CN111580577A - Method, device, equipment and medium for monitoring temperature of machine room - Google Patents
Method, device, equipment and medium for monitoring temperature of machine room Download PDFInfo
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Abstract
The application discloses a method, a device, equipment and a medium for monitoring the temperature of a machine room, comprising the following steps: acquiring temperature data of IT equipment in a machine room; constructing a three-dimensional space diagram of the machine room by using the position data of the IT equipment; wherein the IT equipment is a corresponding simulation point in the three-dimensional space diagram; performing interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube; and generating a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value and the temperature data. Can detect the temperature of any point in the computer lab environment to grasp computer lab ambient temperature comprehensively, through three-dimensional space temperature distribution diagram, the temperature distribution situation in the computer lab can directly perceived timely the understanding of fortune dimension personnel has improved the computer lab and has maintained efficiency.
Description
Technical Field
The application relates to the technical field of machine room equipment, in particular to a machine room temperature monitoring method, device, equipment and medium.
Background
The data center machine room is provided with important electronic facilities such as servers, storage equipment, network equipment, safety equipment and the like, and the working efficiency of the electronic facilities is closely related to the ambient temperature. When the environment temperature is too high, the operation efficiency of the equipment can be rapidly reduced, and even parts can be damaged in serious conditions, so that the equipment operation fault and the service stop are caused, and the economic loss is caused. Therefore, the data center machine room is equipped with a complete set of air conditioning and ventilating system to maintain the normal and stable temperature of the environment of the machine room. However, in a high-density machine room, the problem of over-high temperature in a local area, namely the problem of local hot spots, still occurs easily under the condition that the total refrigerating capacity meets the refrigerating requirement of the IT equipment. Once do not carry out effectual management and control to computer lab air current organization, the cold and hot air current of computer lab is disorderly, just can be in local production hot spot in the computer lab, and then influences IT equipment work efficiency. With systems that can monitor temperature, it is also important to take action when an alarm occurs. It is also important that manual measurements be taken by maintenance personnel in critical areas near the hot spot on a regular basis to ensure that the sensors of the automated system are able to obtain the correct temperature. In the fight against hot spots, the machine room air conditioner is the most important measure. Without a high quality room air conditioning system, it is almost impossible to maintain the data center equipment at an acceptable temperature. However, operating only the room air conditioning system does not prevent the equipment from overheating. The cool air must be delivered to strategic locations within the data center to ensure that the air intakes on the various servers are able to access the cool air as needed.
However, the existing machine room environment detection means has the defects of poor intuition and low fixed point accuracy. It is difficult to show the complete temperature distribution state in the machine room for operation and maintenance personnel. Firstly, temperature collection of a temperature sensor can only reflect the temperature of a certain position point in a machine room space, and the data is single and cannot reflect the environmental temperature distribution of the whole machine room; secondly, the operation and maintenance personnel collect the data of the temperature sensor manually or through an air conditioning system, the efficiency is low, the operation environment temperature of the IT equipment cannot be accurately reflected, local high-temperature hot spots can be solved only by adjusting fans near the hot spots, but hot spots can not be generated at other positions, and the environment temperature of the machine room cannot be controlled globally.
Disclosure of Invention
In view of this, an object of the present application is to provide a method, an apparatus, a device and a medium for monitoring a temperature of a machine room, which can detect a temperature of any point in a machine room environment, so as to comprehensively grasp an environmental temperature of the machine room, and through a three-dimensional spatial temperature distribution map, an operation and maintenance person can visually and timely know a temperature distribution situation in the machine room, thereby improving a maintenance efficiency of the machine room. The specific scheme is as follows:
in a first aspect, the application discloses a machine room temperature monitoring method, comprising:
acquiring temperature data of IT equipment in a machine room;
constructing a three-dimensional space diagram of the machine room by using the position data of the IT equipment; wherein the IT equipment is a corresponding simulation point in the three-dimensional space diagram;
performing interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube;
and generating a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value and the temperature data.
Optionally, the obtaining of the temperature data of the IT device in the machine room includes:
sending a corresponding IPMI command to an IP address corresponding to the IT equipment;
and acquiring the temperature data returned by the IT equipment.
Optionally, the constructing a three-dimensional space diagram of the machine room by using the position data of the IT device includes:
and determining the three-dimensional position coordinates of the IT equipment by utilizing the position information of the cabinet where the IT equipment is located and the U bit of the IT equipment in the cabinet where the IT equipment is located so as to construct the three-dimensional space diagram.
