CN111571007B - Method and device for optimizing laser processing quality - Google Patents
Method and device for optimizing laser processing quality Download PDFInfo
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- CN111571007B CN111571007B CN202010444493.3A CN202010444493A CN111571007B CN 111571007 B CN111571007 B CN 111571007B CN 202010444493 A CN202010444493 A CN 202010444493A CN 111571007 B CN111571007 B CN 111571007B
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- axis moving
- supporting device
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- moving assembly
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- 238000012545 processing Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000008093 supporting effect Effects 0.000 claims abstract description 67
- 230000007246 mechanism Effects 0.000 claims abstract description 37
- 239000007789 gas Substances 0.000 claims description 14
- 238000007664 blowing Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 9
- 239000000112 cooling gas Substances 0.000 claims description 4
- 239000002893 slag Substances 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 230000001133 acceleration Effects 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 2
- 241001391944 Commicarpus scandens Species 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
Abstract
The invention discloses a method and a device for optimizing laser processing quality. During laser processing, the processed sheet is supported by the supporting device, the XY-axis moving mechanism is controlled to move in real time according to the movement of the laser spot of the laser equipment, the XY-axis moving mechanism is controlled to move at the same speed as the acceleration of the main shaft XY-axis mechanism of the laser equipment, the supporting device is moved, the center of the laser spot of the laser equipment is always kept aligned with the center of a supporting area of the supporting device, the supporting effect is ensured, the deformation and the heat influence of a workpiece caused by high temperature and high pressure during processing are effectively reduced, the heat dissipation and slag discharge of the processing area are facilitated, laser is prevented from irradiating on an elastic thimble of the supporting device, the phenomenon that the processing surface is uneven due to the fact that the elastic thimble is attached to the surface of the elastic thimble is prevented, the problems that the workpiece is easy to break in the processing process and the like are effectively solved, and the processing quality is good.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a method and a device for optimizing laser processing quality.
Background
With the development of integrated circuits and semiconductor industries, various substrates are widely manufactured, but the substrates in the integrated circuits have the characteristics of being hard, brittle, thin and the like, the traditional processing mode is not favorable for processing, and the yield is low.
Laser processing is mainly adopted at present, but short pulse laser processing efficiency is low and cost is high, and the method is not beneficial to industrialized batch production, so long pulse high-energy laser is mainly adopted for processing at present. In the long-pulse high-energy laser processing process, because the laser energy is high, the generated slag is more, the auxiliary blowing is needed on the processing surface or the back surface to cool and remove the slag, but the thin plate is easy to deform at high temperature and high pressure, even the heated tissue of the thin plate is changed, and the damage to the appearance and the microstructure is caused. In the prior art, an ejector pin is generally arranged on the bottom surface of a thin plate, the method cannot flexibly deal with the problem of real-time change of a processing area, the processing position is easily coincided with the ejector pin, the ejector pin is damaged by laser or slag is attached to the ejector pin, so that the subsequent processing surface is not flat, even a thin plate workpiece is directly broken, and the processing quality is influenced. Meanwhile, the arrangement of the ejector pins is not beneficial to heat dissipation and slag discharge of the processing area, and the heat dissipation and slag discharge of the processing area have great influence on the processing efficiency and quality.
Disclosure of Invention
In view of the above-mentioned shortcomings, the present invention provides a method and apparatus for optimizing laser processing quality.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
a method for optimizing laser processing quality is characterized in that during laser processing, a processed workpiece is supported by a supporting device, the supporting device is moved in real time according to the movement of a laser spot of laser equipment, and the center of the laser spot of the laser equipment is always aligned with the center of a supporting area of the supporting device; the area of the supporting device is 6-8 times of the area of the laser spot, and the outline of the supporting area is preferably in Gaussian distribution.
A device for optimizing laser processing quality comprises an XY-axis moving mechanism and a supporting device, wherein the supporting device is arranged on the XY-axis moving mechanism and is driven by the XY-axis moving mechanism to move in the X-axis direction and the Y-axis direction; the supporting device comprises a mounting seat and elastic thimbles, the elastic thimbles are distributed on the mounting seat in an annular arrangement mode, the area of a supporting area formed by the elastic thimbles in a surrounding mode is 6-8 times of the area of a laser spot, and the outline of the supporting area formed in the surrounding mode is preferably in Gaussian distribution.
As a preferable aspect of the present invention, the mounting seat is cylindrical, the center position of the mounting seat is an auxiliary gas blowing port, and the plurality of elastic thimbles are symmetrically distributed on the upper top surface of the mounting seat around the auxiliary gas blowing port as a center of a circle.
