CN111584504B - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
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- CN111584504B CN111584504B CN202010392319.9A CN202010392319A CN111584504B CN 111584504 B CN111584504 B CN 111584504B CN 202010392319 A CN202010392319 A CN 202010392319A CN 111584504 B CN111584504 B CN 111584504B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000010409 thin film Substances 0.000 claims abstract description 49
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 40
- 239000010408 film Substances 0.000 claims abstract description 39
- 229920006037 cross link polymer Polymers 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 64
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 60
- 239000002346 layers by function Substances 0.000 claims description 37
- 238000001723 curing Methods 0.000 claims description 36
- 244000028419 Styrax benzoin Species 0.000 claims description 30
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 30
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 30
- 229960002130 benzoin Drugs 0.000 claims description 30
- 235000019382 gum benzoic Nutrition 0.000 claims description 30
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 24
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 20
- 239000011368 organic material Substances 0.000 claims description 14
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000000016 photochemical curing Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 26
- 238000000926 separation method Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 description 10
- -1 polydimethylsiloxane Polymers 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 239000004697 Polyetherimide Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920001230 polyarylate Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention discloses a display panel and a preparation method thereof. The display panel includes: a flexible substrate having a plurality of first regions and a plurality of second regions, wherein the material of the first regions comprises a crosslinked polymer of a flexible material and a photosensitive curing agent; the array film layer is arranged on the flexible substrate and comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area; the Young's modulus of the first region is greater than the Young's modulus of the second region. According to the invention, the first area and the second area which are crosslinked and polymerized are formed on the flexible substrate, the Young modulus of the first area is larger than that of the second area, the deformation of the first area during bending can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, the damage of the thin film transistor and the problem of film separation are reduced, and the reliability of the display panel is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
Flexible Organic Light Emitting Diode (OLED) display screens have been used in the display fields of televisions, mobile phones, mobile wear, and the like due to their foldable and rollable properties. However, in the folding or bending process of the flexible display screen, it is required to ensure that the thin film transistor is not damaged, avoid the problem of reliability reduction caused by film peeling or cracking during bending or bending, and ensure that a specific area remains rigid after folding or curling to support the screen to be flat.
Disclosure of Invention
In a first aspect, an embodiment of the present invention provides a display panel, including: a flexible substrate having a plurality of first regions and a plurality of second regions, wherein the material of the first regions comprises a crosslinked polymer of a flexible material and a photosensitive curing agent; the array film layer is arranged on the flexible substrate doped with the photosensitive curing agent and comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area; the Young's modulus of the first region is greater than the Young's modulus of the second region.
In an embodiment, the flexible substrate further comprises an organic functional layer, wherein the organic functional layer is arranged on one side of the array film layer away from the flexible substrate, the organic functional layer comprises a plurality of third areas and a plurality of fourth areas, and the material of the third areas comprises a cross-linked polymer of an organic material and a photosensitive curing agent; the Young's modulus of the third region is greater than the Young's modulus of the fourth region, and the orthographic projection of the first region overlaps with the orthographic projection of the third region.
In an embodiment, the orthographic projection of the first region is located within the orthographic projection of the third region.
In an embodiment, the young's modulus of the first region is the same as the young's modulus of the third region, and the young's modulus of the second region is the same as the young's modulus of the fourth region.
In one embodiment, the material of the photosensitive curing agent includes at least one of benzoin, benzoin diethyl ether, benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone.
In an embodiment, the young's modulus of the first region ranges from 11000 mpa to 15000 mpa.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including: preparing a flexible substrate to be treated, which is provided with a flexible material and is doped with a photosensitive curing agent; carrying out light treatment on the flexible substrate to be treated to form a flexible substrate, wherein the flexible substrate is provided with a plurality of first areas and a plurality of second areas, the material of the first areas comprises crosslinked polymer of flexible material and photosensitive curing agent, and the Young modulus of the first areas is larger than that of the second areas; and preparing an array film layer on the flexible substrate, wherein the array film layer comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area.