Optionally, the performing interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space map to determine the temperature value of the target point in the target cube includes:
and performing lepp linear interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram so as to determine the temperature value of the target point in the target cube.
Optionally, the performing a lerp linear interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube includes:
performing fade nonlinear interpolation calculation on the position data corresponding to each vertex of the target cube in the three-dimensional space diagram to obtain a corresponding interpolation coefficient;
and performing lepp linear interpolation calculation by using the interpolation coefficient and the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube.
Optionally, the method for monitoring the temperature of the machine room further includes:
and acquiring the out-of-band IP of the IT equipment to obtain the corresponding IP address.
Optionally, the method for monitoring the temperature of the machine room further includes:
acquiring identification information of the IT equipment;
and establishing a corresponding relation between the temperature data and the position data by using the identification information.
In a second aspect, the present application discloses a machine room temperature monitoring device, including:
the temperature data acquisition module is used for acquiring temperature data of IT equipment in the machine room;
the three-dimensional space construction module is used for constructing a three-dimensional space diagram of the machine room by utilizing the position data of the IT equipment; wherein the IT equipment is a corresponding simulation point in the three-dimensional space diagram;
the target temperature determination module is used for performing interpolation calculation by utilizing the temperature data corresponding to each vertex of a target cube in the three-dimensional space diagram so as to determine a temperature value of a target point in the target cube;
and the temperature distribution map generation module is used for generating a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value and the temperature data.
In a third aspect, the present application discloses a machine room temperature monitoring device comprising a processor and a memory; wherein,
the memory is used for storing a computer program;
the processor is used for executing the computer program to realize the computer room temperature monitoring method.
In a fourth aspect, the present application discloses a computer-readable storage medium for storing a computer program, wherein the computer program, when executed by a processor, implements the aforementioned room temperature monitoring method.
Therefore, the temperature data of the IT equipment in the machine room is obtained, and the three-dimensional space diagram of the machine room is constructed by utilizing the position data of the IT equipment; the IT equipment is a corresponding simulation point in the three-dimensional space diagram, then interpolation calculation is carried out by utilizing the temperature data corresponding to each vertex of a target cube in the three-dimensional space diagram so as to determine a temperature value of a target point in the target cube, and finally a corresponding three-dimensional space temperature distribution diagram is generated by utilizing the three-dimensional space diagram, the temperature value and the temperature data. Therefore, the temperature data corresponding to each vertex of the target cube in the three-dimensional space graph is utilized to perform interpolation calculation so as to determine the temperature value of the target point in the target cube, generate the corresponding three-dimensional space temperature distribution graph, and detect the temperature of any point in the machine room environment, so that the temperature of the machine room environment is comprehensively mastered, and through the three-dimensional space temperature distribution graph, operation and maintenance personnel can visually and timely know the temperature distribution condition in the machine room, and the machine room maintenance efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a flow chart of a method for monitoring a temperature of a machine room as disclosed herein;
fig. 2 is a flowchart of a specific method for monitoring the temperature of the machine room disclosed in the present application;
FIG. 3 is a schematic diagram of a nonlinear interpolation fade function provided herein;
FIG. 4 is a schematic view of a target cube of the present disclosure;
FIG. 5 is a schematic view of a target cube of the present disclosure;
FIG. 6 is a schematic structural diagram of a machine room temperature monitoring apparatus disclosed in the present application;
fig. 7 is a block diagram of a machine room temperature monitoring apparatus according to the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The existing detection means of the machine room environment has the defects of poor intuition and low fixed point accuracy. It is difficult to show the complete temperature distribution state in the machine room for operation and maintenance personnel. Firstly, temperature collection of a temperature sensor can only reflect the temperature of a certain position point in a machine room space, and the data is single and cannot reflect the environmental temperature distribution of the whole machine room; secondly, the operation and maintenance personnel collect the data of the temperature sensor manually or through an air conditioning system, the efficiency is low, the operation environment temperature of the IT equipment cannot be accurately reflected, local high-temperature hot spots can be solved only by adjusting fans near the hot spots, but hot spots can not be generated at other positions, and the environment temperature of the machine room cannot be controlled globally. Therefore, the machine room temperature monitoring scheme can detect the temperature of any point in the machine room environment, the environmental temperature of the machine room is comprehensively mastered, and operation and maintenance personnel can visually and timely know the temperature distribution situation in the machine room through the three-dimensional space temperature distribution diagram, so that the machine room maintenance efficiency is improved.
