CN111584401A - Chip acid dip pickle - Google Patents
Chip acid dip pickle Download PDFInfo
- Publication number
- CN111584401A CN111584401A CN202010414266.6A CN202010414266A CN111584401A CN 111584401 A CN111584401 A CN 111584401A CN 202010414266 A CN202010414266 A CN 202010414266A CN 111584401 A CN111584401 A CN 111584401A
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- Prior art keywords
- chip
- pickling
- spring
- chassis
- ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
The invention discloses a chip pickling device, which structurally comprises a top cover, a chip placing rotating mechanism, a pickling machine body and a pickling solution discharge pipe, wherein the top cover is hinged to the top of the pickling machine body, the pickling machine body is provided with the chip placing rotating mechanism, the bottom of one side of the pickling machine body is communicated with the pickling solution discharge pipe, and compared with the prior art, the chip pickling device has the beneficial effects that: can place the chip of treating the pickling, and the chip is that a slice is independently placed, can avoid the chip to stack the area and overlap appearing, improve the area of contact of chip and pickle, help improving pickling efficiency and effect, the chip can use the pivot to rotate as the axle at pickling in-process, make chip and pickle and produce the counter force, more do benefit to the pickle to the pickling of chip, the pickling of chip is more abundant, the back has been washd, the tensile supporting shoe of being convenient for of spring loosens the chip after the pickling, the chip of being convenient for is whole to pour, need not take by a slice again.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a chip pickling device.
Background
The diode is an electronic device made of semiconductor material, and has one-way conductivity, i.e. when positive voltage is applied to anode and cathode of the diode, the diode is conducted, in the production process of the diode, the chip is required to be pickled in the process flow, the existing pickling mode of the chip is to directly place the chip to be pickled in a pickling tank, but the chip is also horizontally placed, the chip is easy to cause small contact area between the chip and pickling solution due to area superposition, so that the pickling efficiency of the chip is low, the pickling effect is poor, and the pickling of the chip is not thorough.
Disclosure of Invention
The invention mainly aims to overcome the defects of the prior art and provide a chip pickling device.
The invention is realized by adopting the following technical scheme: a chip pickling device structurally comprises a top cover, a chip placing and rotating mechanism, a pickling machine body and a pickling solution discharge pipe, wherein the top cover is hinged to the top of the pickling machine body;
the chip is placed the rotary mechanism and is coated outward and have strong oxidation resistant coating, the chip is placed rotary mechanism and is included chip, spring unit, gag lever post, chassis, apical ring, telescopic link, rotating assembly, micromotor, the chassis passes through spring unit and is connected with the apical ring, spring unit is the circle battle array and lays, and adjacent two sets of the chip has been placed between the spring unit, chip and gag lever post contact, the gag lever post is connected with the chassis is perpendicular, the gag lever post still with apical ring clearance fit, apical ring top center vertical connection in telescopic link, chassis, telescopic link all cooperate there is rotating assembly, rotating assembly is equipped with two sets ofly, one of them is a set of rotating assembly and micromotor are connected.
The spring assembly comprises an outer guide rod, two supporting blocks, a spring and an inner guide rod, the outer guide rod and the inner guide rod are matched with the spring, the supporting blocks are fixed on the outer walls of the two sides of the spring, the supporting blocks are in contact with the chip, one end of the spring is connected with the base plate, the other end of the spring is connected with the top ring, one end of the outer guide rod and one end of the inner guide rod are vertically connected with the base plate, and the other end of the outer guide rod and the other end of the inner guide rod are matched with the top.
As a further optimization of the content of the invention, the top ring comprises a rectangular hole, a ring body, a first guide hole and a second guide hole, wherein the first guide hole, the second guide hole and the rectangular hole are uniformly distributed on the ring body, the first guide hole is matched with the outer guide rod, the second guide hole is in clearance fit with the limiting rod, and the rectangular hole is matched with the inner guide rod.
The spring comprises a spring body, through holes and guide grooves, the through holes are formed in two sides of a spring section of the spring body, the guide grooves are formed in the inner wall of the spring section of the spring body and matched with the inner guide rods, the outer guide rods penetrate through the through holes, one end of the spring body is connected with the base plate, and the other end of the spring body is connected with the top ring.
