CN111579967A - Dynamic aging test device for radio frequency power amplification module - Google Patents
Dynamic aging test device for radio frequency power amplification module Download PDFInfo
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- CN111579967A CN111579967A CN202010475673.8A CN202010475673A CN111579967A CN 111579967 A CN111579967 A CN 111579967A CN 202010475673 A CN202010475673 A CN 202010475673A CN 111579967 A CN111579967 A CN 111579967A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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Abstract
The invention discloses a dynamic aging test device for a radio frequency power amplification module, which is characterized by comprising a test box (2) and a control box (1) connected to the test box (2); a plurality of testing mechanisms and temperature detection modules (12) are arranged in the test box (2), and a heating module (10) and a refrigerating module (11) are installed at the bottom of the test box; the control box (1) is internally provided with a control system, and the control system comprises a controller, a clock module and a radio frequency signal output module which are respectively connected with the controller, and a power divider connected with the radio frequency signal output module. The invention respectively carries out aging test on the radio frequency power amplification module in high-temperature and low-temperature environments, and simultaneously respectively starts the radio frequency power amplification module in the high-temperature and low-temperature environments, so that the radio frequency power amplification module respectively receives impact in the high-temperature and low-temperature environments, and tests the starting and running performances of the radio frequency power amplification module in the high-temperature and low-temperature environments.
Description
Technical Field
The invention relates to the field of testing of radio frequency power amplification modules, in particular to a dynamic aging test device for a radio frequency power amplification module.
Background
With the development of electronic technology, a good electronic device not only requires higher performance index, but also has higher stability and reliability. As an important component of wireless communication devices, power amplifiers, i.e., rf power amplifiers, also need to be tested for reliability to eliminate some broken chips. However, the existing aging technology is generally only to place the radio frequency power amplification module in a high temperature room for testing, and the testing method is relatively single, and the performance of the radio frequency power amplification module in starting and running at high temperature and low temperature cannot be tested.
Disclosure of Invention
The invention aims to overcome the problems and provide a test device capable of simulating the aging test of the radio frequency power amplification module under different environments.
The purpose of the invention is realized by the following technical scheme: the dynamic aging test device of the radio frequency power amplification module comprises a test box and a control box connected to the test box; the test box is internally provided with a plurality of test mechanisms and temperature detection modules, and the bottom of the test box is provided with a heating module and a refrigerating module; a control system is arranged in the control box and comprises a controller, a clock module, a radio frequency signal output module and a power divider, wherein the clock module and the radio frequency signal output module are respectively connected with the controller; the controller is connected with the heating module, the refrigerating module and the temperature detection module, and the power divider is connected with the radio frequency power amplification module in the test box;
the radio frequency signal output module is used for providing a radio frequency signal for the radio frequency power amplification module to be detected;
the power divider is used for distributing the radio frequency signals to a plurality of radio frequency power amplification modules to be detected;
the clock module is used for setting heating time and refrigerating time;
and the controller is used for controlling the radio frequency signal output module, the heating module and the refrigerating module to work according to the time set by the clock module.
Furthermore, a clapboard for dividing the inner space of the test box into a plurality of installation cavities is arranged in the test box; the testing mechanism is installed in the installation cavity.
The test mechanism comprises a plurality of sockets arranged on the side wall of the test box and a plurality of clamping mechanisms which are arranged on the partition board and correspond to the sockets; all the clamping mechanisms are connected through a connecting structure.
The clamping mechanism comprises a test clamp and a plug connected with the test clamp through a lead; the plug is mounted on the connecting structure.
The test fixture comprises a base, an upper cover hinged with the base, a silicon image adhesive layer arranged inside the base, a test circuit board arranged inside the base and positioned above the silicon image adhesive layer, and an interface arranged on the base and connected with the test circuit board; the test circuit board is connected with the power divider, and the interface is connected with the plug through a lead.
