CN111581040B - Method and system for determining destructive boundary value of electronic device - Google Patents
Method and system for determining destructive boundary value of electronic device Download PDFInfo
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Abstract
The present disclosure relates to a method of determining a destructive boundary value of an electronic device and a system thereof. The method comprises the following steps: taking a guide upper limit threshold and a guide lower limit threshold of a parameter to be tested of each electronic device; presetting a preset upper limit threshold and a preset lower limit threshold of the electronic equipment based on the acquired guidance upper limit threshold and guidance lower limit threshold aiming at the parameter to be tested; selecting an initial parameter value between the preset upper limit threshold and the preset lower limit threshold, gradually increasing or decreasing test parameters according to a preset step length on the basis of the initial parameter value, testing the working state of the electronic equipment, and finally obtaining a testing destructive upper boundary value or a testing destructive lower boundary value of the electronic equipment; and determining an average value of the test destructive upper boundary value and a preset upper threshold value as a destructive upper boundary value of the electronic equipment and determining an average value of the test destructive lower boundary value and a preset lower threshold value as a destructive lower boundary value of the electronic equipment.
Description
Technical Field
The present disclosure relates to the field of determining a destructive boundary value of a device, and more particularly, to a method and a system for determining a destructive boundary value of an electronic device.
Background
In recent years, with the increasing complexity of electronic products, the variety of integrated components is increasing, the number of integrated components is increasing, the requirement on the overall applicable environment of electronic equipment is increasing, the reliability of electronic products is also becoming stricter, and more clear guidance needs to be given to the applicable conditions of electronic products. If the guiding condition of the product is narrowed based on conservative consideration, the electronic device is not easy to be selected by the customer, and if the guiding condition is given based on the maximum applicable condition of the electronic device in the electronic device, the customer can exceed the actual destructive boundary value of the whole electronic device when using the electronic device, and the customer can be caused to make a compensation request. Therefore, how to faithfully and accurately determine the overall guidance applicable conditions of the electronic equipment is extremely important for electronic equipment manufacturers.
The overall guidance applicability of an existing determination electronic device is generally determined simply based on the applicability of a main electronic device, such as a CPU, in the electronic device. For example, if the minimum use temperature of the CPU is-10 degrees, the minimum use temperature of the entire electronic device is determined to be-10 degrees. Or if the lowest applicable temperature of the two main electronic devices is-10 degrees or-20 degrees, averaging the minimum applicable temperatures to-15 degrees as the overall guidance applicable condition of the electronic equipment.
Obviously, the existing technical scheme for determining the overall guidance applicable conditions of the electronic equipment has a plurality of defects. First, there are limitations. The existing technical scheme only considers the temperature or vibration boundary value of a main chip on the tested device, for other on-board devices, such as an auxiliary control chip (CPLD, FPGA, and the like), a general memory (norFlash, nandFlash, EEPROM, DRAM, and the like), and various bus loss degrees are unknown, and under the condition of test failure, if not critical chip damage, more efforts are usually required to measure signals of peripheral devices, which is not favorable for positioning problems. Second, the results are inaccurate. Usually, the test boundary values given by the chip manual are often the guide values given by the chip manufacturer through the test on the chip alone under the specific environment. And for the whole tested device, the test boundary value of the device is influenced to a certain extent by considering the external reasons such as the position, density degree, single plate and shell structure of the assembled device, so that the formulated boundary value has extremely high inaccuracy. Finally, this determination has no mode reference value. Since different models of devices may use different main function chips (for network devices, the main chips include CPU, switch chip, PHY chip, etc.), the test boundary values in each chip manual often have great differences due to different manufacturing processes. The temperature, amplitude, etc. thresholds are redesigned for each device tested.
Therefore, to obtain accurate guiding and applicable conditions of the electronic equipment, the requirements of the working state of the product reliability under the working condition with poor conditions cannot be met only by the conventional testing procedure. Therefore, the test procedure is optimized, and a test link with higher requirements is introduced, so that the clear requirements for verifying and improving the reliability of the product are met.
