CN111504766B - MEMS probe single-rotating-shaft symmetric bending test structure and pitching arm thereof - Google Patents

MEMS probe single-rotating-shaft symmetric bending test structure and pitching arm thereof Download PDF

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Publication number
CN111504766B
CN111504766B CN202010383675.4A CN202010383675A CN111504766B CN 111504766 B CN111504766 B CN 111504766B CN 202010383675 A CN202010383675 A CN 202010383675A CN 111504766 B CN111504766 B CN 111504766B
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arm
cross
adapter
rotating shaft
lifting
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CN111504766A (en
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于海超
周明
赵梁玉
刘明星
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Strong Half Conductor Suzhou Co ltd
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Maxone Semiconductor Suzhou Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G01N2203/0017—Tensile
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0023—Bending
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/003—Generation of the force
    • G01N2203/005—Electromagnetic means

Abstract

The invention relates to a MEMS probe single-rotating-shaft symmetric bending test structure and a pitching arm thereof, belonging to the field of IC manufacturing industry; the structure is sequentially provided with a first main rotating shaft, a first shaft adapter, a cross adapter, a second shaft adapter and a second main rotating shaft from top to bottom, wherein the first main rotating shaft, the first shaft adapter, the cross adapter, the second shaft adapter and the second main rotating shaft are vertically symmetrical relative to the cross adapter; the left end of the cross adapter is coaxially provided with a rotatable left pitching arm, and the right end of the cross adapter is coaxially provided with a rotatable right pitching arm; lifting rods are respectively arranged at the outer end parts of the left pitching arm and the right pitching arm through rotating shafts, and the lower end parts of the lifting rods are respectively connected to the top ends of the lifting structures; the lifting structure moves up and down; the structure can simultaneously test the tensile property and the bending property of a plurality of probe cards with different sizes; the MEMS device can be realized by only one motor, so that the condition that a plurality of driving devices are crowded under a small size is avoided, and the heat dissipation problem of the MEMS device is solved.

Description

MEMS probe single-rotating-shaft symmetric bending test structure and pitching arm thereof
Technical Field
The invention discloses a single-rotating-shaft symmetric bending test structure of an MEMS (micro-electromechanical system) probe and a pitching arm thereof, belongs to the field of IC (integrated circuit) manufacturing industry, and particularly relates to a device and a method for testing the performance of a palladium alloy probe in an MEMS probe card and related key technologies.
Background
The probe card is an important technology in the chip manufacturing process, before the chip is packaged, the probe on the probe card is directly contacted with the welding pad or the lug on the chip, the chip signal is led out, and then the automatic measurement is realized by matching with a peripheral test instrument and software control, so that the defective product is screened out, and the product yield is ensured.
With the development of Micro Electro Mechanical System (MEMS) technology, the size of the chip is smaller and smaller, reaching millimeter level, and the integration level inside the chip is higher and higher, reaching micron level, even nanometer level. This makes probe cards for testing chips extremely challenging and also puts new demands on the probes:
firstly, the density of the probes is required to be small, so that the chip is prevented from being damaged in the test process;
secondly, the strength of the probe is required to be high, so that the self damage in the test process is avoided;
thirdly, the elastic modulus is large, so that the probe can be fully contacted with the chip;
fourthly, the heat dissipation performance is good, and the influence of temperature drift errors on the test result is reduced by reducing the change of the test temperature in the test process;
fifthly, the shock absorption is good, and the interruption of a test signal caused by the separation of a probe and a chip in the test process is avoided;
the palladium alloy is an alloy formed by adding other elements into palladium as a base, and has the characteristics of small density, high strength, large elastic modulus, good heat dissipation and good shock absorption, so that the palladium alloy can be used for manufacturing probes of probe cards. MEMS probe cards based on palladium alloy probes have performance and life directly determined by the probes, and in order to evaluate the performance of the probe card correctly, the palladium alloy probes need to be tested.
However, no special test equipment specially used for testing various properties of the palladium alloy probe is found at present. The situation is not only because the MEMS probe card has new technology and narrow field, and is difficult to be directly applied by general equipment, but also the technical difficulty of manufacturing special test equipment for testing various performances of the palladium alloy probe is high, because the MEMS probe card has small volume and parts are only in millimeter level, the requirement on the number of driving systems is very strict, and if the number of the driving systems is too large, the driving systems are not arranged in a limited space, and the problem of heat dissipation is difficult to solve.
Disclosure of Invention
Aiming at the requirement of a palladium alloy probe performance test in an MEMS probe card, and simultaneously aiming at the problem that the field lacks a device and a method for detecting the palladium alloy probe performance, the invention discloses an MEMS palladium alloy probe test device, a method and related key technologies, which are intended to test the tensile performance and the bending performance of a palladium alloy probe.
The purpose of the invention is realized as follows:
an MEMS palladium alloy probe testing device comprises a barrel-shaped shell, a disturbance structure arranged on the inner wall of the barrel-shaped shell, an electromagnetic pole arranged on the outer wall of the barrel-shaped shell, a reference testing platform horizontally arranged in the barrel-shaped shell, a symmetrical bending testing structure positioned above the reference testing platform, a sealing cover arranged above the barrel-shaped shell, and a sensor, a sprayer, a heater and a fan which are arranged on the sealing cover;
the disturbance structure comprises a disturbance main body with a circular section, a roller and tooth structure arranged on the outer wall of the disturbance main body and a disturbance plate arranged on the inner wall of the disturbance main body; four tooth structures are uniformly distributed along the circumference of the cross section of the disturbance main body; the number of the disturbing plates is multiple;
the electromagnetism utmost point has six, evenly distributed on the circumference of tubbiness casing outer wall cross-section, six two liang of electromagnetism utmost points are relative, constitute three magnetic poles of group to right, are magnetic pole pair A, magnetic pole pair B and magnetic pole pair C respectively, and the circular telegram order is in proper order:
the first sequence is as follows: pole pair a → pole pair B → pole pair C, or: pole pair C → pole pair B → pole pair a;
and a second sequence: pole pair a pole pair B → pole pair B pole pair C → pole pair C pole pair a, or: pole pair C pole pair A → pole pair B pole pair C → pole pair A pole pair B;
and the sequence is three: pole pair A → pole pair A pole pair B → pole pair B pole pair C → pole pair C pole pair A; or: pole pair C pole pair a → pole pair C → pole pair B → pole pair a;
the sensors include a temperature sensor and a humidity sensor.