As a further optimization of the invention, the supporting block comprises a connecting block, an arc-shaped groove, a block body and a limiting block, wherein the connecting block is fixed on one side of the block body, the arc-shaped groove is formed in the connecting block, the limiting block is vertically connected to the top of the block body, the arc-shaped groove is fixedly connected with the outer wall of a spring ring of the spring body, and the block body is in contact with the chip.
As a further optimization of the invention, the rotating assembly comprises a rotating disc, a semicircular support, a semicircular locking plate and a rotating shaft, the center of one end of the rotating disc is connected with the rotating shaft, the other end of the rotating disc is fixedly connected with the semicircular support, the semicircular support is provided with the semicircular locking plate, the rotating shaft is connected with a micro motor, and the convex column of the chassis can be matched with the semicircular support.
Advantageous effects
Compared with the prior art, the invention provides a chip pickling device, which has the following beneficial effects:
the telescopic rod retracts inwards to pull the top ring to rise, so that the spring is stretched, the distance between the spring ring and the spring ring is increased equidistantly based on the stretching of the spring, the distance between the support block and the support block in the longitudinal direction is increased, the chip is placed between two transversely adjacent support blocks, the arrangement of the limiting rod and the limiting block has a limiting effect on the placement of the chip, the chip can be placed in the middle and is more beneficial to acid cleaning of the chip, the arrangement of the through hole and the outer guide rod is facilitated, the arrangement of the guide groove and the inner guide rod has a limiting effect on the spring body, the twisting and deviation of the spring body are effectively prevented, after the chip to be cleaned is fully placed, the force is applied to the top ring through the extension of the telescopic rod, the spring is compressed, the distance between the spring ring and the spring ring is reduced equidistantly based on the stretching of the spring, so that the support block can apply force, the clearance has between chip and chip, can improve the area of contact of chip and pickling water, through the semicircle jam plate internal contraction in the semicircle stay, lug through the chassis, the spring unit that the chip was put to the clamp will be put to the telescopic link and place in the semicircle jam plate, the overhanging and semicircle stay closure of rethread semicircle jam plate, thereby realize to the chassis, the fixed at telescopic link both ends, toward pickling liquid of internal joining of pickling machine, cover the top cap, through driving micromotor function, under the rotating action of pivot, make spring unit can use the pivot as the rotation of axes, thereby drive chip and pickling water production counterpoint, more do benefit to the pickling of pickling water to the chip, make the pickling of chip more abundant, after washing, the tensile supporting shoe of spring is convenient for loosen the chip after the pickling, be convenient for the chip and all pour, need not take by one more slice.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a chip pickling apparatus according to the present invention.
Fig. 2 is a schematic cross-sectional view of a chip placement rotation mechanism according to the present invention.
Fig. 3 is a schematic left side view of the chip placement rotation mechanism of the present invention.
Fig. 4 is a right side view structural schematic diagram of the chip placing rotation mechanism of the invention.
Fig. 5 is a schematic structural view of a first operating state of the rotating assembly of the present invention.
Fig. 6 is a schematic structural view of a second operating state of the rotating assembly of the present invention.
Fig. 7 is a schematic structural view of a first working state of the spring assembly of the present invention in cooperation with a chip.
Fig. 8 is a structural diagram of a second working state of the spring assembly of the present invention in cooperation with a chip.
Fig. 9 is a schematic perspective view of the spring and the outer guide rod of the present invention.
Fig. 10 is a perspective view of the spring according to the present invention.
Fig. 11 is a schematic structural view of an enlarged view of a in fig. 10.
FIG. 12 is a schematic view of the support block of the present invention.
In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:
top cover-100, chip placing and rotating mechanism-200, pickling machine body-300, pickling solution discharge pipe-400, chip-Y1, spring component-Y2, limiting rod-Y3, chassis-Y4, top ring-Y5, telescopic rod-Y6, rotating component-Y7, micromotor-Y8, outer guide rod-2Y 1, supporting block-2Y 2, spring-2Y 3, inner guide rod-2Y 4, rectangular hole-5Y 1, ring-5Y 2, first guide hole-5Y 3, second guide hole-5Y 4, spring body-2Y 31, through hole-2Y 32, guide groove-2Y 33, connecting block-2Y 21, arc groove-2Y 22, block-2Y 23, limiting block-2Y 24, turntable-7Y 1, semicircular support-7Y 2, semicircular locking plate-7Y 3, pivot-7Y 4.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-6, the present invention provides a chip pickling apparatus, comprising: its structure is including top cap 100, chip place rotary mechanism 200, pickling machine body 300, pickle delivery pipe 400, pickling machine body 300 top hinged joint has top cap 100, pickling machine body 300 is equipped with the chip and places rotary mechanism 200, pickling machine body 300 one side bottom intercommunication has pickle delivery pipe 400, the chip place rotary mechanism 200 set up lie in can place the chip of treating the pickling for chip a slice is independently placed, avoids the chip to stack the area and overlaps, helps improving pickling efficiency and effect.
