CN111571022A - Laser marking device - Google Patents

Laser marking device Download PDF

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Publication number
CN111571022A
CN111571022A CN202010396135.XA CN202010396135A CN111571022A CN 111571022 A CN111571022 A CN 111571022A CN 202010396135 A CN202010396135 A CN 202010396135A CN 111571022 A CN111571022 A CN 111571022A
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CN
China
Prior art keywords
laser
laser marking
material loading
plate
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010396135.XA
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Chinese (zh)
Inventor
郭缙
曹洪涛
刘亮
黄海庆
杨柯
吕启涛
高云峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Han s Laser Technology Industry Group Co Ltd
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Han s Laser Technology Industry Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Han s Laser Technology Industry Group Co Ltd filed Critical Han s Laser Technology Industry Group Co Ltd
Priority to CN202010396135.XA priority Critical patent/CN111571022A/en
Publication of CN111571022A publication Critical patent/CN111571022A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to laser marking equipment which comprises a laser, a turntable mechanism and a light blocking assembly, wherein at least 2 material loading positions are arranged on a rotating disk of the turntable mechanism, each material loading position is separated by a partition plate, the light blocking assembly and the partition plates can enclose to form a shielding cavity, and when the rotating disk rotates to enable a workpiece at one material loading position to be located in the shielding cavity, a laser beam emitted by the laser can penetrate through a window in the light blocking assembly to be incident on the workpiece located in the shielding cavity. According to the laser marking equipment, the workpieces on the multiple loading positions can be efficiently transferred to the shielding cavity in a rotating mode of the rotating disk, and under the shielding of the shielding cavity, the identification and positioning of the laser marking equipment on the workpieces cannot be interfered by external light beams, so that the machining efficiency is improved, and the machining precision is improved.

Description

Laser marking device
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to laser marking equipment.
Background
With the wide application of laser processing technology in various industries, more and more automatic processing is adopted to replace traditional manual work, for example, marking operation is carried out on a workpiece by adopting laser marking equipment, and the processing efficiency and quality are effectively improved. However, the processing efficiency of the current laser marking device is yet to be further improved, and when the laser marking device is used for laser marking operation, the recognition and positioning accuracy of the laser marking device on a workpiece is easily affected by external light, so that the processing accuracy is affected.
Disclosure of Invention
Accordingly, it is necessary to provide a laser marking apparatus which improves processing accuracy while improving processing efficiency.
The invention provides a laser marking device, comprising:
a laser for emitting a laser beam;
the rotary table mechanism comprises a rotary table, a partition plate and a driving piece, wherein at least 2 material loading positions are arranged on the rotary table and used for loading workpieces, the partition plate is connected with the rotary table and used for separating the material loading positions, and the driving piece is used for driving the rotary table to rotate;
the light blocking assembly can be enclosed with the partition plate to form a shielding cavity, a window is reserved on the light blocking assembly, and when the rotating disc rotates to enable a workpiece with one of the material loading positions to be located in the shielding cavity, laser beams emitted by the laser can penetrate through the window to enter the workpiece located in the shielding cavity.
In one embodiment, the rotating disc is provided with 2 material loading positions, the partition plate is perpendicular to the rotating disc, and the 2 material loading positions are arranged in a mirror image mode by taking the partition plate as a mirror image.
In one embodiment, the light blocking assembly comprises a transverse plate and 2 supporting plates, wherein the 2 supporting plates are respectively vertically connected to two opposite sides of the transverse plate, and the window is arranged on the transverse plate.
In one embodiment, one or more light bars are installed on the transverse plate, and the light bars are located on the periphery side or above the window.
In one embodiment, a CCD camera is connected to the laser, the CCD camera is used for identifying and positioning the workpiece in the shielding cavity, the laser is connected with the CCD camera through a controller signal, and the controller can control the laser to perform laser marking on the workpiece according to the position identified by the CCD camera.
In one embodiment, the laser marking device includes a light shield assembly for selectively shielding a lens of the CCD camera.
