CN111501044B - Anti-corrosion treatment method for heat sink surface - Google Patents

Anti-corrosion treatment method for heat sink surface Download PDF

Info

Publication number
CN111501044B
CN111501044B CN202010336659.XA CN202010336659A CN111501044B CN 111501044 B CN111501044 B CN 111501044B CN 202010336659 A CN202010336659 A CN 202010336659A CN 111501044 B CN111501044 B CN 111501044B
Authority
CN
China
Prior art keywords
heat sink
reaction
film
sink material
transition film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010336659.XA
Other languages
Chinese (zh)
Other versions
CN111501044A (en
Inventor
陈悦健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Lingkong Technology Co ltd
Original Assignee
Shanghai Lingkong Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Lingkong Technology Co ltd filed Critical Shanghai Lingkong Technology Co ltd
Priority to CN202010336659.XA priority Critical patent/CN111501044B/en
Publication of CN111501044A publication Critical patent/CN111501044A/en
Application granted granted Critical
Publication of CN111501044B publication Critical patent/CN111501044B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/74Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • C25D5/50After-treatment of electroplated surfaces by heat-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The invention provides a heat sink surface anti-corrosion treatment method, which comprises the following steps: generating a transition film of alloy elements on the surface of a heat sink; and (2) diffusion reaction treatment, wherein the alloy element is a metal element which has eutectic reaction or peritectic reaction with the heat sink material, and the thickness of the transition film is 1-30 μm.