The connecting structure comprises two brackets respectively fixed on two opposite side walls of the test box and a plug connecting plate movably arranged between the two brackets; the plug is fixed on the plug connecting plate.
The heating module and the refrigerating module are both installed in the test box through a fixing clamp; the fixing clamp comprises two opposite supporting rods and two clamping parts respectively arranged on the two supporting rods.
The clamping part comprises a push rod, one end of the push rod penetrates through the supporting rod and is connected with a clamping plate, the other end of the push rod is connected with a pulling plate, and the push rod is fixedly connected to the clamping plate and is located between the clamping plate and the supporting rod.
The aging method of the dynamic aging test device for the radio frequency power amplification module comprises the following steps:
step 1: initializing equipment, setting heating time and refrigerating time in a clock module, and setting heating temperature and refrigerating temperature in a controller;
step 2: the controller controls the radio frequency signal output module to output a radio frequency signal to the radio frequency power amplification module, and controls the heating module to heat the internal temperature of the test box to a set temperature;
and step 3: stopping heating after the heating time is reached, and simultaneously controlling the refrigeration module to adjust the internal temperature of the test box to the set refrigeration temperature by the controller;
and 5: the controller controls the heating module to heat the interior of the test box to a set heating temperature, then inputs a radio frequency signal to the radio frequency power amplification module, and stops heating after the heating time is reached; the temperature in the test box is cooled to a set cooling temperature, the cooling is stopped after the cooling time is reached, and the radio frequency signal is stopped being input to the radio frequency power amplification module;
step 6: the controller controls the refrigeration module to refrigerate the internal temperature of the test box to a set refrigeration temperature, then inputs a radio frequency signal to the radio frequency power amplification module, and stops refrigeration after the refrigeration time is reached; and (3) heating the temperature in the test box to a set heating temperature, stopping heating after the heating time is reached, stopping inputting the radio frequency signal to the radio frequency power amplification module, and returning to the step 2 after the temperature in the test box reaches the room temperature.
In addition, the set heating time and the set refrigerating time are both 60-80 min, the set heating temperature is 60-70 ℃, and the set refrigerating temperature is-5 to-10 ℃.
Compared with the prior art, the invention has the following advantages and beneficial effects:
(1) the invention respectively carries out aging test on the radio frequency power amplification module in high-temperature and low-temperature environments, and simultaneously respectively starts the radio frequency power amplification module in the high-temperature and low-temperature environments, so that the radio frequency power amplification module respectively receives impact in the high-temperature and low-temperature environments, and tests the starting and running performances of the radio frequency power amplification module in the high-temperature and low-temperature environments.
(2) According to the invention, the silicon image adhesive layer is arranged below the test circuit board, and the silicon image adhesive layer is not easy to deform at high temperature and low temperature, so that the radio frequency power amplification module is ensured to be in good contact with the test circuit board in the test process.
(3) In the invention, the plugs on all the clamping mechanisms are fixed on the plug connecting plate, so that the plugs of all the clamping mechanisms can be quickly inserted into the socket during a test, and the working efficiency is improved.
(4) The heating module and the refrigerating module are both fixed through the fixing clamp, so that the heating module and the refrigerating module are convenient to disassemble and assemble and convenient to maintain and replace.
Drawings
FIG. 1 is a block diagram of the present invention.
FIG. 2 is a structural view of the test jig of the present invention.
Fig. 3 is a cross-sectional view of the base of the present invention.
Fig. 4 is a view showing a state of use of the fixing clip of the present invention.
Fig. 5 is a schematic connection diagram of the control system of the present invention.
FIG. 6 is a schematic diagram of the aging process of the present invention.