Further, the benchmark test platform comprises a main board and a plurality of sliding blocks, wherein the main board is provided with openings from two sides to the symmetrical center direction, the cross section of each opening is in an I shape, the sliding blocks are inserted into the openings, a plurality of circular through holes in the vertical direction are distributed on the sliding blocks at equal intervals, and the through holes can be provided with lifting structures; the main plate and the slide block are made of different materials, and the method specifically comprises the following steps:
firstly, the speed of the volume increase of the main board material along with the temperature rise is smaller than the speed of the volume increase of the slide block material along with the temperature rise, and the main board and the slide block are assembled at the temperature lower than the test environment before the performance of the palladium alloy probe is tested, so that the main board and the slide block are tightly matched when the probe performance of the palladium alloy is tested;
secondly, the main board is made of a material with thermal shrinkage and cold expansion properties, the sliding block is made of a material with thermal expansion and cold contraction properties, the main board and the sliding block are assembled at a temperature lower than a test environment before the performance of the palladium alloy probe is tested, and the main board and the sliding block are tightly matched when the performance of the palladium alloy probe is tested;
thirdly, the speed of the main board material increasing in volume along with the temperature rise is greater than the speed of the sliding block material increasing in volume along with the temperature rise, the main board and the sliding block are assembled at the temperature higher than the test environment temperature before the performance of the palladium alloy probe is tested, and the main board and the sliding block are ensured to be tightly matched when the performance of the palladium alloy probe is tested;
fourthly, the main board is made of a material with thermal expansion and cold contraction performance, the sliding block is made of a material with thermal expansion and cold expansion performance, the main board and the sliding block are assembled at a temperature higher than a test environment temperature before the performance of the palladium alloy probe is tested, and the main board and the sliding block are tightly matched when the performance of the palladium alloy probe is tested;
the mainboard symmetry central point puts and still is provided with the elevating platform, the elevating platform can fix the probe that awaits measuring.
Further, the symmetric bending test structure comprises a pitching arm, specifically a left pitching arm and a right pitching arm;
the left pitching arm comprises a left support arm, a left cross arm and a left connecting arm, wherein the rotating shaft of the left support arm is connected to the left end of the cross-shaped adapter, the left cross arm is vertically connected to the left support arm and is positioned in the horizontal direction, the left connecting arm is vertically connected to the left cross arm and is parallel to the left support arm, the left connecting arm and the left cross arm can be detached and replaced, the number of the left connecting arms is multiple, the length of the left connecting arms can be adjusted, and each left connecting arm is;
the right pitching arm comprises a right support arm, a right cross arm and a right connecting arm, wherein the right support arm is connected to the right end of the cross adaptor in a rotating shaft manner, the right cross arm is vertically connected to the right support arm and is positioned in the horizontal direction, the right connecting arm is vertically connected to the right cross arm and is parallel to the right support arm, the right connecting arm and the right cross arm can be detached and replaced, the number of the right connecting arms is multiple, the length of the right connecting arms can be adjusted, and each right connecting arm is;
the left support arm and the right support arm are located on the same straight line.
A MEMS palladium alloy probe test method comprises the following steps:
step a, loading a probe to be tested: the method comprises a method for loading a probe to be tested during testing tensile performance and a method for loading a probe to be tested during testing bending performance;
step b, setting a test temperature and humidity: the temperature and humidity are adjusted through the monitoring of a sensor and the matching of a sprayer, a heater and a fan, and in the adjusting process, a disturbance main body rotates under the action of an electromagnetic pole to ensure that the temperature and the humidity in a test environment are uniform;
and c, testing, namely only working by a symmetrical bending test structure to realize the test of the tensile property and the bending property of the probe to be tested with a plurality of different parameters.
Further, the method for loading the probe to be tested in the process of testing the tensile property comprises the following specific steps:
a1, assembling a main board and a sliding block according to the size and the test parameters of a probe to be tested;
step a2, retracting the lifting platform from the lower part of the main board;
step a3, loading a lifting structure on a slide block;
and a4, adhering the probes to be tested on the two symmetrical lifting structures, wherein at the moment, the probes to be tested can not move up and down relative to the lifting structures, and can not move left and right relative to the lifting structures.
Further, the method for loading the probe to be tested in the process of testing the bending performance comprises the following specific steps:
a1, assembling a main board and a sliding block according to the size and the test parameters of a probe to be tested;
step a2, extending the lifting platform from the lower part of the main board, wherein the length of the extension is not less than the longest length of the extension of the lifting structure from the lower part of the main board;
a3, sticking a probe to be tested below the lifting table;
step a4, loading a lifting structure on a slide block;
step a5, the lifting platform is retracted,
the average value of the longest length and the shortest length of the lifting structure extending out of the lower part of the main board realizes the test of the differential bending performance in the positive direction and the negative direction;
or
The shortest length of the lifting structure extending out of the lower part of the main board realizes the simultaneous double-parameter bending performance test of one probe;
at this time, the probe to be tested cannot move up and down relative to the lifting structure, but can move left and right relative to the lifting structure.
A symmetrical bending test structure of a single rotating shaft of an MEMS probe is sequentially provided with a first main rotating shaft, a first shaft adapter, a cross adapter, a second shaft adapter and a second main rotating shaft from top to bottom, wherein the first main rotating shaft, the first shaft adapter, the cross adapter, the second shaft adapter and the second main rotating shaft are vertically symmetrical relative to the cross adapter;
the first shaft adapter comprises a first flat plate and a first inclined plate, and the second shaft adapter comprises a second flat plate and a second inclined plate; the first flat plate and the first main rotating shaft rotate synchronously, the second flat plate and the second main rotating shaft rotate synchronously, the first main rotating shaft and the second main rotating shaft coaxially rotate synchronously, the first inclined plate is connected with an upper end universal shaft of the cross adapter, and the second inclined plate is connected with a lower end universal shaft of the cross adapter;
the left end of the cross adapter is coaxially provided with a rotatable left pitching arm, and the right end of the cross adapter is coaxially provided with a rotatable right pitching arm; lifting rods are mounted at the outer end parts of the left pitching arm and the right pitching arm through rotating shafts, and the lower end parts of the lifting rods are connected to the top end of the lifting structure; the lifting structure is limited to move only up and down.