As a preferred scheme of the present invention, the elastic thimble includes a thimble and a spring, the mounting seat is provided with a mounting cavity, the spring is disposed in the mounting cavity, and a lower end of the thimble extends into the mounting cavity to be pressed against the elastic force. The supporting device elastically supports the bottom surface of the workpiece and can well support and fix the workpiece.
As a preferable scheme of the invention, the ball head is arranged at the upper end of the thimble, so that the thimble is more beneficial to sliding and avoids scratching workpieces.
As a preferable aspect of the present invention, the XY-axis moving mechanism includes an X-axis moving assembly and a Y-axis moving assembly, the Y-axis moving assembly is disposed on the X-axis moving assembly and driven by the X-axis moving assembly to reciprocate in an X-axis direction, and the support device is disposed on the Y-axis moving assembly and driven by the Y-axis moving assembly to reciprocate in a Y-axis direction. Or the XY-axis moving mechanism comprises an X-axis moving assembly and a Y-axis moving assembly, the X-axis moving assembly is arranged on the Y-axis moving assembly and driven by the Y-axis moving assembly to reciprocate in the Y-axis direction, and the supporting device is arranged on the X-axis moving assembly and driven by the X-axis moving assembly to reciprocate in the X-axis direction.
During machining, the XY-axis moving mechanism can carry the supporting device to follow up according to the main shaft XY-axis mechanism of the laser equipment in real time so as to ensure that the laser spot of the equipment is always positioned in the center of the supporting area of the supporting device. The XY-axis moving mechanism can drive the supporting device to reach any position in the plane of the laser equipment workbench so as to ensure that the supporting device is positioned in the processing breadth. The relative position of the center of the supporting area of the supporting device relative to the processing head is not changed by controlling the XY-axis moving mechanism to move at the same speed and the same acceleration of the main shaft XY-axis mechanism of the laser device. And during processing, the XY-axis moving mechanism automatically starts the motion of the XY-axis mechanism of the follow-up main shaft, and after the processing is finished, the XY-axis moving mechanism is automatically closed and stopped, and the stroke of the XY-axis moving mechanism meets the two-dimensional area of the processed breadth.
As a preferable aspect of the present invention, an auxiliary gas is blown to the surface of the processing area of the workpiece to rapidly remove the processing residue. A cooling gas is blown to the bottom surface of the machining region of the workpiece to rapidly cool the machining region. The laser beam machining device has the advantages that cooling gas and auxiliary gas are introduced, deformation and heat influence caused by high temperature and high pressure are reduced by cooling the machining area in a gas cooling mode, and meanwhile, slag generated by machining is removed when the laser beam passes through the machining area, so that the machining cross section is smooth and tidy, and machining quality is improved.
The invention has the beneficial effects that: the method of the invention supports the bottom surface of the processed workpiece by moving the supporting device according to the movement of the laser spot of the laser equipment in real time, and always keeps the center of the laser spot of the laser equipment aligned with the center of the supporting area of the supporting device, thereby ensuring the supporting effect, effectively reducing the deformation and heat influence of the workpiece caused by high temperature and high pressure during processing, being beneficial to the heat dissipation and slag discharge of the processing area, effectively avoiding the problems of easy breakage and the like during the processing of the workpiece due to the damage of the elastic thimble or the adhesion of slag on the surface of the elastic thimble caused by the direct irradiation of the laser on the elastic thimble of the supporting device, and improving the processing quality and efficiency. In addition, auxiliary gas and cooling gas can be blown to the processing area of the workpiece, so that the processing quality of the workpiece is further optimized, the smoothness and the orderliness of the processing section are facilitated, and the processing quality is good. The device has the advantages of ingenious and reasonable structural design and easy operation, can provide effective support for the processed workpiece in real time, further reduces the deformation and the heat influence of the workpiece, effectively improves the processing quality and the processing speed of the workpiece, and is beneficial to wide popularization and application.
The invention is further described with reference to the following figures and examples.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic perspective view of the supporting device of the present invention.
Fig. 3 is a schematic top view of the supporting device of the present invention.
FIG. 4 is a schematic view of the present invention during processing.
Detailed Description
Example (b): referring to fig. 1 to 4, the apparatus for optimizing the quality of laser processing provided by this embodiment includes an XY axis moving mechanism 1 and a supporting device 2, where the supporting device 2 is disposed on the XY axis moving mechanism 1 and is driven by the XY axis moving mechanism 1 to move in the X axis and Y axis directions.
