CN111579484A

CN111579484A - Chip fixing objective table

Info

Publication number: CN111579484A
Application number: CN201910120643.2A
Authority: CN
Inventors: 吴江湖; 洪艳
Original assignee: BGI Shenzhen Co Ltd
Current assignee: BGI Shenzhen Co Ltd
Priority date: 2019-02-18
Filing date: 2019-02-18
Publication date: 2020-08-25
Anticipated expiration: 2039-02-18
Also published as: CN111579484B

Abstract

The invention provides a chip fixing objective table which comprises a supporting table and a chip fixing device, wherein the chip fixing device fixes a chip on the supporting table in an electromagnetic adsorption mode. The chip is fixed by utilizing the electromagnetic adsorption mode, the power is switched on when the chip needs to be fixed, the chip can be fixed by switching off the power when the chip needs to be replaced, the operation is convenient, and the pollution and corrosion problems caused by liquid permeation are avoided.

Description

Chip fixing objective table

Technical Field

The invention relates to the field of sample detection, in particular to a chip fixing objective table used in sample detection.

Background

A conventional water lens (an objective lens working by immersing in a liquid) microscope stage holds a chip in a manner as shown in fig. 1, and a chip 12 is pressed against a stage 13 by a spring plate 11. Since the elastic sheet 11 is pressed on the upper surface of the chip 12, a part of the area of the chip 12 is shielded by the elastic sheet 11, and the chip 12 cannot be scanned globally.

As shown in fig. 2, another method for fixing the chip is to form a negative pressure tank 22 in the stage 21 and to suck the chip 23 by transferring a negative pressure through the negative pressure tank 22. However, the water microscope needs to be immersed in the liquid reagent to work and clearly photograph the surface of the chip 23 (refer to chinese patent CN206638882U), the liquid reagent is easily sucked into the negative pressure tank 22 to cause contamination, and when there is a large-scale detection requirement (such as gene detection and immunoassay), the fixing method will also cause the detection efficiency to be reduced. In addition, this method is not suitable for fixing the chip with the cover glass removed during the detection.

Disclosure of Invention

In view of the above, it is desirable to provide a chip-mounting stage that solves at least one of the above problems.

The chip fixing objective table comprises a supporting table and a chip fixing device, wherein the chip fixing device fixes a chip on the supporting table in an electromagnetic adsorption mode.

In at least one embodiment, the chip fixing device includes a positioning device and a supporting device, the positioning device is fixed on the chip, a magnetic element is disposed on the positioning device, the supporting device is disposed on the supporting platform, and the supporting device includes an electromagnetic element, and the electromagnetic element forms a magnetic coupling with the magnetic element when the supporting device is powered on, so as to fix the positioning device on the supporting platform.

In at least one embodiment, the positioning device and the supporting device are respectively provided with a matching surface, and the matching surfaces are matched in a concave-convex manner.

In at least one embodiment, the mating surface of the positioning device is a concave surface, and the mating surface of the supporting device is a convex surface.

In at least one embodiment, the mating surfaces are conical surfaces, and the taper of the cone on which the convex surface is located is smaller than the taper of the cone on which the concave surface is located.

In at least one embodiment, the chip fixing object stage further comprises a flexible liquid containing device, a shaping device and a moving device, the supporting table comprises a supporting area, the supporting area comprises a supporting surface for supporting the chip, the flexible liquid containing device surrounds the supporting surface, the shaping device is used for shaping the flexible liquid containing device, and the moving device is used for changing the shape of the flexible liquid containing device so as to change the height of the liquid level in the flexible liquid containing device.

In at least one embodiment, the shaping device includes an upper shaping device, the upper shaping device is used for shaping the opening of the flexible liquid containing device, the moving device is connected with the upper shaping device, and the position of the upper shaping device is changed through movement so as to change the shape of the flexible liquid containing device.

In at least one embodiment, the shaping device includes a lower shaping device, the lower shaping device is configured to shape a bottom position of the flexible liquid containing device, and the lower shaping device fixes the bottom position of the flexible liquid containing device on the support table around the support surface.

In at least one embodiment, the moving device raises and lowers the upper shaping device between a first height position and a second height position, the first height position is higher than the second height position, the liquid in the flexible liquid containing device is higher than the surface of the chip in the first height position, and the liquid in the flexible liquid containing device is lower than the surface of the chip in the second height position.