Furthermore, the left pitching arm is limited to comprise a left support arm, a left cross arm and a left connecting arm, wherein the rotating shaft of the left support arm is connected to the left end of the cross-shaped adapter, the left cross arm is vertically connected to the left support arm and is positioned in the horizontal direction, the left connecting arm is vertically connected to the left cross arm and is parallel to the left support arm, the left connecting arm and the left cross arm can be detached and replaced, the number of the left connecting arms is multiple, the length of the left connecting arms can be adjusted, each left connecting arm is connected with one lifting rod in a rotating shaft mode, and;
the right pitching arm comprises a right support arm, a right cross arm and a right connecting arm, wherein the right support arm is connected to the right end of the cross adaptor in a rotating shaft manner, the right cross arm is vertically connected to the right support arm and is positioned in the horizontal direction, the right connecting arm is vertically connected to the right cross arm and is parallel to the right support arm, the right connecting arm and the right cross arm can be detached and replaced, the number of the right connecting arms is multiple, the length of the right connecting arms can be adjusted, each right connecting arm is connected with a lifting rod in a rotating shaft manner, and;
the left support arm and the right support arm are located on the same straight line.
A parameter adjustment method for MEMS probe single-axis symmetric bending test specifies:
the connecting point of the first inclined plate and the universal shaft of the cross adapter is a point A;
the connecting point of the second inclined plate and the universal shaft of the cross adapter is a point B;
the connecting point of the left pitching arm and the lifting rod rotating shaft is a point C;
the connecting point of the right pitching arm and the lifting rod rotating shaft is a point D;
the middle point of the AB connecting line is an o point, the o point is used as a coordinate origin, and a Cartesian coordinate system conforming to the right-hand spiral rule is established, wherein the direction from the o point to the first main rotating shaft is the positive direction of the z axis, the plane determined by the o point and the right pitching arm is the yoz plane, and the direction from the o point to the right pitching arm is the positive direction of the y axis;
the distance from the point A or the point B to the z axis is r;
the rotating angular speeds of the first main rotating shaft and the second main rotating shaft are omega;
the distance from the point A or the point B to the xoy plane is h;
the point A or the point B starts to rotate from the xoz plane, and the rotating time is t;
the distance from the point o to the reference test platform is H;
the distance from the point C or the point D to the point o is l;
the length of the lifting rod is l;
the distance from the lifting structure to the z axis is l;
when the first main rotating shaft and the second main rotating shaft are seen from the direction right opposite to the z-axis, the first main rotating shaft and the second main rotating shaft synchronously rotate anticlockwise;
at this time, the unidirectional movement displacement of the lifting structure is as follows:
Figure BDA0002483064410000051
wherein:
Figure BDA0002483064410000052
alpha is the included angle between the CD connecting line and the y axis.
Further, the air conditioner is provided with a fan,
the distance l between the lifting structure and the z axis is adjusted by changing the assembly position of the sliding block on the main board and selecting the position of the circular through hole of the lifting structure inserted into the sliding block, so that the requirements of testing probes with different sizes are met;
the lifting rod is selected to be a telescopic structure, and the length l of the lifting rod is adjusted by changing the length of the lifting rod;
selecting a first flat plate and a second flat plate as telescopic structures, and adjusting the distance l from a point C or a point D to a point o by changing the lengths of the first flat plate and the second flat plate;
the unidirectional motion displacement delta x of the lifting structure is realized by adjusting the z-axis distance l, the length l of the lifting rod, the C point or the distance l from the D point to the o point, and any one or two or all three of the three parameters0The requirements of the probe for testing under different parameters are further met by adjusting the probe.
Has the advantages that:
the invention discloses a device for testing an MEMS palladium alloy probe, which comprises a barrel-shaped shell, a disturbance structure, an electromagnetic pole, a reference test platform, a symmetrical bending test structure, a sealing cover, a sensor, a sprayer, a heater and a fan, wherein the structure can be used for testing the tensile property and the bending property of the probe on an MEMS probe card.
Secondly, because tooth structure has four along disturbance structure cross section circumference evenly distributed, six electromagnetic pole evenly distributed are on the circumference of tubbiness casing outer wall cross-section simultaneously, and six electromagnetic poles two liang are relative, constitute three group magnetic pole pairs to three secondary has been injectd the circular telegram order, such structure and method are injectd, can make the disturbance structure at the uniform velocity rotatory in the test procedure, and then make temperature humidity keep invariable in the test environment, are favorable to improving the test result accuracy.
Thirdly, the benchmark test platform comprises a mainboard and a plurality of sliding blocks, wherein the plurality of sliding blocks can be designed to test a plurality of probes simultaneously, so that the test efficiency is improved; in addition, the main board is provided with gaps from two sides to the symmetrical center direction, sliding blocks are inserted into the gaps, and meanwhile, the main board and the sliding blocks are assembled under the environment different from the test temperature according to the material matching of the main board and the sliding blocks, so that the position fixing without a transfer piece between the main board and the sliding blocks is realized; simultaneously, the equidistant circular through-hole that has a plurality of vertical directions that distributes on the slider for install elevation structure, consequently can realize testing not unidimensional probe.
Fourth, every single move arm includes that the pivot is connected in the support arm of cross adaptor, connects perpendicularly in the support arm and is located the xarm of horizontal direction, connects perpendicularly in the xarm and with the parallel linking arm of support arm, because can dismantle the change between linking arm and the xarm, the quantity of linking arm is a plurality of, and the length can be adjusted, consequently can realize carrying the adjustment of pull rod displacement, and then realize the test to the different tensile properties of probe and bending property.
Fifthly, in the MEMS palladium alloy probe testing method, the main board and the slide block are assembled firstly, then the lifting platform retracts from the lower part of the main board, the lifting structure is loaded on the slide block, and finally the probe to be tested is stuck on the two symmetrical lifting structures, so that the loading of the probe to be tested during the test of the tensile property is realized.
Sixthly, assembling the main board and the slide block, extending the lifting platform out of the lower part of the main board, sticking the probe to be tested below the lifting platform, loading the lifting structure on the slide block, and retracting the lifting platform, wherein the lifting platform is positioned on the average value of the longest length and the shortest length of the lifting structure extending out of the lower part of the main board, so as to realize the differential bending performance test in the positive direction and the negative direction; or the shortest length of the lifting structure extending out of the lower part of the main board realizes the simultaneous double-parameter bending performance test of one probe.
The key structural design of the first main rotating shaft, the first shaft adapter, the cross adapter, the second shaft adapter and the second main rotating shaft realizes that the lifting structure moves up and down under the condition that the first main rotating shaft and the second main rotating shaft synchronously move, and the pitching arm structure with multiple connecting arms disclosed by the invention is matched, so that the synchronous test of the tensile property and the bending property of a plurality of probe cards with different sizes can be carried out, the test efficiency is greatly improved, the consistency of test environment parameters is ensured, and the repeated measurement is realized by using one-time measurement time; because the synchronous motion of the first main rotating shaft and the second main rotating shaft can be realized only by one motor, the driving structure is minimized, the condition that a plurality of driving devices are crowded under the millimeter-scale or even micron-scale size is avoided, and the heat dissipation problem of the MEMS device is further solved.