Disclosure of Invention
In order to solve one of the above-mentioned problems in the prior art, according to one aspect of the present disclosure, there is provided a method of determining a destructive boundary value of an electronic device including a main electronic device and a peripheral electronic device, the method including: inquiring an instruction manual of each electronic device used on the electronic equipment, and acquiring a guidance upper limit threshold and a guidance lower limit threshold of a parameter to be tested of each electronic device; presetting a preset upper limit threshold and a preset lower limit threshold of the to-be-tested parameter for the electronic equipment based on the obtained guidance upper limit threshold and guidance lower limit threshold; selecting an initial parameter value between the preset upper limit threshold and the preset lower limit threshold, gradually increasing or decreasing test parameters on the basis of the initial parameter value according to a preset step length, testing the working state of the electronic equipment, and finally obtaining a destructive test upper boundary value or a destructive test lower boundary value of the electronic equipment, wherein the electronic equipment is in a destructive failure working state when testing the destructive upper boundary value or the destructive test lower boundary value and is still in the failure working state when reverting to the initial parameter value; and determining an average value of the test destructive upper boundary value and the preset upper threshold value as a destructive upper boundary value of the electronic device and determining an average value of the test destructive lower boundary value and the preset lower threshold value as a destructive lower boundary value of the electronic device.
The method for determining the destructive boundary value of the electronic device according to the present disclosure, wherein presetting a preset upper threshold and a preset lower threshold for the electronic device for the parameter to be tested includes: presetting the highest instruction lower limit threshold value in the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices as a preset lower limit threshold value and presetting the lowest instruction upper limit threshold value in the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices as a preset upper limit threshold value.
The method for determining the destructive boundary value of the electronic device according to the present disclosure, wherein presetting a preset upper threshold value and a preset lower threshold value for the electronic device of the parameter to be tested includes: the average value of the highest instruction lower limit threshold values of the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices is preset as a preset lower limit threshold value, and the average value of the lowest instruction upper limit threshold values of the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices is preset as a preset upper limit threshold value.
The method for determining the destructive boundary value of the electronic device according to the present disclosure, wherein selecting the starting parameter value between the preset upper threshold and the preset lower threshold includes: selecting the preset upper threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive upper boundary value of the electronic equipment, and selecting the preset lower threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive lower boundary value of the electronic equipment.
The method for determining a destructive boundary value of an electronic device according to the present disclosure, wherein selecting a starting parameter value between the preset upper threshold value and the preset lower threshold value comprises: selecting a parameter value of one or more steps smaller than the preset upper threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive upper boundary value of the electronic equipment, and selecting a parameter value of one or more steps larger than the preset lower threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive lower boundary value of the electronic equipment.
According to another aspect of the present disclosure, there is provided a system for determining a destructive boundary value of an electronic device, the electronic device including a main electronics and a peripheral electronics, the system comprising: a receiving unit which acquires a guidance upper limit threshold and a guidance lower limit threshold of a parameter to be tested, which are recorded in an instruction manual of each electronic device used on the electronic equipment; the preset unit is used for presetting a preset upper limit threshold value and a preset lower limit threshold value of the to-be-tested parameter for the electronic equipment based on the acquired guidance upper limit threshold value and guidance lower limit threshold value; the test unit is used for selecting an initial parameter value between the preset upper limit threshold value and the preset lower limit threshold value, gradually increasing or decreasing test parameters on the basis of the initial parameter value according to a preset step length, testing the working state of the electronic equipment, and finally obtaining a destructive test upper boundary value or a destructive test lower boundary value of the electronic equipment, wherein the electronic equipment is in a destructive failure working state when testing the destructive upper boundary value or the destructive test lower boundary value and is still in a failure working state when reverting to the initial parameter value; and a determination unit that determines an average value of the test destructive upper boundary value and a preset upper threshold value as a destructive upper boundary value of the electronic device and an average value of the test destructive lower boundary value and a preset lower threshold value as a destructive lower boundary value of the electronic device.
According to the destructive boundary value determining system of the electronic device, the presetting unit presets the highest instruction lower limit threshold value of the parameters to be tested of the same type of all the main electronic devices and the peripheral electronic devices as the preset lower limit threshold value and presets the lowest instruction upper limit threshold value of the parameters to be tested of the same type of all the main electronic devices and the peripheral electronic devices as the preset upper limit threshold value.
According to the destructive boundary value determining system of the electronic device, the presetting unit presets the average value of the highest instruction lower limit threshold values of the parameters to be tested of the same type of the main electronic devices and the peripheral electronic devices as the preset lower limit threshold value and presets the average value of the lowest instruction upper limit threshold values of the parameters to be tested of the same type of the main electronic devices and the peripheral electronic devices as the preset upper limit threshold value.
