CN111554601A - 晶圆前端传送系统 - Google Patents
晶圆前端传送系统 Download PDFInfo
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- CN111554601A CN111554601A CN202010344078.0A CN202010344078A CN111554601A CN 111554601 A CN111554601 A CN 111554601A CN 202010344078 A CN202010344078 A CN 202010344078A CN 111554601 A CN111554601 A CN 111554601A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
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Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010344078.0A CN111554601B (zh) | 2020-04-27 | 2020-04-27 | 晶圆前端传送系统 |
Applications Claiming Priority (1)
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CN202010344078.0A CN111554601B (zh) | 2020-04-27 | 2020-04-27 | 晶圆前端传送系统 |
Publications (2)
Publication Number | Publication Date |
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CN111554601A true CN111554601A (zh) | 2020-08-18 |
CN111554601B CN111554601B (zh) | 2021-12-28 |
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CN202010344078.0A Active CN111554601B (zh) | 2020-04-27 | 2020-04-27 | 晶圆前端传送系统 |
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CN (1) | CN111554601B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114322853A (zh) * | 2021-12-31 | 2022-04-12 | 上海果纳半导体技术有限公司 | 气浮平台动态水平度检测方法及应用该方法的晶圆传输系统 |
CN114400190A (zh) * | 2022-03-25 | 2022-04-26 | 南京伟测半导体科技有限公司 | 一种全方位检测晶舟盒内晶圆的装置 |
CN114783924A (zh) * | 2022-04-06 | 2022-07-22 | 深圳市深科达智能装备股份有限公司 | 晶圆搬运设备、晶圆搬运控制方法、电气设备及存储介质 |
WO2022179011A1 (zh) * | 2021-02-25 | 2022-09-01 | 长鑫存储技术有限公司 | 晶圆自动处理方法及晶圆自动处理装置 |
CN116092984A (zh) * | 2023-03-06 | 2023-05-09 | 睿励科学仪器(上海)有限公司 | 用于确定晶圆传输设备的定位精度的方法 |
CN116525517A (zh) * | 2023-06-19 | 2023-08-01 | 苏州鸿安机械股份有限公司 | 一种半导体晶圆输送的定位控制方法及系统 |
TWI824421B (zh) * | 2022-02-24 | 2023-12-01 | 雷傑科技股份有限公司 | 微晶粒加工設備及微晶粒加工方法 |
CN117410211A (zh) * | 2023-12-11 | 2024-01-16 | 天通控股股份有限公司 | 一种盒装晶片的编码、缺陷识别系统及控制方法 |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070209591A1 (en) * | 2006-03-08 | 2007-09-13 | Tokyo Electron Limited | Substrate processing system, substrate surface processing apparatus, substrate surface inspecting apparatus, substrate surface inspecting method, and storage medium storing program for implementing the method |
CN101339896A (zh) * | 2007-07-02 | 2009-01-07 | 日东电工株式会社 | 对半导体晶圆粘贴粘合带的方法以及保护带的剥离方法 |
KR20090090938A (ko) * | 2008-02-22 | 2009-08-26 | (주)쎄미시스코 | 기판 품질 검사 장치 |
CN100587920C (zh) * | 2006-06-29 | 2010-02-03 | 东京毅力科创株式会社 | 基板处理方法和基板处理装置 |
US20100118302A1 (en) * | 2008-11-13 | 2010-05-13 | Tokyo Electron Limited | Method and apparatus for detecting foreign materials and storage medium |
CN101933130A (zh) * | 2008-06-27 | 2010-12-29 | 日商英益达股份有限公司 | 硅晶圆的缺陷检查装置及其缺陷检查方法 |
CN102782828A (zh) * | 2010-02-17 | 2012-11-14 | 应用材料公司 | 用于在高速机械手运输中成像工件表面的度量系统 |