The eighth invention discloses a parameter adjusting method for MEMS probe single-rotating-shaft symmetric bending test, which is used for meeting the test requirements of probes with different sizes by changing the assembly position of a sliding block on a main board and selecting the position of a circular through hole for inserting a lifting structure into the sliding block; the lifting rod is selected to be of a telescopic structure, the first flat plate and the second flat plate are selected to be of a telescopic structure, and the adjustment of unidirectional movement displacement of the lifting structure is achieved by changing the lengths of the lifting rod, the first flat plate and the second flat plate, so that the testing requirements of the probe under different parameters are met.
Drawings
FIG. 1 is a schematic structural diagram of a MEMS palladium alloy probe testing device of the present invention.
Fig. 2 is a schematic diagram of electromagnetic pole distribution on the outer wall of the barrel-shaped shell.
FIG. 3 is a schematic diagram of a benchmark platform.
FIG. 4 is a schematic diagram of a symmetric bend test structure.
FIG. 5 is a schematic structural diagram of a single-axis symmetric bending test structure.
FIG. 6 is a schematic view of the probe loading to be tested while testing tensile properties.
FIG. 7 is a first schematic view of a probe loading to be tested in testing bending performance.
FIG. 8 is a second schematic view of the probe loading to be tested during bending performance testing.
FIG. 9 is a first method for adjusting parameters of a single-axis symmetric bending test structure.
FIG. 10 is a second method for adjusting parameters of a single-axis symmetric bending test structure.
FIG. 11 is a third method for adjusting parameters of a single-axis symmetric bending test structure.
In the figure: 1 barrel-shaped shell, 2 disturbance structure, 2-1 disturbance main body, 2-2 rollers, 2-3 tooth structure, 2-4 disturbance plate, 3 electromagnetic pole, 4 benchmark test platform, 4-1 main plate, 4-2 slide block, 4-3 lifting platform, 5 symmetrical bending test structure, 5-1 first main rotating shaft, 5-2 first shaft adapter, 5-2-1 first flat plate, 5-2-2 first inclined plate, 5-3 cross adapter, 5-4 second shaft adapter, 5-4-1 second flat plate, 5-4-2 second inclined plate, 5-5 second main rotating shaft, 5-6 left pitching arm, 5-6-1 left support arm, 5-6-2 left cross arm and 5-6-3 left connecting arm, 5-7 parts of right pitching arm, 5-7-1 parts of right supporting arm, 5-7-2 parts of right cross arm, 5-7-3 parts of right connecting arm, 5-8 parts of lifting rod, 5-9 parts of lifting structure, 6 parts of sealing cover, 7 parts of sensor, 8 parts of sprayer, 9 parts of heater and 10 parts of fan.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Detailed description of the invention
The following is a specific embodiment of the MEMS palladium alloy probe test device of the present invention.
Fig. 1 shows a schematic structural diagram of a MEMS palladium alloy probe testing apparatus according to this embodiment. The MEMS palladium alloy probe testing device comprises a barrel-shaped shell 1, a disturbance structure 2 arranged on the inner wall of the barrel-shaped shell 1, an electromagnetic pole 3 arranged on the outer wall of the barrel-shaped shell 1, a reference testing platform 4 horizontally arranged in the barrel-shaped shell 1, a symmetrical bending testing structure 5 positioned above the reference testing platform 4, a sealing cover 6 arranged above the barrel-shaped shell 1, and a sensor 7, a sprayer 8, a heater 9 and a fan 10 which are arranged on the sealing cover 6;
the disturbance structure 2 comprises a disturbance main body 2-1 with a circular section, rollers 2-2 and tooth structures 2-3 arranged on the outer wall of the disturbance main body 2-1, and disturbance plates 2-4 arranged on the inner wall of the disturbance main body 2-1; four tooth structures 2-3 are uniformly distributed along the circumference of the section of the main disturbance body 2-1; the number of the disturbing plates 2-4 is multiple;
electromagnetic pole 3 has six, evenly distributed on the circumference of 1 outer wall cross-section of tubbiness casing, six two liang of electromagnetic poles are relative, constitute three magnetic pole pairs of group, are magnetic pole pair A, magnetic pole pair B and magnetic pole pair C respectively, as shown in fig. 2, the circular telegram order is in proper order:
the first sequence is as follows: pole pair a → pole pair B → pole pair C, or: pole pair C → pole pair B → pole pair a;
and a second sequence: pole pair a pole pair B → pole pair B pole pair C → pole pair C pole pair a, or: pole pair C pole pair A → pole pair B pole pair C → pole pair A pole pair B;
and the sequence is three: pole pair A → pole pair A pole pair B → pole pair B pole pair C → pole pair C pole pair A; or: pole pair C pole pair a → pole pair C → pole pair B → pole pair a;
the sensor 7 includes a temperature sensor and a humidity sensor.
Detailed description of the invention
The following is a specific embodiment of the MEMS palladium alloy probe test device of the present invention.
On the basis of the specific embodiment one, the MEMS palladium alloy probe testing device in the embodiment further defines that the benchmark testing platform includes a main board 4-1 and a plurality of sliders 4-2, the main board 4-1 is provided with openings from both sides to the direction of the symmetry center, the cross-sectional shape of each opening is in an i shape, the sliders 4-2 are inserted into the openings, the sliders 4-2 are equidistantly distributed with a plurality of circular through holes in the vertical direction, and the through holes can be provided with lifting structures 5-9, as shown in fig. 3; the main board 4-1 and the slide block 4-2 are made of different materials, specifically as follows:
firstly, the speed of the volume increase of the material of the main board 4-1 along with the temperature rise is smaller than the speed of the volume increase of the material of the sliding block 4-2 along with the temperature rise, before the performance of the palladium alloy probe is tested, the main board 4-1 and the sliding block 4-2 are assembled at the temperature lower than the testing environment temperature, and the main board 4-1 and the sliding block 4-2 are ensured to be tightly matched when the performance of the palladium alloy probe is tested;
secondly, the main board 4-1 is made of a material with thermal shrinkage and cold expansion properties, the sliding block 4-2 is made of a material with thermal expansion and cold contraction properties, the main board 4-1 and the sliding block 4-2 are assembled at a temperature lower than a test environment before the performance of the palladium alloy probe is tested, and the main board 4-1 and the sliding block 4-2 are ensured to be tightly matched when the performance of the palladium alloy probe is tested;
thirdly, the speed of the volume of the material of the main board 4-1 increasing with the temperature rise is higher than the speed of the volume of the material of the sliding block 4-2 increasing with the temperature rise, before the performance of the palladium alloy probe is tested, the main board 4-1 and the sliding block 4-2 are assembled at the temperature higher than the testing environment temperature, and the main board 4-1 and the sliding block 4-2 are ensured to be tightly matched when the performance of the palladium alloy probe is tested;
fourthly, the main board 4-1 is made of a material with thermal expansion and cold contraction performance, the sliding block 4-2 is made of a material with thermal expansion and cold expansion performance, the main board 4-1 and the sliding block 4-2 are assembled at a temperature higher than a test environment before the performance of the palladium alloy probe is tested, and the main board 4-1 and the sliding block 4-2 are ensured to be tightly matched when the performance of the palladium alloy probe is tested;
the symmetrical center of the main board 4-1 is further provided with a lifting table 4-3, and the lifting table 4-3 can fix a probe to be detected.