The reference numbers in the above figures refer to: 1-control box, 2-proof box, 3-plug connecting plate, 4-plug, 5-socket, 6-support, 7-baffle, 8-test anchor clamps, 81-upper cover, 82-base, 83-interface, 84-silicon image glue layer, 85-test circuit board, 9-mounting fixture, 91-push rod, 92-arm-tie, 93-bracing piece, 94-compression spring, 95-radio frequency power amplification module, 96-clamp plate, 10-heating module, 11-refrigeration module, 12-temperature detection module.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
Example 1
As shown in fig. 1, the dynamic burn-in test apparatus for a radio frequency power amplification module of the present invention includes a test chamber 2 and a control chamber 1 connected to the test chamber 2. A plurality of testing mechanisms and temperature detection modules 12 are arranged in the test box 2, and in addition, a heating module 10 and a refrigeration module 11 are further installed at the bottom of the test box 2.
The control box 1 is a control center of the whole aging test device, and a control system is arranged in the control box. Specifically, as shown in fig. 5, the control system includes a controller, a clock module, a radio frequency signal output module, and a power divider. The clock module is connected with the controller and is used for setting the heating time and the cooling time inside the test box 2; the radio frequency signal output module is also connected with the controller and is used for providing radio frequency signals for the radio frequency power amplification module to be detected; the input end of the power divider is connected with the radio frequency signal output module, the output end of the power divider is connected with the radio frequency power amplification modules, and the power divider is used for distributing the radio frequency signals output by the radio frequency signal output module to the radio frequency power amplification modules to be tested. The controller is respectively connected with the heating module 10, the refrigerating module 11, the temperature detection module 12 and the radio frequency power amplification module 95 to be tested, the heating temperature and the refrigerating temperature are preset in the controller, the controller controls the radio frequency signal output module, the heating module and the refrigerating module to work according to the time set by the clock module, and in addition, the controller also receives the detection signal of the temperature detection module 12 and the signal output by the radio frequency power amplification module 95, so that a tester can know the test condition.
The control system of this embodiment still is provided with the display, and this display is connected with the controller, through data such as display temperature, time to experimental personnel more audio-visual understanding test condition.
In order to perform an aging test on a plurality of rf power amplification modules 95 simultaneously, as shown in fig. 1, a partition 7 is disposed in the test chamber 2, the partition 7 divides the internal space of the test chamber 2 into a plurality of installation cavities, the installation cavities are distributed in sequence from top to bottom, and the testing mechanism is installed in the installation cavities.
Specifically, the test mechanism comprises a plurality of sockets 5 arranged on the side wall of the test box 2 and a plurality of clamping mechanisms which are arranged on the partition plate 7 and correspond to the sockets 5, wherein the number and the positions of the clamping mechanisms correspond to the sockets 5, namely one clamping mechanism corresponds to one socket 5. As shown in fig. 1, each mounting cavity has a row of sockets 5 and a clamping mechanism corresponding to the row of sockets 5.
The clamping mechanism comprises a test clamp 8 and a plug 4 connected with the test clamp 8 through a lead. As shown in fig. 2 and 3, the test fixture 8 includes a base 82, an upper cover 81 hinged to the base 82, a silicon image glue layer 84 installed inside the base 82, a test circuit board 85 installed inside the base 82 and located above the silicon image glue layer 84, and an interface 83 disposed on the base 82 and connected to the test circuit board 85; the test circuit board 85 is connected with the power divider, and the interface 83 is connected with the plug 4 through a lead.
The upper cover 81 can open and close the base 82, during testing, the rf power amplification module 95 to be tested is placed on the test circuit board 85 to be in contact with the pole piece on the test circuit board 85, and the rf signal is supplied to the rf power amplification module 95 to be tested after passing through the test circuit board 85 by the power divider. The test circuit board 85 is a test circuit board used in a conventional test apparatus, and its structure will not be described.
The silicon image adhesive layer 84 is not easy to deform at high temperature and low temperature, so that the radio frequency power amplification module 95 and the test circuit board 85 are well contacted in the test process, and the test result is prevented from being influenced by poor contact between the test circuit board 85 and the radio frequency power amplification module 95.