Description

Anti-corrosion treatment method for heat sink surface
Technical Field
The invention belongs to the field of surface treatment of heat sinks, and particularly relates to a heat sink surface anti-corrosion treatment method.
Background
High performance water-cooled heat sinks generally require relatively small water flow channels and relatively large flow rates to achieve a high heat transfer coefficient at the solid-liquid interface.
In terms of heat transfer science, nusselt Number (Nusselt Number) is often used to describe the heat transfer characteristics of a flowing liquid, with the following formula:
Figure BDA0002465842130000011
where Nu is the Nurseel number, h is the heat transfer coefficient of the solid-liquid interface, D h Is the hydraulic diameter of the channel in which the flowing liquid is located (equal to 4 times the channel cross-sectional area divided by the perimeter), and k is the thermal conductivity of the liquid. In the steady laminar flow regime, the nusselt number is a constant whose value is determined by the geometry of the channel cross-section. The nusselt number is approximately 4.12 when the aspect ratio of the channel is 2. Under turbulent conditions, the nusselt number is a complex function of the liquid flow rate. The Dittus-Boelter formula is one of the expressions:
Nu=0.023Re 0.8 Pr n
where Re is the Reynolds number, which is proportional to the average flow rate of the liquid; pr is the prandtl number, which is a constant describing the properties of the liquid. Because of the small hydraulic diameter of the channels in the microchannel heat sink, the flow of the cooling fluid can produce a large heat transfer coefficient at the liquid-solid interface. Altoz indicates that in a microchannel with a cross section of 254 μm × 50.8 μm, the heat transfer coefficient of water can reach 4.3 × 10 under a stable laminar flow condition 4 W/m 2 Altoz, "Thermal Management", chapter 2in electronic Packaging and Interconnection Handbook ", ed.C.A.Harper, mcGraw-Hill, new York, (1991), p.2.89. Roy and Avanic experimentally determined the heat transfer coefficient of water in a microchannel having a cross-section of 1295. Mu. M.times.508. Mu.m, corresponding to 5X 10 5 W/m 2 ℃(S.K.Roy and B.L.Avanic,“A Very High Heat Flux Microchannel Heat Exchanger for Cooling of Semiconductor Laser Diode Arrays”,IEEE Trans.on Components,Packaging,and Manufacturing Technology Part B,19(1996) (No. 2): 444-51). Salem et al are inIn a microchannel Heat sink having a Heat-dissipating surface of 25.4 mm by 25.4 mm And a three-dimensional channel structure, the Thermal resistance was found to be less than 0.15 ℃/W (T.E.Salem, D.Porschet, S.B.Bayne, Y.Chen.; "Thermal Performance of Water-Cooled Heat Sinks", applied Power Electronics Conference And expansion, austin, texas, march 6-10, 2005) at a flow rate of 7 liters/min. In general, the higher the flow rate, the smaller the channel, the greater the heat transfer coefficient and thus the better the heat sink performance.
However, since the engineering material such as red copper commonly used for heat sinks has low mechanical strength and is not corrosion-resistant, the channel surface of the heat sink is easily corroded by water flow during use, which results in performance reduction and even failure of the heat sink. Therefore, the surface treatment of the channel of the heat sink has significant meaning for prolonging the service life of the heat sink and enhancing the stability of the performance of the heat sink.
Disclosure of Invention
It is therefore an object of the present invention to provide a method of improving the erosion resistance of the channel surface of a heat sink to improve the performance of the heat sink.
In order to achieve the purpose of the invention, the invention provides a method for anti-corrosion treatment of the surface of a heat sink, which comprises the following steps: firstly, generating a transition film of an alloy element on the surface of a heat sink; secondly, diffusion reaction treatment.
Further, the alloy element is a metal element which performs eutectic reaction or peritectic reaction with the heat sink material, and includes, but is not limited to, tin, zinc, nickel and silver. Further, the heat sink material is red copper.
Further, the thickness of the transition thin film is 1 to 30 μm, preferably 1 to 10 μm.
Further, the preparation method of the transition thin film includes, but is not limited to, vacuum sputtering, physical or chemical vapor deposition, electroplating and electroless plating.
Further, the diffusion reaction treatment is performed in a vacuum state or in a reducing atmosphere.
Detailed Description
To make the objects, technical solutions and advantages of the present invention more apparent to those skilled in the art, the present invention will be described in further detail with reference to specific embodiments.
There are two ways in which the heat sink channel surface can erode. One is simple mechanical stripping. When the stress applied to the surface of the heat sink channel by the flowing liquid exceeds the mechanical strength of the heat sink material, the solid on the surface of the channel is gradually stripped, and the process is like cutting. Second, corrosion accelerated mechanical stripping. In this case, the liquid exerts a stress that is less than the mechanical strength of the heat sink material. However, since the boundaries between grains in the polycrystalline material have a high chemical activity, corrosion starts from the grain boundaries. As the corrosion progresses, the grain-to-grain adhesion is weakened. Under the action of the water flow, the crystal grains are dug out from the surface of the channel and are carried away by the water flow. In high performance heat sinks, both of these erosion pathways can occur, and the second pathway is more hazardous.
Therefore, the inventors of the present invention have proceeded from two points to improve the erosion resistance, i.e., the improvement of the mechanical strength and the passivation of the grain boundaries of the heat sink material. Alloying is a common method for improving the mechanical strength of heat sink materials in the engineering field. For example, bronze, brass, and cupronickel are alloyed products of copper, with additional alloying elements including, but not limited to, tin, zinc, nickel, and silver, among others. For example, the mechanical strength of silver-copper alloys can be up to 3 times that of red copper. Due to the higher chemical activity of the grain boundaries, the diffusion resistance of the atoms is smaller there. During the diffusion process, the alloying elements are concentrated at the grain boundaries, reducing its chemical activity. Therefore, the method of the invention improves the mechanical strength of the superficial layer of the heat sink surface on one hand and passivates the chemical activity of the grain boundary on the other hand by local alloy treatment of the superficial layer of the surface, thereby achieving the purpose of improving the erosion resistance.
Specifically, in one embodiment of the present invention, the present invention provides a method for anti-corrosion treatment of a heat sink surface, comprising: firstly, generating a transition film of alloy elements on the surface of a heat sink; secondly, diffusion reaction treatment.
The transition film material may be selected from metal elements such as silver, tin, zinc, etc. that undergo eutectic or peritectic reactions with a heat sink material such as copper. The preparation method of the transition film comprises the processes of vacuum sputtering, physical or chemical vapor deposition, electroplating, chemical plating and the like. The thickness of the transition film may be in the range of 1 to 30 μm, preferably 1 to 10 μm.
The diffusion reaction treatment is carried out in a vacuum state or in a reducing atmosphere, the workpiece is heated to a temperature higher than the eutectic reaction or peritectic reaction temperature, the temperature is kept for 10-300 minutes, then the heating is stopped, and the workpiece is cooled to room temperature along with the furnace. During the diffusion reaction, the film material completely melts and gradually penetrates into the heat sink material. When the film material is fully infiltrated into the heat sink material, the surface of the heat sink material is re-solidified. This reaction process is also known as a transient liquid phase diffusion reaction. This reaction process can also be used for welding of two workpieces. At this point, the two workpieces are brought together and a certain pressure is applied to both sides of the workpieces, so that their surfaces with the transitional film are tightly attached to each other, and the two workpieces are joined together by a diffusion reaction. If the two workpieces are of the same material, the weld seam will disappear.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, it is possible to make various improvements and modifications without departing from the technical principle of the present invention, and those improvements and modifications should be also considered as the protection scope of the present invention.

