CN111506202B - Keyboard and keyboard assembling method - Google Patents

Keyboard and keyboard assembling method Download PDF

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Publication number
CN111506202B
CN111506202B CN202010307333.4A CN202010307333A CN111506202B CN 111506202 B CN111506202 B CN 111506202B CN 202010307333 A CN202010307333 A CN 202010307333A CN 111506202 B CN111506202 B CN 111506202B
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China
Prior art keywords
keyboard
circuit board
holes
connection
isolation
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Application number
CN202010307333.4A
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Chinese (zh)
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CN111506202A (en
Inventor
梁小强
石磊
朱洪根
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Lite On Technology Changzhou Co Ltd
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Lite On Technology Changzhou Co Ltd
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Priority to CN202010307333.4A priority Critical patent/CN111506202B/en
Publication of CN111506202A publication Critical patent/CN111506202A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/02Input arrangements using manually operated switches, e.g. using keyboards or dials
    • G06F3/0202Constructional details or processes of manufacture of the input device

Abstract

The application discloses a keyboard and a keyboard assembling method. The key module is provided with a bottom plate, a circuit board and a plurality of key groups, wherein the circuit board is arranged on the bottom plate, a plurality of key groups are arranged on the circuit board, the bottom plate is provided with a plurality of connecting holes, the circuit board is provided with a plurality of through holes, and a plurality of connecting holes respectively correspond to a plurality of through holes. The keyboard frame is arranged on the key module and is provided with a plurality of key openings, and the plurality of key groups are respectively positioned in the corresponding key openings. The plurality of connecting pieces are respectively filled in the corresponding connecting holes and are connected with the surface, close to the circuit board, of the keyboard frame through the corresponding through holes. The above structure can easily complete the assembly without using screws, so that the problems of improper assembly such as poor locking, sliding teeth and the like are avoided, and the problem of short circuit caused by falling into a computer due to loosening of the screws is also avoided.