Referring to fig. 1, an embodiment of the present application discloses a method for monitoring a temperature of a machine room, including:
step S11: and acquiring temperature data of the IT equipment in the machine room.
In a specific implementation manner, the embodiment of the present application may send a corresponding IPMI command to an IP address corresponding to the IT device; and acquiring the temperature data returned by the IT equipment. In addition, the embodiment may obtain an out-of-band IP of the IT device to obtain the corresponding IP address. The temperature data is detected by a temperature sensor arranged at an air inlet of the IT equipment.
It will be appreciated that the temperature sensor must be mounted to take into account the natural rise in heat, and that the temperature sensor may be mounted near the top of the rack. Furthermore, the temperature sensor should be installed near the equipment air inlet, as this is a critical location where temperature can be a problem.
In a specific implementation manner, in this embodiment, data collection software may be deployed and communicated with an out-of-band network of IT equipment in a machine room, an out-of-band IP is collected in advance, the data collection software is imported, and an IPMI command is sent by the data collection software to collect the temperature data. That is, the data collection software is deployed in the out-of-band management network, and the data of the air inlet temperature sensor of the IT equipment is directly obtained from the out-of-band management network of the IT equipment. The method can be deployed to certain equipment of an out-of-band network, a certain port number of the open equipment is used by software, operation and maintenance personnel provide an out-of-band IP list of the equipment in a machine room, and the software sends an IPMI command according to the list to acquire the air inlet temperature of each equipment.
IT can be understood that the IT device is generally provided with a plurality of temperature sensors, and the embodiment may utilize the air inlet temperature sensor therein, and the collected data may be obtained by sending an IPMI command through the out-of-band network. It should be noted that network management can be divided into two management modes, out-of-band (out-of-band) and in-band (in-band). The in-band management means that the management control information of the network and the bearing service information of the user network are transmitted through the same logical channel; in the out-of-band management mode, the management control information of the network and the bearer service information of the user network are transmitted in different logical channels. The IPMI is an Intelligent Platform Management Interface (Intelligent Platform Management Interface), and is an industrial standard for managing peripheral devices used in an enterprise system.
Step S12: constructing a three-dimensional space diagram of the machine room by using the position data of the IT equipment; and the IT equipment is a corresponding simulation point in the three-dimensional space diagram.
In a specific implementation manner, in this embodiment, the position data of the IT device may be obtained first, where the position data includes the position information of the cabinet where the IT device is located and the U bit of the IT device in the cabinet where the IT device is located, and then the three-dimensional position coordinates of the IT device are determined by using the position information of the cabinet where the IT device is located and the U bit of the IT device in the cabinet where the IT device is located, so as to construct the three-dimensional space diagram. For example, the position of the rack where the IT equipment is located is used as the X, Y axis coordinate, and the U position of the rack where the IT equipment is located is used as the Z (height) axis coordinate. Simplifying all IT devices as simulation points in this three-dimensional space.
That is, this embodiment can combine the IT equipment position data of fortune dimension personnel arrangement, simplifies the computer lab space into three-dimensional space, simplifies the IT equipment into the scattered point in the picture.
Step S13: and performing interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube.
In a specific implementation manner, this embodiment may send a corresponding IPMI command to an IP address corresponding to the IT device to obtain identification information of the IT device, establish a corresponding relationship between the identification information and the temperature data, and establish a corresponding relationship between the temperature data and the location data by using the identification information, where the identification information may be a serial number of the IT device. Specifically, a corresponding IPMI command may be sent to the IP address corresponding to the IT device through data collection software to obtain the identification information of the IT device, and then a correspondence table between the temperature data and the location data of the IT device is established.
And, supposing that the cabinets in the machine room are arranged according to a certain rule and connected with IT equipment simulation points, the three-dimensional space of the machine room can be subdivided into a plurality of cubic spaces. For a certain point in any cube, the influence of the temperature of other equipment except the vertex of the cube on the certain point can be ignored, namely, interpolation calculation is carried out only through the temperature of 8 vertexes (namely 8 IT equipment) of the cube where the certain point is located to obtain the temperature distribution in the cube, and the temperature distribution condition in the whole machine room space can be obtained by repeating the operation.
Step S14: and generating a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value and the temperature data.