The system for determining a destructive boundary value of an electronic device according to the present disclosure, wherein the test unit selects the preset upper threshold as a starting parameter value for testing an operating state of the electronic device so as to finally acquire a testing destructive upper boundary value of the electronic device, and selects the preset lower threshold as a starting parameter value for testing an operating state of the electronic device so as to finally acquire a testing destructive lower boundary value of the electronic device.
The system for determining a destructive boundary value of an electronic device according to the present disclosure, wherein the test unit selecting a starting parameter value between the preset upper threshold value and the preset lower threshold value comprises: selecting a parameter value of one or more steps smaller than the preset upper threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive upper boundary value of the electronic equipment, and selecting a parameter value of one or more steps larger than the preset lower threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive lower boundary value of the electronic equipment.
In summary, the system and method for determining a destructive boundary value of an electronic device according to the present disclosure provide a scientific and general method for determining a destructive test boundary value, so as to make the test result accurate, and better provide the developer with design basis and reference. Such a system and method breaks through the limitations of prior art solutions. The system and the method for determining the destructive boundary value of the electronic equipment consider the whole tested equipment (comprising an auxiliary control chip, a universal memory, various capacitors and resistor devices on boards on a team and the like), do not consider a main function chip singly, and work out a boundary value calculation formula which is more scientific and standard on the basis of experimental data. Secondly, according to the system and the method for determining the destructive boundary value of the electronic equipment, the accuracy of the whole boundary value of the electronic equipment is improved, the manufacturer manual of each device on each board is referred to on the basis of test data, external factors including the position, the density degree, the structure of the single board and the shell and the like are fully considered, and the system and the method are a comprehensive scheme made by comprehensively considering all the factors. Finally, the system and method for determining destructive boundary values of electronic devices according to the present disclosure provide a design model that can be referenced, providing a complete and consideration-able combined design solution for the same type of devices. The test engineer can simply apply the model formula to design a scientific and standard test boundary value conveniently.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
For a better understanding of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
FIG. 1 illustrates an exemplary block diagram of a system for determining destructive boundary values for an electronic device in accordance with the present disclosure;
fig. 2 illustrates a timing diagram of a wireless access device handling a connection between a client device and a DHCP server without DNS configuration information in accordance with the present disclosure; and
fig. 3 shows a flow chart of a data processing method of a wireless access device according to the present disclosure;
FIG. 4 is a test schematic illustrating, as an example, a shock damage boundary value for a test unit testing electronic device of the determination system according to the present disclosure;
FIG. 5 is a schematic flow chart illustrating a process for determining a destructive boundary value for an electronic device according to the present disclosure.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the disclosure, as detailed in the appended claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, a first could also be termed a second, and, similarly, a second could also be termed a first, without departing from the scope of the present disclosure. The word "if," as used herein, may be interpreted as "at … …" or "at … …" or "in response to a determination," depending on the context.
Exemplary embodiments are described with reference to the accompanying drawings. Wherever convenient, the same reference numbers will be used throughout the drawings to refer to the same or like parts. Although examples and features of the disclosed principles are described herein, modifications, adaptations, and other implementations are possible without departing from the spirit and scope of the disclosed embodiments.
The components and steps shown are set forth to illustrate the exemplary embodiments shown, and it is anticipated that ongoing technology development will change the manner in which particular functions are performed. These examples are presented herein for purposes of illustration and not of limitation. Moreover, the boundaries of the functional building blocks have been arbitrarily defined herein for the convenience of the description. Alternative boundaries can be defined so long as the specified functions and relationships thereof are appropriately performed. Alternatives (including equivalents, extensions, variations, deviations, etc. of those described herein) will be apparent to persons skilled in the relevant art(s) based on the teachings contained herein. Such alternatives fall within the scope and spirit of the disclosed embodiments.
FIG. 1 illustrates an exemplary block diagram of a system for determining a destructive boundary value for an electronic device according to the present disclosure. As shown in fig. 1, the system 100 for determining destructive boundary values of electronic devices uses electronic devices including a main electronic device and a peripheral electronic device. Such as CPU, switch chip, PHY chip, etc., and other peripheral electronic devices such as CPLD, FPGA, bridge chip, capacitor, resistor, various physical bus controllers, etc. The determination system 100 includes a parameter receiving unit 110, a threshold presetting unit 120, a boundary testing unit 130, and a boundary determining unit 140.
