CN111579096B - Infrared temperature measurement sensor module, temperature measurement method and temperature measurement equipment - Google Patents
Infrared temperature measurement sensor module, temperature measurement method and temperature measurement equipment Download PDFInfo
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Abstract
The invention discloses an infrared temperature measurement sensor module, a temperature measurement method and temperature measurement equipment, which comprise a plurality of thermopile sensor units and at least one temperature sensor, wherein each thermopile sensor unit comprises a processor and a thermopile sensor; the thermopile sensor is used for measuring a first ambient temperature and a first temperature of a target object; the temperature sensor is used for acquiring a second ambient temperature of the target object; the processor is used for generating a temperature difference value according to the first environment temperature and the first temperature measured by the thermopile sensor, and correcting the initial temperature according to the second environment temperature of the temperature sensor to generate the final temperature of the target object. The infrared temperature measurement sensor module in the embodiment of the invention can quickly respond to the ambient temperature, improves the temperature measurement precision, has a simple temperature calculation method, and improves the temperature measurement efficiency.
Description
Technical Field
The invention relates to the technical field of infrared temperature measurement, in particular to an infrared temperature measurement sensor module, a temperature measurement method and temperature measurement equipment.
Background
Infrared light is a light that is not visible to the human eye. The physical nature of infrared radiation is thermal radiation, the higher the temperature of an object, the more infrared radiation is emitted and the more energetic the infrared radiation is. Thermopile (Thermopile) infrared temperature measurement sensors directly sense thermal radiation for measuring small temperature differences or average temperatures, and have been widely used in the field of non-contact temperature measurement.
In temperature measurement using a thermopile, a thermopile infrared temperature sensor (hereinafter, referred to as an IR sensor) is directed at a target object, and the thermopile senses a difference between infrared rays emitted from the target object and ambient infrared rays of the sensor and converts the difference into an analog voltage signal. Suppose the absolute temperature of the target object is ToThe absolute temperature of the environment of the sensor is TaAnd the units are all kelvin, the analog voltage signal can be expressed as:
wherein A is a constant. Can be controlled by fixing the temperature T of the target objectoAnd the ambient temperature TaThen, measure V with the instrumentoThen, the constant A of the sensor is calculated. In addition to an IR (Infrared) sensor, an NTC (Negative Temperature Coefficient) Thermistor (also called a Thermistor) is generally packaged in the thermopile Infrared Temperature measurement sensor for detecting an ambient Temperature T of the IR sensoraConventional lidar.
Infrared temperature sensing using thermopilesThe temperature T of the target object is measured by the temperature measuring deviceoThe process is as follows:
measuring resistance of NTC thermistor, and calculating ambient temperature T according to R-T table of NTC thermistora；
Measuring analog voltage V output by IR sensoro；
The target temperature is calculated using the following formula (2):
NTC thermistors are semiconductor ceramic components made of transition metal oxides as main raw materials by high-temperature sintering, have a very large negative temperature coefficient, and the resistance value changes with the ambient temperature or self-heating caused by passing current, i.e. the resistance value rapidly decreases with the temperature rise under a certain measuring power. By utilizing the characteristic, the NTC thermistor can determine the corresponding temperature by measuring the resistance value thereof, thereby achieving the purpose of detecting and controlling the temperature.
Zero-power resistance value R of NTC thermistorTDefined as the resistance value measured at a given temperature with a measurement power that causes a change in resistance that is negligible with respect to the total measurement error. Zero power resistance value R measured at a temperature of 25 DEG C25Becomes the nominal resistance value.
The parameter representing how fast the NTC thermistor changes in resistance with changes in temperature is a Thermal Time Constant (TTC), which is denoted by τ. Under the condition of zero power, when the temperature changes, the time required for the temperature of the thermistor body to change by 63.2% of the temperature difference at the beginning and the end is defined as the thermal time constant tau of the NTC thermistor. Assuming ambient temperature from T1Change to T2After time T seconds, the thermistor temperature T can be expressed as:
now, assuming that the elapsed time t is τ, the thermistor temperature can be expressed as:
T＝(T2-T1)(1-e-1)+T1 (4)
then, it is possible to obtain:
the surface thermal time constant τ is defined as the time for the thermistor to reach 63.2% of the difference between its initial and final temperature, as shown in FIG. 1.
