexible substrate are subjected to polymerization reaction to form a cross-linked polymer, the cross-linked polymer is converted into a flexible substrate, and the Young modulus of the cross-linked polymer is larger than that of other regions. Therefore, the flexible substrate is provided with a plurality of cross-linked polymeric first areas and a plurality of second areas, the Young modulus of the first areas is larger than that of the second areas, and then an array film layer is prepared on the flexible substrate, wherein the array film layer comprises thin film transistors, and the orthographic projection of the thin film transistors is positioned in the orthographic projection of the first areas.
The stripping layer can be organic material or inorganic material, the inorganic material comprises silicon nitride, silicon oxide and the like, the adhesion between the stripping layer and the flexible substrate is less than 0.01N/inch, the stripping layer has low ultraviolet absorption capacity, the stripping layer can be separated from the flexible substrate layer through laser stripping or mechanical stripping, and finally the required display panel is formed.
The flexible material includes polyimide and polydimethylsiloxane. The material of the photosensitive curing agent comprises at least one of benzoin, benzoin ethyl ether and benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone materials. The size of the first area graph can be changed according to the design of the first light shield graph, so that ultraviolet light can be controlled to irradiate partial area, the flexible material and the material of the photosensitive curing agent in the flexible substrate to be processed are subjected to polymerization reaction through the ultraviolet light with the wavelength of 200 nm to 400 nm, namely, photosensitive free radical polymerization reaction, the flexible substrate is initiated to be converted into the flexible substrate, the first area of the flexible substrate forms an area with higher molecular weight and higher rigidity due to the polymerization reaction, and the Young modulus of the first area is larger than that of the second area.
According to the manufacturing method of the display panel provided by the embodiment of the invention, the flexible substrate is subjected to ultraviolet irradiation to form the plurality of cross-linked polymerized first areas and the plurality of second areas, the Young modulus of the first areas is larger than that of the second areas, so that the deformation of the first areas during bending can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, the problems of damage and film layer separation of the thin film transistor are reduced, and the reliability of the display panel is improved.
In one embodiment, an organic functional layer to be processed, which is provided with organic materials and doped with photosensitive curing agents, is prepared on an array film layer, the organic functional layer to be processed is subjected to illumination processing to form the organic functional layer, the organic functional layer is provided with a plurality of third regions and a plurality of fourth regions, wherein the materials of the third regions comprise cross-linked polymers of the organic materials and the photosensitive curing agents, the Young modulus of the third regions is larger than that of the fourth regions, and the orthographic projection of the first regions is overlapped with that of the third regions.
The organic material comprises at least one of polyethylene naphthalate, polyethylene terephthalate, polyarylate, polycarbonate, or polyetherimide polymer material. The material of the photosensitive curing agent comprises at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether or 2-hydroxy-2-methyl-1-phenyl ketone. The size of the third area graph can be changed according to the design of the second light shield graph, so that ultraviolet light can be controlled to irradiate partial area, the ultraviolet light with the wavelength of 200-400 nm irradiates organic materials in the organic functional layer to be processed and materials of the photosensitive curing agent to generate polymerization reaction, namely photosensitive free radical polymerization reaction, the organic functional layer to be processed is triggered to be converted into the organic functional layer, the third area of the organic functional layer forms an area with higher molecular weight and higher rigidity due to polymerization, and the Young modulus of the third area is larger than that of the fourth area.
In one embodiment, before the flexible substrate to be processed is subjected to illumination processing to form the flexible substrate, a patterned first light shield is provided; providing a second patterned light shield before the organic functional layer to be processed is subjected to illumination processing to form the organic functional layer; the first light shield and the second light shield have the same structure. Particularly, the first light shield and the second light shield are identical in structure, so that the second light shield is not needed, the process is simplified, the production efficiency is improved, and the production cost is saved.
In an embodiment, the orthographic projection of the first region is located in the orthographic projection of the third region, so that deformation of the thin film transistor during bending can be reduced, damage of the thin film transistor during bending is reduced, and the service life of the display panel is prolonged.
According to the manufacturing method of the display panel, provided by the embodiment of the invention, the orthographic projection of the first area is positioned in the orthographic projection of the third area, so that the deformation of the thin film transistor during bending can be reduced, the damage of the thin film transistor during bending is reduced, and the service life of the display panel is prolonged.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A display panel, comprising:
a flexible substrate having a plurality of first regions and a plurality of second regions, wherein the material of the first regions comprises a cross-linked polymer of a flexible material and a photosensitive curing agent;
the array film layer is arranged on the flexible substrate and comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area;
the Young's modulus of the first region is greater than the Young's modulus of the second region.
2. The display panel according to claim 1, further comprising an organic functional layer disposed on a side of the array film layer away from the flexible substrate, the organic functional layer comprising a plurality of third regions and a plurality of fourth regions, wherein a material of the third regions comprises a crosslinked polymer of an organic material and a photosensitive curing agent; the Young's modulus of the third region is greater than that of the fourth region, and the orthographic projection of the first region overlaps with that of the third region.
3. A display panel as claimed in claim 2 characterized in that the orthographic projection of the first area is located within the orthographic projection of the third area.
4. The display panel according to claim 2, wherein the young's modulus of the first region is the same as the young's modulus of the third region, and wherein the young's modulus of the second region is the same as the young's modulus of the fourth region.
5. The display panel according to any one of claims 1 to 4, wherein the material of the photosensitive curing agent comprises at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether, and 2-hydroxy-2-methyl-1-phenyl ketone.
6. The display panel according to any one of claims 1 to 4, wherein the Young's modulus of the first region is in a range of 11000 MPa to 15000 MPa.
7. A method for manufacturing a display panel is characterized in that,
preparing a flexible substrate to be processed, which is provided with a flexible material and is doped with a photosensitive curing agent;
performing illumination treatment on the flexible substrate to be treated to form a flexible substrate, wherein the flexible substrate is provided with a plurality of first areas and a plurality of second areas, the material of the first areas comprises a cross-linked polymer of a flexible material and a photosensitive curing agent, and the Young modulus of the first areas is larger than that of the second areas;
preparing an array film layer on the flexible substrate, wherein the array film layer comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area.
8. The method for manufacturing a display panel according to claim 7, further comprising forming an organic functional layer to be processed having an organic material and doped with a photosensitive curing agent on the array film layer;
and carrying out light irradiation treatment on the organic functional layer to be treated to form the organic functional layer, wherein the organic functional layer is provided with a plurality of third areas and a plurality of fourth areas, the material of the third areas comprises a cross-linked polymer of the organic material and a photosensitive curing agent, the Young modulus of the third areas is larger than that of the fourth areas, and the orthographic projection of the first areas is overlapped with that of the third areas.
9. The method for manufacturing a display panel according to claim 8, wherein an orthogonal projection of the first region is located within an orthogonal projection of the third region.
10. The method for manufacturing a display panel according to claim 8, wherein a patterned first light shield is provided before the flexible substrate to be processed is irradiated to form the flexible substrate; before the organic functional layer to be processed is subjected to illumination processing to form the organic functional layer, providing a patterned second light shield; the first light shield and the second light shield have the same structure.
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