In one embodiment, the shading assembly comprises a shading plate and a telescopic driving piece, the shading plate can move to a first position and a second position relative to the CCD camera under the driving of the telescopic driving piece, when the shading plate moves to the first position, the shading plate shades the lens of the CCD camera, and when the shading plate moves to the second position, the shading plate releases the shading of the lens of the CCD camera.
In one embodiment, the telescopic drive is mounted on the laser or the telescopic drive is mounted on the light barrier assembly.
In one of them embodiment, the work piece through carry the material tool place in carry the material level, logical groove has been seted up with carry material level corresponding position on the rotary disk, laser marking equipment includes jacking locating component, jacking locating component includes roof and jacking driving piece, when the work piece that one of them carried the material level is located shield the chamber, the roof can be in what the jacking driving piece ordered down passes logical groove to the bearing carry the material tool jacking to remove, make carry the material tool with the rotary disk separation.
In one embodiment, handles are arranged on two opposite sides of the material loading jig, and when the material loading jig moves out of the shielding cavity along with the rotation of the rotating disc, the material loading jig can be taken down from the rotating disc by gripping the handles.
The invention relates to laser marking equipment which comprises a laser, a rotary table mechanism and a light blocking assembly, wherein at least 2 material carrying positions are arranged on a rotary table of the rotary table mechanism, each material carrying position is separated by a partition plate, the light blocking assembly and the partition plates can enclose to form a shielding cavity, when the rotary table rotates to enable a workpiece at one material carrying position to be located in the shielding cavity, a laser beam emitted by the laser can penetrate through a window in the light blocking assembly to be incident to the workpiece in the shielding cavity for marking processing, the workpieces at the plurality of material carrying positions can be efficiently transferred to the shielding cavity by the rotation of the rotary table, and under the shielding of the shielding cavity, the external light beam cannot interfere the identification and positioning of the laser marking equipment on the workpiece, so that the processing efficiency is improved, and the processing precision is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings of the embodiments can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a laser marking apparatus according to an embodiment;
FIG. 2 is a schematic structural diagram of a turntable mechanism of the laser marking apparatus according to an embodiment;
fig. 3 is a schematic perspective view of a material loading jig in the laser marking device according to the embodiment;
fig. 4 is a schematic structural diagram of a light blocking assembly and a light shielding assembly in the laser marking apparatus according to an embodiment;
FIG. 5 is a schematic view of an assembly structure of a light blocking assembly and a turntable mechanism in the laser marking apparatus according to an embodiment;
FIG. 6 is a schematic structural diagram of a jacking positioning assembly in the laser marking device according to an embodiment;
FIG. 7 is a schematic diagram of a laser of the laser marking device of an embodiment;
fig. 8 is a schematic structural diagram of a focusing mechanism of the laser marking apparatus according to an embodiment.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1, fig. 1 schematically illustrates the structure of a laser marking apparatus in one embodiment. The laser marking apparatus includes a cabinet 10, a turntable mechanism 20, a light blocking assembly 30, and a laser 40. The cabinet 10 can provide a receiving space for a controller of the laser marking device, and meanwhile, the cabinet 10 can also provide support for structures such as the turntable mechanism 20, the light blocking assembly 30, and the laser 40, for convenience of description, a top surface of the cabinet 10 is referred to as a "workbench 10 a", and the turntable mechanism 20, the light blocking assembly 30, and the laser 40 are all mounted on the workbench 10 a.
Wherein, the laser 40 is used for emitting laser beams, and the type of the laser 40 can be a solid-state laser or a semiconductor laser.
In some embodiments, the laser 40 may be a solid state laser 40 capable of emitting green laser light having a wavelength of 532nm, and the type of the laser 40 is not limited herein as long as it can accommodate the marking needs of the corresponding workpiece.
Referring to fig. 2, fig. 2 schematically illustrates a structure of a turntable mechanism 20 of a laser marking apparatus according to an embodiment. The turntable mechanism 20 includes a rotating disk 21, a partition 22, and a driving member. The rotating disc 21 is provided with at least 2 material loading positions for loading workpieces. The material loading position can be a limit area formed by enclosing a plurality of separating ribs 21a, so that the material loading jig 25 for loading workpieces can be stably placed in the limit area enclosed by the separating ribs 21a, and is not easy to shift when the rotating disc 21 rotates. In other embodiments, the loading position may be formed by other structures integrally formed on the rotating disc 21, which is not limited herein, and the loading position of the rotating disc 21 can only carry the corresponding workpiece or the loading fixture 25 for placing the workpiece.