The thermal time constant τ of the NTC thermistor is colloquially said to indicate the sensitivity of the NTC thermistor to changes in ambient temperature. The thermal time constant is an inherent device characteristic that is independent of the rate of environmental change.
In the thermopile infrared temperature measuring sensor with higher integration level, the temperature T of the target object (or human) is detectedoIn addition to the Infrared (IR) sensor, an NTC thermistor is usually integrated for detecting the temperature T of the IR sensora. Due to the influence of a plurality of factors such as the quality, the shape, the filling material, the packaging shell and the like of the thermistor, the sensitivity of the NTC thermistor of the thermopile is found to be poorer than that of the IR sensor in actual work, and the NTC thermistor is usually used for high-low temperature tests that infrared temperature measurement products such as forehead temperature guns, ear temperature guns and the like made of the thermopile sensor are difficult to pass the rapid change of the environmental temperature. The main reason is that when the IR sensor measures the target temperature, the ambient temperature obtained by the NTC thermistor is a lagging temperature value, and the target temperature calculated by the formula (2) cannot completely reflect the change of the target temperature.
When the thermopile infrared temperature measurement sensor in the prior art is used for measuring temperature, the environment temperature cannot be accurately measured when the environment temperature is rapidly changed, and the temperature measurement precision is poor.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide an infrared temperature measurement sensor module, a temperature measurement method and temperature measurement equipment, and aims to solve the problem that the temperature measurement precision is poor because the environment temperature cannot be accurately measured when the environment temperature rapidly changes during temperature measurement of the infrared temperature measurement sensor of the thermopile in the prior art.
The technical scheme of the invention is as follows:
an infrared temperature measurement sensor module comprises a plurality of thermopile sensor units and at least one temperature sensor, wherein the thermopile sensor units are connected with the temperature sensor and comprise a processor and the thermopile sensor, and the processor is connected with the thermopile sensor;
the thermopile sensor is used for measuring a first ambient temperature and a first temperature of a target object;
the temperature sensor is used for acquiring a second ambient temperature of the target object;
the processor is used for generating a temperature difference value according to the first environment temperature and the first temperature measured by the thermopile sensor, and correcting the initial temperature according to the second environment temperature of the temperature sensor to generate the final temperature of the target object.
Optionally, the thermopile sensor unit further comprises a communication interface, the communication interface being connected with the processor,
the communication interface is used for outputting the final temperature of the target object generated by the processor.
Optionally, the infrared temperature measurement sensor module further comprises a power converter, and the power converter is respectively connected with the thermopile sensor unit and the temperature sensor;
the power converter is used for providing power for the thermopile sensor unit and the temperature sensor.
Optionally, a thermal time constant of the temperature sensor is less than a thermal time constant of the thermopile sensor.
Optionally, the number of the thermopile sensor units is one, and the number of the thermopile sensor units is connected to the temperature sensor.
Optionally, the number of the temperature sensors is the same as that of the thermopile sensor units, and the thermopile sensor units are connected with the temperature sensors in a one-to-one correspondence manner.
Another embodiment of the present invention provides a temperature measurement method for an infrared temperature measurement sensor module based on any one of the above, including:
the method comprises the steps that a processor obtains a first environment temperature and a first temperature output by a thermopile sensor, and a temperature difference value is calculated according to the first environment temperature and the first temperature;
the processor acquires a second ambient temperature output by the temperature sensor;
and the processor generates the final temperature of the target object according to the temperature difference and the second environment temperature.
Optionally, the processor obtains a first ambient temperature and a first temperature output by the thermopile sensor, and calculates a temperature difference value according to the first ambient temperature and the first temperature, including:
the processor acquires a first environment temperature T output by the thermopile sensoraAnd a first temperature T0，
According to a first ambient temperature TaAnd a first temperature T0The calculation formula for calculating the temperature difference Δ T is as follows:
optionally, the processor generates a final temperature of the target object according to the temperature difference and the second ambient temperature, and includes:
according to the temperature difference Delta T and the second ambient temperature Ta,newGenerating a final temperature T of the target objecto,newThe calculation formula of (a) is as follows:
the invention further provides temperature measuring equipment, which comprises the infrared temperature measuring sensor module.