During testing, the plug 4 on one clamping mechanism needs to be inserted into the socket 5, and as a plurality of clamping mechanisms need to be used simultaneously, a plurality of plugs 4 need to be inserted into the socket 5, which takes a lot of time, therefore, the aging test device is provided with the connecting structure, each mounting cavity is internally provided with one connecting structure, the plug 4 in the same mounting cavity is fixed on the connecting structure, and the fixed distance between the plugs 4 is the same as that of the socket 5, so that the plugs 4 can be simultaneously inserted into the corresponding sockets 5 together, and the efficiency is improved.
Specifically, the connecting structure comprises two brackets 6 respectively fixed on two opposite side walls of the test box 2, and a plug connecting plate 3 movably arranged between the two brackets 6; the plug 4 is fixed on the plug connecting plate 3. The brackets 6 are provided with clamping grooves, and the two ends of the connecting plate 3 are respectively clamped into the clamping grooves of the two brackets 6. When the socket is used, the connecting plate 3 is taken down from the bracket 6, and the plug 4 is inserted into the socket.
The heating module 10 and the refrigerating module 11 are both installed in the test box 2 through a fixing clamp 9. As shown in fig. 4, the fixing jig 9 includes two support rods 93 fixed to each other in the test chamber 2, and two holding members respectively attached to the two support rods 93.
Specifically, the clamping member includes a push rod 91 having one end penetrating through the support rod 93 and connected to a clamping plate 96, and the other end connected to a pulling plate 92, and a compression spring 94 fixedly connected to the clamping plate 96 and located between the clamping plate 96 and the support rod 93.
During installation, the pulling plates 92 of the two clamping parts are connected to enable the clamping plates 96 of the two clamping parts to be away from each other, the compression springs 94 are compressed at the moment, the heating module 10 or the refrigerating module is placed between the two clamping plates 96, the pulling plates 92 are loosened, the compression springs 94 are restored, the heating module or the refrigerating module is clamped by the two clamping plates 96, and the heating module or the refrigerating module is convenient to operate and convenient to maintain.
Example 2
This embodiment is an aging method of the dynamic aging test apparatus for the rf power amplifier module in embodiment 1, as shown in fig. 6, and includes the following steps:
step 1: initializing equipment, setting heating time and refrigerating time in a clock module, and setting heating temperature and refrigerating temperature in a controller; and installing the radio frequency power amplification module to be tested on the experiment clamp. In the embodiment, the set heating temperature is 60-70 ℃, and is specifically set to be 60 ℃; the set refrigeration temperature is-5 to-10 ℃, and is specifically set to-10 ℃. The set heating time and the set refrigerating time refer to the time maintained after the set heating temperature and the set refrigerating temperature are reached, and the heating time and the refrigerating time are both 60-80 min, and are specifically set to be 80min in the embodiment; namely, during heating, timing is started after the temperature in the test chamber reaches 60 ℃, and the temperature of 60 ℃ in the test chamber is maintained for 80 min; similarly, during refrigeration, the time is started after the temperature in the test chamber reaches-10 ℃, and the temperature in the test chamber at-10 ℃ is maintained for 80 min.
Step 2: the controller controls the radio frequency signal output module to work, and the radio frequency signal output module outputs a radio frequency signal which is transmitted to the radio frequency power amplification module after passing through the power divider; and simultaneously, the controller controls the heating module to work, and the temperature in the test box is heated to a set temperature, namely 60 ℃. Meanwhile, the temperature detection module detects the temperature in the test box in real time and feeds the temperature back to the controller, when the temperature reaches 60 ℃, the controller sends a signal to the clock module, and the clock module starts timing.
And step 3: after the heating time is up, namely the temperature in the test box is maintained at 60 ℃ for 80min, the controller controls the heating module to stop heating; meanwhile, the controller controls the refrigeration module to work, and the internal temperature of the test box is adjusted to a set refrigeration temperature, namely-10 ℃; meanwhile, the temperature detection module detects the temperature in the test box in real time and feeds the temperature back to the controller, when the temperature reaches-10 ℃, the controller sends a signal to the clock module, and the clock module starts timing.