In at least one embodiment, the support table includes a support region including a support surface for supporting the chip, the support surface having a reservoir disposed thereon for storing a liquid for holding the immersion lens.

According to the chip fixing object stage provided by the embodiment of the invention, the chip is fixed by an electromagnetic adsorption mode, the power is switched on when the chip needs to be fixed, the chip can be fixed by switching off the power when the chip needs to be replaced, the operation is convenient, and the pollution and corrosion problems caused by liquid permeation are avoided. In addition, the chip fixing device adopted by the chip fixing objective table adopts concave-convex cooperation: the concave surface and the convex surface are matched, and the concave surface and the convex surface have different cone angles, so that the chip is positioned more accurately and more quickly. Moreover, the flexible liquid containing device with the adjustable liquid level height is adopted, so that liquid overflow is avoided, and the chip is convenient to take and place; and set up the reservoir on the fixed objective table of chip, make things convenient for objective to soak wherein during the chip is changed, avoid the crystallization of objective lower surface.

Drawings

Fig. 1 is a schematic diagram of a prior art chip fixed on an object stage by a spring.

FIG. 2 is a schematic diagram of a prior art chip being adsorbed on a stage by negative pressure.

Fig. 3 is a schematic perspective view of a chip-fixing stage according to an embodiment of the invention.

Fig. 4 is an exploded view of the chip holding stage shown in fig. 3.

Fig. 5 is a schematic view of the flexible liquid container of the chip-holding stage shown in fig. 3 in a first state.

Fig. 6 is a second state diagram of the flexible liquid container of the chip-holding stage shown in fig. 3.

Fig. 7 is an enlarged view of a VII portion of the chip holding stage shown in fig. 4.

Fig. 8 is a partial half sectional view of the chip holding stage shown in fig. 3.

FIG. 9 is a schematic view of the chip holder assembly of FIG. 3.

Fig. 10A-10C are schematic distribution diagrams of chip fixing devices according to various embodiments of the present invention.

Description of the main elements

Chip fixing objective table	30	Supporting table	31
				Flexible liquid containing device	33	Shaping device	35
Exercise device	37	Chip fixing device	39
				Chip and method for manufacturing the same	40	Objective lens	50
Support area	311	Support surface	311a
				Liquid storage tank	312	Upper shaping device	351
Lower shaping device	353	Step	311b
				Step surface
	311c	Fixing structure			351a
				Sport terminal
	371	Positioning device	391
				Supporting device	393	Magnetic element	3911
Groove	3912、314	Mating surfaces	3913、393a
				Opening of the container	3912a、314a	Vertex point		3913a、393b
Electromagnet
		393c	Sealing element		393d

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "mounted on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 3 and 4, a chip fixing stage 30 according to an embodiment of the present invention includes a supporting table 31, a flexible liquid container 33 disposed on the supporting table 31, a shaping device 35 for shaping the flexible liquid container 33, a moving device 37 for changing the shape of the flexible liquid container 33, and a chip fixing device 39 for fixing a chip 40.

The support stage 31 includes a support region 311, and the support region 311 is used for supporting the chip 40. The chip holding device 39 holds the chip 40 in the support region 311. Specifically, in the present embodiment, the supporting region 311 is disposed at a substantially central position of the supporting stage 31, the supporting region 311 is higher than the surrounding region, a supporting surface 311a is disposed on the supporting region 311, and the chip fixing device 39 extends out of the supporting surface 311a to support the chip 40. The flexible liquid containing device 33 is arranged around the supporting surface 311 a. It is understood that in other embodiments, the support region 311 may be located at an edge region of the support table 31, and the height of the support region 311 may be flush with the surrounding region.

The supporting surface 311a is further provided with a liquid storage tank 312, the liquid storage tank 312 is used for storing liquid, when the chip 40 is replaced, the objective lens 50 can be soaked in the liquid storage tank 312 at the gap of the replacement chip 40, and the liquid on the lower surface of the objective lens 50 is prevented from crystallizing. In one embodiment, the reservoir 312 is disposed at a center of the supporting surface 311 a.

The shaping device 35 comprises an upper shaping device 351 and a lower shaping device 353, wherein the upper shaping device 351 is arranged at the opening of the flexible liquid containing device 33 and is used for shaping the opening of the flexible liquid containing device 33; the lower shaping device 353 is disposed at a bottom position of the flexible liquid containing device 33, and is used for shaping the bottom of the flexible liquid containing device 33. Since the upper shaping device 351 and the lower shaping device 353 respectively shape different positions of the flexible liquid containing device 33, the region of the flexible liquid containing device 33 between the upper shaping device 351 and the lower shaping device 353 forms a three-dimensional space region for containing liquid by the flexible liquid containing device 33.

