CN111575627B - Tin plating equipment for processing semiconductor element and working method thereof - Google Patents
Tin plating equipment for processing semiconductor element and working method thereof Download PDFInfo
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- CN111575627B CN111575627B CN202010590583.3A CN202010590583A CN111575627B CN 111575627 B CN111575627 B CN 111575627B CN 202010590583 A CN202010590583 A CN 202010590583A CN 111575627 B CN111575627 B CN 111575627B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/40—Plates; Strips
- C23C2/405—Plates of specific length
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a tinning device for processing a semiconductor element and a working method thereof.
Description
Technical Field
The invention relates to the technical field of semiconductor element processing, in particular to tinning equipment for semiconductor element processing and a working method thereof.
Background
Semiconductor components are electronic devices that are electrically conductive between a good conductor and an insulator, and that utilize the special electrical properties of the semiconductor material to perform specific functions, which can be used to generate, control, receive, convert, amplify signals, and perform energy conversion.
Patent document (CN201110456556.8) discloses a tinning apparatus and a tinning method, wherein the tinning apparatus tin-plates and applies soldering flux to chip pins by lifting a tin pan and a soldering flux pan, thereby avoiding waste of soldering flux and tin and reducing pollution to non-to-be-soldered surfaces of chips; the invention does not use a tinned pump, and correspondingly does not have high energy consumption when a pump motor rotates at a high speed; the tin pot has smaller opening, and can greatly reduce the contact surface between tin and air, thereby reducing the oxidation of tin and reducing the corresponding heating energy consumption. But this tinning stack can not guarantee that the scaling powder spraying on PCB board surface is even, and then can't guarantee subsequent abundant tin-plating, and this tinning stack can not carry the PCB board of equidimension not simultaneously.
Disclosure of Invention
The invention aims to provide tinning equipment for processing a semiconductor element and a working method thereof, and the tinning equipment is used for solving the following technical problems: (1) the tin plating equipment for processing the semiconductor element can meet the clamping and conveying work of the PCB with different sizes by the structural arrangement, and has strong practicability; (2) by starting two first motors, the first motors drive a belt to transmit through two belt pulleys and further drive the PCB to move through a moving shell, a second air cylinder and a third air cylinder are started, the second air cylinder pushes a first driving shell upwards, the third air cylinder pushes a second driving shell downwards, four lower coating rollers on the first driving shell contact the lower surface of the PCB, four upper coating rollers on the second driving shell contact the upper surface of the PCB, the PCB in the moving process drives the upper coating rollers and the lower coating rollers to rotate, the lower coating rollers coat the soldering flux in a first soldering flux groove on the lower surface of the PCB, the upper coating rollers drive a coating belt to transmit, the coating belt drives a guide wheel to rotate, the guide wheel coats the soldering flux in a second soldering flux groove on the coating belt, the coating belt coats the soldering flux on the upper coating roller, the upper coating rollers coat the soldering flux on the upper surface of the PCB, the PCB moves to the upper part of a tin bath after the soldering flux is coated, the grip block cancellation is to PCB board centre gripping, and the PCB board falls into tin-plating in the tinning bath and tin-plates, through above structure setting, scaling powder is evenly paintd to the upper and lower surface of PCB board to this equipment before the tin-plating, guarantees that the tin-plating on PCB board surface is more abundant.
The purpose of the invention can be realized by the following technical scheme:
the tinning equipment for processing the semiconductor element comprises a bottom plate, wherein side frames are arranged on two sides of the bottom plate, a fixed shell is mounted on each side frame, a first motor is mounted on each fixed shell, two belt pulleys are arranged in each fixed shell in a rotating mode and are connected through belt transmission, a movable shell is mounted on a belt between the two belt pulleys through a belt clamp, two movable plates are mounted on each movable shell in a sliding mode, a first air cylinder is mounted on each movable plate, and a clamping plate is mounted at the end of a piston rod of each first air cylinder;
the bottom plate is provided with a first mounting plate, a second mounting plate is arranged between the two side frames, the second mounting plate is arranged right above the first mounting plate, the upper surface of the first mounting plate is provided with two second cylinders, the lower surface of the second mounting plate is provided with two third cylinders, two second cylinder piston rods are connected with a first driving shell, two third cylinder piston rods are connected with a second driving shell, the first driving shell is internally provided with four lower coating rollers in a rotating way, a first scaling powder groove is arranged in the first driving shell, the first scaling powder groove is arranged below the lower coating rollers, the second driving shell is internally provided with four upper coating rollers, the second driving shell is provided with two driving wheels, the two driving wheels are connected through a coating belt in a transmission way, the coating belt is arranged above the four upper coating rollers, and the upper coating rollers are in contact with the belt, the outer surface of one side of the coating belt is in contact with the guide wheel, a second soldering flux groove is arranged below the guide wheel, and a tin plating groove is arranged between the two side frames.