In one embodiment, the method further comprises forming an organic functional layer to be treated, which is provided with an organic material and doped with a photosensitive curing agent, on the array film layer; the organic functional layer to be treated is subjected to light treatment to form an organic functional layer, the organic functional layer is provided with a plurality of third areas and a plurality of fourth areas, the material of the third areas comprises crosslinked polymers of the organic material and a photosensitive curing agent, the Young modulus of the third areas is larger than that of the fourth areas, and orthographic projections of the first areas are overlapped with orthographic projections of the third areas.
In an embodiment, the orthographic projection of the first region is located within the orthographic projection of the third region.
In an embodiment, a patterned first mask is provided before the flexible substrate to be processed is subjected to illumination treatment to form a flexible substrate; before the organic functional layer to be treated is subjected to light treatment to form the organic functional layer, a patterned second light shield is provided; the first light shield and the second light shield have the same structure.
The technical scheme of the invention provides a display panel and a preparation method thereof, wherein the display panel comprises: a flexible substrate having a plurality of first regions and a plurality of second regions, wherein the material of the first regions comprises a crosslinked polymer of a flexible material and a photosensitive curing agent; the array film layer is arranged on the flexible substrate and comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area; the Young's modulus of the first region is greater than the Young's modulus of the second region. According to the invention, the first area and the second area which are crosslinked and polymerized are formed on the flexible substrate, the Young modulus of the first area is larger than that of the second area, the deformation of the crosslinked and polymerized first area during bending can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, the damage of the thin film transistor and the problem of film separation are reduced, and the reliability of the display panel is improved.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading the following detailed description of non-limiting embodiments thereof, taken in conjunction with the accompanying drawings in which like or similar reference characters designate the same or similar features.
Fig. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of a display panel according to another embodiment of the invention.
Fig. 3 is a schematic cross-sectional view of a display panel according to another embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a display panel according to another embodiment of the invention.
Fig. 5 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the prior art, a display panel includes a flexible substrate, a driving circuit layer, a functional film layer, a light-emitting layer, and the like, which are stacked, and in order to meet consumer demands, the display panel is required to be applied to display fields such as televisions, mobile phones, mobile wearers, and the like, in a folding or curling characteristic. However, in the flexible folding or curling process, it is necessary to ensure that the thin film transistor in the driving circuit layer is not damaged, prevent the problem of reliability degradation caused by film peeling or cracking during bending or curling, and simultaneously ensure that a specific area remains rigid after folding or curling to support the screen flat.
In order to solve the above problems, the present invention is designed to ensure that the thin film transistor is kept flat as a whole when it is bent, and based on the above-described inventive concept, the present invention forms a first region and a second region of cross-linked polymerization on a flexible substrate, wherein the young's modulus of the first region is greater than that of the second region, so that the deformation of the first region of cross-linked polymerization when it is bent can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, the damage of the thin film transistor and the problem of film separation are reduced, and the reliability of the display panel is improved.
Fig. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention. As shown in fig. 1, the display panel includes a flexible substrate 100 and an array film layer 200, the flexible substrate 100 having a plurality of first regions 101 and a plurality of second regions 102, the material of the first regions 101 including a crosslinked polymer of a flexible material and a photosensitive curing agent; the array film layer 200 is disposed on the flexible substrate 100 and includes a thin film transistor 210, and an orthographic projection of the thin film transistor 210 is located within an orthographic projection of the first region 101; the young's modulus of the first region 101 is greater than the young's modulus of the second region 102.
Referring to fig. 1, the flexible material includes polyimide and polydimethylsiloxane. The material of the photosensitive curing agent comprises at least one of benzoin, benzoin diethyl ether, benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone material. The flexible substrate 100 may be a Polyimide (PI) substrate doped with a photo-curing agent or a Polydimethylsiloxane (PDMS) substrate doped with a photo-curing agent. Specifically, polyimide or polydimethylsiloxane material and benzoin, benzoin diethyl ether and at least one of benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone material are mixed according to a certain proportion to form a flexible substrate, the mass ratio of the doped photosensitive curing agent ranges from 0.2% to 1%, and the specific proportion of the doped photosensitive curing agent can be specifically 0.4%, 0.65%, 0.8% and the like, and is adjusted according to the requirements of products.