It should be noted that each material loading position is arranged around the rotation center of the rotating disc 21, so that along with the rotation of the rotating disc 21, each material loading position sequentially moves to a corresponding marking position, and the marking position refers to a position where the workpiece to be marked is currently located when the workpiece is marked by the laser marking device, that is, only when the workpiece is located at the marking position, the laser marking device can perform laser marking on the workpiece located at the marking position.
The partitions 22 are connected to the rotating disc 21 and separate the material loading positions, and it is understood that the number of the partitions 22 can be adjusted according to the material loading positions on the rotating disc 21, for example, in some embodiments, when there are 2 material loading positions on the rotating disc 21, only 1 partition 22 needs to be arranged on the rotating disc 21, so that 2 material loading positions can be separated. For another example, in some embodiments, when 3 material loading positions are provided on the rotating disc 21, the adjacent material loading positions need to be separated by the partition plate 22, and at this time, the material loading positions can be separated by 3 partition plates 22.
In this embodiment, the driving member may be a servo motor or an electric cylinder. As long as the driving piece can provide a power source, the rotating disc 21 is driven to rotate, so that the driving piece is used for driving the rotating disc 21 to rotate, workpieces borne by the loading positions on the rotating disc 21 can be moved to the marking position, the workpiece transfer efficiency is improved, the waiting time is shortened, and the automation efficiency of the laser marking equipment is improved effectively.
In the embodiment where the driving member is a servo motor, the servo motor may be disposed on the rib divider 24, and the rib divider 24 is a high-speed precise rotating mechanism capable of precisely positioning the rotating angle of the rotating disc 21, so as to move the corresponding workpiece to the marking position.
In the above embodiment, the light blocking assembly 30 can block external light when the laser marking device marks corresponding workpieces, so that the workpieces are in independent processing environments, and therefore when the laser marking device identifies and positions the workpieces, the interference cannot be caused, the workpieces are precisely subjected to laser marking, and the processing precision is improved.
Specifically, the light blocking assembly 30 can enclose with the partition 22 to form a shielding cavity, so that the shielding cavity prevents external light from interfering with the laser-marked workpiece, the position of the laser marking device for marking the workpiece cannot shift due to light interference, and the laser marking precision of the laser marking device for the workpiece is effectively ensured.
It should be noted that, in conjunction with fig. 4, a window 311 is reserved on the light blocking assembly 30 to accommodate the laser beam passing through the window 311, specifically, when the rotary disk 21 rotates to make the workpiece at one of the loading positions located in the shielding chamber, the laser beam emitted by the laser 40 can pass through the window 311 and enter the workpiece located in the shielding chamber.
Referring to fig. 4 and 5, the light blocking assembly 30 is in a half-enclosed frame shape, specifically, the light blocking assembly 30 includes a horizontal plate 31 and 2 supporting plates 32, the 2 supporting plates 32 are respectively vertically connected to two opposite sides of the horizontal plate 31, and the window 311 is opened in the horizontal plate 31. The two support plates 32 span the transverse plate 31 on the workbench 10a, and the transverse plate 31 spans over the rotating disk 21, so that when the rotating disk 21 rotates, the partition 22 on the rotating disk 21 can rotate to between the two support plates 32, and forms a shielding cavity with the transverse plate 31 and the two support plates 32.
In some embodiments, 2 material loading positions are arranged on the rotating disc 21, the partition plate 22 is perpendicular to the rotating disc 21, and the 2 material loading positions are arranged in a mirror image mode by taking the partition plate 22 as a mirror image, so that when the rotating disc 21 rotates 180 degrees, the 2 material loading positions are interchanged, that is, under the structural arrangement, a workpiece at one material loading position is located at a marking position, and the other material loading position is located on one side, back to the marking position, of the partition plate 22, so that synchronous feeding and discharging can be performed, the material waiting time can be effectively reduced, and the processing efficiency can be improved.