Further, remove shell one side and install the second motor, it is provided with first lead screw, second lead screw to remove the shell internal rotation, first lead screw and second lead screw fixed connection, first lead screw, second lead screw outer peripheral face all rotate and install the lead screw connecting block, first lead screw, second lead screw are connected with the movable plate through the lead screw connecting block respectively, be provided with two slide rails in the removal shell, install two sliders on the movable plate, the movable plate passes through slider sliding connection slide rail, second motor output shaft second lead screw.
Furthermore, the first screw rod and the second screw rod have the same thread number and opposite thread directions.
Furthermore, two second cylinders are respectively installed on two sides of the upper surface of the first installation plate, and two third cylinders are respectively installed on two sides of the lower surface of the second installation plate.
Further, the working method of the tin plating equipment for processing the semiconductor element comprises the following steps:
the method comprises the following steps: putting a PCB (printed circuit board) between two side frames, starting a second motor, driving a second screw rod to rotate by an output shaft of the second motor, driving a first screw rod to rotate by the second screw rod, driving the distance adjustment of two moving plates by the first screw rod and the second screw rod which are matched with a screw rod connecting block, further driving the distance adjustment of two first air cylinders, starting the first air cylinders, and clamping two sides of the PCB by the four first air cylinders;
step two: two first motors are started, the first motors drive a belt to transmit through two belt pulleys and further drive the PCB to move through a moving shell, a second cylinder and a third cylinder are started, the second cylinder pushes a first driving shell upwards, the third cylinder pushes a second driving shell downwards, four lower coating rollers on the first driving shell contact the lower surface of the PCB, four upper coating rollers on the second driving shell contact the upper surface of the PCB, the PCB in the moving process drives the upper coating rollers and the lower coating rollers to rotate, the lower coating rollers coat the soldering flux in a first soldering flux groove on the lower surface of the PCB, the upper coating rollers drive a coating belt to transmit, the coating belt drives a guide wheel to rotate, the guide wheel coats the soldering flux in a second soldering flux groove on the coating belt, the coating belt coats the soldering flux on the upper coating roller, the upper coating roller coats the soldering flux on the upper surface of the PCB, the PCB moves above a tin plating groove after the soldering flux is coated, the clamping plate cancels the clamping of the PCB, and the PCB falls into the tin plating bath for tin plating.
The invention has the beneficial effects that:
(1) according to the tinning equipment for processing the semiconductor element and the working method thereof, the PCB is placed between the two side frames, the second motor is started, the output shaft of the second motor drives the second lead screw to rotate, the second lead screw drives the first lead screw to rotate, the first lead screw and the second lead screw are matched with the lead screw connecting block to drive the distance adjustment of the two moving plates, so that the distance adjustment of the two first air cylinders is driven, the first air cylinders are started, the four first air cylinders clamp the two sides of the PCB, and through the structural arrangement, the tinning equipment for processing the semiconductor element can meet the clamping and conveying work of the PCB with different sizes, and is high in practicability;
(2) by starting two first motors, the first motors drive a belt to transmit through two belt pulleys and further drive the PCB to move through a moving shell, a second air cylinder and a third air cylinder are started, the second air cylinder pushes a first driving shell upwards, the third air cylinder pushes a second driving shell downwards, four lower coating rollers on the first driving shell contact the lower surface of the PCB, four upper coating rollers on the second driving shell contact the upper surface of the PCB, the PCB in the moving process drives the upper coating rollers and the lower coating rollers to rotate, the lower coating rollers coat the soldering flux in a first soldering flux groove on the lower surface of the PCB, the upper coating rollers drive a coating belt to transmit, the coating belt drives a guide wheel to rotate, the guide wheel coats the soldering flux in a second soldering flux groove on the coating belt, the coating belt coats the soldering flux on the upper coating roller, the upper coating rollers coat the soldering flux on the upper surface of the PCB, the PCB moves to the upper part of a tin bath after the soldering flux is coated, the grip block cancellation is to PCB board centre gripping, and the PCB board falls into tin-plating in the tinning bath and tin-plates, through above structure setting, scaling powder is evenly paintd to the upper and lower surface of PCB board to this equipment before the tin-plating, guarantees that the tin-plating on PCB board surface is more abundant.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view showing the structure of a tin plating apparatus for processing a semiconductor device according to the present invention;
FIG. 2 is a schematic structural view of a first and a second driving case according to the present invention;
FIG. 3 is an internal structural view of a first drive case and a second drive case according to the present invention;
FIG. 4 is an internal structural view of the fixing case of the present invention;
fig. 5 is an enlarged view of the invention at a in fig. 4.