Detailed description of the invention
The following is a specific embodiment of the benchmark test platform in the MEMS palladium alloy probe test device of the present invention.
The benchmark test platform in the embodiment comprises a main board 4-1 and a plurality of sliding blocks 4-2, wherein the main board 4-1 is provided with openings from two sides to the symmetrical center direction, the cross section of each opening is in an I shape, the sliding blocks 4-2 are inserted into the openings, a plurality of circular through holes in the vertical direction are distributed on the sliding blocks 4-2 at equal intervals, and the through holes can be provided with lifting structures 5-9, as shown in fig. 3; the main board 4-1 and the slide block 4-2 are made of different materials, specifically as follows:
firstly, the speed of the volume increase of the material of the main board 4-1 along with the temperature rise is smaller than the speed of the volume increase of the material of the sliding block 4-2 along with the temperature rise, before the performance of the palladium alloy probe is tested, the main board 4-1 and the sliding block 4-2 are assembled at the temperature lower than the testing environment temperature, and the main board 4-1 and the sliding block 4-2 are ensured to be tightly matched when the performance of the palladium alloy probe is tested;
secondly, the main board 4-1 is made of a material with thermal shrinkage and cold expansion properties, the sliding block 4-2 is made of a material with thermal expansion and cold contraction properties, the main board 4-1 and the sliding block 4-2 are assembled at a temperature lower than a test environment before the performance of the palladium alloy probe is tested, and the main board 4-1 and the sliding block 4-2 are ensured to be tightly matched when the performance of the palladium alloy probe is tested;
thirdly, the speed of the volume of the material of the main board 4-1 increasing with the temperature rise is higher than the speed of the volume of the material of the sliding block 4-2 increasing with the temperature rise, before the performance of the palladium alloy probe is tested, the main board 4-1 and the sliding block 4-2 are assembled at the temperature higher than the testing environment temperature, and the main board 4-1 and the sliding block 4-2 are ensured to be tightly matched when the performance of the palladium alloy probe is tested;
fourthly, the main board 4-1 is made of a material with thermal expansion and cold contraction performance, the sliding block 4-2 is made of a material with thermal expansion and cold expansion performance, the main board 4-1 and the sliding block 4-2 are assembled at a temperature higher than a test environment before the performance of the palladium alloy probe is tested, and the main board 4-1 and the sliding block 4-2 are ensured to be tightly matched when the performance of the palladium alloy probe is tested;
the symmetrical center of the main board 4-1 is further provided with a lifting table 4-3, and the lifting table 4-3 can fix a probe to be detected.
Detailed description of the invention
The following is a specific embodiment of the MEMS palladium alloy probe test device of the present invention.
In the MEMS palladium alloy probe testing apparatus in this embodiment, on the basis of the first specific embodiment, the symmetric bending test structure 5 is further defined to include a pitch arm, specifically, a left pitch arm 5-6 and a right pitch arm 5-7;
the left pitching arm 5-6 comprises a left support arm 5-6-1, a left cross arm 5-6-2 and a left connecting arm 5-6-3, wherein the left support arm 5-6-1 is connected to the left end of the cross adapter 5-3 through a rotating shaft, the left cross arm 5-6-2 is vertically connected to the left support arm 5-6-1 and is positioned in the horizontal direction, the left connecting arm 5-6-3 is vertically connected to the left cross arm 5-6-2 and is parallel to the left support arm 5-6-1, the left connecting arm 5-6-3 and the left cross arm 5-6-2 can be detached and replaced, the number of the left connecting arms 5-6-3 is multiple, the length of the left connecting arms can be adjusted, and;
the right pitching arm 5-7 comprises a right support arm 5-7-1, a right cross arm 5-7-2 and a right connecting arm 5-7-3, wherein the right support arm 5-7-1 is connected to the right end of the cross adapter 5-3 through a rotating shaft, the right cross arm 5-7-2 is vertically connected to the right support arm 5-7-1 and is positioned in the horizontal direction, the right connecting arm 5-7-3 is vertically connected to the right cross arm 5-7-2 and is parallel to the right support arm 5-7-1, the right connecting arm 5-7-3 and the right cross arm 5-7-2 can be detached and replaced, the number of the right connecting arms 5-7-3 is multiple, the length of the right connecting arms can be adjusted;
the left support arm 5-6-1 and the right support arm 5-7-1 are located on the same straight line, as shown in fig. 4.
Detailed description of the invention
The following is a specific embodiment of a symmetric bending test structure in the MEMS palladium alloy probe test apparatus of the present invention.
The symmetrical bending test structure 5 in the embodiment comprises pitching arms, specifically comprises a left pitching arm 5-6 and a right pitching arm 5-7;
the left pitching arm 5-6 comprises a left support arm 5-6-1, a left cross arm 5-6-2 and a left connecting arm 5-6-3, wherein the left support arm 5-6-1 is connected to the left end of the cross adapter 5-3 through a rotating shaft, the left cross arm 5-6-2 is vertically connected to the left support arm 5-6-1 and is positioned in the horizontal direction, the left connecting arm 5-6-3 is vertically connected to the left cross arm 5-6-2 and is parallel to the left support arm 5-6-1, the left connecting arm 5-6-3 and the left cross arm 5-6-2 can be detached and replaced, the number of the left connecting arms 5-6-3 is multiple, the length of the left connecting arms can be adjusted, and;
the right pitching arm 5-7 comprises a right support arm 5-7-1, a right cross arm 5-7-2 and a right connecting arm 5-7-3, wherein the right support arm 5-7-1 is connected to the right end of the cross adapter 5-3 through a rotating shaft, the right cross arm 5-7-2 is vertically connected to the right support arm 5-7-1 and is positioned in the horizontal direction, the right connecting arm 5-7-3 is vertically connected to the right cross arm 5-7-2 and is parallel to the right support arm 5-7-1, the right connecting arm 5-7-3 and the right cross arm 5-7-2 can be detached and replaced, the number of the right connecting arms 5-7-3 is multiple, the length of the right connecting arms can be adjusted;
the left support arm 5-6-1 and the right support arm 5-7-1 are located on the same straight line, as shown in fig. 4.
