CN111506202A

CN111506202A - Keyboard and keyboard assembling method

Info

Publication number: CN111506202A
Application number: CN202010307333.4A
Authority: CN
Inventors: 梁小强; 石磊; 朱洪根
Original assignee: Lite On Technology Changzhou Co Ltd
Current assignee: Lite On Technology Changzhou Co Ltd
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2020-08-07
Anticipated expiration: 2040-04-17
Also published as: CN111506202B

Abstract

The application discloses a keyboard and a keyboard assembly method. The key module is provided with a bottom plate, a circuit board and a plurality of key groups, wherein the circuit board is arranged on the bottom plate, the key groups are arranged on the circuit board, the bottom plate is provided with a plurality of connecting holes, the circuit board is provided with a plurality of through holes, and the connecting holes are respectively corresponding to the through holes. The keyboard frame is arranged on the key module and is provided with a plurality of key openings, and the plurality of key groups are respectively positioned in the corresponding key openings. The connecting pieces are respectively filled in the corresponding connecting holes and are connected with the surface, close to the circuit board, of the keyboard frame through the corresponding through holes. The structure can easily complete assembly without using screws, so that the problems of improper assembly such as poor locking, tooth slippage and the like are avoided, and the problem of short circuit caused by falling into the computer due to loosening of the screws is also avoided.

Description

Keyboard and keyboard assembling method

Technical Field

The present application relates to the field of keyboards and keyboard manufacturing technologies, and in particular, to a keyboard and a keyboard assembling method.

Background

At present, the computer keyboard is mostly assembled by using a hot melting mode, a screw locking mode or a rivet mode, wherein the screw locking mode causes more problems, for example, the problems of poor screw locking, tooth slipping and the like often occur because the number of screws is more and the operation of personnel and machines is difficult, and even the problem of short circuit caused by that the screws are loosened and fall into the computer is caused.

Disclosure of Invention

The embodiment of the application provides a keyboard assembling method, which can solve the problem of various assembling caused by using assembling pieces such as screws in the prior art by combining materials without using screws.

In order to solve the technical problem, the present application is implemented as follows:

there is provided a keyboard assembly method, including: arranging the keyboard frame on the key module, and correspondingly penetrating a plurality of keys through a plurality of key openings; and a plurality of connecting pieces are respectively formed corresponding to the connecting holes, and the connecting pieces are bonded with the surface of the keyboard frame close to the circuit board through the through holes.

A keyboard is provided that includes a key module, a keyboard frame, and a plurality of connectors. The key module is provided with a bottom plate, a circuit board and a plurality of key groups, wherein the circuit board is arranged on the bottom plate, the key groups are arranged on the circuit board, the bottom plate is provided with a plurality of connecting holes, the circuit board is provided with a plurality of through holes, and the connecting holes are respectively corresponding to the through holes. The keyboard frame is arranged on the key module and is provided with a plurality of key openings, and the plurality of key groups are respectively positioned in the corresponding key openings. The connecting pieces are respectively filled in the corresponding connecting holes and are connected with the surface, close to the circuit board, of the keyboard frame through the corresponding through holes.

In the embodiment of the application, the combination material is combined with the bottom plate and the cover plate, so that the assembly can be easily completed, and screws are not used, so that the problems of improper assembly such as poor locking, tooth sliding and the like are solved, and the problem of short circuit caused by falling into a computer due to loosening of the screws is solved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a flow chart of a keyboard assembly method according to an embodiment of the present application;

fig. 2 to 4 are schematic views illustrating operation steps of a keyboard assembling method according to a first embodiment of the present application;

FIGS. 5 to 7 are schematic views illustrating the operation steps of a keyboard assembling method according to a second embodiment of the present application;

fig. 8 to 10 are schematic views of the operation steps of the keyboard assembling method according to the third embodiment of the present application;

FIG. 11 is a top view of a keyboard assembled by the keyboard assembly method of the present application;

