CN111565509A - Ceramic-based rigid multilayer circuit board - Google Patents
Ceramic-based rigid multilayer circuit board Download PDFInfo
- Publication number
- CN111565509A CN111565509A CN202010509037.2A CN202010509037A CN111565509A CN 111565509 A CN111565509 A CN 111565509A CN 202010509037 A CN202010509037 A CN 202010509037A CN 111565509 A CN111565509 A CN 111565509A
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- CN
- China
- Prior art keywords
- circuit board
- ceramic
- conductive
- sleeve
- multilayer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention discloses a ceramic-based rigid multilayer circuit board which comprises a ceramic circuit board, a dielectric layer and a multilayer rigid circuit board which are sequentially arranged from bottom to top, wherein conductive through holes are formed in the ceramic circuit board, the dielectric layer and the multilayer rigid circuit board, conductive expansion sleeves are arranged in the conductive through holes and comprise sleeve bodies, conductive soft adhesive layers are arranged on the outer sleeve walls of the sleeve bodies, the tail parts of the conductive expansion sleeves exceed the lower end face of the ceramic circuit board, the head parts of the conductive expansion sleeves are flush with the upper end face of the multilayer rigid circuit board, and backing plates flush with the tail parts of the conductive expansion sleeves are further arranged on the lower end face of the ceramic circuit board. The multilayer rigid circuit board and the ceramic circuit board are connected through the conductive expansion sleeve, so that the multilayer rigid circuit board and the ceramic circuit board are quickly connected and conducted, and the production efficiency of the circuit board is improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a ceramic-based rigid multilayer circuit board.
Background
The conventional circuit board is an alumina ceramic circuit board which has the advantages of high heat dissipation, corrosion resistance, high insulating property, excellent high-frequency property, low expansion coefficient, stable chemical property, high thermal conductivity, no toxicity and the like; but the structure is brittle, the machining difficulty is high, and simultaneously, because the surface is smooth, the interlayer conduction is not easy to realize through electroplating, and the interlayer conduction and other layers are difficult to effectively combine to form a multilayer circuit board.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention discloses a ceramic-based rigid multilayer circuit board.
In order to achieve the purpose, the invention is realized by the following technical scheme:
the embodiment of the invention discloses a ceramic-based rigid multilayer circuit board, which comprises a ceramic circuit board, a dielectric layer and a multilayer rigid circuit board which are sequentially arranged from bottom to top, wherein conductive through holes are formed in the ceramic circuit board, the dielectric layer and the multilayer rigid circuit board, conductive expansion sleeves are arranged in the conductive through holes and comprise sleeve bodies, conductive soft adhesive layers are arranged on the outer sleeve walls of the sleeve bodies, the tail parts of the conductive expansion sleeves exceed the lower end surface of the ceramic circuit board, the head parts of the conductive expansion sleeves are flush with the upper end surface of the multilayer rigid circuit board, and backing plates flush with the tail parts of the conductive expansion sleeves are further arranged on the lower end surface of the ceramic circuit board.
As one preferable scheme of the invention, the multilayer rigid circuit board comprises two layers of epoxy resin circuit boards, and a dielectric layer is also arranged between the two layers of epoxy resin circuit boards.
In a preferred embodiment of the present invention, the dielectric layer is a PP layer.
As one preferable scheme of the present invention, the sleeve body of the conductive expansion sleeve is a copper expansion sleeve.
As one preferable scheme of the invention, the inner core is a steel needle.
In a preferred embodiment of the present invention, the conductive expansion sleeve is mounted in the following manner:
1) providing the conductive expansion sleeve, wherein an inner core is arranged in a sleeve body of the conductive expansion sleeve, the tail part of the inner core is positioned outside the sleeve body, and the diameter of the tail part of the inner core is larger than the inner diameter of the sleeve body;
2) connecting the connecting stud with the head of the inner core of the conductive expansion sleeve, then penetrating the conductive expansion sleeve through the conductive through hole, and enabling the tail of the conductive expansion sleeve to be located on the side of the ceramic circuit board;
3) and pulling the gun to pull the inner core, wherein the inner core rises along with the pulling force and props up the inner cavity of the sleeve body so that the sleeve body deforms outwards to be tightly connected with the conductive through hole, and finally the inner core is separated from the sleeve body.
As one preferable aspect of the present invention, the pad is attached to the lower end surface of the ceramic circuit board by glue or tape.
Compared with the prior art, the invention has at least the following advantages:
1) the ceramic-based rigid multilayer circuit board provided by the invention comprises two layers of rigid circuit boards and a ceramic circuit board, so that the problems of brittleness and high machining difficulty of a single ceramic circuit board are solved.