The thickness of the flexible substrate 100 ranges from 6.5 microns to 12 microns, preferably 8 microns, 9.5 microns and 10.8 microns. The array film layer 200 includes a thin film transistor 210, metal wirings, etc., and the thin film transistor 210 includes a source electrode, a drain electrode, a gate electrode, an active layer, a gate insulating layer, an interlayer insulating layer, a silicon nitride layer, a silicon oxide layer, etc.
In one embodiment, the material of the photosensitive curing agent includes at least one of benzoin, benzoin diethyl ether, benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone. Specifically, the photosensitive curing agent can be prepared from any one material of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone, can also be prepared from 3 materials of benzoin, benzoin ethyl ether and benzoin butyl ether, and can also be prepared from 2 materials of benzoin, benzoin ethyl ether or benzoin ethyl ether and benzoin butyl ether.
In one embodiment, the Young's modulus of the first region ranges from 11000 megapascals to 15000 megapascals. Preferably 12000 mpa, 13000 mpa or 14300 mpa. The Young's modulus of the second region ranges from 2000 megapascals to 8000 megapascals. Preferably 3000 mpa, 4500 mpa, 6400 mpa or 7600 mpa.
In one embodiment, the first region has a rectangular, trapezoidal, inverted trapezoidal, and stepped shape in a cross section perpendicular to the flexible substrate.
According to the invention, the first area and the second area which are crosslinked and polymerized are formed on the flexible substrate, the Young modulus of the first area is larger than that of the second area, the deformation of the first area during bending can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, the damage of the thin film transistor and the problem of film separation are reduced, and the reliability of the display panel is improved.
Fig. 2 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. As shown in fig. 2, the display panel includes a flexible substrate 100 and an array film layer 200, the flexible substrate 100 having a plurality of first regions 101 and a plurality of second regions 102, the material of the first regions 101 including a crosslinked polymer of a flexible material and a photosensitive curing agent; the array film layer 200 is disposed on the flexible substrate 100 and includes a thin film transistor 210, and an orthographic projection of the thin film transistor 210 is located within an orthographic projection of the first region 101; the young's modulus of the first region 101 is greater than that of the second region 102, and the organic functional layer 300 is arranged on one side of the array film layer 200 away from the flexible substrate 100, the organic functional layer 300 comprises a plurality of third regions 301 and a plurality of fourth regions 302, and the material of the third regions 301 comprises a cross-linked polymer of an organic material and a photosensitive curing agent; the young's modulus of the third region 301 is greater than the young's modulus of the fourth region 302, and the orthographic projection of the first region 101 overlaps with the orthographic projection of the third region 301.
The organic material comprises at least one of polyethylene naphthalate, polyethylene terephthalate, polyarylate, polycarbonate or polyetherimide polymer material. The material of the photosensitive curing agent comprises at least one of benzoin, benzoin diethyl ether, benzoin butyl ether, benzoin dimethyl ether or 2-hydroxy-2-methyl-1-phenyl ketone. The organic functional layer 300 may be a planarization layer or a pixel defining layer, and specifically, may be an organic functional layer formed by mixing at least one of polyethylene naphthalate, polyethylene terephthalate, polyarylate, polycarbonate, and polyetherimide polymer material with at least one of benzoin, benzoin ether, benzoin butyl ether, benzoin dimethyl ether, and 2-hydroxy-2-methyl-1-phenyl ketone material in a certain ratio.
In an embodiment, the young's modulus of the first area is the same as the young's modulus of the third area, and the young's modulus of the second area is the same as the young's modulus of the fourth area, so that the process can be simplified, the time can be saved, and the production efficiency can be improved.
In an embodiment, the young's modulus of the first region is the same as the young's modulus of the third region, and the young's modulus of the second region is greater than the young's modulus of the fourth region. Or the Young's modulus of the first region is the same as that of the third region, and the Young's modulus of the second region is smaller than that of the fourth region.
In an embodiment, the young's modulus of the first region is greater than the young's modulus of the third region, and the young's modulus of the second region is less than the young's modulus of the fourth region. Or the Young's modulus of the first region is smaller than that of the third region, and the Young's modulus of the second region is larger than that of the fourth region.