FIG. 12 is an exploded perspective view of the keyboard of FIG. 11;

FIG. 13 is a cross-sectional view of the keyboard of FIG. 11 taken along line A-A;

FIG. 14 is a side view of the keyboard of FIG. 12;

FIG. 15 is an exploded view of a keyboard according to another embodiment of the present application;

fig. 16 is an exploded view of a keyboard according to yet another embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Please refer to fig. 1, which is a flowchart illustrating a keyboard assembling method according to an embodiment of the present application; as shown in the drawings, the present embodiment provides a keyboard assembly method, first performing step S1, in step S1, providing a bottom plate 10, and disposing a plurality of key groups 20 on the bottom plate 10 to form a key module. Please refer to fig. 2 to fig. 4, which are schematic diagrams illustrating operation steps of a keyboard assembly method according to an embodiment of the present application. As shown in fig. 2, a base plate 10 is provided. The base plate 10 may be a metal plate, such as an iron plate. The plurality of key groups 20 are disposed on the circuit board 30, and the key groups 20 and the circuit board 30 are disposed on the base plate 10.

Referring back to fig. 1, after step S1 is completed, the process then proceeds to step S2. In step S2, a keyboard frame 40 is provided, wherein the keyboard frame 40 has a plurality of key openings 41. As shown in fig. 2, a keyboard frame 40 is provided, and the keyboard frame 40 has a plurality of key tops 41. The keyboard frame 40 may be an injection-molded plate, and a plurality of key openings 41 are formed simultaneously during injection molding, and each key opening 41 corresponds to the key group 20. The keyboard frame 40 includes a first surface 42 and a second surface 43, and the first surface 42 is disposed opposite to the second surface 43.

Referring back to fig. 1, after step S2 is completed, the process then proceeds to step S3. In step S3, a plurality of connection holes 11 are formed on the base plate 10. As shown in fig. 2, the bottom plate 10 has a plurality of connection holes 11, and the connection holes 11 may be formed in the bottom plate 10 by stamping. The position of the coupling hole 11 corresponds to the first surface 42 of the keyboard frame 40. In addition, since the circuit board 30 is disposed on the base plate 10 and the connection holes 11 of the base plate 10 are adapted to be filled with a connection paste M, which will be described later, the through holes 31 are correspondingly formed in the circuit board 30, and the through holes 31 of the circuit board 30 correspond to the connection holes 11 of the base plate 10.

Referring back to fig. 1, after step S3 is completed, the process then proceeds to step S4. In step S4, keyboard frame 40 is assembled to bottom plate 10, and a plurality of key groups 20 are inserted through a plurality of key openings 41. As shown in fig. 2 and 3, the first surface 42 of the keyboard frame 40 faces the base plate 10, and the first surface 42 of the keyboard frame 40 is pressed against the circuit board 30. The first surface 42 of the keyboard frame 40 is exposed through the through-hole 31 of the circuit board 30 and the connection hole 11 of the base plate 10.

Referring back to fig. 1, after step S4 is completed, the process then proceeds to step S5. In step S5, the connection glue M is poured into the connection holes 11 and attached to the keyboard frame 40. (refer to fig. 3 and 4) a connection adhesive M is poured into the connection holes 11 of the base plate 10 and the through holes 31 of the circuit board 30 and attached to the first surface 42 of the keyboard frame 40. And then, the connecting colloid M is cured or hardened and fixed on the keyboard frame 40 and the bottom plate 10, the cured connecting colloid M respectively forms a plurality of connecting pieces corresponding to the connecting holes 11 of the bottom plate 10, and the connecting pieces are adhered to the surface of the keyboard frame 40 close to the circuit board 30 through the connecting holes 11. The assembly of the base plate 10 and the keyboard frame 40 can be completed, and the curing or hardening of the connecting colloid M can be completed by illumination, pressurization or heating. The key group 20 and the circuit board 30 are sandwiched between the bottom plate 10 and the keyboard frame 40 to perform the positioning function.