As shown in fig. 7, a CCD camera 43 is connected to the laser 40, and specifically, the CCD camera 43 may be mounted on the housing 41 of the laser 40. The CCD camera 43 is used for identifying and positioning the workpiece in the shielding cavity, the laser 40 is connected with the CCD camera 43 through a controller signal, and the controller can control the laser 40 to carry out laser marking on the workpiece according to the position identified by the CCD camera 43. The laser head 42 including a galvanometer system may be a part of the laser 40 that emits a laser beam, so as to deflect the laser beam by using the galvanometer to realize marking scanning.
Referring to fig. 4, one or more light bars are installed on the horizontal plate 31, and the light bars are located on the periphery of or above the window 311, so as to irradiate the workpiece through the light-transmitting window 311 emitted by the light bars, thereby adapting to the polishing requirement of the workpiece, so that the CCD camera 43 can better identify and position the workpiece.
For convenience of understanding, a light bar located on the side edge of the window 311 is called a first light bar 33, a light bar erected above the window 311 is called a second light bar 35, when a workpiece needs to be identified and positioned, the first light bar 33 or the second light bar 35 can be independently started, so that the workpiece is illuminated, the CCD camera 43 can clearly image, the workpiece can be identified and positioned, the alignment of the laser 40 and the marking position is facilitated, and the marking precision is improved.
With continued reference to fig. 4, the first light bar 33 can be mounted on the horizontal plate 31 by the first bracket 33a, and correspondingly, the second light bar 35 can be mounted on the horizontal plate 31 by the second bracket 34.
In some embodiments, the first bracket 33a and the second bracket 34 can adjust the mounting height of the respective light bars.
Taking the second bracket 34 as an example, the second bracket 34 includes the supporting rod 341 and the mounting piece 342, and the mounting piece 342 is provided with a strip-shaped hole 34a, so that locking members such as screws or bolts can be utilized to pass through different positions of the strip-shaped hole 34a, the mounting piece 342 is mounted at different heights of the supporting rod 341, and after the second light bar 35 is mounted on the mounting piece 342, the second light bar 35 can polish a workpiece at a proper height. For the angle adjustment of polishing of better adaptation second lamp strip 35, seted up arc wall 34b on the installation piece 342, utilize the retaining member that passes this arc wall 34b to link together second lamp strip 35 and installation piece 342, arc wall 34b can adapt to retaining member mounted position adjustment for second lamp strip 35 realizes polishing angle adjustment towards equidirectional not.
In some embodiments, the laser marking device includes a shutter assembly for selectively blocking the lens 43a of the CCD camera 43. When the laser beam emitted by the laser 40 is used for laser marking of the workpiece, the CCD camera 43 is no longer required to identify the workpiece, so that the lens 43a of the CCD camera 43 is shielded by the shading component, the laser beam can be prevented from being reflected into the CCD camera 43, and the photosensitive module of the CCD camera 43 is prevented from being burnt and injured.
The shading assembly comprises a shading plate 37 and a telescopic driving piece 36, the shading plate 37 can move to a first position and a second position relative to the CCD camera 43 under the driving of the telescopic driving piece 36, when the shading plate 37 moves to the first position, the shading plate 37 shades the lens 43a of the CCD camera 43, and when the shading plate 37 moves to the second position, the shading plate 37 releases the shading to the lens 43a of the CCD camera 43.
The telescopic driving member 36 may be mounted on the laser 40 or the light blocking unit 30, and the position of the light blocking plate 37 may be adjusted to have a blocking state and a blocking release state for the lens 43a of the CCD camera 43 when the telescopic driving member 36 is moved telescopically. Taking the telescopic driving member 36 mounted on the light blocking assembly 30 as an example, in the embodiment that the light blocking assembly 30 includes the horizontal plate 31, the telescopic driving member 36 may be mounted and fixed on the horizontal plate 31 through a supporting frame.
In the above embodiment, the retractable driving member 36 may be an air cylinder, the light shielding plate 37 is connected to the retractable rod of the air cylinder, the position of the light shielding plate 37 is adjusted by using the retractable movement of the retractable rod of the air cylinder, when the laser beam strikes the workpiece, the light shielding plate 37 shields the lens 43a of the CCD camera 43, and the laser is prevented from entering the CCD camera 43 and affecting the service life of the CCD camera 43.