It should be noted that, the bending of the screen body is divided into an inward bending and an outward bending, and when the display panel is folded inwards, the flexible substrate provides a main anti-deformation effect; when the display panel is folded outwards, the organic functional layer provides a main anti-deformation effect; meanwhile, the flexible substrate and the organic function are partitioned, so that the moduli of different areas are different, the deformation of the array film layer is reduced, the service life of the display panel is prolonged, the requirements of consumers are met, and different bending modes are selected according to the requirements of different customers.
According to the embodiment of the invention, the cross-linked polymeric third region and the cross-linked polymeric fourth region are formed on the organic functional layer, the Young modulus of the third region is larger than that of the fourth region, the deformation of other film layers on the third region during bending can be reduced, the cross-linked polymeric first region and the cross-linked polymeric second region are formed on the flexible substrate, the Young modulus of the first region is larger than that of the second region, the deformation of the first region of the thin film transistor during bending is reduced, and the deformation of the thin film transistor in the first region is reduced because the thin film transistor is positioned between the flexible substrate and the organic functional layer, and meanwhile the deformation of the thin film transistor in the third region is also reduced, so that the deformation of the thin film transistor during bending can be further reduced, the damage of the thin film transistor and the problem of film layer separation are reduced, and the reliability of the display panel is improved.
Fig. 3 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. As shown in fig. 3, the display panel includes a flexible substrate 100 and an array film layer 200, the flexible substrate 100 having a plurality of first regions 101 and a plurality of second regions 102, the material of the first regions 101 including a crosslinked polymer of a flexible material and a photosensitive curing agent; the array film layer 200 is disposed on the flexible substrate 100 and includes a thin film transistor 210, and an orthographic projection of the thin film transistor 210 is located within an orthographic projection of the first region 101; the young's modulus of the first region 101 is greater than that of the second region 102, and the organic functional layer 300 is arranged on one side of the array film layer 200 away from the flexible substrate 100, the organic functional layer 300 comprises a plurality of third regions 301 and a plurality of fourth regions 302, and the material of the third regions 301 comprises a cross-linked polymer of an organic material and a photosensitive curing agent; the young's modulus of the third region 301 is greater than the young's modulus of the fourth region 302, the orthographic projection of the first region 101 being located within the orthographic projection of the third region 301.
In an embodiment, the projection of the first area along the direction perpendicular to the flexible substrate is completely overlapped with the projection of the third area along the direction perpendicular to the flexible substrate, so that the design is beneficial to reducing the cost, simplifying the process and improving the production efficiency.
In an embodiment, the projection of the first region in a direction perpendicular to the flexible substrate overlaps with the projection of the third region in a direction perpendicular to the flexible substrate.
According to the embodiment of the invention, the orthographic projection of the first area is positioned in the orthographic projection of the third area, so that the deformation of the thin film transistor during bending can be reduced, the damage of the thin film transistor during bending is reduced, and the service life of the display panel is prolonged.
Fig. 4 is a schematic cross-sectional view of a display panel according to another embodiment of the invention. As shown in fig. 4, the display panel further includes a light emitting layer 400 and an encapsulation layer 500, the light emitting layer 400 is disposed at a side of the organic functional layer 300 remote from the array film layer 200, and the encapsulation layer 500 is disposed at a side of the light emitting layer 400 remote from the organic functional layer 300. The light emitting layer includes a hole injection layer, a hole transport layer, an ion injection layer, an organic light emitting layer, and the like. The encapsulation layer includes an inorganic layer, an organic layer, an inorganic layer, and the like. The packaging layer prevents external water and oxygen from entering the light-emitting layer, and normal light emission of the display panel is affected. The invention can also carry out partition treatment on the film layer of the luminous layer, so that the Young modulus of different areas is different, and the requirements of products are met.
An embodiment of the invention provides a method for manufacturing a display panel, and fig. 5 is a flowchart of the method for manufacturing the display panel. The method comprises the following steps:
step 200: preparing a flexible substrate to be treated, which is provided with a flexible material and is doped with a photosensitive curing agent;
step 210: carrying out illumination treatment on a flexible substrate to be treated to form a flexible substrate, wherein the flexible substrate is provided with a plurality of first areas and a plurality of second areas, the material of the first areas comprises crosslinked polymers of flexible materials and a photosensitive curing agent, and the Young modulus of the first areas is larger than that of the second areas;
step 220: an array film layer is prepared on a flexible substrate, the array film layer comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area.