The moving means 37 is connected to the upper shaping means 351 and the moving means 37 changes the position of the upper shaping means 351 by moving, thereby changing the shape of the flexible liquid containing means 33 and thus the liquid level in the flexible liquid containing means 33. Specifically, by changing the shape of the flexible liquid containing device 33, the liquid level of the liquid in the flexible liquid containing device 33 can be changed, so that the liquid level in the flexible liquid containing device 33 can be raised or lowered to a certain position as required. In the present embodiment, when the objective lens 50 is used to detect the chip 40 fixed on the supporting surface 311a, the liquid level in the flexible liquid container 33 needs to be higher than the surface of the chip 40, and when the chip 40 needs to be moved out of the supporting region 311 after the detection is completed, the liquid level in the flexible liquid container 33 needs to be located below the chip 40, so as to avoid the liquid in the flexible liquid container 33 and facilitate the movement out of the chip 40.

In this embodiment, the supporting region 311 is provided with a step 311b around the supporting surface 311a, the step 311b is provided with a step surface 311c, and the lower fixing device 353 is fixed on the step surface 311c, thereby fixing the bottom position of the flexible liquid containing device 33 on the step surface 311c and enabling the bottom position of the flexible liquid containing device 33 to be arranged around the supporting surface 311 a. Specifically, in this embodiment, the flexible liquid containing device 33 is a hydrophobic membrane, the bottom area of the hydrophobic membrane is cut to have an area matching the size of the supporting surface 311a, the lower shaping device 353 is an integral frame structure with a size capable of surrounding the supporting surface 311a, and the lower shaping device 353 fixes the bottom position of the flexible liquid containing device 33 on the step surface 311c by fixing means such as locking, engaging, or gluing. The fastening means such as locking, engaging or gluing are conventional means for fastening two or more components and will not be described herein in any greater detail. The lower setting device 353 fixes the bottom position of the flexible liquid container 33 to the step surface 311c, and also seals the bottom position of the flexible liquid container 33 to prevent the liquid in the flexible liquid container 33 from leaking from the bottom.

It will be appreciated that in another embodiment, a sealing material may be disposed at the bottom of the flexible liquid container 33 for sealing.

It is understood that in other embodiments, the step 311b may be omitted, and the lower fixing device 353 fixes the flexible liquid containing device 33 on the supporting surface 311 a; alternatively, the lower shaping device 352 fixes the flexible liquid containing device 33 on the side wall on the peripheral side of the supporting surface 311 a; alternatively, the lower shaping device 352 fixes the flexible liquid containing device 33 on the table top of the supporting table 31 around the supporting region 311.

In this embodiment, the upper shaping device 351 is an integral frame structure, the opening position of the flexible liquid containing device 33 is fixed on the upper shaping device 351 by gluing, clamping or locking, the integral size of the upper shaping device 351 is matched with the size of the opening of the flexible liquid containing device 33, and the opening of the flexible liquid containing device 33 is fixed on the upper shaping device 351 at one circle. It is understood that in other embodiments, the overall size of the upper shaping device 351 may not match the size of the opening of the flexible liquid holding device 33, for example, the overall size of the upper shaping device 351 may be larger than the size of the opening of the flexible liquid holding device 33, and the flexible liquid holding device 33 is fixed at only a part of the upper shaping device 351; the overall size of the upper shaping device 351 may also be smaller than the size of the opening of the flexible liquid containing device 33, and the flexible liquid containing device 33 may be fixed only at a part of the upper shaping device 351, or may be fixed on the upper shaping device 351 at the opening for a circle.

The upper shaping device 351 is provided with fixing structures 351a at several positions, and is fixed on the moving device 37 through the fixing structures 351 a. Specifically, in this embodiment, the fixing structure 351a is a hole opened on the upper shaping device 351, and the moving device 37 can drive the upper shaping device 351 to move through the matching of the hole and the moving device 37, so as to change the shape of the flexible liquid containing device 33 and make the liquid level in the flexible liquid containing device 33 rise and fall.