The chip placing and rotating mechanism 200 is externally coated with a strong oxidation resistant coating, and the strong oxidation resistant coating is arranged to prevent corrosion by a pickling solution, so that the service life of the chip placing and rotating mechanism 200 is prolonged.
The chip placing and rotating mechanism 200 comprises a chip Y1, a spring component Y1, a limiting rod Y1, a chassis Y1, a top ring Y1, a telescopic rod Y1, a rotating component Y1 and a micro-motor Y1, wherein the chassis Y1 is connected with the top ring Y1 through the spring component Y1, the spring components Y1 are distributed in a circular array, the chip Y1 is placed between two adjacent groups of spring components Y1, the chip Y1 is in contact with the limiting rod Y1, the limiting rod Y1 is vertically connected with the chassis Y1, the limiting rod Y1 is movably matched with the top ring Y1, the top center of the top ring Y1 is vertically connected with the telescopic rod Y1, the chassis Y1 and the telescopic rod Y1 are both matched with the rotating component Y1, the rotating component Y1 is provided with two groups, one group of the rotating component Y1 is connected with the micro-motor Y1, the micro-motor Y1 can provide power for the rotating the spring components Y1 to rotate the chassis 1, thereby drive chip Y1 and pickling water and produce counter force, more do benefit to the pickling of pickling water to chip Y1 for the pickling of chip is more abundant, setting up of gag lever post Y3 lies in can playing spacing effect to chip Y1, does benefit to the accuracy of chip Y1 and places.
The spring component Y2 comprises an outer guide rod 2Y1, a supporting block 2Y2, a spring 2Y3 and an inner guide rod 2Y4, the spring 2Y3 is matched with two outer guide rods 2Y1 and two inner guide rods 2Y4 respectively, supporting blocks 2Y2 are fixed on the outer walls of two sides of the spring 2Y3, the supporting block 2Y2 is contacted with the chip Y1, one end of the spring 2Y3 is connected with the bottom disc Y4, the other end is connected with the top ring Y5, one end of the outer guide rod 2Y1 and one end of the inner guide rod 2Y4 are vertically connected with the chassis Y4, the other end of the outer guide rod is matched with the top ring Y5, the supporting block 2Y2 and the spring 2Y3 are combined, when the spring is used for stretching, the distance between the spring ring and the spring ring can be equidistantly increased or decreased, when the distance is increased, the chip is conveniently placed, when the distance is decreased, the chip is conveniently clamped, the chip is independently placed in a sheet, and a gap is formed between the chip and the chip, so that the contact area between the chip and the pickling water can be increased.
The top ring Y5 includes rectangular hole 5Y1, ring body 5Y2, a guide hole 5Y3, No. two guide holes 5Y4, evenly distributed has a guide hole 5Y3, No. two guide holes 5Y4, rectangular hole 5Y1 on the ring body 5Y2, a guide hole 5Y3 and outer guide rod 2Y1 cooperation, No. two guide holes 5Y4 and gag lever post Y3 clearance fit, rectangular hole 5Y1 and inner guide rod 2Y4 cooperation, a guide hole 5Y3 and outer guide rod 2Y1, No. two guide holes 5Y4 and gag lever post Y3 combine the setting, make ring body 5Y2 can the translation to spring 2Y3 application of force.
The rotating assembly Y7 includes carousel 7Y1, semicircle support 7Y2, semicircle locking plate 7Y3, pivot 7Y4, the one end center of carousel 7Y1 is connected with pivot 7Y4, and the other end and semicircle support 7Y2 fixed connection, semicircle support 7Y2 is equipped with semicircle locking plate 7Y3, pivot 7Y4 is connected with micromotor Y8, the projection of chassis Y4 can cooperate with semicircle support 7Y2, the combination setting of semicircle support 7Y2 and semicircle locking plate 7Y3 is favorable to the placing installation of chassis Y4, telescopic link Y6 for chassis Y4 can drive spring assembly Y2 and rotate with pivot 7Y4 as the axle.