And 5: when the temperature in the test box returns to the room temperature, the controller controls the heating module to heat the interior of the test box to the set heating temperature, namely 60 ℃, then controls the radio frequency signal output module to work, inputs a radio frequency signal to the radio frequency power amplification module, and stops heating after the temperature at 60 ℃ is maintained for 80 min. And then the controller controls the refrigeration module to work, the temperature in the test box is refrigerated to the set refrigeration temperature, namely-10 ℃, the refrigeration is stopped when the temperature of-10 ℃ is maintained for 80min, the radio frequency signal output module is controlled to stop working, and the radio frequency signal is stopped from being input to the radio frequency power amplification module. The starting of the radio frequency power amplification module is tested in a high-temperature environment, and the running conditions of the radio frequency power amplification module in the high-temperature environment and the low-temperature environment are tested.
Step 6: the controller controls the refrigeration module to work, the temperature in the test box is refrigerated to a set refrigeration temperature, namely minus 10 ℃, then the radio frequency signal output module is controlled to work, a radio frequency signal is input to the radio frequency power amplification module, the temperature at minus 10 ℃ is maintained for 80min, and then refrigeration is stopped. And then the controller controls the heating module to work, the temperature in the test box is heated to a set heating temperature, namely 60 ℃, the heating is stopped when the temperature of 60 ℃ is maintained for 80min, the radio frequency signal output module is controlled to stop working, and the radio frequency signal is stopped from being input to the radio frequency power amplification module. The starting of the radio frequency power amplification module is tested in a low-temperature environment, and the running conditions of the radio frequency power amplification module in the high-temperature environment and the low-temperature environment are tested. And (5) returning to the step (2) when the internal temperature of the test chamber reaches the room temperature, and repeating the step to perform an aging test on the radio frequency power amplification module. In the test process, a signal of the radio frequency power amplification module is output to the controller, and a tester can check the test condition through the display.
As described above, the present invention can be preferably realized.
Claims (10)
1. The dynamic aging test device for the radio frequency power amplification module is characterized by comprising a test box (2) and a control box (1) connected to the test box (2); a plurality of testing mechanisms and temperature detection modules (12) are arranged in the test box (2), and a heating module (10) and a refrigerating module (11) are installed at the bottom of the test box; a control system is arranged in the control box (1), and the control system comprises a controller, a clock module and a radio frequency signal output module which are respectively connected with the controller, and a power divider connected with the radio frequency signal output module; the controller is connected with the heating module (10), the refrigerating module (11) and the temperature detection module (12), and the power divider is connected with the radio frequency power amplification module in the test box (2);
the radio frequency signal output module is used for providing a radio frequency signal for the radio frequency power amplification module to be detected;
the power divider is used for distributing the radio frequency signals to a plurality of radio frequency power amplification modules to be detected;
the clock module is used for setting heating time and refrigerating time;
and the controller is used for controlling the radio frequency signal output module, the heating module and the refrigerating module to work according to the time set by the clock module.
2. The dynamic aging test device of the radio frequency power amplification module according to claim 1, wherein a partition plate (7) for dividing the internal space of the test chamber (2) into a plurality of installation cavities is arranged in the test chamber (2); the testing mechanism is installed in the installation cavity.
3. The dynamic aging test device for the radio frequency power amplification module according to claim 2, wherein the test mechanism comprises a plurality of sockets (5) arranged on the side wall of the test box (2), and a plurality of clamping mechanisms which are arranged on the partition plate (7) and correspond to the sockets (5); all the clamping mechanisms are connected through a connecting structure.
4. The dynamic aging test device of the radio frequency power amplification module according to claim 3, wherein the clamping mechanism comprises a test clamp (8), a plug (4) connected with the test clamp (8) through a lead; the plug (4) is mounted on the connecting structure.