Referring to fig. 2 and 3, the workpiece is placed at the loading position by the loading jig 25. The loading jig 25 may be a profiling jig, which is set according to the type of the workpiece, so that the workpiece can be stably fixed on the loading jig 25.
It is understood that the loading jig 25 is provided with a loading platform 253 for placing the workpiece. The loading platform 253 can be formed by a plurality of positioning blocks with adjustable installation positions, so that the loading platform can be adjusted to adapt to the shape of a workpiece, and can stably bear the workpiece.
In some embodiments, the loading platform 253 is disposed on the bottom plate 251 of the loading fixture 25, and the bottom plate 251 is used as a mounting carrier of the loading platform 253, and also facilitates the overall pick-and-place operation of the loading fixture 25.
As shown in fig. 3, the carrying jigs 25 are provided with handles 252 on opposite sides thereof, the lifting may be fixedly connected to both sides of the bottom plate 251, and when the carrying jigs 25 are moved out of the shielding cavity along with the rotation of the rotating disc 21, the carrying jigs 25 can be taken down from the rotating disc 21 by grasping the handles 252.
A through groove (not shown) is formed on the rotating disc 21 at a position corresponding to the material loading position. Combine fig. 6 to show, laser marking equipment includes jacking locating component 60, and jacking locating component 60 includes jacking driving piece 61 and roof 62, and when the work piece that one of them year material position was located and shields the chamber, roof 62 can pass logical groove under the driving of jacking driving piece 61 to bearing year material tool 25 jacking removes, makes year material tool 25 and rotary disk 21 separation.
With the structure, when workpieces in the material loading jig 25 need to be machined, the top plate 62 can lift the material loading jig 25 and is separated from the rotating disc 21, so that the top plate 62 serves as a constant bearing position for laser marking machining, and then all the workpieces can be machined in a consistent mode in the automatic machining process. Even if the rotating disc 21 is dislocated with the material loading jig 25 during the rotating motion, the jacking positioning assembly 60 separates the material loading jig 25 from the rotating disc 21, and then the material loading jig 25 is located at the same position, so that the workpiece processing consistency is ensured, and the marking effect is stable.
The jacking driving element 61 can be an air cylinder, the jacking driving element 61 is mounted on the workbench 10a through the mounting plate 63 and is located below the rotating disc 21, so that when the jacking driving element 61 jacks the top plate 62, the top plate 62 moves up and down relative to the rotating disc 21, and in the process of jacking the top plate 62, the bearing loading jig 25 leaves the rotating disc 21.
In some embodiments, as shown in conjunction with fig. 1 and 8, the laser marking device further includes a focusing mechanism 50, the focusing mechanism 50 being configured to adjust the height of the laser 40 such that the laser 40 is positioned at different heights from the turntable to laser mark the workpiece.
The focusing mechanism 50 includes a mount 51, a lift table 52, a lift lever 53, and a hand wheel 54. The mounting base 51 is mounted on the working table 10a, the lifting platform 52 is mounted on the mounting base 51 in a lifting manner, and the lifting rod 53 is in linkage connection with the hand wheel 54 and is used for driving the lifting platform 52 to move up and down relative to the mounting base 51.
The laser 40 is mounted on the lifting table 52 to move up and down along with the lifting table 52, so as to adjust the distance between the laser 40 and the rotating disc, and realize focusing.
The linkage connection between the handwheel 54 and the lifting rod 53 may be a toothed transmission, for example, a rotating rod (not shown) having a gear (not shown) is connected to the handwheel 54, the rotating rod is rotatably connected to the mounting seat 51, and the rotating rod is rotated by operating the handwheel 54. The lifting rod 53 is provided with a meshing part meshed with the gear of the rotating rod, so that when the hand wheel 54 is rotated, the rotating rod is meshed with the lifting rod 53 to drive the lifting platform 52 to move up and down relative to the mounting seat 51, the height of the laser 40 is adjusted, and focusing is realized.