In the figure: 1. a side frame; 2. a base plate; 3. a stationary case; 4. a first motor; 5. a belt pulley; 6. moving the shell; 7. a second motor; 8. a first lead screw; 9. a second lead screw; 10. moving the plate; 11. a first cylinder; 12. a clamping plate; 13. a first mounting plate; 14. a second mounting plate; 15. a second cylinder; 16. a third cylinder; 17. a first drive case; 18. a second drive case; 19. a lower coating roller; 20. a first flux groove; 21. an upper coating roller; 22. coating a tape; 23. a drive wheel; 24. a guide wheel; 25. a second flux groove; 26. and (4) a tin plating bath.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the invention is a tin plating apparatus for processing a semiconductor element, which includes a bottom plate 2, side frames 1 are respectively disposed on two sides of the bottom plate 2, a fixed shell 3 is mounted on the side frames 1, a first motor 4 is mounted on the fixed shell 3, two belt pulleys 5 are rotatably disposed in the fixed shell 3, the two belt pulleys 5 are in transmission connection through a belt, a movable shell 6 is mounted on the belt between the two belt pulleys 5 through a belt clamp, two movable plates 10 are slidably mounted on the movable shell 6, a first cylinder 11 is mounted on each movable plate 10, and a clamping plate 12 is mounted at the end of a piston rod of each first cylinder 11;
a first mounting plate 13 is mounted on the bottom plate 2, a second mounting plate 14 is mounted between the two side frames 1, the second mounting plate 14 is arranged right above the first mounting plate 13, two second air cylinders 15 are mounted on the upper surface of the first mounting plate 13, two third air cylinders 16 are mounted on the lower surface of the second mounting plate 14, piston rods of the two second air cylinders 15 are connected with a first driving shell 17, piston rods of the two third air cylinders 16 are connected with a second driving shell 18, four lower coating rollers 19 are rotatably arranged in the first driving shell 17, a first scaling powder groove 20 is arranged in the first driving shell 17, the first scaling powder groove 20 is arranged below the lower coating roller 19, four upper coating rollers 21 are arranged in the second driving shell 18, two driving wheels 23 are arranged on the second driving shell 18, the two driving wheels 23 are in transmission connection through a coating belt 22, the coating belt 22 is arranged above the four upper coating rollers 21, the upper coating rollers 21 contact the coating belt 22, one side outer surface of the coating tape 22 contacts with a guide wheel 24, a second flux groove 25 is arranged below the guide wheel 24, and a tin-plating groove 26 is arranged between the two side frames 1.
Specifically, a second motor 7 is installed on one side of a movable shell 6, a first lead screw 8 and a second lead screw 9 are arranged in the movable shell 6 in a rotating mode, the first lead screw 8 is fixedly connected with the second lead screw 9, lead screw connecting blocks are installed on the outer peripheral faces of the first lead screw 8 and the second lead screw 9 in a rotating mode, a movable plate 10 is connected to the first lead screw 8 and the second lead screw 9 through the lead screw connecting blocks respectively, two sliding rails are arranged in the movable shell 6, two sliding blocks are installed on the movable plate 10, the movable plate 10 is connected with the sliding rails through the sliding blocks in a sliding mode, and an output shaft of the second motor 7 is connected with the second lead screw 9. The first screw rod 8 and the second screw rod 9 have the same thread number and opposite thread directions. Two second cylinders 15 are respectively installed on two sides of the upper surface of the first installation plate 13, and two third cylinders 16 are respectively installed on two sides of the lower surface of the second installation plate 14.