CN102782830A (zh) * | 2010-02-17 | 2012-11-14 | 应用材料公司 | 高机械手传输下减少或防止移动引起失真的工件表面成像方法 |
CN102792436A (zh) * | 2010-02-17 | 2012-11-21 | 应用材料公司 | 高速机械手运输下修正移动引起失真的工件表面成像方法 |
US20140176701A1 (en) * | 2011-04-05 | 2014-06-26 | Masanori OKUNO | Substrate processing device |
CN106067435A (zh) * | 2015-04-23 | 2016-11-02 | 株式会社荏原制作所 | 基板处理装置及基板异常的检测方法 |
US20160336206A1 (en) * | 2013-04-29 | 2016-11-17 | GlobalFoundries, Inc. | System and method for monitoring wafer handling and a wafer handling machine |
CN107102515A (zh) * | 2016-02-22 | 2017-08-29 | 东京毅力科创株式会社 | 基板处理方法和基板处理装置 |
CN109554662A (zh) * | 2017-09-27 | 2019-04-02 | 株式会社爱发科 | 位置检测装置、位置检测方法以及蒸镀装置 |
US20190109031A1 (en) * | 2011-03-31 | 2019-04-11 | Tokyo Electron Limited | Substrate processing apparatus |
CN110692129A (zh) * | 2017-01-08 | 2020-01-14 | 德思美有限公司 | 用于测试半导体装置的设备和方法 |
WO2020045280A1 (ja) * | 2018-08-31 | 2020-03-05 | 川崎重工業株式会社 | 基板搬送ロボット |
CN110875222A (zh) * | 2018-08-30 | 2020-03-10 | 台湾积体电路制造股份有限公司 | 设备前端装置及其操作方法 |
CN110957240A (zh) * | 2018-09-27 | 2020-04-03 | 台湾积体电路制造股份有限公司 | 感应器、装载端及水平方法 |
-
2020
- 2020-04-27 CN CN202010344078.0A patent/CN111554601B/zh active Active
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070209591A1 (en) * | 2006-03-08 | 2007-09-13 | Tokyo Electron Limited | Substrate processing system, substrate surface processing apparatus, substrate surface inspecting apparatus, substrate surface inspecting method, and storage medium storing program for implementing the method |
CN100587920C (zh) * | 2006-06-29 | 2010-02-03 | 东京毅力科创株式会社 | 基板处理方法和基板处理装置 |
CN101339896A (zh) * | 2007-07-02 | 2009-01-07 | 日东电工株式会社 | 对半导体晶圆粘贴粘合带的方法以及保护带的剥离方法 |
KR20090090938A (ko) * | 2008-02-22 | 2009-08-26 | (주)쎄미시스코 | 기판 품질 검사 장치 |
CN101933130A (zh) * | 2008-06-27 | 2010-12-29 | 日商英益达股份有限公司 | 硅晶圆的缺陷检查装置及其缺陷检查方法 |
US20100118302A1 (en) * | 2008-11-13 | 2010-05-13 | Tokyo Electron Limited | Method and apparatus for detecting foreign materials and storage medium |
CN102792436A (zh) * | 2010-02-17 | 2012-11-21 | 应用材料公司 | 高速机械手运输下修正移动引起失真的工件表面成像方法 |
CN102782830A (zh) * | 2010-02-17 | 2012-11-14 | 应用材料公司 | 高机械手传输下减少或防止移动引起失真的工件表面成像方法 |
CN102782828A (zh) * | 2010-02-17 | 2012-11-14 | 应用材料公司 | 用于在高速机械手运输中成像工件表面的度量系统 |
US20190109031A1 (en) * | 2011-03-31 | 2019-04-11 | Tokyo Electron Limited | Substrate processing apparatus |
US20140176701A1 (en) * | 2011-04-05 | 2014-06-26 | Masanori OKUNO | Substrate processing device |
US20160336206A1 (en) * | 2013-04-29 | 2016-11-17 | GlobalFoundries, Inc. | System and method for monitoring wafer handling and a wafer handling machine |
CN106067435A (zh) * | 2015-04-23 | 2016-11-02 | 株式会社荏原制作所 | 基板处理装置及基板异常的检测方法 |
CN107102515A (zh) * | 2016-02-22 | 2017-08-29 | 东京毅力科创株式会社 | 基板处理方法和基板处理装置 |