Description

Keyboard and keyboard assembling method
Technical Field
The application relates to the technical field of keyboards and keyboard manufacturing, in particular to a keyboard and a keyboard assembling method.
Background
At present, the computer keyboard is assembled by hot melting, screw locking or rivet locking, wherein the screw locking method causes more problems, for example, because the number of screws is more, the operation of personnel and machines is difficult, the problems of poor screw locking, sliding teeth and the like often occur, and even the problem of short circuit caused by the fact that the screws are loosened and fall into the computer is caused.
Disclosure of Invention
The embodiment of the application provides a keyboard assembling method, which can solve various assembling problems caused by using assembling parts such as screws in the prior art by using a bonding material without using the screws.
In order to solve the technical problems, the application is realized as follows:
there is provided a keyboard assembly method, comprising: the keyboard frame is arranged on the key module, and a plurality of keys correspondingly penetrate through a plurality of key openings; and a plurality of connecting pieces are respectively formed in the corresponding connecting holes, and the connecting pieces are adhered to the surface, close to the circuit board, of the keyboard frame through the through holes.
A keyboard is provided that includes a key module, a keyboard frame, and a plurality of connectors. The key module is provided with a bottom plate, a circuit board and a plurality of key groups, wherein the circuit board is arranged on the bottom plate, a plurality of key groups are arranged on the circuit board, the bottom plate is provided with a plurality of connecting holes, the circuit board is provided with a plurality of through holes, and a plurality of connecting holes respectively correspond to a plurality of through holes. The keyboard frame is arranged on the key module and is provided with a plurality of key openings, and the plurality of key groups are respectively positioned in the corresponding key openings. The plurality of connecting pieces are respectively filled in the corresponding connecting holes and are connected with the surface, close to the circuit board, of the keyboard frame through the corresponding through holes.
In the embodiment of the application, the bottom plate and the cover plate are combined by the combining material, so that the assembly can be easily completed, and screws are not used, so that the problems of improper assembly such as poor locking, sliding teeth and the like are avoided, and the problem of short circuit caused by falling into a computer due to loosening of the screws is also avoided.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a flow chart of a keyboard assembly method according to an embodiment of the application;
fig. 2 to 4 are schematic views illustrating operation steps of a keyboard assembly method according to a first embodiment of the present application;
fig. 5 to 7 are schematic views illustrating operation steps of a keyboard assembly method according to a second embodiment of the present application;
fig. 8 to 10 are schematic views illustrating operation steps of a keyboard assembly method according to a third embodiment of the present application;
FIG. 11 is a top view of a keyboard assembled by the keyboard assembly method of the present application;
FIG. 12 is an exploded perspective view of the keyboard of FIG. 11;
FIG. 13 is a cross-sectional view of the keyboard of FIG. 11 taken along line A-A;
FIG. 14 is a side view of the keyboard of FIG. 12;
FIG. 15 is an exploded view of a keyboard according to another embodiment of the present application;
fig. 16 is an exploded view of a keyboard according to yet another embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1, a flowchart of a keyboard assembly method according to an embodiment of the application is shown; as shown in the drawing, the present embodiment provides a keyboard assembly method, firstly, step S1 is performed, in step S1, a base plate 10 is provided, and a plurality of key groups 20 are disposed on the base plate 10 to form a key module. Fig. 2 to 4 are schematic views illustrating operation steps of a keyboard assembly method according to an embodiment of the application. As shown in fig. 2, a base plate 10 is provided. The base plate 10 may be a metal plate, such as an iron plate. The plurality of key sets 20 are disposed on the circuit board 30, and the key sets 20 and the circuit board 30 are disposed on the base plate 10.
Referring back to fig. 1, after step S1 is completed, step S2 is then performed. In step S2, a keyboard frame 40 is provided, the keyboard frame 40 having a plurality of key apertures 41. As shown in fig. 2, a keyboard frame 40 is provided, the keyboard frame 40 having a plurality of key apertures 41. The keyboard frame 40 may be an injection-molded plate, and a plurality of key ports 41 are simultaneously formed at the time of injection molding, each key port 41 corresponding to the key group 20. The keyboard frame 40 includes a first surface 42 and a second surface 43, the first surface 42 being disposed opposite the second surface 43.
Referring back to fig. 1, after step S2 is completed, step S3 is then performed. In step S3, a plurality of connection holes 11 are formed on the base plate 10. As shown in fig. 2, the base plate 10 has a plurality of connection holes 11, and the connection holes 11 may be formed in the base plate 10 by punching. The position of the connection hole 11 corresponds to the first surface 42 of the keyboard frame 40. In addition, since the circuit board 30 is disposed on the base plate 10 and the connection holes 11 of the base plate 10 are adapted to be filled with a connection colloid M described later, the through holes 31 are correspondingly formed in the circuit board 30, and the through holes 31 of the circuit board 30 correspond to the connection holes 11 of the base plate 10.