Referring to fig. 1-5, the tin plating apparatus for processing a semiconductor device of the present embodiment works as follows:
the method comprises the following steps: putting a PCB (printed circuit board) between two side frames 1, starting a second motor 7, driving a second screw rod 9 to rotate by an output shaft of the second motor 7, driving a first screw rod 8 to rotate by the second screw rod 9, driving two movable plates 10 to adjust the distance by the first screw rod 8 and the second screw rod 9 matching with a screw rod connecting block, further driving two first air cylinders 11 to adjust the distance, starting the first air cylinders 11, and clamping two sides of the PCB by four first air cylinders 11;
step two: two first motors 4 are started, the first motors 4 drive a belt to transmit through two belt pulleys 5, and further drive the PCB to move through a moving shell 6, a second air cylinder 15 and a third air cylinder 16 are started, the second air cylinder 15 pushes a first driving shell 17 upwards, the third air cylinder 16 pushes a second driving shell 18 downwards, four lower coating rollers 19 on the first driving shell 17 contact the lower surface of the PCB, four upper coating rollers 21 on the second driving shell 18 contact the upper surface of the PCB, the PCB in the moving process drives the upper coating rollers 21 and the lower coating rollers 19 to rotate, the lower coating rollers 19 coat the soldering flux in a first soldering flux groove 20 on the lower surface of the PCB, the upper coating rollers 21 drive a coating belt 22 to transmit, the coating belt 22 drives a guide wheel 24 to rotate, the guide wheel 24 coats the soldering flux in a second soldering flux groove 25 on the coating belt 22, the coating belt 22 coats the soldering flux on the upper coating rollers 21, the upper coating roller 21 coats the soldering flux on the upper surface of the PCB, the PCB is moved to the position above the tinning bath 26 after the soldering flux is coated, the clamping plate 12 cancels the clamping of the PCB, and the PCB falls into the tinning bath 26 to be tinned.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.
Claims (5)
1. The tinning equipment for processing the semiconductor element is characterized by comprising a bottom plate (2), wherein side frames (1) are arranged on two sides of the bottom plate (2), a fixed shell (3) is mounted on each side frame (1), a first motor (4) is mounted on each fixed shell (3), two belt pulleys (5) are rotationally arranged in each fixed shell (3), the two belt pulleys (5) are connected through belt transmission, a movable shell (6) is mounted on a belt between the two belt pulleys (5) through a belt clamp, two movable plates (10) are slidably mounted on each movable shell (6), a first cylinder (11) is mounted on each movable plate (10), and a clamping plate (12) is mounted at the end part of a piston rod of each first cylinder (11);
the bottom plate (2) is provided with a first mounting plate (13), a second mounting plate (14) is mounted between the two side frames (1), the second mounting plate (14) is arranged right above the first mounting plate (13), the upper surface of the first mounting plate (13) is provided with two second cylinders (15), the lower surface of the second mounting plate (14) is provided with two third cylinders (16), the piston rods of the two second cylinders (15) are connected with a first driving shell (17), the piston rods of the two third cylinders (16) are connected with a second driving shell (18), the first driving shell (17) is internally provided with four lower coating rollers (19) in a rotating manner, a first scaling powder groove (20) is arranged in the first driving shell (17), the first scaling powder groove (20) is arranged below the lower coating rollers (19), and four upper coating rollers (21) are arranged in the second driving shell (18), second drive shell (18) are provided with two drive wheels (23), connect through coating area (22) transmission between two drive wheels (23), coating area (22) set up in four and coat roller (21) tops on, it contacts coating area (22) to go up coating roller (21), coating area (22) one side external surface contact leading wheel (24), leading wheel (24) below is provided with second scaling powder groove (25), is provided with tin-plated groove (26) between two side bearer (1).