Has the advantages that: compared with the prior art, the infrared temperature measurement sensor module in the embodiment of the invention can quickly respond to the ambient temperature, improves the temperature measurement precision, has a simple temperature calculation method, and improves the temperature measurement efficiency.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic diagram illustrating the thermal time constant of a thermistor according to the prior art;
FIG. 2 is a schematic diagram illustrating pin definition of an MLX90614 infrared temperature sensor;
FIG. 3 is a functional block diagram of an MLX90614 infrared temperature measurement sensor;
FIG. 4 is a schematic diagram of a RAM memory address of the MLX90614 infrared temperature measurement sensor;
FIG. 5 is a hardware configuration diagram of an embodiment of an infrared temperature sensor module according to the present invention;
FIG. 6 is a hardware configuration diagram of another embodiment of an infrared temperature sensor module according to the present invention;
FIG. 7 is a flow chart of a temperature measurement method based on an infrared temperature measurement sensor module according to the present invention;
FIG. 8 is a hardware configuration diagram of a thermometric apparatus of the present invention.
Detailed Description
In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention is described in further detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Embodiments of the present invention will be described below with reference to the accompanying drawings.
The embodiment of the invention provides that a temperature sensor with quick temperature response (smaller thermal time constant) is added on the basis of a commercially available thermopile infrared temperature sensor to improve the performance of the thermopile infrared temperature sensor for responding to the environmental temperature change. Also, IR sensing in a thermopile sensor without direct acquisitionVoltage value V of the deviceoIn this case, the present invention proposes a new algorithm to calculate the target temperature.
The contents of the embodiment of the present invention are illustrated by taking the commercially available MLX90614 infrared temperature measurement sensor of Melexis, belgium as an example. The MLX90614 infrared sensor uses an I2C digital output, which has 4 pins, as defined in FIG. 2. The MLX90614 output mode defaults to two-wire I2C, including both SCL and SDA signal lines.
The system block diagram of MLX90614 is shown in FIG. 3. The thermopile with the model number of 81101 is adopted, and comprises an IR sensor used for sensing the infrared radiation of a target object; and an NTC thermistor for measuring an ambient temperature of the IR sensor. It also has a signal processing front end model 90302, which includes analog switches, signal amplifier OPA, digital signal processor DSP, and PWM signal generator, all operating under the control of a state machine (STATE MACHINE).
RAM storage address schematic diagram of MLX90614 infrared temperature measurement sensor as shown in FIG. 4, the ambient temperature T of the sensor can be read from the RAM area of MLX90614 through I2C interfaces (SDA and SCL)a(located at RAM address 0x06) and the temperatures T of the two target objectso1(at RAM address 0x07) and To2(located at RAM address 0x 08). The MLX90614 has multiple models, and a part of the MLX90614 only integrates one IR sensor and can only measure the temperature of one target object at the same time. For the sake of generality of the description, we consider only T in FIG. 4OBJ1And is named target temperature To。
The embodiment of the invention provides an infrared temperature measurement sensor module, which comprises a plurality of thermopile sensor units and at least one temperature sensor, wherein the thermopile sensor units are connected with the temperature sensor and comprise a processor and the thermopile sensor, and the processor is connected with the thermopile sensor;
the thermopile sensor is used for measuring a first ambient temperature and a first temperature of a target object;
the temperature sensor is used for acquiring a second ambient temperature of the target object;
the processor is used for generating a temperature difference value according to the first environment temperature and the first temperature measured by the thermopile sensor, and correcting the initial temperature according to the second environment temperature of the temperature sensor to generate the final temperature of the target object.
In specific implementation, the infrared temperature sensor module provided by the invention comprises a temperature sensor, a thermopile sensor unit and a power converter. The infrared temperature sensor module may include only one thermopile sensor unit or a plurality of thermopile sensor units. The thermopile sensor unit is connected with a temperature sensor. The thermopile sensor unit includes a thermopile sensor and a processor.