The parameter receiving unit 110 acquires a guide upper limit threshold value and a guide lower limit threshold value of a parameter to be tested described in an instruction manual of each electronic device used on the electronic apparatus. Taking temperature thresholds as an example, the industry typically sets a guideline upper threshold and a guideline lower threshold for self-supplied electronic devices so that a technician or downstream manufacturer can use the devices between the guideline upper threshold and the guideline lower threshold. Usually, the upper and lower temperature limit thresholds given by the CPU device instruction manual are usually-20 ℃ to 95 ℃, the upper and lower temperature limit thresholds given by the exchange chip instruction manual are usually-10 ℃ to 90 ℃, and the upper and lower temperature limit thresholds given by the phy chip are usually-25 ℃ to 110 ℃. In addition to the temperature, some devices also give other parameter values, such as shock threshold, anti-whip performance value, anti-pressure performance value, high acceleration lifetime, high acceleration stress, etc. These values can be obtained by testing the user query and inputting to the parameter receiving unit 110, or can be obtained directly by crawling the networked query. Based on the constituent electronic devices of the electronic equipment to be tested, a list of guideline upper threshold values and guideline lower threshold values for all electronic devices of each parameter to be tested is formed. Next, the parameter presetting unit 120 presets a preset upper limit threshold and a preset lower limit threshold for the electronic device of the parameter to be tested based on the obtained guidance upper limit threshold and guidance lower limit threshold for the parameter to be tested. Presetting the preset upper limit threshold and the preset lower limit threshold of the electronic equipment needs to comprehensively consider the density degree, the device position and the single board and shell structure of electronic devices formed on the electronic equipment. Specifically, the parameter presetting unit 120 presets the highest instruction lower threshold value in the similar to-be-tested parameters of all the main electronic devices and the peripheral electronic devices as the preset lower threshold value and presets the lowest instruction upper threshold value in the similar to-be-tested parameters of all the main electronic devices and the peripheral electronic devices as the preset upper threshold value. For example, the upper temperature guidance threshold and the lower guidance threshold given by the CPU manual are-20 ℃ to 95 ℃, the upper temperature guidance threshold and the lower guidance threshold given by the exchange chip manual are-10 ℃ to 90 ℃, and the upper temperature guidance threshold and the lower guidance threshold given by the phy chip manual are-25 ℃ to 110 ℃, then under comprehensive consideration, the preset lower temperature threshold of the electronic device is preset to-10 ℃, and the preset upper temperature threshold of the electronic device is preset to 90 ℃, that is, the preset upper and lower temperature thresholds of the electronic device are preset to-10 ℃ to 90 ℃. Alternatively, the parameter presetting unit 120 may preset an average value of the highest instructional lower limit thresholds of the parameters to be tested of the same type of the main electronic devices and the peripheral electronic devices as the preset lower limit threshold and preset an average value of the lowest instructional upper limit thresholds of the parameters to be tested of the same type of the main electronic devices and the peripheral electronic devices as the preset upper limit threshold. For example, the upper temperature guidance threshold and the lower guidance threshold given by the CPU manual are-20 ℃ to 100 ℃, the upper temperature guidance threshold and the lower guidance threshold given by the exchange chip manual are-10 ℃ to 90 ℃, and the upper temperature guidance threshold and the lower guidance threshold given by the phy chip manual are-30 ℃ to 110 ℃, then under comprehensive consideration, the preset lower temperature threshold of the electronic device is preset to-20 ℃, and the preset upper temperature threshold of the electronic device is preset to 100 ℃, that is, the preset upper and lower temperature thresholds of the electronic device are preset to-20 ℃ to 100 ℃. Further alternatively, different weights may be given to the environment where each device is located, the density between each device and another device, the heat dissipation environment, and the like, and a weighted average may be obtained to preset the upper threshold and the lower threshold.
To obtain the destructive boundaries of the parameters of the electronic device, the electronic device is then placed in a test environment set by the boundary test unit 130 for testing. The boundary testing unit 130 first selects an initial parameter value between a preset upper threshold and a preset lower threshold corresponding to a parameter to be tested, then gradually increases or decreases the testing parameter based on the initial parameter value according to a predetermined step length, tests the working state of the electronic device, and finally obtains a testing destructive upper boundary value or a testing destructive lower boundary value of the electronic device, where the electronic device is in a destructive failure working state when testing the destructive upper boundary value or the testing destructive lower boundary value and is still in a failure working state when reverting to the initial parameter value.