5. The dynamic aging test device of the radio frequency power amplification module according to claim 4, wherein the test fixture (8) comprises a base (82), an upper cover (81) hinged with the base (82), a silicon image adhesive layer (84) installed inside the base (82), a test circuit board (85) installed inside the base (82) and located above the silicon image adhesive layer (84), and an interface (83) arranged on the base (82) and connected with the test circuit board (85); the test circuit board (85) is connected with the power divider, and the interface (83) is connected with the plug (4) through a lead.
6. The dynamic aging test device of the radio frequency power amplification module according to claim 5, wherein the connecting structure comprises two brackets (6) respectively fixed on two opposite side walls of the test box (2), and a plug connecting plate (3) movably mounted between the two brackets (6); the plug (4) is fixed on the plug connecting plate (3).
7. The dynamic aging test device for the radio frequency power amplification module according to claim 6, wherein the heating module (10) and the refrigerating module (11) are both installed in the test box (2) through a fixing clamp (9); the fixing clamp (9) comprises two opposite supporting rods (93) and two clamping parts which are respectively arranged on the two supporting rods (93).
8. The dynamic aging test device of the radio frequency power amplification module according to claim 7, wherein the clamping member comprises a push rod (91) having one end penetrating through the support rod (93) and connected with a clamping plate (96) and the other end connected with a pull plate (92), and a compression spring (94) fixedly connected to the clamping plate (96) and located between the clamping plate (96) and the support rod (93).
9. The dynamic aging test device for the radio frequency power amplification module according to claim 8, wherein the aging method of the dynamic aging test device for the radio frequency power amplification module comprises the following steps:
step 1: initializing equipment, setting heating time and refrigerating time in a clock module, and setting heating temperature and refrigerating temperature in a controller;
step 2: the controller controls the radio frequency signal output module to output a radio frequency signal to the radio frequency power amplification module, and controls the heating module to heat the internal temperature of the test box to a set temperature;
and step 3: stopping heating after the heating time is reached, and simultaneously controlling the refrigeration module to adjust the internal temperature of the test box to the set refrigeration temperature by the controller;
step 4; stopping refrigerating after the refrigerating time is reached, and simultaneously stopping inputting radio frequency signals to the radio frequency power amplification module;
and 5: the controller controls the heating module to heat the interior of the test box to a set heating temperature, then inputs a radio frequency signal to the radio frequency power amplification module, and stops heating after the heating time is reached; the temperature in the test box is cooled to a set cooling temperature, the cooling is stopped after the cooling time is reached, and the radio frequency signal is stopped being input to the radio frequency power amplification module;
step 6: the controller controls the refrigeration module to refrigerate the internal temperature of the test box to a set refrigeration temperature, then inputs a radio frequency signal to the radio frequency power amplification module, and stops refrigeration after the refrigeration time is reached; and (3) heating the temperature in the test box to a set heating temperature, stopping heating after the heating time is reached, stopping inputting the radio frequency signal to the radio frequency power amplification module, and returning to the step 2 after the temperature in the test box reaches the room temperature.
10. The dynamic aging test device for the radio frequency power amplification module according to claim 9, wherein the set heating time and the set cooling time are both 60-80 min, the set heating temperature is 60-70 ℃, and the set cooling temperature is-5-10 ℃.
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| CN117214593A (en) * | 2023-11-09 | 2023-12-12 | 苏州摩尔镓芯半导体科技有限公司 | Aging test device and energy recovery system |
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| 马骁: "一种功放加载老化测试系统的设计与实现", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117214593A (en) * | 2023-11-09 | 2023-12-12 | 苏州摩尔镓芯半导体科技有限公司 | Aging test device and energy recovery system |
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| Publication number | Publication date |
|---|---|
| CN111579967B (en) | 2020-12-25 |
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