Example 2
Referring to fig. 1 to 12, the present invention provides a chip pickling apparatus, comprising: its structure is including top cap 100, chip place rotary mechanism 200, pickling machine body 300, pickle delivery pipe 400, pickling machine body 300 top hinged joint has top cap 100, pickling machine body 300 is equipped with the chip and places rotary mechanism 200, pickling machine body 300 one side bottom intercommunication has pickle delivery pipe 400, the chip place rotary mechanism 200 set up lie in can place the chip of treating the pickling for chip a slice is independently placed, avoids the chip to stack the area and overlaps, helps improving pickling efficiency and effect.
The chip placing and rotating mechanism 200 is externally coated with a strong oxidation resistant coating, and the strong oxidation resistant coating is arranged to prevent corrosion by a pickling solution, so that the service life of the chip placing and rotating mechanism 200 is prolonged.
The chip placing and rotating mechanism 200 comprises a chip Y1, a spring component Y1, a limiting rod Y1, a chassis Y1, a top ring Y1, a telescopic rod Y1, a rotating component Y1 and a micro-motor Y1, wherein the chassis Y1 is connected with the top ring Y1 through the spring component Y1, the spring components Y1 are distributed in a circular array, the chip Y1 is placed between two adjacent groups of spring components Y1, the chip Y1 is in contact with the limiting rod Y1, the limiting rod Y1 is vertically connected with the chassis Y1, the limiting rod Y1 is movably matched with the top ring Y1, the top center of the top ring Y1 is vertically connected with the telescopic rod Y1, the chassis Y1 and the telescopic rod Y1 are both matched with the rotating component Y1, the rotating component Y1 is provided with two groups, one group of the rotating component Y1 is connected with the micro-motor Y1, the micro-motor Y1 can provide power for the rotating the spring components Y1 to rotate the chassis 1, thereby drive chip Y1 and pickling water and produce counter force, more do benefit to the pickling of pickling water to chip Y1 for the pickling of chip is more abundant, setting up of gag lever post Y3 lies in can playing spacing effect to chip Y1, does benefit to the accuracy of chip Y1 and places.
The spring component Y2 comprises an outer guide rod 2Y1, a supporting block 2Y2, a spring 2Y3 and an inner guide rod 2Y4, the spring 2Y3 is matched with two outer guide rods 2Y1 and two inner guide rods 2Y4 respectively, supporting blocks 2Y2 are fixed on the outer walls of two sides of the spring 2Y3, the supporting block 2Y2 is contacted with the chip Y1, one end of the spring 2Y3 is connected with the bottom disc Y4, the other end is connected with the top ring Y5, one end of the outer guide rod 2Y1 and one end of the inner guide rod 2Y4 are vertically connected with the chassis Y4, the other end of the outer guide rod is matched with the top ring Y5, the supporting block 2Y2 and the spring 2Y3 are combined, when the spring is used for stretching, the distance between the spring ring and the spring ring can be equidistantly increased or decreased, when the distance is increased, the chip is conveniently placed, when the distance is decreased, the chip is conveniently clamped, the chip is independently placed in a sheet, and a gap is formed between the chip and the chip, so that the contact area between the chip and the pickling water can be increased.
The spring 2Y3 includes spring body 2Y31, through-hole 2Y32, guide way 2Y33, through-hole 2Y32 has all been seted up to spring body 2Y 31's spring festival both sides, the spring body 2Y 31's spring festival inner wall has seted up guide way 2Y33, guide way 2Y33 cooperatees with inner guide rod 2Y4, outer guide rod 2Y1 runs through in through-hole 2Y32, spring body 2Y31 one end links to each other with chassis Y4, the other end meets with top ring Y5, through-hole 2Y32 and outer guide rod 2Y1, the combination setting of guide way 2Y33 and inner guide rod 2Y4 lies in playing the effect of spacing to spring body 2Y31, effectively prevents spring body 2Y31 distortion off normal position.