Specifically, in the present embodiment, the moving device 37 includes a plurality of moving ends 371 corresponding to the fixed structure 351a, and the moving ends 371 are connected to the fixed structure 351a, and the upper shaping device 351 is driven by a power mechanism (not shown) to move. In this embodiment, the moving end 371 is a lifting column disposed on the support platform 31 and located outside the support region 311, one end of the lifting column far from the support platform 31 is clamped in a hole of the upper shaping device 351, the other end of the lifting column is disposed in the support platform 31, and the lifting column is driven by a power mechanism (not shown) in the support platform 31 to ascend and descend relative to the support platform 31, so as to drive the upper shaping device 351 to ascend and descend.

Specifically, please refer to fig. 5 and fig. 6, which are schematic diagrams illustrating the flexible liquid containing device 33 in a first state and a second state, respectively. When the lifting column is in the first state, the lifting column rises to a first height position, the opening of the flexible liquid containing device 33 is lifted, the whole flexible liquid containing device 33 is longitudinally stretched, the area of the flexible liquid containing device 33 on a vertical and longitudinal horizontal plane is reduced near the bottom position, the liquid level in the flexible liquid containing device 33 rises, and the liquid level in the flexible liquid containing device 33 is higher than the chip 40 in the first state. In the second state, the liftable column is lowered to a second height position lower than the first height position, the opening of the flexible liquid containing device 33 is lowered, the flexible liquid containing device 33 surrounds the supporting area 311 to form a water tank lower than the supporting surface 311a, liquid is stored in the water tank, the liquid level is lower than the chip 40, and the chip 40 is convenient to take and place.

It can be understood that, in the present embodiment, the moving end 371 moves the upper shaping structure 351 by ascending and descending, so as to change the shape of the flexible liquid container 33 to make the liquid level in the flexible liquid container 33 ascend and descend. However, in other embodiments, the movable end 371 can also change the shape of the flexible liquid container 33 by moving horizontally on the support 31 or by moving horizontally and vertically at the same time. For example, when the upper shaping device 351 uses sub-shaping structures separated from each other by a certain distance, the shape of the flexible liquid holding device 33 can be changed by horizontal movement or vertical movement in combination with horizontal movement by reasonably arranging the positions of the sub-shaping structures at the opening of the flexible liquid holding device 33 and reasonably arranging the positions of the starting point and the ending point of the movement of each movement end, and the liquid level in the flexible liquid holding device 33 is higher than the chip 40 during the detection process and lower than the chip 40 after the detection is finished.

It is understood that the plurality of moving ends 371 may be driven separately by a plurality of power mechanisms, or may be driven by one power mechanism.

It is understood that although the upper and

lower shaping devices

351, 353 are shown as being quadrilateral, and the moving end 371 connects the upper shaping device 351 at four corners of the upper shaping device 351, in other embodiments, the moving end 371 connects the upper shaping device 351 at other locations of the upper shaping device 351, such as at four sides.

It is understood that the upper and/or

lower shaping devices

351, 353 may not be regular quadrangles, for example, the upper and/or

lower shaping devices

351, 353 may be trapezoids. It is understood that the upper and/or

lower shaping devices

351, 353 may also be other than quadrilateral, for example, the upper and/or

lower shaping devices

351, 353 may be annular, triangular, pentagonal, hexagonal, etc. It is understood that the upper and

lower shaping devices

351, 353 may be of the same shape or of different shapes, for example, the lower shaping device 353 may be a quadrilateral shape while the upper shaping device 351 is a circular shape. In short, the arrangement of the upper and

lower shaping devices

351 and 353 is not limited, and only consideration is needed to avoid hindering or facilitating the detection, pick-and-place, etc. of the chip 40.

It is understood that the upper shaping device 351 may be integrally formed, or may be formed by assembling or combining a plurality of partial frame structures. Even more, the upper shaping device 351 may not be a unitary frame structure, but may include a plurality of independent and separated sub-shaping structures, each of which fixes one of the positions of the opening of the flexible liquid containing device 33. Each sub-pattern is spatially separated from the other sub-patterns by a distance. Each sub-pattern is moved by a moving end 371.

It is understood that the lower shaping device 353 may be integrally formed, or may be formed by assembling or combining a plurality of partial frame structures.

It is understood that both the upper and

lower shaping devices

351 and 353 can be made of liquid corrosion resistant materials.

Referring to fig. 7 and 8, the chip fixing device 39 fixes the chip 40 and the supporting platform 31 by electromagnetic absorption. The chip fixing device 39 includes a positioning device 391 disposed below the chip 40 and a supporting device 393 having one end protruding from the supporting surface 311a of the supporting platform 31, and the chip 40 is precisely fixed on the set position of the supporting platform 31 by the cooperation of the supporting device 393 and the positioning device 391.