In a specific implementation manner, the embodiment can utilize the temperature value and the temperature data to render the three-dimensional space map, and generate a corresponding three-dimensional space temperature distribution map, so that an operation and maintenance person can visually and visually obtain a three-dimensional environment temperature distribution image in the machine room, and the three-dimensional space temperature distribution map in the machine room can enable the operation and maintenance person to more visually and timely know the temperature distribution condition in the machine room space, and directly locate the corresponding high-temperature IT equipment and the high-temperature hot spot formed by airflow disorder in the machine room. The temperature control method is beneficial to operation and maintenance personnel to carry out an accurate temperature regulation strategy, improves the stability of the temperature of the machine room, eliminates high-temperature hot spots in the machine room, improves the operation efficiency of the IT equipment near the hot spots, and protects the IT equipment parts near the hot spots from being damaged. The management time of operation and maintenance personnel is saved, and the damage rate of IT equipment in a machine room is reduced.
Therefore, the temperature data of the IT equipment in the machine room is obtained, and the three-dimensional space diagram of the machine room is constructed by utilizing the position data of the IT equipment; the IT equipment is a corresponding simulation point in the three-dimensional space diagram, then interpolation calculation is carried out by utilizing the temperature data corresponding to each vertex of a target cube in the three-dimensional space diagram so as to determine a temperature value of a target point in the target cube, and finally a corresponding three-dimensional space temperature distribution diagram is generated by utilizing the three-dimensional space diagram, the temperature value and the temperature data. Therefore, the temperature data corresponding to each vertex of the target cube in the three-dimensional space graph is utilized to perform interpolation calculation so as to determine the temperature value of the target point in the target cube, generate the corresponding three-dimensional space temperature distribution graph, and detect the temperature of any point in the machine room environment, so that the temperature of the machine room environment is comprehensively mastered, and through the three-dimensional space temperature distribution graph, operation and maintenance personnel can visually and timely know the temperature distribution condition in the machine room, and the machine room maintenance efficiency is improved.
Referring to fig. 2, an embodiment of the present application discloses a specific machine room temperature monitoring method, including:
step S21: and acquiring temperature data of the IT equipment in the machine room.
Step S22: constructing a three-dimensional space diagram of the machine room by using the position data of the IT equipment; and the IT equipment is a corresponding simulation point in the three-dimensional space diagram.
Step S23: and performing fade nonlinear interpolation calculation on the position data corresponding to each vertex of the target cube in the three-dimensional space diagram to obtain a corresponding interpolation coefficient.
Step S24: and performing lepp linear interpolation calculation by using the interpolation coefficient and the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube.
In some embodiments, the temperature value at a point in the cube can be calculated multiple times by a lerp linear interpolation between the vertex temperatures: lerp (a, b, u) ═ a + u (b-a); wherein a represents the temperature value of one vertex of the cube, b represents the temperature value of the other vertex of the cube, and u is an interpolation coefficient. Although this is computationally efficient, the resulting profile is not as effective and may appear unnatural. Therefore, the present application adopts a smoother, nonlinear interpolation fade function to replace the parameter u in the linear interpolation, as shown in fig. 3, where fig. 3 is a schematic diagram of a nonlinear interpolation fade function provided by the present application, and the mathematical expression of the nonlinear interpolation function fade is as follows: fade (t) 6t5-15t4+10t3。
For example, referring to fig. 4, an embodiment of the present application discloses a schematic diagram of a target cube. Calculating cube interior point I (x)i,yi,zi) Temperature C ofiThe coordinates of each vertex of the cube are (x)0,y0,z0)，(x1,y0,z0)，(x0,y1,z0)，(x0,y0,z1)，(x1,y1,z0)，(x1,y0,z1)，(x0,y1,z1)，(x1,y1,z1) Corresponding temperatures are respectively C000，C100，C010，C001，C110，C101，C011，C111。
Three interpolation coefficients are calculated:
ux＝fade(xi-x0)，uxis an interpolation coefficient in the direction of the x axis.
uy＝fade(yi-y0)，uyThe interpolation coefficient in the y-axis direction is used.
uz＝fade(zi-z0)，uzIs an interpolation coefficient in the z-axis direction.
Interpolating 8 vertexes to obtain Ci：
Cx1＝lerp(C111,C011,ux)；
Cx2＝lerp(C101,C001,ux)；
Cy1＝lerp(Cx1,Cx2,uy)；
Cx3＝lerp(C110,C010,ux)；
Cx4＝lerp(C100,C000,ux)；
Cy2＝lerp(Cx3,Cx4,uy)；
Ci＝lerp(Cy1,Cy2,uz)。
Referring to fig. 5, fig. 5 is a schematic diagram of a target cube disclosed in the embodiment of the present application.