The supporting block 2Y2 comprises a connecting block 2Y21, an arc-shaped groove 2Y22, a block body 2Y23 and a limiting block 2Y24, a connecting block 2Y21 is fixed on one side of the block body 2Y23, the connecting block 2Y21 is provided with an arc-shaped groove 2Y22, the top of the block body 2Y23 is vertically connected with a limit block 2Y24, the arc-shaped groove 2Y22 is fixedly connected with the outer wall of the spring ring of the spring body 2Y31, the block body 2Y23 is in contact with the chip Y1, the arrangement of the limit block 2Y24 has a limit effect on the placement of the chip Y1, so that the chip Y1 can be placed in the middle, the acid cleaning of the chip Y1 is facilitated, the arc-shaped groove 2Y22 is arranged to be matched with the outer wall of the spring body 2Y31, which is beneficial to improving the connection area of the two, therefore, the firmness of connection is improved, the arrangement of the block body 2Y23 not only plays a role in supporting the chip Y1, but also plays a role in clamping, and the chip Y1 is effectively prevented from falling off in the pickling process.
The working principle of the invention is as follows: the telescopic rod Y6 is retracted inwards to pull the top ring Y5 to rise, so that the spring 2Y3 is stretched, the distance between the spring ring and the spring ring is increased equidistantly when the spring is stretched, the distance between the support block 2Y2 and the support block 2Y2 in the longitudinal direction is increased, the chip Y1 is placed between two transversely adjacent support blocks 2Y2, the arrangement of the limiting rod Y3 and the limiting block 2Y24 has a limiting effect on the placement of the chip Y1, so that the chip Y1 is placed in the center, the acid cleaning of the chip Y1 is facilitated, the through hole 2Y32 and the outer guide rod 2Y1 are arranged, the arrangement of the guide groove 2Y33 and the inner guide rod 2Y4 has a limiting effect on the spring body 2Y31, the torsion deviation of the spring body 2Y31 is effectively prevented, after the chip Y1 to be cleaned is fully placed, the telescopic rod Y6 is extended outwards to apply force to the top ring Y5, so that the spring 2Y3 is compressed, and the distance between the spring ring is reduced equidistantly when the, therefore, the supporting block 2Y2 can apply force to the chip, the chip is conveniently clamped, the chip is independently placed in one piece, a gap is formed between the chip and the chip, the contact area between the chip and pickling water can be improved, the semicircular locking plate 7Y3 is retracted into the semicircular support 7Y2, the spring component Y2 clamped with the chip Y1 is placed on the semicircular locking plate 7Y3 through the convex block of the chassis Y4 and the telescopic rod Y6, and then the semicircular locking plate 7Y3 is extended to be locked with the semicircular support 7Y2, so that the two ends of the chassis Y4 and the telescopic rod Y6 are fixed, the pickling solution is added into the pickling machine body 300, the top cover 100 is covered, the micromotor Y8 is driven to operate, under the rotating action of the rotating shaft 7Y4, the spring component Y2 can rotate by taking the rotating shaft 7Y4 as the shaft, the chip Y1 is driven to be opposite to the pickling water, the pickling water is more beneficial to the pickling of the pickling water to the chip Y1, and the pickling, after cleaning, the stretching of the spring 2Y3 is convenient for the supporting block 2Y2 to loosen the chips after pickling, so that the chips can be poured out completely without taking the chips one by one.
In summary, the technical progress obtained by the invention compared with the prior art is as follows: according to the invention, through the combination arrangement of the chip, the spring assembly, the limiting rod, the chassis, the top ring, the telescopic rod, the rotating assembly and the micro motor, the chip to be pickled can be placed, one chip is placed independently, the overlapping of areas of the chips can be avoided, the contact area of the chip and the pickling solution is increased, the pickling efficiency and the pickling effect are improved, the chip can rotate by taking the rotating shaft as the shaft in the pickling process, the counter force is generated between the chip and the pickling solution, the pickling of the chip by the pickling solution is facilitated, the pickling of the chip is more sufficient, after the pickling is finished, the stretching of the spring facilitates the supporting block to release the chip after the pickling, the chip can be poured out completely, and one chip does not need to be taken.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a chip acid dip pickle, its structure is including top cap (100), chip place rotary mechanism (200), pickling organism (300), pickle delivery pipe (400), pickling organism (300) top even has top cap (100), pickling organism (300) are equipped with the chip and place rotary mechanism (200), pickling organism (300) have still connect pickle delivery pipe (400), its characterized in that:
the chip placing and rotating mechanism (200) is coated with a strong oxidation resistant coating, the chip placing and rotating mechanism (200) comprises a chip (Y1), a spring component (Y2), a limiting rod (Y3), a chassis (Y4), a top ring (Y5), a telescopic rod (Y6), a rotating component (Y7) and a micro motor (Y8), the chassis (Y4) is connected with the top ring (Y5) through spring assemblies (Y2), a chip (Y1) is placed between two adjacent groups of spring assemblies (Y2), the chip (Y1) is contacted with a limiting rod (Y3), the limiting rod (Y3) is vertically connected with the chassis (Y4), the limiting rod (Y3) is matched with the top ring (Y5), the top ring (Y5) is vertically connected with the telescopic rod (Y6), the chassis (Y4) and the telescopic rod (Y6) are both matched with a rotating component (Y7), the rotating assemblies (Y7) are provided with two groups, wherein one group of the rotating assemblies (Y7) is connected with a micromotor (Y8).