In this embodiment, the positioning device 391 is provided with a magnetic element 3911, and specifically, the positioning device 391 is provided with a groove 3912, and the magnetic element 3911 is disposed in the groove 3912. The magnetic element 3911 is a magnetic bead. The positioning device 391 is further provided with a matching surface 3913, and the positioning device 391 contacts the supporting device 393 through the matching surface 3913. Further, in the present embodiment, the recess 3912 has an opening 3912a on a side facing the chip 40, and the magnetic element 3911 is embedded in the positioning device 391 through the opening 3912 a. The positioning device 391 is then glued or otherwise secured to the underside of the chip 40 and seals the magnetic element 3911 to prevent the magnetic element 3911 from being contaminated by liquid and corroded. The engagement surface 3913 is disposed on a side of the positioning device 391 away from the chip 40, and the engagement surface 3913 is a concave surface, which may be a concave conical surface, a spherical surface, or a V-shaped surface. The mating surface 3913 has an apex 3913a proximate the magnetic element 3911. The apex 3913a is the point on the mating surface 3913 where the inward depression depth is greatest. In this embodiment, the vertex 3913a is closest to the magnetic element 3911 than other points on the mating surface 3913.

The supporting platform 31 is provided with a groove 314, the groove 314 is provided with an opening 314a on the supporting surface 311a, the supporting device 393 is embedded in the groove 314, and one end of the supporting device 393 extends out of the opening 314a and protrudes out of the supporting surface 311 a. In this embodiment, the supporting device 393 is an electromagnetic device that generates a magnetic field when energized, and the magnetic field generates an attraction force on the magnetic element 3911 to attract the chip 40 to the supporting surface 311 a. One end of the supporting device 393 protruding from the supporting surface 311a is provided with a matching surface 393a, where the matching surface 393a is a convex surface protruding toward the chip 40, and the convex surface may be a conical surface, a spherical surface, a V-shaped surface, or the like. The convex surface may be received within a mating surface 3913 of the positioning device 391. The convex surface has a vertex 393b, and the vertex 393b is the highest protruding height of the mating surface 393 a. The vertex 393b is located at a position corresponding to the position of the vertex 3913a on the matching surface 3913 when the matching surface 393a is accommodated in the matching surface 3913.

In this embodiment, the mating surface 3913 is a concave conical surface. The mating surface 393a is a protruding conical surface, and the taper of the cone where the mating surface 393a is located is smaller than that of the cone where the mating surface 3913 is located.

Because the matching surface 393a has a relatively small taper, when a user places the chip 40 on the supporting surface 311a, the vertex 3913a on the matching surface 3913 is automatically aligned with the vertex 393b on the matching surface 393a under the action of the magnetic attraction force, so that the automatic and accurate alignment is completed. Referring to fig. 9, F is an equivalent attractive force between the magnetic element 3911 and the electromagnetic device, N is a surface pressure between the mating surface 3913 and the mating surface 393a, G is a gravity of the chip 40, F is a friction force between the

mating surfaces

3913 and 393a, μ is a friction coefficient between the

mating surfaces

3913 and 393a, α is an 1/2 taper angle (i.e., one half of the taper angle) of the mating surface 3913, and β is an included angle between F and G, where a and μ satisfy: α < arcctg μ, the equivalent attractive force F between the magnetic element 3911 and the electromagnetic device can overcome all the resistances when the above conditions are met: gravity and friction force return both the magnetic element 3911 and the electromagnetic device to an equilibrium position where the apex 3913a is aligned with the apex 393 b.

With reference to fig. 8, in the present embodiment, the supporting device 393 includes an electromagnet 393c and a sealing member 393d, the electromagnet 393c is at least partially received in the groove 314, and the sealing member 393d seals the portion of the electromagnet 393c protruding from the supporting surface 311a and also seals the groove 314 to prevent the electromagnet 393 from being contaminated by the liquid. In this embodiment, the electromagnet 393c protrudes from the supporting surface 311a and is convex. The seal 393d is a dowel pin, and the shape of the seal 393d matches the convex shape of the electromagnet 393 c. The sealing member 393d defines a mating surface 393a for the support device 393.