Referring back to fig. 1, after step S3 is completed, step S4 is then performed. In step S4, the keyboard frame 40 is assembled to the base plate 10, and the plurality of key groups 20 correspondingly pass through the plurality of key ports 41. As shown in fig. 2 and 3, the first surface 42 of the keyboard frame 40 faces the bottom board 10, and the first surface 42 of the keyboard frame 40 is press-bonded to the circuit board 30. The first surface 42 of the keyboard frame 40 is exposed through the through hole 31 of the circuit board 30 and the connection hole 11 of the chassis 10.
Referring back to fig. 1, after step S4 is completed, step S5 is then performed. In step S5, the connecting glue M is poured into the plurality of connecting holes 11 and attached to the keyboard frame 40. (refer to fig. 3 and 4) the adhesive M is poured into the connection hole 11 of the base plate 10 and the through hole 31 of the circuit board 30 and is attached to the first surface 42 of the keyboard frame 40. Then, the bonding glue M is cured or hardened and fixed on the keyboard frame 40 and the bottom board 10, and the cured bonding glue M forms a plurality of connecting pieces respectively corresponding to the connecting holes 11 of the bottom board 10, and the connecting pieces are adhered to the surface of the keyboard frame 40, which is close to the circuit board 30, through the connecting holes 11. The bottom plate 10 and the keyboard frame 40 are assembled, and the curing or hardening of the adhesive M can be accomplished by irradiation, pressurization or heating. The key group 20 and the circuit board 30 are clamped between the bottom board 10 and the keyboard frame 40 to play a role of positioning.
In this embodiment, the step of pouring the adhesive M into the connecting hole 11 and attaching the adhesive M to the keyboard frame 40 includes: the bonding paste M is continuously poured and exposed to the surface of the base plate 10. The diameter of the portion of the connection colloid M exposed from the surface of the base plate 10 is larger than the diameter of the connection hole 11. After the bonding paste M is cured in this way, the bonding paste M forms an enlarged head outside the connection hole 11, and is glued to the surface of the base plate 10.
In the present embodiment, the opposite surfaces of the base plate 10 are formed with an isolation protrusion 12 (first isolation protrusion) on one surface at a position corresponding to the connection hole 11 (please refer to fig. 14), and a positioning groove 13 on the other surface, in the present embodiment, the isolation protrusion 12 is circular, each connection hole 11 is circular, and the center of the connection hole 11 coincides with the center of each isolation protrusion 12. The diameter of the through hole 31 of the circuit board 30 is larger than that of the isolation convex part 12 of the bottom board 10, so that the through hole 31 of the circuit board 30 can be sleeved on the isolation convex part 12 of the bottom board 10, and plays a role in positioning when the circuit board 30 is arranged on the bottom board 10, on the other hand, in the process that the connection colloid M is poured into the connection hole 11 of the bottom board 10 to the first surface 42 of the keyboard frame 40, the isolation convex part 12 can play a role in isolating the connection colloid M, and the connection colloid M is prevented from adhering to the circuit board 30. The isolation protrusion 12 abuts against the first surface 42 of the keyboard frame 40. The positioning groove 13 on the other surface of the bottom plate 10 may be filled with the positioning groove 13 when the connecting colloid M is poured into the connecting hole 11, so that the connecting piece formed by the connecting colloid M after curing is also filled in the positioning groove 13. The diameter of the positioning groove 13 is larger than that of the connection hole 11, so that the enlarged head can be formed at the outer end of the connection hole 11 after the connection gel M is hardened.
Please refer to fig. 5-7, which are schematic diagrams illustrating operation steps of a keyboard assembly method according to a second embodiment of the present application. As shown in the drawings, the same components as those of the first embodiment are given the same symbols and the description thereof is omitted. The difference between the present embodiment and the first embodiment is that the present embodiment forms the connection groove 44 on the keyboard frame 40, and the position of the connection groove 44 corresponds to the connection hole 11. The first surface 42 of the keyboard frame 40 of the present embodiment forms the connection groove 44, and the connection groove 44 may be formed simultaneously when the keyboard frame 40 is injection molded. The step S4 of pouring the adhesive M into the plurality of connection holes 11 and attaching the adhesive M to the keyboard frame 40 includes pouring the adhesive M into the connection groove 44. When the bonding paste M is cured, the connection members are formed, and each of the connection members fills the corresponding connection hole 11 and connection groove 44.
The diameter of the connection groove 44 may be the same as that of the connection hole 11, or the diameter of the connection groove 44 may be larger than that of the connection hole 11, or the diameter of the connection groove 44 may be smaller than that of the connection hole 11. The depth of the connection groove 44 may be appropriately set so that a sufficient coupling force is generated after the coupling paste M filled in the connection groove 44 is hardened.