The test unit 130 may be a temperature controlled chamber or may be a vibration controlled platform. Different test units can be configured according to different actual requirements.
FIG. 2 is a test schematic illustrating an example of a low temperature damage boundary value of a test unit test electronics of a determination system according to the present disclosure. As shown in fig. 2, the test is started from the initial temperature as the initial parameter value, and the temperature is decreased by a certain step value or a temperature decrease step length. When the temperature is reduced by one step to T2, the test electronic equipment sample is invalid; and then, the temperature is adjusted back to T1, and the test equipment is recovered to be normal. And continuously cooling, when the temperature is reduced by two steps to be reduced to T3, the test electronic equipment fails, at the moment, the temperature is adjusted back to T1 again, the test electronic equipment returns to be normal, and the temperature T1 is confirmed to be the low-temperature working limit value of the test electronic equipment. And continuously cooling, when the temperature is reduced to T4 in three steps, the testing electronic equipment is invalid, then the temperature is adjusted back to T1, the testing electronic equipment cannot be recovered to be normal, and the testing electronic equipment still does not work until the temperature is adjusted back to the initial temperature, and then the T4 is determined as the low-temperature damage boundary value of the testing electronic equipment.
FIG. 3 is a test schematic illustrating an example of a high temperature damage boundary value of a test unit test electronics of a determination system according to the present disclosure. As shown in fig. 3, the test was started from the start temperature as the start parameter value, and the temperature was raised by a predetermined step value or temperature raising step. When the temperature rises by one step to T2 in FIG. 3, the test electronic device sample fails; and the temperature is adjusted back to T1, and the test equipment is recovered to be normal. And continuing heating, when the temperature rises to T3 in two steps, the test electronic equipment fails, at the moment, the temperature is adjusted back to T1 again, the test electronic equipment returns to normal, and the temperature T1 is confirmed to be the high-temperature working limit value of the test electronic equipment. And continuing heating, when the temperature rises to T4 in three steps, the test electronic equipment fails, then, returning the temperature to T1, and the test electronic equipment cannot be recovered to be normal until the temperature is returned to the initial temperature and the test electronic equipment still does not work, and then, determining that T4 is the high-temperature damage boundary value of the test electronic equipment.
FIG. 4 is a test diagram illustrating, as an example, a shock damage boundary value for a test unit testing electronic device of a determination system according to the present disclosure. As shown in fig. 4, the test starts from the initial vibration magnitude as the initial parameter value, and the vibration magnitude is raised by a certain step value or vibration magnitude step length. When the vibration magnitude rises by one step to g2 in fig. 4, the test electronic device sample fails; and the vibration magnitude is adjusted back to g1, and the test equipment is recovered to be normal. And continuously increasing the vibration magnitude, when the vibration magnitude increases to g3 by two steps, the test electronic equipment fails, at the moment, the vibration magnitude is adjusted back to g1 again, the test electronic equipment returns to normal, and the vibration magnitude g1 is confirmed to be the high vibration magnitude working limit value of the test electronic equipment. And continuing to increase the vibration magnitude, when the three step lengths of the vibration magnitude increase to g4, the test electronic equipment fails to work, then, returning the vibration magnitude to g1, and the test electronic equipment cannot recover to be normal until the vibration magnitude is returned to the initial vibration magnitude and the test electronic equipment still does not work, and then determining g4 as a high vibration magnitude damage boundary value of the test electronic equipment.
It should be noted that, the boundary test unit 130 may select the preset upper threshold as a starting parameter value for testing the operating state of the electronic device so as to finally obtain a testing destructive upper boundary value of the electronic device, and select the preset lower threshold as a starting parameter value for testing the operating state of the electronic device so as to finally obtain a testing destructive lower boundary value of the electronic device, when the starting temperature is used as the starting parameter value. Alternatively, the boundary test unit 130 selecting the starting parameter value between the preset upper threshold and the preset lower threshold includes: selecting a parameter value of one or more steps smaller than the preset upper threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive upper boundary value of the electronic equipment, and selecting a parameter value of one or more steps larger than the preset lower threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive lower boundary value of the electronic equipment. By selecting the initial parameter value closer to the preset upper threshold value and the preset lower threshold value, the testing steps in the process of testing the electronic equipment can be reduced, and the testing time is reduced.