That is, the temperature of any point in the machine room can be determined by the temperature calculation function.
Step S25: and generating a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value and the temperature data.
Referring to fig. 6, an embodiment of the present application discloses a machine room temperature monitoring apparatus, including:
the temperature data acquisition module 11 is used for acquiring temperature data of IT equipment in a machine room;
the three-dimensional space construction module 12 is configured to construct a three-dimensional space diagram of the machine room by using the position data of the IT device; wherein the IT equipment is a corresponding simulation point in the three-dimensional space diagram;
a target temperature determination module 13, configured to perform interpolation calculation using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram, so as to determine a temperature value of a target point in the target cube;
and a temperature distribution map generating module 14, configured to generate a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value, and the temperature data.
Therefore, the temperature data of the IT equipment in the machine room is obtained, and the three-dimensional space diagram of the machine room is constructed by utilizing the position data of the IT equipment; the IT equipment is a corresponding simulation point in the three-dimensional space diagram, then interpolation calculation is carried out by utilizing the temperature data corresponding to each vertex of a target cube in the three-dimensional space diagram so as to determine a temperature value of a target point in the target cube, and finally a corresponding three-dimensional space temperature distribution diagram is generated by utilizing the three-dimensional space diagram, the temperature value and the temperature data. Therefore, the temperature data corresponding to each vertex of the target cube in the three-dimensional space graph is utilized to perform interpolation calculation so as to determine the temperature value of the target point in the target cube, generate the corresponding three-dimensional space temperature distribution graph, and detect the temperature of any point in the machine room environment, so that the temperature of the machine room environment is comprehensively mastered, and through the three-dimensional space temperature distribution graph, operation and maintenance personnel can visually and timely know the temperature distribution condition in the machine room, and the machine room maintenance efficiency is improved.
The temperature data obtaining module 11 is specifically configured to send a corresponding IPMI command to an IP address corresponding to the IT device; and acquiring the temperature data returned by the IT equipment.
The three-dimensional space constructing module 12 is specifically configured to determine a three-dimensional position coordinate of the IT device by using the position information of the cabinet where the IT device is located and the U-bit of the IT device in the cabinet where the IT device is located, so as to construct the three-dimensional space map.
The target temperature determining module 13 is specifically configured to perform a lerp linear interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram, so as to determine a temperature value of a target point in the target cube. Further, the target temperature determining module 13 is specifically configured to perform fade nonlinear interpolation calculation on the position data corresponding to each vertex of the target cube in the three-dimensional space map to obtain a corresponding interpolation coefficient; and performing lepp linear interpolation calculation by using the interpolation coefficient and the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube.
The machine room temperature monitoring device further comprises an identification information acquisition module used for acquiring identification information of the IT equipment.
The machine room temperature monitoring device further comprises a position temperature corresponding module, and the position temperature corresponding module is used for establishing the corresponding relation between the temperature data and the position data by utilizing the identification information.
Referring to fig. 7, an embodiment of the present application discloses a machine room temperature monitoring apparatus, which includes a processor 21 and a memory 22; wherein, the memory 22 is used for saving computer programs; the processor 21 is configured to execute the computer program to implement the following steps:
acquiring temperature data of IT equipment in a machine room; constructing a three-dimensional space diagram of the machine room by using the position data of the IT equipment; wherein the IT equipment is a corresponding simulation point in the three-dimensional space diagram; performing interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube; and generating a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value and the temperature data.
Therefore, the temperature data of the IT equipment in the machine room is obtained, and the three-dimensional space diagram of the machine room is constructed by utilizing the position data of the IT equipment; the IT equipment is a corresponding simulation point in the three-dimensional space diagram, then interpolation calculation is carried out by utilizing the temperature data corresponding to each vertex of a target cube in the three-dimensional space diagram so as to determine a temperature value of a target point in the target cube, and finally a corresponding three-dimensional space temperature distribution diagram is generated by utilizing the three-dimensional space diagram, the temperature value and the temperature data. Therefore, the temperature data corresponding to each vertex of the target cube in the three-dimensional space graph is utilized to perform interpolation calculation so as to determine the temperature value of the target point in the target cube, generate the corresponding three-dimensional space temperature distribution graph, and detect the temperature of any point in the machine room environment, so that the temperature of the machine room environment is comprehensively mastered, and through the three-dimensional space temperature distribution graph, operation and maintenance personnel can visually and timely know the temperature distribution condition in the machine room, and the machine room maintenance efficiency is improved.