In this embodiment, the step of pouring the connection colloid M into the connection hole 11 and attaching the connection colloid M to the keyboard frame 40 includes: the connection colloid M is continuously poured and exposed out of the surface of the bottom plate 10. The diameter of the portion of the connection colloid M exposed out of the surface of the base plate 10 is larger than that of the connection hole 11. After the connecting colloid M is hardened in this way, the connecting colloid M forms an enlarged head outside the connecting hole 11 and is adhered to the surface of the base plate 10 by gluing.

In the present embodiment, two opposite surfaces of the bottom plate 10 are formed with an isolation protrusion 12 (first isolation protrusion) on one surface at a position corresponding to the connection hole 11 (please refer to fig. 14), and a positioning groove 13 on the other surface, in the present embodiment, the isolation protrusion 12 is circular, each connection hole 11 is circular, and the center of the connection hole 11 coincides with the center of each isolation protrusion 12. The diameter of the through hole 31 of the circuit board 30 is larger than the diameter of the isolation convex portion 12 of the bottom plate 10, so that the through hole 31 of the circuit board 30 can be sleeved on the isolation convex portion 12 of the bottom plate 10 to play a role in positioning when the circuit board 30 is disposed on the bottom plate 10, and on the other hand, in the process that the connection colloid M is poured into the connecting hole 11 of the bottom plate 10 to the first surface 42 of the keyboard frame 40, the isolation convex portion 12 can play a role in isolating the connection colloid M to prevent the connection colloid M from being adhered to the circuit board 30. The isolating projection 12 abuts against the first surface 42 of the keyboard frame 40. The positioning groove 13 on the other surface of the bottom plate 10 can be filled in the positioning groove 13 when the connecting colloid M is poured into the connecting hole 11, so that the positioning groove 13 is filled with the connecting member formed by the solidified connecting colloid M. The diameter of the positioning groove 13 is larger than that of the connection hole 11, so that the aforementioned enlarged head can be formed at the outer end of the connection hole 11 after the bonding gel M is hardened.

Please refer to fig. 5 to 7, which are schematic views illustrating operation steps of a keyboard assembly method according to a second embodiment of the present application. As shown in the drawing, the same components of the present embodiment as those of the first embodiment are given the same symbols and the description thereof is omitted. The difference between the present embodiment and the first embodiment is that the present embodiment forms a connection groove 44 on the keyboard frame 40, and the location of the connection groove 44 corresponds to the connection hole 11. The first surface 42 of the keypad frame 40 of the present embodiment forms the coupling groove 44, and the coupling groove 44 may be formed simultaneously when the keypad frame 40 is injection molded. The step S4 of pouring the connection glue M into the connection holes 11 and attaching the connection glue M to the keyboard frame 40 includes pouring the connection glue M into the connection grooves 44. When the connection colloid M is cured to form connection members, each connection member fills the corresponding connection hole 11 and connection groove 44.

The diameter of the connection groove 44 may be the same as that of the connection hole 11, or the diameter of the connection groove 44 may be larger than that of the connection hole 11, or the diameter of the connection groove 44 may be smaller than that of the connection hole 11. The depth of the connection grooves 44 may be set appropriately so that the connection colloid M filled in the connection grooves 44 is hardened to generate a sufficient bonding force.