In one embodiment, a glass substrate is provided, a stripping layer is prepared on the glass substrate, a flexible substrate to be treated with a flexible material and doped with a photosensitive curing agent is prepared on the stripping layer, and then a patterned first light shield is provided to cover the flexible substrate to be treated, so that under the irradiation of ultraviolet light, the flexible material and the photosensitive curing agent at the position where the flexible substrate to be treated is irradiated by the ultraviolet light are polymerized to form a crosslinked polymer and are converted into a flexible substrate, and the Young modulus of the area where the crosslinked polymerization occurs is larger than that of other areas. The flexible substrate is provided with a plurality of cross-linked polymerized first areas and a plurality of second areas, the Young modulus of the first areas is larger than that of the second areas, and then an array film layer is prepared on the flexible substrate, wherein the array film layer comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first areas.
The stripping layer can be made of organic materials or inorganic materials, the inorganic materials comprise silicon nitride, silicon oxide and the like, the adhesion force between the stripping layer and the flexible substrate is smaller than 0.01N/inch, the stripping layer has lower ultraviolet absorption capacity, and the stripping layer can be separated from the flexible substrate layer through laser stripping or mechanical stripping means, so that the display panel is finally formed.
The flexible material includes polyimide and polydimethylsiloxane. The material of the photosensitive curing agent comprises at least one of benzoin, benzoin diethyl ether, benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone material. The size of the first region pattern can be changed according to the design of the first mask pattern, so that the irradiation of ultraviolet light to a part of the region can be controlled, and the ultraviolet light irradiation with the wavelength of 200-400 nanometers causes the polymerization reaction of the flexible material in the flexible substrate to be treated and the material of the photosensitive curing agent, namely the photosensitive free radical polymerization reaction, to trigger the flexible substrate to be converted into the flexible substrate, and the first region of the flexible substrate forms a region with higher molecular weight and higher rigidity due to the polymerization reaction, so that the Young modulus of the first region is larger than that of the second region.
According to the manufacturing method of the display panel, the plurality of crosslinked and polymerized first areas and the plurality of second areas are formed through ultraviolet irradiation on the flexible substrate, the Young modulus of the first area is larger than that of the second area, deformation of the first area during bending can be reduced, the bending radius is increased, the thin film transistor is in a relatively flat state, damage of the thin film transistor and the problem of film separation are reduced, and reliability of the display panel is improved.
In an embodiment, an organic functional layer to be treated, which is provided with an organic material and doped with a photosensitive curing agent, is prepared on the array film layer, the organic functional layer to be treated is subjected to light irradiation treatment to form the organic functional layer, the organic functional layer is provided with a plurality of third areas and a plurality of fourth areas, wherein the material of the third areas comprises a crosslinked polymer of the organic material and the photosensitive curing agent, the Young's modulus of the third areas is larger than that of the fourth areas, and the orthographic projection of the first areas overlaps with that of the third areas.
The organic material comprises at least one of polyethylene naphthalate, polyethylene terephthalate, polyarylate, polycarbonate or polyetherimide polymer material. The material of the photosensitive curing agent comprises at least one of benzoin, benzoin diethyl ether, benzoin butyl ether, benzoin dimethyl ether or 2-hydroxy-2-methyl-1-phenyl ketone. The size of the third region pattern can be changed according to the design of the second mask pattern, so that the irradiation of ultraviolet light to a part of the region can be controlled, and the ultraviolet light with the wavelength of 200-400 nanometers irradiates the organic material in the organic functional layer to be treated and the material of the photosensitive curing agent to perform polymerization reaction, namely photosensitive free radical polymerization reaction, so that the organic functional layer to be treated is initiated to be converted into the organic functional layer, and the third region of the organic functional layer is polymerized to form a region with higher molecular weight and higher rigidity, so that the Young modulus of the third region is larger than that of the fourth region.
In one embodiment, a patterned first mask is provided before a flexible substrate is formed by performing light treatment on a flexible substrate to be treated; providing a patterned second light shield before carrying out light irradiation treatment on the organic functional layer to be treated to form the organic functional layer; the first light shield and the second light shield have the same structure. Specifically, the first light shield and the second light shield have the same structure, so that the second light shield is not required to be used in the design, the process is simplified, the production efficiency is improved, and the production cost is saved.