In this embodiment, when the processor 21 executes the computer subprogram stored in the memory 22, the following steps may be specifically implemented: sending a corresponding IPMI command to an IP address corresponding to the IT equipment; and acquiring the temperature data returned by the IT equipment.
In this embodiment, when the processor 21 executes the computer subprogram stored in the memory 22, the following steps may be specifically implemented: and determining the three-dimensional position coordinates of the IT equipment by utilizing the position information of the cabinet where the IT equipment is located and the U bit of the IT equipment in the cabinet where the IT equipment is located so as to construct the three-dimensional space diagram.
In this embodiment, when the processor 21 executes the computer subprogram stored in the memory 22, the following steps may be specifically implemented: and performing lepp linear interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram so as to determine the temperature value of the target point in the target cube.
In this embodiment, when the processor 21 executes the computer subprogram stored in the memory 22, the following steps may be specifically implemented: performing fade nonlinear interpolation calculation on the position data corresponding to each vertex of the target cube in the three-dimensional space diagram to obtain a corresponding interpolation coefficient; and performing lepp linear interpolation calculation by using the interpolation coefficient and the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube.
In this embodiment, when the processor 21 executes the computer subprogram stored in the memory 22, the following steps may be specifically implemented: and acquiring the out-of-band IP of the IT equipment to obtain the corresponding IP address.
In this embodiment, when the processor 21 executes the computer subprogram stored in the memory 22, the following steps may be specifically implemented: acquiring identification information of the IT equipment; and establishing a corresponding relation between the temperature data and the position data by using the identification information.
Further, an embodiment of the present application also discloses a computer readable storage medium for storing a computer program, wherein the computer program, when executed by a processor, implements the following steps:
acquiring temperature data of IT equipment in a machine room; constructing a three-dimensional space diagram of the machine room by using the position data of the IT equipment; wherein the IT equipment is a corresponding simulation point in the three-dimensional space diagram; performing interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube; and generating a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value and the temperature data.
Therefore, the temperature data of the IT equipment in the machine room is obtained, and the three-dimensional space diagram of the machine room is constructed by utilizing the position data of the IT equipment; the IT equipment is a corresponding simulation point in the three-dimensional space diagram, then interpolation calculation is carried out by utilizing the temperature data corresponding to each vertex of a target cube in the three-dimensional space diagram so as to determine a temperature value of a target point in the target cube, and finally a corresponding three-dimensional space temperature distribution diagram is generated by utilizing the three-dimensional space diagram, the temperature value and the temperature data. Therefore, the temperature data corresponding to each vertex of the target cube in the three-dimensional space graph is utilized to perform interpolation calculation so as to determine the temperature value of the target point in the target cube, generate the corresponding three-dimensional space temperature distribution graph, and detect the temperature of any point in the machine room environment, so that the temperature of the machine room environment is comprehensively mastered, and through the three-dimensional space temperature distribution graph, operation and maintenance personnel can visually and timely know the temperature distribution condition in the machine room, and the machine room maintenance efficiency is improved.
In this embodiment, when the computer subprogram stored in the computer-readable storage medium is executed by the processor, the following steps may be specifically implemented: sending a corresponding IPMI command to an IP address corresponding to the IT equipment; and acquiring the temperature data returned by the IT equipment.
In this embodiment, when the computer subprogram stored in the computer-readable storage medium is executed by the processor, the following steps may be specifically implemented: and determining the three-dimensional position coordinates of the IT equipment by utilizing the position information of the cabinet where the IT equipment is located and the U bit of the IT equipment in the cabinet where the IT equipment is located so as to construct the three-dimensional space diagram.
In this embodiment, when the computer subprogram stored in the computer-readable storage medium is executed by the processor, the following steps may be specifically implemented: and performing lepp linear interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram so as to determine the temperature value of the target point in the target cube.
In this embodiment, when the computer subprogram stored in the computer-readable storage medium is executed by the processor, the following steps may be specifically implemented: performing fade nonlinear interpolation calculation on the position data corresponding to each vertex of the target cube in the three-dimensional space diagram to obtain a corresponding interpolation coefficient; and performing lepp linear interpolation calculation by using the interpolation coefficient and the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube.