Please refer to fig. 8 to 10, which are schematic views illustrating operation steps of a keyboard assembly method according to a third embodiment of the present application. As shown in the drawing, the same components of the present embodiment as those of the first embodiment are given the same symbols and the description thereof is omitted. The difference between the present embodiment and the first embodiment is that the opposite surfaces of the bottom plate 10 of the present embodiment are formed with a ring-shaped protrusion 14 on one surface and a recess on the other surface at the position corresponding to the connecting hole 11, but the recess of the present embodiment faces the keyboard frame 40, so that an accommodating space is formed between the bottom plate 10 and the keyboard frame 40. When the connection colloid M is poured into the connection hole 11, the connection colloid M may be attached to the outside of the first surface 42 of the keyboard frame 40 and partially filled in the accommodating space. When the bonding adhesive M is hardened, an adhesion portion may be formed on the first surface 42 of the keyboard frame 40, the receiving space and the annular protrusion 14 outside the connection hole 11, so as to increase the bonding force between the base plate 10 and the keyboard frame 40. In the present embodiment, the coupling colloid M forms an enlarged head at the annular convex portion 14 outside the connection hole 11. In addition, in the present embodiment, the annular protrusion 14 is circular, each of the connection holes 11 is circular, and the center of the connection hole 11 coincides with the center of each of the annular protrusions 14. The first surface 42 of the keyboard frame 40 of this embodiment may have no connecting slots like the first embodiment, or may have connecting slots 44 (as shown in fig. 5) like the second embodiment. As shown in fig. 8 to 10, the first surface 42 of the keyboard frame 40 of the present embodiment does not have a connection groove. Therefore, the difference between this embodiment and the second embodiment shown in fig. 5 is that the bottom plate 10 of this embodiment has the annular convex portion 14 and the keyboard frame 40 does not have the connecting slot, while the bottom plate 10 of the second embodiment has the recessed positioning slot 13 and the keyboard frame 40 has the connecting slot 44.

Please refer to fig. 11, 12, 13 and 14, which are a top view of the keyboard assembled by the keyboard assembling method of the present application, an exploded perspective view of the keyboard of fig. 11, a cross-sectional view of the keyboard of fig. 11 and a side view of the keyboard of fig. 12. The keyboard 100 includes, in addition to the base plate 10, the key set 20, the circuit board 30 and the keyboard frame 40, the keyboard 100 further includes an outer cover 50 and a protective plate 60, the outer cover 50 covers the second surface 43 of the keyboard frame 40, in this embodiment, the outer cover 50 may be a frame (also referred to as a C-piece) of a notebook computer, and the protective plate 60 is disposed on the back of the base plate 10.

In another embodiment, as shown in fig. 15, the isolation convex portion 12 '(second isolation convex portion) may also be disposed on the keyboard frame 40, extending from the first surface 42 of the keyboard frame 40 toward the bottom plate 10, and a connection groove 44' as shown in fig. 5 is formed in the isolation convex portion 12 ', the connection hole 11 on the bottom plate 10 corresponds to the connection groove 44' of the isolation convex portion 12 ', and the connection glue is poured into the connection hole 11 and the connection groove 44'. Similarly, the through hole 31 of the circuit board 30 is disposed on the isolation protrusion 12' to position and isolate the connection colloid.

In another embodiment, as shown in fig. 16, the isolation convex portion 12 (first isolation convex portion) and the isolation convex portion 12 ' (second isolation convex portion) may be respectively disposed on the bottom plate 10 and the keyboard frame 40, the isolation convex portions 12, 12 ' on the bottom plate 10 and the keyboard frame 40 extend toward each other and are aligned with each other to be assembled, the connection hole 11 is disposed on the isolation convex portion 12 of the bottom plate 10, the connection groove 44 ' is disposed on the isolation convex portion 12 ' on the keyboard frame 40, and the connection groove 44 ' and the connection hole 11 are aligned with each other. The coupling gel is poured into the coupling holes 11 and the coupling grooves 44'. Similarly, the through hole 31 of the circuit board 30 is sleeved on the isolation convex portions 12 and 12' to play a role of positioning and isolating the connection colloid.