One or more guide plates 55 are provided on the elevating table 52 in parallel with each other, and as shown in fig. 8, 2 guide plates 55 are provided on the elevating table 52. The guide plate 55 is fitted to the mounting base 51 in a telescopic motion manner, and the extending direction of the guide plate 55 is parallel to the extending direction of the lifting rod 53, so that when the lifting table 52 moves up and down along with the lifting rod 53, no interference occurs, the guide plate 55 can also play a good guiding effect, and the stability of the lifting table 52 in the lifting motion is improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A laser marking apparatus, comprising:
a laser for emitting a laser beam;
the rotary table mechanism comprises a rotary table, a partition plate and a driving piece, wherein at least 2 material loading positions are arranged on the rotary table and used for loading workpieces, the partition plate is connected with the rotary table and used for separating the material loading positions, and the driving piece is used for driving the rotary table to rotate;
the light blocking assembly can be enclosed with the partition plate to form a shielding cavity, a window is reserved on the light blocking assembly, and when the rotating disc rotates to enable a workpiece with one of the material loading positions to be located in the shielding cavity, laser beams emitted by the laser can penetrate through the window to enter the workpiece located in the shielding cavity.
2. The laser marking device as claimed in claim 1, wherein 2 loading positions are arranged on the rotating disk, the partition plate is arranged perpendicular to the rotating disk, and the 2 loading positions are arranged in a mirror image manner by taking the partition plate as a mirror image surface.
3. The laser marking apparatus as claimed in claim 1, wherein the light blocking assembly includes a cross plate and 2 support plates, the 2 support plates are respectively vertically connected to opposite sides of the cross plate, and the window is opened in the cross plate.
4. The laser marking apparatus of claim 3, wherein one or more light bars are mounted on the cross plate, the light bars being located on or above the periphery of the window.
5. The laser marking device according to claim 1, wherein a CCD camera is connected to the laser, the CCD camera is used for identifying and positioning the workpiece located in the shielding cavity, the laser is connected to the CCD camera through a controller signal, and the controller is capable of controlling the laser to laser mark the workpiece according to the position identified by the CCD camera.
6. The laser marking device according to claim 1, comprising a light shield assembly for selectively shielding a lens of the CCD camera.
7. The laser marking apparatus according to claim 6, wherein the light shielding assembly includes a light shielding plate and a telescopic driving member, the light shielding plate is capable of moving to a first position and a second position relative to the CCD camera under the driving of the telescopic driving member, when the light shielding plate moves to the first position, the light shielding plate shields the lens of the CCD camera, and when the light shielding plate moves to the second position, the light shielding plate releases the shielding of the lens of the CCD camera.
8. Laser marking apparatus according to claim 7, wherein the telescopic drive is mounted on the laser or the telescopic drive is mounted on the light barrier assembly.
9. The laser marking device as claimed in any one of claims 1 to 8, wherein the workpiece is placed at the material loading position through a material loading jig, a through groove is formed in a position, corresponding to the material loading position, on the rotating disk, the laser marking device comprises a jacking positioning assembly, the jacking positioning assembly comprises a top plate and a jacking driving piece, when one of the workpieces at the material loading position is located in the shielding cavity, the top plate can penetrate through the through groove under the driving of the jacking driving piece and supports the material loading jig to lift and move, and therefore the material loading jig is separated from the rotating disk.
10. The laser marking device as claimed in claim 9, wherein handles are provided on opposite sides of the loading jig, and when the loading jig is moved out of the shielding cavity with rotation of the rotating disc, the loading jig can be removed from the rotating disc by grasping the handles.
CN202010396135.XA 2020-05-12 2020-05-12 Laser marking device Pending CN111571022A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112692437A (en) * 2020-12-17 2021-04-23 Tcl王牌电器(惠州)有限公司 Laser marking equipment
CN117226319A (en) * 2023-11-16 2023-12-15 镭神泰克科技(苏州)有限公司 Material carrying device, precise marking equipment and marking method

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CN117226319B (en) * 2023-11-16 2024-01-23 镭神泰克科技(苏州)有限公司 Material carrying device, precise marking equipment and marking method

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