In this embodiment, when the computer subprogram stored in the computer-readable storage medium is executed by the processor, the following steps may be specifically implemented: and acquiring the out-of-band IP of the IT equipment to obtain the corresponding IP address.
In this embodiment, when the computer subprogram stored in the computer-readable storage medium is executed by the processor, the following steps may be specifically implemented: acquiring identification information of the IT equipment; and establishing a corresponding relation between the temperature data and the position data by using the identification information.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The above detailed description is provided for a method, an apparatus, a device and a medium for monitoring a temperature of a machine room, and a specific example is applied in the detailed description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A method of monitoring a temperature of a machine room, comprising:
acquiring temperature data of IT equipment in a machine room;
constructing a three-dimensional space diagram of the machine room by using the position data of the IT equipment; wherein the IT equipment is a corresponding simulation point in the three-dimensional space diagram;
performing interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube;
and generating a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value and the temperature data.
2. The method for monitoring the temperature of the machine room according to claim 1, wherein the acquiring the temperature data of the IT equipment in the machine room comprises:
sending a corresponding IPMI command to an IP address corresponding to the IT equipment;
and acquiring the temperature data returned by the IT equipment.
3. The method for monitoring the temperature of the machine room according to claim 1, wherein the constructing the three-dimensional space diagram of the machine room by using the position data of the IT equipment comprises:
and determining the three-dimensional position coordinates of the IT equipment by utilizing the position information of the cabinet where the IT equipment is located and the U bit of the IT equipment in the cabinet where the IT equipment is located so as to construct the three-dimensional space diagram.
4. The machine room temperature monitoring method according to claim 1, wherein the performing interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube comprises:
and performing lepp linear interpolation calculation by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram so as to determine the temperature value of the target point in the target cube.
5. The machine room temperature monitoring method according to claim 4, wherein the determining the temperature value of the target point in the target cube by using the temperature data corresponding to each vertex of the target cube in the three-dimensional space map through lerp linear interpolation calculation comprises:
performing fade nonlinear interpolation calculation on the position data corresponding to each vertex of the target cube in the three-dimensional space diagram to obtain a corresponding interpolation coefficient;
and performing lepp linear interpolation calculation by using the interpolation coefficient and the temperature data corresponding to each vertex of the target cube in the three-dimensional space diagram to determine the temperature value of the target point in the target cube.
6. The machine room temperature monitoring method according to claim 2, further comprising:
and acquiring the out-of-band IP of the IT equipment to obtain the corresponding IP address.
7. The machine room temperature monitoring method according to any one of claims 1 to 6, further comprising:
acquiring identification information of the IT equipment;
and establishing a corresponding relation between the temperature data and the position data by using the identification information.
8. A machine room temperature monitoring apparatus, comprising:
the temperature data acquisition module is used for acquiring temperature data of IT equipment in the machine room;
the three-dimensional space construction module is used for constructing a three-dimensional space diagram of the machine room by utilizing the position data of the IT equipment; wherein the IT equipment is a corresponding simulation point in the three-dimensional space diagram;
the target temperature determination module is used for performing interpolation calculation by utilizing the temperature data corresponding to each vertex of a target cube in the three-dimensional space diagram so as to determine a temperature value of a target point in the target cube;
and the temperature distribution map generation module is used for generating a corresponding three-dimensional space temperature distribution map by using the three-dimensional space map, the temperature value and the temperature data.
9. A machine room temperature monitoring apparatus comprising a processor and a memory; wherein,
the memory is used for storing a computer program;
the processor is configured to execute the computer program to implement the method for monitoring temperature of the machine room according to any one of claims 1 to 7.