In summary, the present application provides a keyboard assembly method, which can easily complete assembly by combining a bottom plate and a keyboard frame through a connection adhesive without using screws, thereby preventing improper assembly such as poor locking and tooth slippage, and preventing short circuit caused by falling into a computer due to loosening of the screws. And the connecting colloid is filled in the connecting groove of the keyboard frame and the accommodating space between the keyboard frame and the bottom plate, and an expanded head is formed outside the bottom plate, so that the binding force between the bottom plate and the keyboard frame can be increased, and the same or even better fixing effect as that of fixing pieces such as screws is achieved.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A keyboard, comprising:

the key module is provided with a bottom plate, a circuit board and a plurality of key groups, wherein the circuit board is arranged on the bottom plate, the plurality of key groups are arranged on the circuit board, the bottom plate is provided with a plurality of connecting holes, the circuit board is provided with a plurality of through holes, and the plurality of connecting holes respectively correspond to the plurality of through holes;

the keyboard frame is arranged on the key module and is provided with a plurality of key openings, and the plurality of key groups are respectively positioned in the corresponding key openings;

and the connecting pieces are respectively filled in the corresponding connecting holes and are connected with the surface, close to the circuit board, of the keyboard frame through the corresponding through holes.

2. The keyboard of claim 1, wherein the frame has a plurality of attachment slots located on a surface of the frame adjacent to the circuit board and corresponding to a plurality of attachment holes, each of the attachment members filling a corresponding one of the attachment holes and the attachment slots.

3. The keyboard of claim 2, wherein a diameter of the coupling slot is equal to a diameter of the coupling hole.

4. The keyboard according to any one of claims 1 to 3, wherein the surface of the bottom plate away from the circuit board has a plurality of positioning grooves, a plurality of the connection holes are located in the corresponding positioning grooves, and each of the connection members is filled in the corresponding positioning groove.

5. The keyboard of claim 4, wherein the diameter of the positioning slot is greater than the diameter of the connecting hole.

6. The keyboard of claim 4, wherein the through holes have a diameter larger than that of the connecting holes, the surface of the bottom plate near the circuit board has a plurality of first isolating protrusions, the first isolating protrusions are respectively located in the corresponding through holes and abut against the surface of the keyboard frame near the circuit board, and each connecting hole penetrates through the corresponding first isolating protrusion.

7. The keyboard according to any one of claims 1 to 3, wherein the surface of the bottom plate remote from the circuit board has a plurality of annular convex portions, a plurality of the connection holes are located in the corresponding annular convex portions, and each of the connectors is filled in the corresponding annular convex portion.

8. The keyboard of claim 7, wherein the annular protrusion has a diameter greater than a diameter of the attachment hole.

9. The keyboard of claim 7, wherein the through holes have a diameter larger than that of the connecting holes, the surface of the bottom plate adjacent to the circuit board has a plurality of isolating protrusions, the isolating protrusions are respectively located in the corresponding through holes and abut against the surface of the keyboard frame adjacent to the circuit board, and each connecting hole penetrates through the corresponding isolating protrusion.

10. The keyboard of claim 6, wherein the keyboard frame is provided with a plurality of second isolation protrusions, each second isolation protrusion corresponding to and abutting against each first isolation protrusion, the connection groove is provided at the second isolation protrusions, and the first isolation protrusions and the second isolation protrusions correspond to the through holes.

11. The keyboard according to any one of claims 1 to 3, wherein a surface of the keyboard frame adjacent to the circuit board has a plurality of second isolation convex portions, the plurality of second isolation convex portions are respectively located in the corresponding through holes and abut on a surface of the bottom plate adjacent to the circuit board, and the connection groove is provided in the second isolation convex portions.

12. A keyboard assembly method for assembling the keyboard of claim 1, comprising:

arranging the keyboard frame on the key module, and correspondingly penetrating a plurality of keys through a plurality of key openings;

and a plurality of connecting pieces are respectively formed corresponding to the connecting holes, and the connecting pieces are bonded with the surface of the keyboard frame close to the circuit board through the through holes.

13. The keyboard assembly method of claim 12, wherein the step of forming a plurality of the connecting members to the corresponding connecting holes respectively comprises:

filling a connecting colloid in the connecting holes, and bonding the connecting colloid with the surface of the keyboard frame close to the circuit board through the through holes;

and curing the connecting colloid to form a plurality of connecting pieces.