Please refer to fig. 8-10, which are schematic diagrams illustrating operation steps of a keyboard assembly method according to a third embodiment of the present application. As shown in the drawings, the same components as those of the first embodiment are given the same symbols and the description thereof is omitted. The difference between the present embodiment and the first embodiment is that the opposite surfaces of the bottom plate 10 of the present embodiment are formed with annular protrusions 14 on one surface and concave on the other surface at the positions corresponding to the connecting holes 11, but the concave of the present embodiment faces the keyboard frame 40, so that a receiving space is formed between the bottom plate 10 and the keyboard frame 40. When the connecting adhesive M is poured into the connecting hole 11, the connecting adhesive M may be attached to the outside of the first surface 42 of the keyboard frame 40, and may also partially fill the accommodating space. After the adhesive M is hardened, an attachment portion may be formed between the first surface 42 of the keyboard frame 40, the receiving space, and the annular protrusion 14 outside the connection hole 11, thereby increasing the coupling force between the bottom plate 10 and the keyboard frame 40. In the present embodiment, the joining colloid M forms an enlarged head at the annular protrusion 14 outside the connection hole 11. In addition, in the present embodiment, the annular convex portions 14 are circular, each of the connection holes 11 is circular, and the center of the connection hole 11 coincides with the center of each annular convex portion 14. The first surface 42 of the keyboard frame 40 of the present embodiment may have no connecting groove as in the first embodiment, or may have a connecting groove 44 (as shown in fig. 5) as in the second embodiment. As shown in fig. 8 to 10, the first surface 42 of the keyboard frame 40 of the present embodiment has no connection groove. Therefore, the difference between the present embodiment and the second embodiment shown in fig. 5 is that the bottom board 10 of the present embodiment has the annular protrusion 14 and the keyboard frame 40 has no connecting groove, while the bottom board 10 of the second embodiment has the recessed positioning groove 13 and the keyboard frame 40 has the connecting groove 44.
Please refer to fig. 11, 12, 13 and 14, which are a top view of the keyboard assembled by the keyboard assembly method of the present application, an exploded perspective view of the keyboard of fig. 11, a cross-sectional view of the keyboard of fig. 11 and a side view of the keyboard of fig. 12. In addition to the keyboard 100 including the base plate 10, the key group 20, the circuit board 30, and the keyboard frame 40, the keyboard 100 further includes a cover 50 and a cover board 60, wherein the cover 50 covers the second surface 43 of the keyboard frame 40, and in this embodiment, the cover 50 may be a frame (also referred to as a C-piece) of a notebook computer, and the cover board 60 is disposed on the back of the base plate 10.
In another embodiment, as shown in fig. 15, the isolation protrusion 12 '(second isolation protrusion) may also be disposed on the keyboard frame 40, and the first surface 42 of the keyboard frame 40 extends toward the bottom plate 10, and the connection groove 44' shown in fig. 5 is formed in the isolation protrusion 12', and the connection hole 11 on the bottom plate 10 corresponds to the connection groove 44' of the isolation protrusion 12', and the connection gel is poured into the connection hole 11 and the connection groove 44'. Similarly, the through hole 31 of the circuit board 30 is sleeved on the isolation convex portion 12', which can play a role of positioning and isolating the connection colloid.
In another embodiment, as shown in fig. 16, the isolation protrusion 12 (first isolation protrusion) and the isolation protrusion 12' (second isolation protrusion) may be disposed on the base plate 10 and the keyboard frame 40, respectively, the isolation protrusions 12, 12' on the base plate 10 and the keyboard frame 40 extend toward each other and are aligned with each other to be assembled, the connection hole 11 is provided on the isolation protrusion 12 of the base plate 10, the connection groove 44' is provided on the isolation protrusion 12' on the keyboard frame 40, and the connection groove 44' is aligned with the connection hole 11. The coupling gel is poured into the coupling hole 11 and the coupling groove 44'. Similarly, the through hole 31 of the circuit board 30 is sleeved on the isolation convex parts 12 and 12', which can play a role of positioning and isolating the connection colloid.
In summary, the present application provides a keyboard assembly method, which can easily complete the assembly by connecting the glue body with the bottom plate and the keyboard frame, and does not use screws, so that the problems of improper assembly such as poor locking, sliding teeth, etc. and short circuit caused by falling into the computer due to loose screws are avoided. And the connecting colloid is filled in the connecting grooves of the keyboard frame and the accommodating space between the keyboard frame and the bottom plate, and the expanded head is formed outside the bottom plate, so that the binding force between the bottom plate and the keyboard frame can be increased, and the same or even better fixedly connecting effect as that of fixing parts such as screws is achieved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.