2. The tin plating equipment for processing the semiconductor element is characterized in that a second motor (7) is installed on one side of the movable shell (6), a first lead screw (8) and a second lead screw (9) are rotatably arranged in the movable shell (6), the first lead screw (8) is fixedly connected with the second lead screw (9), lead screw connecting blocks are rotatably installed on the outer peripheral surfaces of the first lead screw (8) and the second lead screw (9), a movable plate (10) is respectively connected with the first lead screw (8) and the second lead screw (9) through the lead screw connecting blocks, two slide rails are arranged in the movable shell (6), two slide blocks are installed on the movable plate (10), the movable plate (10) is slidably connected with the slide rails through the slide blocks, and an output shaft of the second motor (7) is connected with the second lead screw (9).
3. The tin plating apparatus for processing semiconductor elements according to claim 2, wherein the first lead screw (8) and the second lead screw (9) have the same number of threads and opposite thread directions.
4. The tin plating apparatus for processing semiconductor elements according to claim 1, wherein two second cylinders (15) are respectively mounted on both sides of the upper surface of the first mounting plate (13), and two third cylinders (16) are respectively mounted on both sides of the lower surface of the second mounting plate (14).
5. The working method of the tin plating equipment for processing the semiconductor element is characterized by comprising the following steps of:
the method comprises the following steps: putting a PCB (printed circuit board) between two side frames (1), starting a second motor (7), driving a second screw rod (9) to rotate by an output shaft of the second motor (7), driving a first screw rod (8) to rotate by the second screw rod (9), driving the distance adjustment of two movable plates (10) by the first screw rod (8) and the second screw rod (9) through matching with a screw rod connecting block, further driving the distance adjustment of two first cylinders (11), starting the first cylinders (11), and clamping two sides of the PCB by the four first cylinders (11) through four clamping plates (12);
step two: two first motors (4) are started, the first motors (4) drive a belt to transmit through two belt pulleys (5), then a mobile shell (6) drives a PCB to move, a second cylinder (15) and a third cylinder (16) are started, the second cylinder (15) upwards pushes a first driving shell (17), the third cylinder (16) downwards pushes a second driving shell (18), four lower coating rollers (19) on the first driving shell (17) contact the lower surface of the PCB, four upper coating rollers (21) on the second driving shell (18) contact the upper surface of the PCB, the PCB in the moving process drives an upper coating roller (21) and a lower coating roller (19) to rotate, the lower coating roller (19) coats scaling powder in a first scaling powder groove (20) on the lower surface of the PCB, the upper coating roller (21) drives a coating belt (22) to transmit, the coating belt (22) drives a guide wheel (24) to rotate, the guide wheel (24) coats the soldering flux in the second soldering flux groove (25) on the coating belt (22), the coating belt (22) coats the soldering flux on the upper coating roller (21), the upper coating roller (21) coats the soldering flux on the upper surface of the PCB, the PCB moves to the upper side of the tinning groove (26) after the soldering flux is coated, the clamping plate (12) cancels the clamping of the PCB, and the PCB is tinned in the tinning groove (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010590583.3A CN111575627B (en) | 2020-06-24 | 2020-06-24 | Tin plating equipment for processing semiconductor element and working method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010590583.3A CN111575627B (en) | 2020-06-24 | 2020-06-24 | Tin plating equipment for processing semiconductor element and working method thereof |
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| CN111575627A CN111575627A (en) | 2020-08-25 |
| CN111575627B true CN111575627B (en) | 2022-03-15 |
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| CN109731736A (en) * | 2018-12-27 | 2019-05-10 | Tcl王牌电器(惠州)有限公司 | Coating machine |
| CN210359698U (en) * | 2019-07-08 | 2020-04-21 | 无锡先导智能装备股份有限公司 | Scaling powder coating device |
| CN110712402B (en) * | 2019-10-15 | 2021-10-08 | 界首市天鸿新材料股份有限公司 | Aluminum-plastic composite film with oxidation resistance and high ductility and preparation method thereof |
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| CN209243150U (en) * | 2018-12-24 | 2019-08-13 | 重庆群崴电子材料有限公司 | A kind of copper strips hot dipped tinning device |
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Denomination of invention: Tin plating equipment and its working method for semiconductor component processing Effective date of registration: 20230530 Granted publication date: 20220315 Pledgee: Ma'anshan branch of Bank of China Ltd. Pledgor: Anhui Fuxin Semiconductor Technology Co.,Ltd. Registration number: Y2023980042203 |
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