2. The chip pickling device according to claim 1, wherein: spring unit (Y2) is including outer guide arm (2Y1), supporting shoe (2Y2), spring (2Y3), interior guide arm (2Y4), spring (2Y3) and outer guide arm (2Y1), interior guide arm (2Y4) cooperation, spring (2Y3) are fixed with supporting shoe (2Y2), supporting shoe (2Y2) and chip (Y1) contact, spring (2Y3) are connected with chassis (Y4), apical ring (Y5), outer guide arm (2Y1), interior guide arm (2Y4) and chassis (Y4).
3. The chip pickling device according to claim 1, wherein: top ring (Y5) is including rectangular hole (5Y1), ring body (5Y2), guide hole (5Y3), No. two guide holes (5Y4), the equipartition has guide hole (5Y3), No. two guide holes (5Y4), rectangular hole (5Y1) on ring body (5Y2), guide hole (5Y3) and outer guide arm (2Y1) cooperation, No. two guide holes (5Y4) cooperate gag lever post (Y3), rectangular hole (5Y1) and inner guide arm (2Y4) cooperation.
4. The chip pickling device according to claim 2, wherein: spring (2Y3) including spring body (2Y31), through-hole (2Y32), guide way (2Y33), through-hole (2Y32), guide way (2Y33) have been seted up in spring body (2Y31), guide way (2Y33) and interior guide arm (2Y4) cooperation, outer guide arm (2Y1) run through in through-hole (2Y32), spring body (2Y31) meet with chassis (Y4), apical ring (Y5).
5. The chip pickling device according to claim 2, wherein: supporting shoe (2Y2) is including connecting block (2Y21), arc wall (2Y22), block (2Y23), stopper (2Y24), block (2Y23) are fixed with connecting block (2Y21), connecting block (2Y21) are equipped with arc wall (2Y22), block (2Y23) meet with stopper (2Y24), arc wall (2Y22) link firmly with spring body (2Y31), block (2Y23) and chip (Y1) contact.
6. The chip pickling device according to claim 1, wherein: rotating assembly (Y7) is including carousel (7Y1), semicircle support (7Y2), semicircle jam plate (7Y3), pivot (7Y4), carousel (7Y1) are connected with pivot (7Y4), semicircle support (7Y2), semicircle support (7Y2) are equipped with semicircle jam plate (7Y3), pivot (7Y4) are connected with micromotor (Y8), chassis (Y4) and semicircle support (7Y2) cooperation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010414266.6A CN111584401A (en) | 2020-05-15 | 2020-05-15 | Chip acid dip pickle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010414266.6A CN111584401A (en) | 2020-05-15 | 2020-05-15 | Chip acid dip pickle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111584401A true CN111584401A (en) | 2020-08-25 |
Family
ID=72117560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010414266.6A Withdrawn CN111584401A (en) | 2020-05-15 | 2020-05-15 | Chip acid dip pickle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111584401A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112296010A (en) * | 2020-10-09 | 2021-02-02 | 徐柏林 | Equipment for removing organic deposits on surface of semiconductor ceramic component |
| CN113798303A (en) * | 2021-08-03 | 2021-12-17 | 徐文 | Chip recycling system |
-
2020
- 2020-05-15 CN CN202010414266.6A patent/CN111584401A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112296010A (en) * | 2020-10-09 | 2021-02-02 | 徐柏林 | Equipment for removing organic deposits on surface of semiconductor ceramic component |
| CN113798303A (en) * | 2021-08-03 | 2021-12-17 | 徐文 | Chip recycling system |
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Application publication date: 20200825 |
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