The thermopile sensor is a commercially available thermopile sensor, such as the MLX90614 described above, and the common communication interface is SMBus or I2C.
The processor adopts a microcontroller which reads the ambient temperature T output by the thermopile sensoraAnd a target temperature To. As shown in FIG. 4, for MLX90614, the ambient temperature T is read from the 0x06 address of the internal RAM spaceaReading the target temperature T from the address 0x07o。
The microcontroller reads the ambient temperature T given by the independent temperature sensor (or calculated by the voltage value)a,new. Compared to the ambient temperature T read from the thermopile sensoraAt this temperature Ta,newThe ambient temperature change of the IR sensor can be reflected more sensitively.
The temperature measurement algorithm provided by the embodiment of the invention runs in the microcontroller and is operated according to the environment temperature TaTarget temperature ToMore sensitive ambient temperature Ta,newCalculating a more accurate target temperature To,new。
Optionally, the thermopile sensor unit further comprises a communication interface, the communication interface being connected with the processor,
the communication interface is used for outputting the final temperature of the target object generated by the processor.
In specific implementation, the microcontroller outputs the calculated accurate target temperature through a communication interface, and the interface form includes but is not limited to I2C, SPI, UART or Ethernet network interface and other interfaces.
Optionally, the infrared temperature measurement sensor module further comprises a power converter, and the power converter is respectively connected with the thermopile sensor unit and the temperature sensor;
the power converter is used for providing power for the thermopile sensor unit and the temperature sensor.
When the thermoelectric sensor unit is specifically implemented, the power converter is used for being connected with commercial power and converting a power supply into working voltage required by the thermoelectric sensor unit and the temperature sensor.
Optionally, a thermal time constant of the temperature sensor is less than a thermal time constant of the thermopile sensor. In specific implementation, the temperature sensor is selected from a temperature sensor with small thermal time constant and fast response to temperature change, and the temperature sensor comprises an NTC thermistor, an RTD (platinum resistor), a thermocouple, an optical fiber temperature sensor, a chip temperature sensor and the like. Factors that affect the thermal time constant of the thermistor are: the quality of the thermistor; the shape (surface area and volume) of the thermistor; encapsulating the potting material; a case enclosing the thermistor; the nature of the thermistor operating environment, e.g., gas or liquid.
Optionally, the number of the temperature sensors is the same as that of the thermopile sensor units, and the thermopile sensor units are connected with the temperature sensors in a one-to-one correspondence manner.
In specific implementation, the invention can be realized by a circuit module, all functions are realized on one module, and the performance of the thermopile infrared temperature sensor sold in the market is improved at a low cost. One of the implementation methods is realized by a stand-alone (standalon), each thermopile sensor is provided with an independent temperature sensor, and a processor, a communication interface and a power converter are added to form a sensor module. Wherein the processor may employ a microcontroller. As shown in fig. 5, a block diagram of only one thermopile sensor is shown.
In a further embodiment, the number of the thermopile sensor units is one, and the temperature sensors are connected with the thermopile sensor units.
In specific implementation, as shown in fig. 6, in a scenario where a plurality of thermopiles are used, a high-precision sensitive temperature sensor can be shared in a space, and the thermopiles, the microcontroller and the communication interface form an improved thermopile sensor unit, which has M sets in total. The M improved thermopile sensor units share the ambient temperature measured by one temperature sensor. In each improved set of thermopile sensor units, the microcontroller runs a temperature measurement algorithm. The method has the advantages that only one independent temperature sensor is needed for the M-set thermopile sensor unit, so that the type of the temperature sensor with high precision and fast response can be selected. The cost of the high-precision and fast-response temperature sensor is spread on each set of thermopile sensor unit, and the cost of each set of thermopile sensor unit cannot be obviously increased. The use of a single sensitive temperature sensor and M sets of thermopile sensor units may significantly reduce costs compared to M sets of thermopile sensor units and M sensitive temperature sensors.