10. A computer-readable storage medium for storing a computer program, wherein the computer program, when executed by a processor, implements the method for monitoring temperature of a machine room according to any one of claims 1 to 7.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112512267A (en) * | 2020-11-11 | 2021-03-16 | 中国建设银行股份有限公司 | Temperature monitoring method, system, equipment and storage medium based on mobile robot |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103714564A (en) * | 2013-12-17 | 2014-04-09 | 国网信通亿力科技有限责任公司 | Machine room ambient temperature three-dimensional dynamic real-time monitoring system and method |
| CN104461822A (en) * | 2014-11-12 | 2015-03-25 | 北京百度网讯科技有限公司 | Supervision method and device for capacity of data center |
| CN104614094A (en) * | 2013-11-05 | 2015-05-13 | 深圳中兴力维技术有限公司 | Method and device for performing temperature monitoring of machine room |
| CN105094061A (en) * | 2014-04-29 | 2015-11-25 | 阿里巴巴集团控股有限公司 | Machine room server temperature adjustment method and equipment |
| CN106339013A (en) * | 2016-08-31 | 2017-01-18 | 浪潮电子信息产业股份有限公司 | Temperature regulation-control method and system of data center machine room |
| CN107560663A (en) * | 2017-07-21 | 2018-01-09 | 深圳市易成自动驾驶技术有限公司 | Ambient parameter detection method and system, storage medium |
| CN108390765A (en) * | 2017-02-03 | 2018-08-10 | 中国移动通信有限公司研究院 | A kind of the temperature localization method and device of data center's whole machine cabinet server |
| CN108768687A (en) * | 2018-04-09 | 2018-11-06 | 北京世纪互联宽带数据中心有限公司 | IDC mixed assets manage system and IDC resource maintenance methods |
| CN108898630A (en) * | 2018-06-27 | 2018-11-27 | 清华-伯克利深圳学院筹备办公室 | A kind of three-dimensional rebuilding method, device, equipment and storage medium |
| CN110837879A (en) * | 2019-11-11 | 2020-02-25 | 国网新疆电力有限公司信息通信公司 | Intelligent management system and management method for machine room assets based on U-bit level monitoring |
| CN110956231A (en) * | 2019-10-12 | 2020-04-03 | 深圳市共济科技股份有限公司 | Method, memory and system for automatically binding asset management electronic tag |
-
2020
- 2020-05-18 CN CN202010419517.XA patent/CN111580577A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104614094A (en) * | 2013-11-05 | 2015-05-13 | 深圳中兴力维技术有限公司 | Method and device for performing temperature monitoring of machine room |
| CN104614094B (en) * | 2013-11-05 | 2019-09-20 | 深圳力维智联技术有限公司 | Computer room temperature monitoring implementation method and its device |
| CN103714564A (en) * | 2013-12-17 | 2014-04-09 | 国网信通亿力科技有限责任公司 | Machine room ambient temperature three-dimensional dynamic real-time monitoring system and method |
| CN105094061A (en) * | 2014-04-29 | 2015-11-25 | 阿里巴巴集团控股有限公司 | Machine room server temperature adjustment method and equipment |
| CN104461822A (en) * | 2014-11-12 | 2015-03-25 | 北京百度网讯科技有限公司 | Supervision method and device for capacity of data center |
| CN106339013A (en) * | 2016-08-31 | 2017-01-18 | 浪潮电子信息产业股份有限公司 | Temperature regulation-control method and system of data center machine room |
| CN108390765A (en) * | 2017-02-03 | 2018-08-10 | 中国移动通信有限公司研究院 | A kind of the temperature localization method and device of data center's whole machine cabinet server |
| CN107560663A (en) * | 2017-07-21 | 2018-01-09 | 深圳市易成自动驾驶技术有限公司 | Ambient parameter detection method and system, storage medium |
| CN108768687A (en) * | 2018-04-09 | 2018-11-06 | 北京世纪互联宽带数据中心有限公司 | IDC mixed assets manage system and IDC resource maintenance methods |
| CN108898630A (en) * | 2018-06-27 | 2018-11-27 | 清华-伯克利深圳学院筹备办公室 | A kind of three-dimensional rebuilding method, device, equipment and storage medium |
| CN110956231A (en) * | 2019-10-12 | 2020-04-03 | 深圳市共济科技股份有限公司 | Method, memory and system for automatically binding asset management electronic tag |
| CN110837879A (en) * | 2019-11-11 | 2020-02-25 | 国网新疆电力有限公司信息通信公司 | Intelligent management system and management method for machine room assets based on U-bit level monitoring |
Non-Patent Citations (1)
| Title |
|---|
| SURYAKUMAR BALAKRISHNAN NAIR: "《LibGDX游戏开发指南》", 28 February 2017, 华中科技大学出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112512267A (en) * | 2020-11-11 | 2021-03-16 | 中国建设银行股份有限公司 | Temperature monitoring method, system, equipment and storage medium based on mobile robot |
| CN112512267B (en) * | 2020-11-11 | 2022-12-23 | 中国建设银行股份有限公司 | Temperature monitoring method, system, equipment and storage medium based on mobile robot |
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Application publication date: 20200825 |