In this embodiment, the XY-axis moving mechanism 1 includes an X-axis moving component and a Y-axis moving component, the X-axis moving component is disposed on the Y-axis moving component and driven by the Y-axis moving component to reciprocate in the Y-axis direction, and the support device 2 is disposed on the X-axis moving component and driven by the X-axis moving component to reciprocate in the X-axis direction. In other embodiments, the X-axis moving assembly may be disposed below the Y-axis moving assembly, that is, the Y-axis moving assembly is disposed on the X-axis moving assembly and driven by the X-axis moving assembly to reciprocate in the X-axis direction, and the supporting device 2 is disposed on the Y-axis moving assembly and driven by the Y-axis moving assembly to reciprocate in the Y-axis direction. The XY-axis moving mechanism 1 can carry the supporting device 2 to follow up according to a main shaft XY-axis mechanism of the laser equipment in real time so as to ensure that the laser spot of the equipment is always positioned at the center of a supporting area of the supporting device 2. The XY-axis moving mechanism 1 can drive the supporting device 2 to reach any position in the plane of the workbench of the laser equipment so as to ensure that the supporting device 2 is positioned in the processing width. The relative position of the center of the supporting area of the supporting device 2 relative to the processing head is not changed by controlling the XY-axis moving mechanism 1 to move with the same acceleration and speed as the main shaft XY-axis mechanism of the laser device. And during processing, the XY-axis moving mechanism 1 automatically starts the motion of the XY-axis mechanism of the follow-up main shaft, and after the processing is finished, the XY-axis moving mechanism 1 automatically closes and stops, and the stroke of the XY-axis moving mechanism meets the two-dimensional area of the processed breadth.
Referring to fig. 2 and 3, the supporting device 2 includes a mounting seat 21 and a plurality of elastic ejector pins distributed on the mounting seat 21 in an annular arrangement, and preferably, the supporting device 2 preferably elastically supports the bottom surface of the workpiece, so as to better support and fix the workpiece. Specifically, the elasticity thimble includes thimble 22 and spring 23, be equipped with the installation cavity on the mount pad 21, in the installation cavity in the spring 23, the lower extreme of thimble 22 stretches into the installation cavity and pushes up on elasticity. The supporting elastic force of the thimble 22 can be adjusted by the spring 23. The ball head is arranged at the upper end of the thimble 22, so that the sliding is facilitated, and the workpiece is prevented from being scratched. In this embodiment, the mounting seat 21 is preferably cylindrical, the center position of the mounting seat is an auxiliary gas blowing port, and the plurality of elastic thimbles are symmetrically distributed on the upper top surface of the mounting seat 21 around the auxiliary gas blowing port as a center. Taking the laser spot processing hole as a circle as an example, the area of a supporting area formed by the enclosing of the plurality of elastic thimbles is preferably 6-8 times of the area of the laser spot, and the outline of the supporting area formed by the enclosing is in Gaussian distribution, so that the heat affected area and the stress concentrated area of the workpiece can be better supported during processing, and the deformation and the heat affected area of the workpiece caused by high temperature and high pressure during processing are effectively reduced.
In laser processing, referring to fig. 4, taking a processed thin plate workpiece 3 as an example, the bottom surface of the processed thin plate workpiece 3 is supported by the supporting device 2, and the XY-axis moving mechanism 1 is controlled to move in real time according to the movement of the laser spot 4 of the laser device, which is equal to the acceleration and the speed of the main shaft XY-axis mechanism of the laser device, so as to move the supporting device 2, the center of the laser spot of the laser device is always kept aligned with the center of the supporting area of the supporting device 2, and the elastic thimble at the edge position of the supporting area of the supporting device 2 can better support the heat affected area and the stress concentrated area of the thin plate workpiece 3 during processing, thereby effectively reducing the deformation and the heat affected area of the thin plate workpiece 3 caused by high temperature and high pressure during processing. The auxiliary gas is blown to the blowing port of the mounting seat 21, which is favorable for heat dissipation of the processing area of the thin plate workpiece 3. The air faucet for blowing the auxiliary gas is arranged at one side of the main shaft of the laser device, the auxiliary gas is blown through the air faucet towards the laser processing position, the molten slag generated by processing can be efficiently taken away when laser penetrates through the air faucet, and the processing efficiency and the processing quality are greatly improved.
Variations and modifications to the above-described embodiments may occur to those skilled in the art, which fall within the scope and spirit of the above description. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and variations of the present invention should fall within the scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation. Other methods and devices, which may be made using the same or similar steps as those described in the above embodiments of the invention, are within the scope of the invention.
Claims (7)
1. A method for optimizing laser processing quality is characterized in that during laser processing, a processed workpiece is supported by a supporting device, the supporting device is moved in real time according to the movement of a laser spot of laser equipment, and the center of the laser spot of the laser equipment is always aligned with the center of a supporting area of the supporting device; the area of the supporting device is 6-8 times of the area of the laser spot;
the supporting device elastically supports the bottom surface of the workpiece;
the supporting device comprises a mounting seat and a plurality of elastic thimbles which are annularly arranged and distributed on the mounting seat;
the elasticity thimble includes thimble and spring, be equipped with the installation cavity on the mount pad, in the installation cavity, the lower extreme of thimble stretches into the installation cavity and pushes up on elasticity.