Detailed description of the invention
The following is a specific embodiment of the MEMS palladium alloy probe test method of the invention.
The MEMS palladium alloy probe testing method in the embodiment comprises the following steps:
step a, loading a probe to be tested: the method comprises a method for loading a probe to be tested during testing tensile performance and a method for loading a probe to be tested during testing bending performance;
step b, setting a test temperature and humidity: monitoring by a sensor 7, matching a sprayer 8, a heater 9 and a fan 10 to realize temperature and humidity adjustment, wherein in the adjustment process, a disturbance main body 2-1 rotates under the action of an electromagnetic pole 3 to ensure uniform temperature and humidity in a test environment;
and c, testing, namely only working by the symmetrical bending test structure 5, so as to test the tensile property and the bending property of the probe to be tested with a plurality of different parameters.
Detailed description of the invention
The following is a specific embodiment of the MEMS palladium alloy probe test method of the invention.
The MEMS palladium alloy probe test method in this embodiment is further defined to include, on the basis of the sixth embodiment:
the method for loading the probe to be tested in the process of testing the tensile property comprises the following specific steps:
a1, assembling a main board 4-1 and a sliding block 4-2 according to the size of a probe to be tested and test parameters;
step a2, retracting the lifting platform 4-3 from the lower part of the main board 4-1;
step a3, loading a lifting structure 5-9 on a slide block 4-2;
a4, adhering probes to be tested on two symmetrical lifting structures 5-9, wherein the probes to be tested can neither move up and down relative to the lifting structures 5-9 nor move left and right relative to the lifting structures 5-9, as shown in fig. 6;
the method for loading the probe to be tested in the process of testing the bending performance comprises the following specific steps:
a1, assembling a main board 4-1 and a sliding block 4-2 according to the size of a probe to be tested and test parameters;
step a2, extending the lifting platform 4-3 from the lower part of the main board 4-1, wherein the extending length is not less than the longest length of the lifting structure 5-9 extending from the lower part of the main board 4-1;
a3, sticking a probe to be tested below the lifting table 4-3;
step a4, loading a lifting structure 5-9 on a slide block 4-2;
step a5, retracting the lift 4-3,
the average value of the longest length and the shortest length of the lifting structure 5-9 extending out of the lower part of the main board 4-1 realizes the test of the differential bending performance in the positive and negative directions, as shown in fig. 7;
or
The shortest length of the lifting structure 5-9 extending from the lower part of the main board 4-1 realizes the simultaneous double-parameter bending performance test of one probe, as shown in fig. 8;
at this time, the probe to be tested cannot move up and down relative to the elevating structure 5-9, but can move left and right relative to the elevating structure 5-9.
Detailed description of the invention
The following is a specific embodiment of the MEMS palladium alloy probe test device of the present invention.
On the basis of the specific embodiment one, the MEMS palladium alloy probe testing device in this embodiment further defines the symmetric bending testing structure 5 as a single-spindle symmetric bending testing structure, and the structure is sequentially provided with a first main spindle 5-1, a first spindle adapter 5-2, a cross adapter 5-3, a second spindle adapter 5-4 and a second main spindle 5-5 from top to bottom, where the first main spindle 5-1, the first spindle adapter 5-2, the cross adapter 5-3, the second spindle adapter 5-4 and the second main spindle 5-5 are vertically symmetric with respect to the cross adapter 5-3;
the first shaft adapter 5-2 comprises a first flat plate 5-2-1 and a first inclined plate 5-2-2, and the second shaft adapter 5-4 comprises a second flat plate 5-4-1 and a second inclined plate 5-4-2; the first flat plate 5-2-1 and the first main rotating shaft 5-1 rotate synchronously, the second flat plate 5-4-1 and the second main rotating shaft 5-5 rotate synchronously, the first main rotating shaft 5-1 and the second main rotating shaft 5-5 coaxially rotate synchronously, the first inclined plate 5-2-2 is connected with an upper end universal shaft of the cross adapter 5-3, and the second inclined plate 5-4-2 is connected with a lower end universal shaft of the cross adapter 5-3;
the left end of the cross adapter 5-3 is coaxially provided with a rotatable left pitching arm 5-6, and the right end of the cross adapter 5-3 is coaxially provided with a rotatable right pitching arm 5-7; lifting rods 5-8 are respectively mounted at the outer end parts of the left pitching arm 5-6 and the right pitching arm 5-7 through rotating shafts, and the lower end parts of the lifting rods 5-8 are respectively connected to the top ends of the lifting structures 5-9; the lifting structures 5-9 are constrained to move only up and down as shown in figure 5.
It should be noted that the matching relationship between the symmetrical bending test structure 5 and the MEMS palladium alloy probe test device according to the first embodiment belongs to the conventional technical means of those skilled in the art, and detailed description is not repeated in this application, and those skilled in the art can seal and match the symmetrical bending test structure 5 and the MEMS palladium alloy probe test device according to the structure of the washing machine drum, and ensure that the symmetrical bending test structure 5 can rotate under the action of a driving motor.
Detailed description of the invention
The following is a specific embodiment of a single-rotation-shaft symmetric bending test structure of the MEMS palladium alloy probe test device.
In the single-rotating-shaft symmetric bending test structure in the embodiment, a first main rotating shaft 5-1, a first shaft adapter 5-2, a cross adapter 5-3, a second shaft adapter 5-4 and a second main rotating shaft 5-5 are sequentially arranged from top to bottom, wherein the first main rotating shaft 5-1, the first shaft adapter 5-2, the cross adapter 5-3, the second shaft adapter 5-4 and the second main rotating shaft 5-5 are vertically symmetric with respect to the cross adapter 5-3;
the first shaft adapter 5-2 comprises a first flat plate 5-2-1 and a first inclined plate 5-2-2, and the second shaft adapter 5-4 comprises a second flat plate 5-4-1 and a second inclined plate 5-4-2; the first flat plate 5-2-1 and the first main rotating shaft 5-1 rotate synchronously, the second flat plate 5-4-1 and the second main rotating shaft 5-5 rotate synchronously, the first main rotating shaft 5-1 and the second main rotating shaft 5-5 coaxially rotate synchronously, the first inclined plate 5-2-2 is connected with an upper end universal shaft of the cross adapter 5-3, and the second inclined plate 5-4-2 is connected with a lower end universal shaft of the cross adapter 5-3;
the left end of the cross adapter 5-3 is coaxially provided with a rotatable left pitching arm 5-6, and the right end of the cross adapter 5-3 is coaxially provided with a rotatable right pitching arm 5-7; lifting rods 5-8 are respectively mounted at the outer end parts of the left pitching arm 5-6 and the right pitching arm 5-7 through rotating shafts, and the lower end parts of the lifting rods 5-8 are respectively connected to the top ends of the lifting structures 5-9; the lifting structures 5-9 are constrained to move only up and down as shown in figure 5.