Another embodiment of the present invention provides a temperature measurement method based on any one of the above infrared temperature measurement sensor modules, please refer to fig. 7, and fig. 7 is a flowchart of a preferred embodiment of the temperature measurement method of an infrared temperature measurement sensor module according to the present invention. As shown in fig. 7, it includes the steps of:
s100, acquiring a first environment temperature and a first temperature output by a thermopile sensor by a processor, and calculating a temperature difference value according to the first environment temperature and the first temperature;
s200, acquiring a second ambient temperature output by the temperature sensor by the processor;
and step S300, the processor generates the final temperature of the target object according to the temperature difference and the second environment temperature.
In specific implementation, the algorithm for the microcontroller to calculate the target temperature is as follows. Firstly, obtaining the ambient temperature T of the output of the thermopileaAnd a target temperature ToCalculating the difference of the powers of four of the two temperatures according to the following formula, and acquiring a more sensitive environment temperature T from an independent temperature sensora,newAnd finally, calculatingA more accurate target temperature.
Specifically, the processor acquires a first ambient temperature and a first temperature output by the thermopile sensor, and calculates a temperature difference value according to the first ambient temperature and the first temperature, including:
the processor acquires a first environment temperature T output by the thermopile sensoraAnd a first temperature T0，
According to a first ambient temperature TaAnd a first temperature T0The calculation formula for calculating the temperature difference Δ T is as follows:
still further, the processor generates a final temperature of the target object based on the temperature difference and the second ambient temperature, including:
according to the temperature difference Delta T and the second ambient temperature Ta,newGenerating a final temperature T of the target objecto,newThe calculation formula of (a) is as follows:
in specific implementation, the above algorithm does not need to read the voltage value V of the IR sensoro。
It should be noted that, in the foregoing embodiments, a certain order does not necessarily exist among the steps, and it can be understood by those skilled in the art according to the description of the embodiments of the present invention that, in different embodiments, the steps may have different execution orders, that is, may be executed in parallel, may also be executed in an exchange manner, and the like.
The invention further provides temperature measuring equipment, which comprises the infrared temperature measuring sensor module.
Specifically, as shown in fig. 8, the temperature measuring device further includes a display, and the display is connected to the infrared temperature measuring sensor module. The display is used for acquiring and displaying the temperature output by the communication interface. The temperature measuring device includes, but is not limited to, a forehead temperature gun, an ear temperature gun and other devices with infrared temperature measurement.
The invention also provides a specific embodiment, and the temperature measurement performance of the embodiment of the invention is verified by using a numerical calculation method in the specific embodiment. Suppose we have a thermopile sensor, such as MLX90614, with a built-in NTC thermistor for measuring the ambient temperature of the IR sensor with a Thermal Time Constant (TTC) of τ. Assuming that the change in ambient temperature is from temperature T1Change to T2According to the formula (3), the change of the temperature T of the thermistor after different time T is:
we can calculate the change in thermistor temperature from t τ to t 5 τ, as shown in the table below.
TABLE 1 NTC thermistor temperature Change
The thermal time constant of an NTC thermistor internally arranged in a thermopile sensor is assumed to be tau15 seconds and assuming a thermal time constant τ for the individual temperature sensors used as proposed by the present invention22.5 seconds, namely the thermal time constant of the independent temperature sensor is half smaller than that of the NTC thermistor arranged in the thermopile. While assuming ambient temperature from temperature T115 ℃ to T235 ℃ and the temperature change is instantaneous. Suppose the constant a in equation (1) is equal to 1.0496 e-9.
Varying in time from t to t1To t 5 τ1Within this range we compare the performance of the prior art and the method of the present invention to calculate the target temperature, which is assumed to be 35 c and kept constant. The two methods are described below.
The prior art is as follows: the ambient temperature of the IR sensor was calculated using an NTC thermistor built into the MLX 90614.
The method comprises the following steps: a separate temperature sensor is used to calculate the ambient temperature of the IR sensor.
For ease of comparison, the changes in target temperature over time calculated by the two methods are tabulated for comparison, as shown in table 2. As can be seen from the table, the method of the invention can obviously accelerate the agility of the calculation of the target temperature to the change of the environmental temperature. Specifically, at time t 2 τ1I.e. 10 seconds, the target temperature calculated by the method of the present application can reach 34.63 ℃, the difference from the true target temperature is 0.37 ℃, the target temperature calculated by the method of the prior art is 32.29 ℃ and the difference from the true target temperature is 2.71 ℃.