Finally, after obtaining the test destructive boundary value for each test parameter, the boundary determination unit 140 determines the average of the test destructive upper boundary value and the preset upper threshold value as the destructive upper boundary value of the electronic device and determines the average of the test destructive lower boundary value and the preset lower threshold value as the destructive lower boundary value of the electronic device. Because various conditions of electronic devices in the electronic equipment are comprehensively considered by selecting the preset upper limit threshold and the preset lower limit threshold, and the actual destructive upper boundary value in the actual test actually represents the objective condition of the electronic equipment, the average processing mode can more truly represent the destructive boundary of the tested electronic equipment facing various environments and conditions.
FIG. 5 is a schematic flow chart illustrating a process for determining a destructive boundary value for an electronic device according to the present disclosure. As shown in fig. 5, first, at step S210, an operating state guidance upper limit threshold and a guidance lower limit threshold of a parameter P to be tested described in a specification of use of each type of electronic device included in the electronic apparatus are collected. Then, at step S215, the preset upper threshold value P of the parameter P to be tested is preset based on the received operating state guidance upper threshold value and guidance lower threshold value of the parameter P to be tested H And a preset lower threshold value P L . As described above, the highest instruction lower limit threshold of the similar parameters to be tested of all the main electronic devices and the peripheral electronic devices is preset as the preset lower limit threshold P L Presetting the lowest instruction upper limit threshold value in the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices as a preset upper limit threshold value P H . Alternatively, the parameter presetting unit 120 may preset an average value of the highest instruction lower limit thresholds of the parameters to be tested of the same type of the main electronic device and the peripheral electronic devices as the preset lower limit threshold P L And presetting the average value of the minimum guidance upper limit threshold values of the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices as a preset upper limit threshold value P H . Subsequently at step S220, an upper threshold value P is preset therebetween H And a preset lower threshold value P L Selecting a real parameter value P = P of a test S . As described above, the boundary test unit 130 selecting the starting parameter value between the preset upper threshold and the preset lower threshold includes: selecting a parameter value of one or more steps smaller than the preset upper threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive upper boundary value of the electronic equipment, and selecting a parameter value of one or more steps larger than the preset lower threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive lower boundary value of the electronic equipment. By selecting the initial parameter value closer to the preset upper threshold value and the preset lower threshold value, the testing steps in the process of testing the electronic equipment can be reduced, and the testing time is reduced. Then, in step S225, the parameter value to be tested is increased or decreased according to the predetermined test parameter step Δ P, and whether the electronic device is in a failure operating state is tested under the parameter value to be tested. The selection of the specific step length is set according to the actual needs of the parameter to be measured, and can be set based on the experience value of a technician. To obtain more accurate test results, the step size may be set smaller. To save test time, the step size may also be set larger. Although shown as "P = P ±. Δ P" in fig. 5, only "P = P- Δp" is employed when the destructive lower boundary value is the object of the test, and only "P = P +. Δ P" is employed when the destructive upper boundary value is the object of the test.
With respect to the test result, at step S230, it is determined whether the electronic device is in a failure state under the selected parameter P to be tested. If not, it returns to step S225. Otherwise, the process proceeds to step S235, and it is determined whether the electronic device is in the first failure state during the testing process when the testing purpose is the destructive lower boundary value or during the testing process when the testing purpose is the destructive upper boundary value. If the first time is determined to be in the operation failure state, the number N of the failure operation state is given as "1", and then the process proceeds to step S240. If it is determined that the operation failure state is not the first time, the process directly proceeds to step S240. In step S240, a test parameter value P for a first test before the first failure state is set to P1, and the parameter value P to be tested is recalled to P1, so as to test the operating state of the electronic device when the parameter to be tested is recalled to P1. Next, at step S245, it is determined whether the test electronic device is restored to a valid operating state. If it is determined that the test electronic device is restored to be in the valid operating state, it is determined at step S250 whether the electronic device has undergone at least two processes of restoring from the disabled state to the valid state. If so, the test parameter value is set to P1 as the operating limit (upper or lower) for the electronic device as determined at step S255. And then returns to step S225. If the result of the determination at step S250 is negative, it returns directly to step S225. Although the number of determinations determined at step S250 is 2, it may be determined to be 3, 4, or 5 according to actual needs. Generally, P1 can be basically determined as the working limit value through two failure and recovery validation processes.