It should be noted that the matching relationship between the symmetrical bending test structure 5 and the MEMS palladium alloy probe test device according to the first embodiment belongs to the conventional technical means of those skilled in the art, and detailed description is not repeated in this application, and those skilled in the art can seal and match the symmetrical bending test structure 5 and the MEMS palladium alloy probe test device according to the structure of the washing machine drum, and ensure that the symmetrical bending test structure 5 can rotate under the action of a driving motor.
Detailed description of the preferred embodiment
The following is a specific embodiment of the single-axis symmetric bending test structure.
In the single-rotating-shaft symmetric bending test structure in the embodiment, on the basis of the eighth specific embodiment or the ninth specific embodiment, the left pitching arm 5-6 is further limited to include a left arm 5-6-1 with a rotating shaft connected to the left end of the cross adaptor 5-3, a left cross arm 5-6-2 vertically connected to the left arm 5-6-1 and located in the horizontal direction, a left connecting arm 5-6-3 vertically connected to the left cross arm 5-6-2 and parallel to the left arm 5-6-1, the left connecting arm 5-6-3 and the left cross arm 5-6-2 can be detached and replaced, the number of the left connecting arms 5-6-3 is multiple, the length of the left connecting arms can be adjusted, each left connecting arm 5-6-3 is connected with one lifting rod 5-8 through a rotating shaft, the lower end part of each lifting rod 5-8 is connected with a lifting structure 5-9;
the right pitching arm 5-7 comprises a right support arm 5-7-1, a right cross arm 5-7-2, a right connecting arm 5-7-3, a lifting rod 5-8 and a lifting structure 5-9, wherein the right support arm 5-7-1 is connected to the right end of the cross adaptor 5-3 through a rotating shaft, the right cross arm 5-7-2 is vertically connected to the right support arm 5-7-1 and is positioned in the horizontal direction, the right connecting arm 5-7-3 is vertically connected to the right cross arm 5-7-2 and is parallel to the right support arm 5-7-1, the right connecting arm 5-7-3 and the right cross arm 5-7-2 can be detached and replaced, the number of the right connecting arms 5-7-3 is multiple, the length of the right connecting arms can be adjusted, the rotating shaft;
the left support arm 5-6-1 and the right support arm 5-7-1 are located on the same straight line, as shown in fig. 4.
Detailed description of the invention
The following is a specific embodiment of a parameter adjustment method for a single-axis symmetric bending test structure.
In the parameter adjustment method for the single-axis symmetric bending test structure according to this embodiment, the following rules are provided as shown in fig. 9 and 10:
the universal shaft connecting point of the first inclined plate 5-2-2 and the cross adapter 5-3 is a point A;
the universal shaft connecting point of the second inclined plate 5-4-2 and the cross adapter 5-3 is a point B;
the connecting point of the rotating shaft of the left pitching arm 5-6 and the lifting rod 5-8 is a point C;
the connecting point of the rotating shaft of the right pitching arm 5-7 and the lifting rod 5-8 is a point D;
the middle point of the AB connecting line is an o point, the o point is taken as a coordinate origin, a Cartesian coordinate system conforming to the right-hand spiral rule is established, wherein the direction from the o point to the first main rotating shaft 5-1 is the positive direction of the z axis, the plane determined by the o point and the right pitching arm 5-7 is the yz plane, and the direction from the o point to the right pitching arm 5-7 is the positive direction of the y axis;
the distance from the point A or the point B to the z axis is r;
the rotating angular speeds of the first main rotating shaft 5-1 and the second main rotating shaft 5-5 are omega;
the distance from the point A or the point B to the xoy plane is h;
the point A or the point B starts to rotate from the xoz plane, and the rotating time is t;
the distance from the point o to the reference test platform is H;
the distance from the point C or the point D to the point o is l1；
The length of the lifting rod 5-8 is l2；
The distance from the lifting structure 5-9 to the z axis is l3；
When the first main rotating shaft 5-1 and the second main rotating shaft 5-5 are seen from the direction right opposite to the z-axis, the first main rotating shaft and the second main rotating shaft synchronously rotate anticlockwise;
at this time, as shown in fig. 11, the unidirectional movement displacement of the lifting structure 5-9 is:
Figure BDA0002483064410000141
wherein:
Figure BDA0002483064410000142
alpha is the included angle between the CD connecting line and the y axis.
Detailed description of the invention
The following is a specific embodiment of a parameter adjustment method for a single-axis symmetric bending test structure.
The parameter adjustment method for the single-spindle symmetric bending test structure in the embodiment further defines, on the basis of the eleventh specific embodiment:
the distance l between the lifting structure 5-9 and the z-axis is realized by changing the assembly position of the sliding block 4-2 on the main board 4-1 and selecting the position of the circular through hole of the lifting structure 5-9 inserted into the sliding block 4-23The adjustment of the probe is carried out, so that the test requirements of probes with different sizes are met;
the lifting rod 5-8 is selected as a telescopic structure, and the length l of the lifting rod 5-8 is changed by changing the length of the lifting rod 5-82Adjusting;
the first flat plate 5-2-1 and the second flat plate 5-4-1 are selected as telescopic structures, and the first flat plate 5-2-1 and the second flat plate 5-4-1 are changedThe length of the plate 5-4-1 realizes the distance l from the point C or the point D to the point o1Adjusting;
by adjusting z-axis distance l3Length l of 5-8 of lifting rod2Distance l from point C or point D to point o1Any one or any two or all three of the three parameters realize the unidirectional movement displacement deltax of the lifting structure 5-90The requirements of the probe for testing under different parameters are further met by adjusting the probe.
Detailed description of the invention
The following is a specific embodiment of a parameter adjustment method for a single-axis symmetric bending test structure.