2. The method of optimizing the quality of laser processing according to claim 1, wherein an auxiliary gas is blown to the surface of the processing area of the workpiece to rapidly remove the processing residue.
3. The method of optimizing the quality of laser processing according to claim 1, wherein a cooling gas is blown to the bottom surface of the processing region of the workpiece to rapidly cool the processing region.
4. A device for optimizing the quality of laser processing is characterized by comprising an XY-axis moving mechanism and a supporting device, wherein the supporting device is arranged on the XY-axis moving mechanism and is driven by the XY-axis moving mechanism to move in the X-axis direction and the Y-axis direction; the supporting device comprises a mounting seat and elastic thimbles, the elastic thimbles are distributed on the mounting seat in an annular arrangement mode, and the area of a supporting area formed by the encircling of the elastic thimbles is 6-8 times of the area of a laser spot;
the mounting seat is cylindrical, the center position of the mounting seat is an auxiliary gas blowing port, and a plurality of elastic thimbles are symmetrically distributed on the upper top surface of the mounting seat in a circle center manner by taking the auxiliary gas blowing port as a circle center;
the elasticity thimble includes thimble and spring, be equipped with the installation cavity on the mount pad, in the installation cavity, the lower extreme of thimble stretches into the installation cavity and pushes up on elasticity.
5. The apparatus of claim 4, wherein: the upper end of the thimble is provided with a ball head.
6. The apparatus of claim 4, wherein: the XY-axis moving mechanism comprises an X-axis moving assembly and a Y-axis moving assembly, the Y-axis moving assembly is arranged on the X-axis moving assembly and driven by the X-axis moving assembly to reciprocate in the X-axis direction, and the supporting device is arranged on the Y-axis moving assembly and driven by the Y-axis moving assembly to reciprocate in the Y-axis direction.
7. The apparatus of claim 4, wherein: the X-axis moving mechanism comprises an X-axis moving assembly and a Y-axis moving assembly, the X-axis moving assembly is arranged on the Y-axis moving assembly and driven by the Y-axis moving assembly to reciprocate in the Y-axis direction, and the supporting device is arranged on the X-axis moving assembly and driven by the X-axis moving assembly to reciprocate in the X-axis direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010444493.3A CN111571007B (en) | 2020-05-23 | 2020-05-23 | Method and device for optimizing laser processing quality |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010444493.3A CN111571007B (en) | 2020-05-23 | 2020-05-23 | Method and device for optimizing laser processing quality |
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| Publication Number | Publication Date |
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| CN111571007A CN111571007A (en) | 2020-08-25 |
| CN111571007B true CN111571007B (en) | 2022-02-11 |
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| CN202010444493.3A Active CN111571007B (en) | 2020-05-23 | 2020-05-23 | Method and device for optimizing laser processing quality |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4563491B1 (en) * | 2009-07-07 | 2010-10-13 | 株式会社片岡製作所 | Laser processing machine |
| DE102010027927B9 (en) * | 2010-04-19 | 2012-05-03 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laser processing machine and method for converting the same |
| DE102012003202A1 (en) * | 2012-02-17 | 2013-08-22 | Vollmer Werke Maschinenfabrik Gmbh | Device useful for processing workpieces, preferably blades by wet laser, comprises a base, machining unit movably mounted on base, which carries wet laser unit, and workpiece support, where wet laser unit comprises e.g. laser beam source |
| CN102941674B (en) * | 2012-11-16 | 2015-04-22 | 江苏大学 | Laser transmission welding follow-up clamping device |
| CN209998559U (en) * | 2019-04-28 | 2020-01-31 | 东泰高科装备科技有限公司 | laser processing head and laser processing device |
| CN110000480B (en) * | 2019-05-09 | 2023-11-17 | 江苏大金激光科技有限公司 | High-precision graphite laser cutting machine and method for processing high-precision graphite pipe by using same |
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Effective date of registration: 20211027 Address after: Building A1, innovation city, Songshanhu University, Dongguan, Guangdong 523000 Applicant after: Material Laboratory of Songshan Lake Applicant after: XI'AN INSTITUTE OF OPTICS AND PRECISION MECHANICS, CHINESE ACADEMY OF SCIENCES Address before: Building A1, innovation city, Songshanhu University, Dongguan, Guangdong 523000 Applicant before: Material Laboratory of Songshan Lake |
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