Claims (11)

1. A keyboard, comprising:
the key module is provided with a bottom plate, a circuit board and a plurality of key groups, wherein the circuit board is arranged on the bottom plate, the plurality of key groups are arranged on the circuit board, the bottom plate is provided with a plurality of connecting holes, the circuit board is provided with a plurality of through holes, and the plurality of connecting holes respectively correspond to the plurality of through holes;
the keyboard frame is arranged on the key module and is provided with a plurality of key openings, a plurality of key groups are respectively positioned in the corresponding key openings, the keyboard frame is provided with a plurality of connecting grooves, and the connecting grooves are positioned on the surface of the keyboard frame, which is close to the circuit board, and correspond to the connecting holes;
a plurality of connection members filled and cured in the corresponding connection holes, respectively, and connected with the surface of the keyboard frame, which is close to the circuit board, through the through holes and the connection grooves corresponding to the connection holes;
the surface of the keyboard frame, which is close to the circuit board, is provided with a plurality of isolation convex parts, the isolation convex parts are respectively positioned in the corresponding through holes and are abutted to the surface of the bottom plate, which is close to the circuit board, and the connecting grooves are formed in the isolation convex parts.
2. The keyboard of claim 1, wherein the diameter of the connection groove is equal to the diameter of the connection hole.
3. The keyboard of any one of claims 1 to 2, wherein a surface of the bottom plate remote from the circuit board has a plurality of positioning grooves, a plurality of the connection holes are located in the corresponding positioning grooves, and each of the connection pieces is filled in the corresponding positioning groove.
4. The keyboard of claim 3, wherein the diameter of the positioning slot is greater than the diameter of the connection hole.
5. The keyboard of claim 3, wherein the diameter of the through hole is larger than the diameter of the connecting hole, the surface of the bottom plate close to the circuit board is provided with a plurality of first isolation convex parts, the plurality of first isolation convex parts are respectively positioned in the corresponding through holes and abutted on the surface of the keyboard frame close to the circuit board, and each connecting hole penetrates through the corresponding first isolation convex part.
6. The keyboard of any one of claims 1 to 2, wherein a surface of the bottom plate remote from the circuit board has a plurality of annular projections, a plurality of the connection holes being located in the corresponding annular projections, each of the connection pieces being filled in the corresponding annular projections.
7. The keyboard of claim 6, wherein the annular protrusion has a diameter greater than a diameter of the connection hole.
8. The keyboard of claim 6, wherein the diameter of the through hole is larger than the diameter of the connecting hole, the surface of the bottom plate close to the circuit board is provided with a plurality of first isolation convex parts, the plurality of first isolation convex parts are respectively positioned in the corresponding through holes and abutted on the surface of the keyboard frame close to the circuit board, and each connecting hole penetrates through the corresponding first isolation convex part.
9. The keyboard of claim 5, wherein the keyboard frame is provided with a plurality of second isolation protrusions, each second isolation protrusion corresponds to and abuts against each first isolation protrusion, the connecting groove is arranged on the second isolation protrusion, and the first isolation protrusion and the second isolation protrusion correspond to the through hole.
10. A keyboard assembly method for assembling the keyboard of claim 1, comprising:
the keyboard frame is arranged on the key module, and a plurality of keys correspondingly penetrate through a plurality of key openings;
and a plurality of connecting pieces are respectively formed in the corresponding connecting holes, and the connecting pieces are adhered to the surface, close to the circuit board, of the keyboard frame through the through holes.
11. The method of assembling a keyboard according to claim 10, wherein the step of forming a plurality of the connection members in the corresponding connection holes, respectively, comprises:
filling a connecting colloid in a plurality of connecting holes, and bonding the connecting colloid with the surface, close to the circuit board, of the keyboard frame through a plurality of through holes;
and curing the bonding colloid to form a plurality of connecting pieces.
CN202010307333.4A 2020-04-17 2020-04-17 Keyboard and keyboard assembling method Active CN111506202B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010307333.4A CN111506202B (en) 2020-04-17 2020-04-17 Keyboard and keyboard assembling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010307333.4A CN111506202B (en) 2020-04-17 2020-04-17 Keyboard and keyboard assembling method

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CN111506202A CN111506202A (en) 2020-08-07
CN111506202B true CN111506202B (en) 2023-09-12

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105702505A (en) * 2014-11-28 2016-06-22 富泰华工业(深圳)有限公司 Keyboard and assembly method thereof
TW201724149A (en) * 2015-12-28 2017-07-01 達方電子股份有限公司 Keyswitch and keyboard thereof
CN209015958U (en) * 2018-11-14 2019-06-21 东莞市极制电子科技有限公司 A kind of casing integrated with body keyboard

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105702505A (en) * 2014-11-28 2016-06-22 富泰华工业(深圳)有限公司 Keyboard and assembly method thereof
TW201724149A (en) * 2015-12-28 2017-07-01 達方電子股份有限公司 Keyswitch and keyboard thereof
CN209015958U (en) * 2018-11-14 2019-06-21 东莞市极制电子科技有限公司 A kind of casing integrated with body keyboard

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