The parameter adjusting method for the single-axis symmetric bending test structure in this embodiment is a probe multi-parameter adjusting method,
the distance l from the lifting structure (5-9) to the z-axis is realized by changing the assembly position of the sliding block (4-2) on the main board (4-1) and selecting the position of the circular through hole of the lifting structure (5-9) inserted into the sliding block (4-2)3The adjustment of the probe is carried out, so that the test requirements of probes with different sizes are met;
the lifting rod (5-8) is selected to be a telescopic structure, and the length l of the lifting rod (5-8) is changed by changing the length of the lifting rod (5-8)2Adjusting;
the first flat plate (5-2-1) and the second flat plate (5-4-1) are selected to be of telescopic structures, and the distance l from the C point or the D point to the o point is realized by changing the lengths of the first flat plate (5-2-1) and the second flat plate (5-4-1)1Adjusting;
by adjusting z-axis distance l3Length l of lifting rod (5-8)2Distance l from point C or point D to point o1Any one or any two or all three of the three parameters realize the unidirectional movement displacement deltax of the lifting structure (5-9)0The requirements of the probe for testing under different parameters are further met by adjusting the probe.
It should be noted that in the above embodiments, permutation and combination can be performed without any contradictory technical solutions, and since a person skilled in the art can exhaust the results of all permutation and combination according to the mathematical knowledge of permutation and combination learned in high-school stages, the results are not listed in this application, but it should be understood that each permutation and combination result is described in this application.
It should be noted that the above embodiments are only illustrative for the patent, and do not limit the protection scope thereof, and those skilled in the art can make modifications to the parts thereof without departing from the spirit of the patent.

Claims (2)

1. A MEMS probe single-rotation axis symmetric bending test structure,
it is characterized in that the preparation method is characterized in that,
the first main rotating shaft (5-1), the first shaft adapter (5-2), the cross adapter (5-3), the second shaft adapter (5-4) and the second main rotating shaft (5-5) are sequentially arranged from top to bottom, wherein the first main rotating shaft (5-1), the first shaft adapter (5-2), the cross adapter (5-3), the second shaft adapter (5-4) and the second main rotating shaft (5-5) are vertically symmetrical relative to the cross adapter (5-3);
the first shaft adapter (5-2) comprises a first flat plate (5-2-1) and a first inclined plate (5-2-2), and the second shaft adapter (5-4) comprises a second flat plate (5-4-1) and a second inclined plate (5-4-2); the first flat plate (5-2-1) and the first main rotating shaft (5-1) rotate synchronously, the second flat plate (5-4-1) and the second main rotating shaft (5-5) rotate synchronously, the first main rotating shaft (5-1) and the second main rotating shaft (5-5) rotate coaxially and synchronously, the first inclined plate (5-2-2) is connected with an upper end universal shaft of the cross adapter (5-3), and the second inclined plate (5-4-2) is connected with a lower end universal shaft of the cross adapter (5-3);
the left end of the cross adapter (5-3) is coaxially provided with a rotatable left pitching arm (5-6), and the right end of the cross adapter (5-3) is coaxially provided with a rotatable right pitching arm (5-7); lifting rods (5-8) are respectively installed at the outer end parts of the left pitching arm (5-6) and the right pitching arm (5-7) through rotating shafts, and the lower end parts of the lifting rods (5-8) are respectively connected to the top ends of the lifting structures (5-9); the lifting structure (5-9) is limited to move only up and down;
the left pitching arm (5-6) comprises a left support arm (5-6-1) with a rotating shaft connected to the left end of the cross adapter (5-3), a left cross arm (5-6-2) vertically connected to the left support arm (5-6-1) and positioned in the horizontal direction, a left connecting arm (5-6-3) vertically connected to the left cross arm (5-6-2) and parallel to the left support arm (5-6-1), the left connecting arms (5-6-3) and the left cross arm (5-6-2) can be detached and replaced, the number of the left connecting arms (5-6-3) is multiple, the length of the left connecting arms can be adjusted, each left connecting arm (5-6-3) is connected with one lifting rod (5-8) through a rotating shaft, and the lower end part of each lifting rod (5-8) is connected with one lifting structure (5-9);
the right pitching arm (5-7) comprises a right support arm (5-7-1) with a rotating shaft connected to the right end of the cross adapter (5-3), a right cross arm (5-7-2) vertically connected to the right support arm (5-7-1) and positioned in the horizontal direction, a right connecting arm (5-7-3) vertically connected to the right cross arm (5-7-2) and parallel to the right support arm (5-7-1), the right connecting arms (5-7-3) and the right cross arm (5-7-2) can be detached and replaced, the number of the right connecting arms (5-7-3) is multiple, the length of the right connecting arms can be adjusted, each right connecting arm (5-7-3) is connected with one lifting rod (5-8) through a rotating shaft, and the lower end part of each lifting rod (5-8) is connected with one lifting structure (5-9);
the left support arm (5-6-1) and the right support arm (5-7-1) are positioned on the same straight line.
2. A pitching arm in a MEMS probe single-rotation-axis symmetric bending test structure is characterized by comprising a left pitching arm (5-6) and a right pitching arm (5-7);
the left pitching arm (5-6) comprises a left support arm (5-6-1) with a rotating shaft connected to the left end of the cross adapter (5-3), a left cross arm (5-6-2) vertically connected to the left support arm (5-6-1) and positioned in the horizontal direction, a left connecting arm (5-6-3) vertically connected to the left cross arm (5-6-2) and parallel to the left support arm (5-6-1), the left connecting arms (5-6-3) and the left cross arm (5-6-2) can be detached and replaced, the number of the left connecting arms (5-6-3) is multiple, the length of the left connecting arms can be adjusted, each left connecting arm (5-6-3) is connected with one lifting rod (5-8) through a rotating shaft, and the lower end part of each lifting rod (5-8) is connected with one lifting structure (5-9);
the right pitching arm (5-7) comprises a right support arm (5-7-1) with a rotating shaft connected to the right end of the cross adapter (5-3), a right cross arm (5-7-2) vertically connected to the right support arm (5-7-1) and positioned in the horizontal direction, a right connecting arm (5-7-3) vertically connected to the right cross arm (5-7-2) and parallel to the right support arm (5-7-1), the right connecting arms (5-7-3) and the right cross arm (5-7-2) can be detached and replaced, the number of the right connecting arms (5-7-3) is multiple, the length of the right connecting arms can be adjusted, each right connecting arm (5-7-3) is connected with one lifting rod (5-8) through a rotating shaft, and the lower end part of each lifting rod (5-8) is connected with one lifting structure (5-9);
the left support arm (5-6-1) and the right support arm (5-7-1) are positioned on the same straight line.
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