TABLE 2 calculated target temperature changes over time
Through the above description of the embodiments, those skilled in the art will clearly understand that the embodiments may be implemented by software plus a general hardware platform, and may also be implemented by hardware. Based on such understanding, the above technical solutions essentially or contributing to the related art can be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods of the various embodiments or some parts of the embodiments.
Conditional language such as "can," "might," or "may" is generally intended to convey that a particular embodiment can include (yet other embodiments do not include) particular features, elements, and/or operations, among others, unless specifically stated otherwise or otherwise understood within the context as used. Thus, such conditional language is also generally intended to imply that features, elements, and/or operations are in any way required for one or more embodiments or that one or more embodiments must include logic for deciding, with or without input or prompting, whether such features, elements, and/or operations are included or are to be performed in any particular embodiment.
What has been described herein in the specification and drawings includes examples that can provide an infrared thermometric sensor module and thermometric method, thermometric apparatus. It will, of course, not be possible to describe every conceivable combination of components and/or methodologies for purposes of describing the various features of the disclosure, but it can be appreciated that many further combinations and permutations of the disclosed features are possible. It is therefore evident that various modifications can be made to the disclosure without departing from the scope or spirit thereof. In addition, or in the alternative, other embodiments of the disclosure may be apparent from consideration of the specification and drawings and from practice of the disclosure as presented herein. It is intended that the examples set forth in this specification and the drawings be considered in all respects as illustrative and not restrictive. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims (7)
1. An infrared temperature measurement sensor module is characterized by comprising a plurality of thermopile sensor units and at least one temperature sensor, wherein the thermopile sensor units are connected with the temperature sensor and comprise a processor and the thermopile sensor, and the processor is connected with the thermopile sensor;
the thermopile sensor is used for measuring a first ambient temperature and a first temperature of a target object;
the temperature sensor is used for acquiring a second ambient temperature of the target object;
the processor is used for generating a temperature difference value according to the first environment temperature and the first temperature measured by the thermopile sensor, and correcting the initial temperature according to the second environment temperature of the temperature sensor to generate the final temperature of the target object;
a thermal time constant of the temperature sensor is less than a thermal time constant of the thermopile sensor;
the number of the temperature sensors is one, and the plurality of thermopile sensor units are connected with the temperature sensors.
2. The infrared thermometric sensor module of claim 1, wherein said thermopile sensor unit further comprises a communication interface, said communication interface being connected to said processor,
the communication interface is used for outputting the final temperature of the target object generated by the processor.
3. The infrared temperature measurement sensor module of claim 2, further comprising a power converter, the power converter being connected to the thermopile sensor unit and the temperature sensor, respectively;
the power converter is used for providing power for the thermopile sensor unit and the temperature sensor.
4. A temperature measurement method based on the infrared temperature measurement sensor module set of any one of claims 1-3, wherein the method comprises:
the method comprises the steps that a processor obtains a first environment temperature and a first temperature output by a thermopile sensor, and a temperature difference value is calculated according to the first environment temperature and the first temperature;
the processor acquires a second ambient temperature output by the temperature sensor;
the processor generates a final temperature of the target object according to the temperature difference value and the second ambient temperature;
a thermal time constant of the temperature sensor is less than a thermal time constant of the thermopile sensor;
the number of the temperature sensors is one, and the plurality of thermopile sensor units are connected with the temperature sensors.
5. The method of claim 4, wherein the step of obtaining the first ambient temperature and the first temperature output by the thermopile sensor and calculating the temperature difference according to the first ambient temperature and the first temperature comprises:
the processor acquires a first environment temperature T output by the thermopile sensoraAnd a first temperature T0，
According to a first ambient temperature TaAnd a first temperature T0The calculation formula for calculating the temperature difference Δ T is as follows:
6. the method of claim 5, wherein the processor generates the final temperature of the target object according to the temperature difference and the second ambient temperature, and comprises:
according to the temperature difference Delta T and the second ambient temperature Ta，newGenerating a final temperature T of the target objecto，newThe calculation formula of (a) is as follows:
7. a temperature measuring device, comprising the infrared temperature measuring sensor module set of any one of claims 1 to 3.
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