If it is determined at step S245 that the electronic device does not recover the operation state, at step S260, the value of the band test parameter that cannot recover the operation state is determined as the test destructive boundary value P of the electronic device D . For example testing destructive upper boundary values P DH And testing the destructive lower boundary value P DL 。
Finally at step S265, based on the test destructive boundary value P D And a corresponding preset upper threshold value P H And a preset lower threshold value P L Determining final guide destructive boundary value P of electronic equipment G And (guiding destructive upper boundary value P) GH And guiding a destructive lower boundary value P GL . In particular, finally a test destructive upper boundary value P is obtained for each test parameter DH And testing the destructive lower boundary value P DL Thereafter, the boundary determination unit 140 determines an average value of the test destructive upper boundary value and the preset upper threshold value as a destructive boundary value upper limit value of the electronic device and an average value of the test destructive lower boundary value and the preset lower threshold value as a destructive boundary value lower limit value of the electronic device. The selection of the preset upper limit threshold and the preset lower limit threshold is already coordinatedVarious conditions of electronic devices in the electronic equipment are considered, the actual destructive upper boundary value of the test actually reflects the objective condition of the electronic equipment, and the average processing mode can truly reflect the destructive boundary of the tested electronic equipment facing various environments and conditions.
In summary, the system and method for determining a destructive boundary value of an electronic device according to the present disclosure provide a scientific and general method for determining a destructive test boundary value, so as to make the test result accurate, and better provide the developer with design basis and reference. Such a system and method breaks through the limitations of prior art solutions. The system and the method for determining the destructive boundary value of the electronic equipment consider the whole tested equipment (comprising an auxiliary control chip, a universal memory, various capacitors and resistor devices on boards on a team and the like), do not consider a main function chip singly, and work out a boundary value calculation formula which is more scientific and standard on the basis of experimental data. Secondly, according to the system and the method for determining the destructive boundary value of the electronic equipment, the accuracy of the whole boundary value of the electronic equipment is improved, the manufacturer manual of each device on each board is referred to on the basis of test data, external factors including the position, the density degree, the structure of the single board and the shell and the like are fully considered, and the system and the method are a comprehensive scheme made by comprehensively considering all the factors. Finally, the system and method for determining destructive boundary values for electronic devices according to the present disclosure provides a design model that can be referenced, providing a complete and deliberate combination design for the same type of device. The test engineer can conveniently design scientific and normative test boundary values simply by applying the model formula.
Destructive tests that may be performed using the systems and methods of the present disclosure typically include rapid high and low temperature, shock, electromagnetic interference, and maximum humidity tests.
The objects of the present disclosure may also be achieved by running a program or a set of programs on any computing device. The computing device may be a general purpose device as is well known. Thus, the object of the present disclosure can also be achieved merely by providing a program product containing program code for implementing the method or apparatus. That is, such a program product also constitutes the present disclosure, and a storage medium storing such a program product also constitutes the present disclosure. It is to be understood that the storage medium may be any known storage medium or any storage medium developed in the future.
It is also noted that in the apparatus and methods of the present disclosure, it is apparent that individual components or steps may be disassembled and/or re-assembled. Such decomposition and/or recombination should be considered as equivalents of the present disclosure. Also, the steps of executing the series of processes described above may naturally be executed chronologically in the order described, but need not necessarily be executed chronologically. Some steps may be performed in parallel or independently of each other.
The above detailed description should not be construed as limiting the scope of the disclosure. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions can occur, depending on design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present disclosure should be included in the scope of protection of the present disclosure.
Claims (10)
1. A method of determining a destructive boundary value for an electronic device, the electronic device comprising a main electronics and a peripheral electronics, the method comprising:
inquiring an instruction manual of each electronic device used on the electronic equipment, and acquiring a guidance upper limit threshold and a guidance lower limit threshold of a parameter to be tested of each electronic device;
presetting a preset upper limit threshold and a preset lower limit threshold of the to-be-tested parameter for the electronic equipment based on the obtained guidance upper limit threshold and guidance lower limit threshold;
selecting an initial parameter value between the preset upper limit threshold and the preset lower limit threshold, gradually increasing or decreasing test parameters on the basis of the initial parameter value according to a preset step length, testing the working state of the electronic equipment, and finally obtaining a destructive test upper boundary value or a destructive test lower boundary value of the electronic equipment, wherein the electronic equipment is in a destructive failure working state when testing the destructive upper boundary value or the destructive test lower boundary value and is still in the failure working state when reverting to the initial parameter value; and
determining an average of the test destructive upper boundary value and the preset upper threshold value as a destructive upper boundary value of the electronic device and determining an average of the test destructive lower boundary value and the preset lower threshold value as a destructive lower boundary value of the electronic device.