In an embodiment, the orthographic projection of the first area is located within the orthographic projection of the third area, so that deformation of the thin film transistor during bending can be reduced, damage of the thin film transistor during bending can be reduced, and service life of the display panel can be prolonged.
According to the manufacturing method of the display panel, the orthographic projection of the first area is located in the orthographic projection of the third area, deformation of the thin film transistor during bending can be reduced, damage of the thin film transistor during bending is reduced, and the service life of the display panel is prolonged.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (6)
1. A display panel, comprising:
a flexible substrate having a plurality of first regions and a plurality of second regions, wherein the material of the first regions comprises a crosslinked polymer of a flexible material and a photosensitive curing agent;
the array film layer is arranged on the flexible substrate and comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area;
the Young's modulus of the first region is greater than the Young's modulus of the second region;
the organic functional layer is arranged on one side of the array film layer far away from the flexible substrate, and comprises a plurality of third areas and a plurality of fourth areas, wherein the materials of the third areas comprise crosslinked polymers of organic materials and photosensitive curing agents; the Young's modulus of the third region is greater than the Young's modulus of the fourth region; the orthographic projection of the first region overlaps with the orthographic projection of the third region, or the orthographic projection of the first region is located within the orthographic projection of the third region.
2. The display panel of claim 1, wherein the young's modulus of the first region is the same as the young's modulus of the third region, and the young's modulus of the second region is the same as the young's modulus of the fourth region.
3. The display panel according to any one of claims 1 to 2, wherein the material of the photo-curing agent comprises at least one of benzoin, benzoin diethyl ether, benzoin butyl ether, benzoin dimethyl ether and 2-hydroxy-2-methyl-1-phenyl ketone.
4. The display panel according to any one of claims 1-2, wherein the young's modulus of the first region ranges from 11000 mpa to 15000 mpa.
5. A preparation method of a display panel is characterized in that,
preparing a flexible substrate to be treated, which is provided with a flexible material and is doped with a photosensitive curing agent;
carrying out light treatment on the flexible substrate to be treated to form a flexible substrate, wherein the flexible substrate is provided with a plurality of first areas and a plurality of second areas, the material of the first areas comprises crosslinked polymer of flexible material and photosensitive curing agent, and the Young modulus of the first areas is larger than that of the second areas; preparing an array film layer on the flexible substrate, wherein the array film layer comprises a thin film transistor, and the orthographic projection of the thin film transistor is positioned in the orthographic projection of the first area;
forming an organic functional layer to be treated, which is provided with an organic material and doped with a photosensitive curing agent, on the array film layer; carrying out light irradiation treatment on the organic functional layer to be treated to form an organic functional layer, wherein the organic functional layer is provided with a plurality of third areas and a plurality of fourth areas, the material of the third areas comprises crosslinked polymer of the organic material and a photosensitive curing agent, and the Young modulus of the third areas is larger than that of the fourth areas; the orthographic projection of the first region overlaps with the orthographic projection of the third region, or the orthographic projection of the first region is located within the orthographic projection of the third region.
6. The method according to claim 5, wherein a patterned first mask is provided before the flexible substrate to be processed is subjected to light treatment to form a flexible substrate; before the organic functional layer to be treated is subjected to light treatment to form the organic functional layer, a patterned second light shield is provided; the first light shield and the second light shield have the same structure.
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| CN109360906A (en) * | 2018-09-13 | 2019-02-19 | 云谷（固安）科技有限公司 | The manufacturing method of oganic light-emitting display device |
| CN110556398A (en) * | 2018-05-15 | 2019-12-10 | 京东方科技集团股份有限公司 | electronic device and preparation method thereof |
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| JP2018049209A (en) * | 2016-09-23 | 2018-03-29 | 株式会社ジャパンディスプレイ | Display |
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| CN110556398A (en) * | 2018-05-15 | 2019-12-10 | 京东方科技集团股份有限公司 | electronic device and preparation method thereof |
| CN109360906A (en) * | 2018-09-13 | 2019-02-19 | 云谷（固安）科技有限公司 | The manufacturing method of oganic light-emitting display device |
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