2) The ceramic-based rigid multilayer circuit board provided by the invention has high heat dissipation, corrosion resistance and heat conductivity.
3) The ceramic-based rigid multilayer circuit board provided by the invention is assembled between the multilayer rigid circuit board and the ceramic circuit board through the conductive expansion sleeve, so that the multilayer rigid circuit board and the ceramic circuit board are quickly connected, and the multilayer rigid circuit board and the ceramic circuit board are electrically communicated, thereby improving the production efficiency of the circuit board. The mode of assembling different circuit boards through the conductive expansion sleeve does not appear in the existing market, and the application provides a novel assembling mode between the circuit boards, and provides a new idea for the assembling between the circuit boards.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a schematic structural diagram of a ceramic-based rigid multilayer circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic view of a ceramic based rigid multilayer circuit board according to an embodiment of the present invention (with the conductive expansion sleeve removed);
fig. 3 is a schematic structural view of an electrically conductive expansion sleeve and inner core as disclosed in an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments and the accompanying drawings so that those skilled in the art can implement the invention with reference to the description.
Referring to fig. 1-3, an embodiment of the present invention discloses a ceramic-based rigid multilayer circuit board, including a ceramic circuit board 1, a dielectric layer 2, and a multilayer rigid circuit board 3, which are sequentially disposed from bottom to top, conductive through holes 4 are disposed on the ceramic circuit board 1, the dielectric layer 2, and the multilayer rigid circuit board 3, conductive expansion sleeves 5 are disposed in the conductive through holes 4, the conductive expansion sleeves 5 include a sleeve body 51, a conductive soft adhesive layer is disposed on an outer sleeve wall of the sleeve body 51, a tail portion of the conductive expansion sleeve 5 exceeds a lower end surface of the ceramic circuit board 1, a head portion of the conductive expansion sleeve 5 is flush with an upper end surface of the multilayer rigid circuit board 3, and a backing plate 6 flush with a tail portion of the conductive expansion sleeve 5 is further disposed on the lower.
As one of the preferred embodiments of the present invention, the multilayer rigid circuit board 3 includes two epoxy resin circuit boards 31, and a dielectric layer 32 is also disposed between the two epoxy resin circuit boards.
In a preferred embodiment of the present invention, the dielectric layers 2 are all PP layers.
As one preferable embodiment of the present invention, the sleeve body 51 of the conductive expansion sleeve 5 is a copper expansion sleeve.
As one preferable aspect of the present invention, the conductive expansion sleeve 5 is mounted as follows:
1) providing a conductive expansion sleeve 5, wherein an inner core 52 is arranged in a sleeve body 51 of the conductive expansion sleeve 5, the tail part of the inner core 52 is positioned outside the sleeve body 51, and the diameter of the tail part of the inner core 52 is larger than the inner diameter of the sleeve body 51, wherein the inner core is a steel needle, and the hardness and the strength of the inner core are larger than those of a copper sleeve body;
2) connecting the connecting rod with the head of the inner core 52 of the conductive expansion sleeve 5, then enabling the conductive expansion sleeve 5 to pass through the conductive through hole 4, and enabling the tail of the conductive expansion sleeve 5 to be located on the side of the ceramic circuit board 1;
3) pulling the gun pulls the inner core 52, the inner core 52 rises along with the pulling force and the inner core 52 props up the inner cavity of the sleeve body 51 to enable the sleeve body 51 to deform outwards to be tightly connected with the conductive through hole 4, and finally, the inner core 52 is pulled out of the sleeve body 51.
As one of the preferable embodiments of the present invention, the pad 6 is attached to the lower end surface of the ceramic circuit board 1 by glue or tape, and the pad 6 may function to support the entire circuit board.
Through the technical scheme, the ceramic-based rigid multilayer circuit board comprises the two layers of rigid circuit boards and the ceramic circuit board 1, so that the problems of brittleness and high machining difficulty of the single ceramic circuit board 1 are solved; the ceramic-based rigid multilayer circuit board provided by the invention has high heat dissipation, corrosion resistance and heat conductivity; the multilayer rigid circuit board 3 and the ceramic circuit board 1 of the ceramic-based rigid multilayer circuit board provided by the invention are assembled through the conductive expansion sleeve 5, so that the rapid connection between the multilayer rigid circuit board 3 and the ceramic circuit board 1 is realized, and the electrical conduction between the multilayer rigid circuit board 3 and the ceramic circuit board 1 is also realized, thereby improving the production efficiency of the circuit board. The mode of assembling different circuit boards through conductive expansion sleeve 5 does not appear in the existing market, and the application provides a novel assembling mode between the circuit boards, and provides a new thought for the assembling between the circuit boards.
Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A ceramic-based rigid multilayer circuit board characterized by: include from supreme ceramic circuit board, dielectric layer and the multilayer rigid circuit board that sets gradually down, be provided with electrically conductive through-hole on ceramic circuit board, dielectric layer and the multilayer rigid circuit board, be provided with electrically conductive expansion sleeve in the electrically conductive through-hole, electrically conductive expansion sleeve includes the sleeve body, be provided with electrically conductive soft glue layer on the outer cover barrel wall of sleeve body, electrically conductive expansion sleeve's afterbody surpasss ceramic circuit board's lower terminal surface, electrically conductive expansion sleeve's head with the up end of multilayer rigid circuit board flushes, still be equipped with on ceramic circuit board's the lower terminal surface with the backing plate that electrically conductive expansion sleeve's afterbody flushed.
2. The ceramic-based rigid multilayer circuit board of claim 1, wherein: the multilayer rigid circuit board comprises two layers of epoxy resin circuit boards, and a dielectric layer is also arranged between the two layers of epoxy resin circuit boards.
3. The ceramic-based rigid multilayer circuit board according to claim 1 or 2, characterized in that: the dielectric layer is a PP layer.
4. The ceramic-based rigid multilayer circuit board of claim 1, wherein: the sleeve body of the conductive expansion sleeve is a copper tensioning sleeve.
5. The ceramic-based rigid multilayer circuit board of claim 1, wherein: the conductive expansion sleeve is mounted in the following manner:
1) providing the conductive expansion sleeve, wherein an inner core is arranged in a sleeve body of the conductive expansion sleeve, the tail part of the inner core is positioned outside the sleeve body, and the diameter of the tail part of the inner core is larger than the inner diameter of the sleeve body;
2) connecting the connecting stud with the head of the inner core of the conductive expansion sleeve, then penetrating the conductive expansion sleeve through the conductive through hole, and enabling the tail of the conductive expansion sleeve to be located on the side of the ceramic circuit board;
3) and pulling the gun to pull the inner core, wherein the inner core rises along with the pulling force and props up the inner cavity of the sleeve body so that the sleeve body deforms outwards to be tightly connected with the conductive through hole, and finally the inner core is separated from the sleeve body.
6. The ceramic-based rigid multilayer circuit board of claim 1, wherein: the inner core is a steel needle.
7. The ceramic-based rigid multilayer circuit board of claim 1, wherein: the backing plate is adhered to the lower end face of the ceramic circuit board through glue or an adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010509037.2A CN111565509A (en) | 2020-06-07 | 2020-06-07 | Ceramic-based rigid multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010509037.2A CN111565509A (en) | 2020-06-07 | 2020-06-07 | Ceramic-based rigid multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111565509A true CN111565509A (en) | 2020-08-21 |
Family
ID=72072566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010509037.2A Withdrawn CN111565509A (en) | 2020-06-07 | 2020-06-07 | Ceramic-based rigid multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111565509A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6747217B1 (en) * | 2001-11-20 | 2004-06-08 | Unisys Corporation | Alternative to through-hole-plating in a printed circuit board |
| US20070193775A1 (en) * | 2006-02-17 | 2007-08-23 | Micron Technology, Inc. | Impedance matching via structure for high-speed printed circuit boards and method of determining same |
| CN201781686U (en) * | 2010-08-03 | 2011-03-30 | 广东达进电子科技有限公司 | Ceramic rigid multilayer circuit board with through holes |
| CN201781681U (en) * | 2010-08-03 | 2011-03-30 | 广东达进电子科技有限公司 | Ceramic-based flex-rigid combined multilayer circuit board with through holes |
| JP2014232785A (en) * | 2013-05-29 | 2014-12-11 | 日立電線株式会社 | Printed wiring board |
-
2020
- 2020-06-07 CN CN202010509037.2A patent/CN111565509A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6747217B1 (en) * | 2001-11-20 | 2004-06-08 | Unisys Corporation | Alternative to through-hole-plating in a printed circuit board |
| US20070193775A1 (en) * | 2006-02-17 | 2007-08-23 | Micron Technology, Inc. | Impedance matching via structure for high-speed printed circuit boards and method of determining same |
| CN201781686U (en) * | 2010-08-03 | 2011-03-30 | 广东达进电子科技有限公司 | Ceramic rigid multilayer circuit board with through holes |
| CN201781681U (en) * | 2010-08-03 | 2011-03-30 | 广东达进电子科技有限公司 | Ceramic-based flex-rigid combined multilayer circuit board with through holes |
| JP2014232785A (en) * | 2013-05-29 | 2014-12-11 | 日立電線株式会社 | Printed wiring board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200821 |