It is understood that the positioning device 391 and the seal 393d can be made of a material that is resistant to abrasion, liquid corrosion, and magnetic field shielding. To further improve the accuracy, stability and balance of the fixing of the chip 40 and to reduce the position registration before detection, two or more positioning devices 391 may be disposed on the chip 40. Referring to fig. 10A, four positioning devices 391 are disposed on the chip 40, the chip 40 is square, and the four positioning devices 391 are symmetrically distributed at four corners of the chip 40. Referring to fig. 10B, four positioning devices 391 are disposed on the chip 40, and the four positioning devices 391 are symmetrically distributed on four side regions of the chip 40. Referring to fig. 10C, three positioning devices 391 are disposed on the chip 40, and the three positioning devices 391 are distributed on the sides and corners of the chip in an equilateral triangle. It is to be understood that the two or more positioning devices 391 are not necessarily distributed on chip 40 in a symmetrical or regular manner, but may also be distributed on chip 40 in an asymmetrical or irregular manner. Correspondingly, a corresponding number and a corresponding position of the supporting devices 393 can also be arranged on the supporting surface 311 a. Since the arrangement of the supporting means 393 may correspond to the arrangement of the positioning means 391, further description is omitted here.

In summary, the chip fixing object stage provided by the embodiment of the invention fixes the chip by using an electromagnetic adsorption mode, and the chip is powered on when the chip needs to be fixed and can be removed by powering off when the chip needs to be replaced, so that the operation is convenient, and the problem of pollution and corrosion caused by liquid permeation is avoided. In addition, the chip fixing device adopted by the chip fixing objective table adopts concave-convex cooperation: the concave surface and the convex surface are matched, and the concave surface and the convex surface have different cone angles, so that the chip is positioned more accurately and more quickly. Moreover, the flexible liquid containing device with the adjustable liquid level height is adopted, so that liquid overflow is avoided, and the chip is convenient to take and place; and set up the reservoir on the fixed objective table of chip, make things convenient for objective to soak wherein during the chip is changed, avoid the crystallization of objective lower surface.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that suitable changes and modifications of the above embodiments are within the scope of the claimed invention as long as they are within the spirit and scope of the present invention.

Claims

1. A chip fixing objective table is characterized by comprising a supporting table and a chip fixing device, wherein the chip fixing device fixes a chip on the supporting table in an electromagnetic adsorption mode.

2. The chip mounting stage of claim 1, wherein said chip mounting means comprises a positioning means and a support means, said positioning means being mounted on said chip, said positioning means having a magnetic element disposed thereon, said support means being disposed on said support stage, said support means comprising an electromagnetic element which, when energized, forms a magnetic coupling with said magnetic element to secure said positioning means to said support stage.

3. The chip holding stage according to claim 2, wherein said positioning device and said supporting device are provided with mating surfaces, and said mating surfaces are concave-convex.

4. The chip holding stage according to claim 3, wherein the mating surface of said positioning device is concave and the mating surface of said supporting device is convex.

5. The chip holding stage according to claim 4, wherein the mating surfaces are tapered surfaces, and the taper of the cone on which the convex surface is located is smaller than the taper of the cone on which the concave surface is located.

6. The chip holding stage according to claim 1, further comprising a flexible liquid holding device, a shaping device, and a moving device, wherein the supporting stage comprises a supporting region, the supporting region comprises a supporting surface for supporting the chip, the flexible liquid holding device is disposed around the supporting surface, the shaping device is configured to shape the flexible liquid holding device, and the moving device is configured to change a shape of the flexible liquid holding device to change a height of a liquid level in the flexible liquid holding device.

7. The chip-holding stage according to claim 6, wherein the shaping device comprises an upper shaping device for shaping the opening of the flexible liquid-holding device, and the moving device is connected to the upper shaping device and changes the position of the upper shaping device by moving to change the shape of the flexible liquid-holding device.

8. The chip-holding stage according to claim 7, wherein the fixing device comprises a lower fixing device for fixing the bottom position of the flexible liquid-holding device to the supporting stage around the supporting surface.

9. The chip-holding stage according to claim 7, wherein said moving means raises and lowers said upper fixing means between a first height position and a second height position, said first height position being higher than said second height position, in said first height position, the liquid in said flexible liquid holding means is higher than the surface of said chip, in said second height position, the liquid in said flexible liquid holding means is lower than the surface of said chip.

10. The chip holder as recited in claim 1, wherein the support stage comprises a support area including a support surface for supporting the chip, the support surface having a reservoir disposed thereon for storing a liquid for holding the immersion lens.