2. The method of determining destructive boundary values of an electronic device according to claim 1, wherein presetting preset upper and lower threshold values for the electronic device for the parameter to be tested comprises:
presetting the highest instruction lower limit threshold value in the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices as a preset lower limit threshold value and presetting the lowest instruction upper limit threshold value in the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices as a preset upper limit threshold value.
3. The method for determining a destructive boundary value of an electronic device according to claim 1, wherein presetting the preset upper threshold value and the preset lower threshold value for the electronic device of the parameter to be tested comprises:
the average value of the highest instruction lower limit threshold values of the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices is preset as a preset lower limit threshold value, and the average value of the lowest instruction upper limit threshold values of the same type of parameters to be tested of all the main electronic devices and the peripheral electronic devices is preset as a preset upper limit threshold value.
4. The method of determining destructive boundary values for an electronic device of claim 2, wherein selecting a starting parameter value between the preset upper threshold and a preset lower threshold comprises: selecting the preset upper threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive upper boundary value of the electronic equipment, and selecting the preset lower threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive lower boundary value of the electronic equipment.
5. The method of determining destructive boundary values for an electronic device of claim 3, wherein selecting a starting parameter value between the preset upper threshold and a preset lower threshold comprises: selecting a parameter value of one or more steps smaller than the preset upper threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive upper boundary value of the electronic equipment, and selecting a parameter value of one or more steps larger than the preset lower threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive lower boundary value of the electronic equipment.
6. A system for determining a destructive boundary value for an electronic device, the electronic device including a main electronics and a peripheral electronics, the system comprising:
a receiving unit which acquires a guidance upper limit threshold and a guidance lower limit threshold of a parameter to be tested, which are recorded in an instruction manual of each electronic device used on the electronic equipment;
the preset unit is used for presetting a preset upper limit threshold value and a preset lower limit threshold value of the to-be-tested parameter for the electronic equipment based on the acquired guidance upper limit threshold value and guidance lower limit threshold value;
the test unit is used for selecting an initial parameter value between the preset upper limit threshold value and the preset lower limit threshold value, gradually increasing or decreasing test parameters on the basis of the initial parameter value according to a preset step length, testing the working state of the electronic equipment, and finally obtaining a destructive test upper boundary value or a destructive test lower boundary value of the electronic equipment, wherein the electronic equipment is in a destructive failure working state when testing the destructive upper boundary value or the destructive test lower boundary value and is still in a failure working state when reverting to the initial parameter value; and
and the determining unit is used for determining the average value of the testing destructive upper boundary value and the preset upper threshold value as the destructive upper limit value of the electronic equipment and determining the average value of the testing destructive lower boundary value and the preset lower threshold value as the destructive lower limit value of the electronic equipment.
7. The system for determining destructive boundary values of electronic devices according to claim 6, wherein said presetting unit presets a highest instructional lower threshold value among all main electronic devices and peripheral electronic devices of the same kind of parameters to be tested as a preset lower threshold value and a lowest instructional upper threshold value among all main electronic devices and peripheral electronic devices of the same kind of parameters to be tested as a preset upper threshold value.
8. The system for determining destructive boundary values of electronic devices according to claim 6, wherein said presetting unit presets an average of highest instructional lower threshold values for all master electronic devices and peripheral electronic devices of the same type of parameters to be tested as a preset lower threshold value and an average of lowest instructional upper threshold values for all master electronic devices and peripheral electronic devices of the same type of parameters to be tested as a preset upper threshold value.
9. The system for determining destructive boundary values of an electronic device according to claim 7, wherein said testing unit selects said preset upper threshold as a starting parameter value for testing an operating state of said electronic device so as to finally obtain a testing destructive upper boundary value of said electronic device, and selects said preset lower threshold as a starting parameter value for testing an operating state of said electronic device so as to finally obtain a testing destructive lower boundary value of said electronic device.
10. The system for determining destructive boundary values of an electronic device of claim 8, wherein said test unit selecting a starting parameter value between said preset upper threshold and a preset lower threshold comprises: selecting a parameter value of one or more steps smaller than the preset upper threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive upper boundary value of the electronic equipment, and selecting a parameter value of one or more steps larger than the preset lower threshold as a starting parameter value for testing the working state of the electronic equipment so as to finally obtain a testing destructive lower boundary value of the electronic equipment.
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