CN110692129A (zh) * | 2017-01-08 | 2020-01-14 | 德思美有限公司 | 用于测试半导体装置的设备和方法 |
CN109554662A (zh) * | 2017-09-27 | 2019-04-02 | 株式会社爱发科 | 位置检测装置、位置检测方法以及蒸镀装置 |
CN110875222A (zh) * | 2018-08-30 | 2020-03-10 | 台湾积体电路制造股份有限公司 | 设备前端装置及其操作方法 |
WO2020045280A1 (ja) * | 2018-08-31 | 2020-03-05 | 川崎重工業株式会社 | 基板搬送ロボット |
CN110957240A (zh) * | 2018-09-27 | 2020-04-03 | 台湾积体电路制造股份有限公司 | 感应器、装载端及水平方法 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022179011A1 (zh) * | 2021-02-25 | 2022-09-01 | 长鑫存储技术有限公司 | 晶圆自动处理方法及晶圆自动处理装置 |
US11961772B2 (en) | 2021-02-25 | 2024-04-16 | Changxin Memory Technologies, Inc. | Method and apparatus for automatically processing wafers |
CN114322853A (zh) * | 2021-12-31 | 2022-04-12 | 上海果纳半导体技术有限公司 | 气浮平台动态水平度检测方法及应用该方法的晶圆传输系统 |
TWI824421B (zh) * | 2022-02-24 | 2023-12-01 | 雷傑科技股份有限公司 | 微晶粒加工設備及微晶粒加工方法 |
CN114400190A (zh) * | 2022-03-25 | 2022-04-26 | 南京伟测半导体科技有限公司 | 一种全方位检测晶舟盒内晶圆的装置 |
CN114400190B (zh) * | 2022-03-25 | 2022-06-10 | 南京伟测半导体科技有限公司 | 一种全方位检测晶舟盒内晶圆的装置 |
CN114783924A (zh) * | 2022-04-06 | 2022-07-22 | 深圳市深科达智能装备股份有限公司 | 晶圆搬运设备、晶圆搬运控制方法、电气设备及存储介质 |
CN114783924B (zh) * | 2022-04-06 | 2023-09-01 | 深圳市深科达智能装备股份有限公司 | 晶圆搬运设备、晶圆搬运控制方法、电气设备及存储介质 |
CN116092984A (zh) * | 2023-03-06 | 2023-05-09 | 睿励科学仪器(上海)有限公司 | 用于确定晶圆传输设备的定位精度的方法 |
CN116525517B (zh) * | 2023-06-19 | 2023-10-13 | 苏州鸿安机械股份有限公司 | 一种半导体晶圆输送的定位控制方法及系统 |
CN116525517A (zh) * | 2023-06-19 | 2023-08-01 | 苏州鸿安机械股份有限公司 | 一种半导体晶圆输送的定位控制方法及系统 |
CN117410211A (zh) * | 2023-12-11 | 2024-01-16 | 天通控股股份有限公司 | 一种盒装晶片的编码、缺陷识别系统及控制方法 |
CN117410211B (zh) * | 2023-12-11 | 2024-03-22 | 天通控股股份有限公司 | 一种盒装晶片的编码、缺陷识别系统及控制方法 |
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Denomination of invention: Wafer front end transport system Effective date of registration: 20220610 Granted publication date: 20211228 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Shanghai pilot Free Trade Zone Lingang xinpian District sub branch Pledgor: Shanghai guona Semiconductor Technology Co.,Ltd. Registration number: Y2022310000053 |
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Date of cancellation: 20230615 Granted publication date: 20211228 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Shanghai pilot Free Trade Zone Lingang xinpian District sub branch Pledgor: Shanghai guona Semiconductor Technology Co.,Ltd. Registration number: Y2022310000053 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Wafer front-end transport system Effective date of registration: 20230628 Granted publication date: 20211228 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Shanghai pilot Free Trade Zone Lingang xinpian District sub branch Pledgor: Shanghai guona Semiconductor Technology Co.,Ltd. Registration number: Y2023310000319 |