Claims (6)

1. A method for treating a heat sink surface to resist corrosion, the method comprising the steps of:
(1) Generating a transition film of alloy elements on the surface of the heat sink; and
(2) The treatment of the diffusion reaction is carried out,
it is characterized in that the alloy element is a metal element which has eutectic reaction or peritectic reaction with the heat sink material, the thickness of the transition film is 1-30 μm,
wherein the diffusion reaction treatment is carried out in a vacuum state or in a reducing atmosphere, the workpiece is heated to a temperature higher than the eutectic reaction or peritectic reaction temperature, the temperature is kept for 10-300 minutes, then the heating is stopped, the workpiece is cooled to the room temperature along with the furnace,
wherein the film material is completely melted and gradually infiltrated into the heat sink material during the diffusion reaction process, and the surface of the heat sink material is re-solidified when the film material is fully infiltrated into the heat sink material.
2. The method of claim 1, wherein the heat sink material is copper.
3. The method of claim 1, wherein the transition film has a thickness of 1-10 μm.
4. The method of claim 1, wherein the transition film is prepared by a method selected from the group consisting of physical or chemical vapor deposition, electroplating, and electroless plating.
5. The method of claim 1, wherein the alloying element is selected from the group consisting of tin, zinc, and silver.
6. The method of claim 4, wherein the physical vapor deposition comprises vacuum sputtering.
CN202010336659.XA 2020-04-24 2020-04-24 Anti-corrosion treatment method for heat sink surface Active CN111501044B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010336659.XA CN111501044B (en) 2020-04-24 2020-04-24 Anti-corrosion treatment method for heat sink surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010336659.XA CN111501044B (en) 2020-04-24 2020-04-24 Anti-corrosion treatment method for heat sink surface

Publications (2)

Publication Number Publication Date
CN111501044A CN111501044A (en) 2020-08-07
CN111501044B true CN111501044B (en) 2023-01-10

Family

ID=71873070

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010336659.XA Active CN111501044B (en) 2020-04-24 2020-04-24 Anti-corrosion treatment method for heat sink surface

Country Status (1)

Country Link
CN (1) CN111501044B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62284062A (en) * 1986-06-03 1987-12-09 Hitachi Cable Ltd Fin material for radiator and its production
JP2015051443A (en) * 2013-09-06 2015-03-19 Jfeスチール株式会社 Continuous casting mold and continuous casting method for steel

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121264A (en) * 1983-12-06 1985-06-28 Nippon Mining Co Ltd Manufacture of radiator having fin with superior corrosion resistance
JPS61166987A (en) * 1985-01-17 1986-07-28 Hitachi Cable Ltd Fin material for radiator
JPS6468459A (en) * 1987-09-08 1989-03-14 Furukawa Electric Co Ltd Heat-exchanger fin material
JPH051367A (en) * 1991-06-24 1993-01-08 Mitsubishi Electric Corp Copper alloy material for electric and electronic equipment
CH690440A5 (en) * 1995-12-11 2000-09-15 Charmilles Technologies Son method and manufacturing apparatus having a brass surface, for the purposes of the EDM wire.
CN110952065B (en) * 2019-12-23 2021-11-16 深圳市诚威新材料有限公司 Copper foil for lithium battery and preparation method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62284062A (en) * 1986-06-03 1987-12-09 Hitachi Cable Ltd Fin material for radiator and its production
JP2015051443A (en) * 2013-09-06 2015-03-19 Jfeスチール株式会社 Continuous casting mold and continuous casting method for steel

Also Published As

Publication number Publication date
CN111501044A (en) 2020-08-07

Similar Documents

Publication Publication Date Title
JP5224430B2 (en) Power semiconductor module
JP5160201B2 (en) Solder material and manufacturing method thereof, joined body and manufacturing method thereof, power semiconductor module and manufacturing method thereof
US3396454A (en) Method of forming ohmic contacts in semiconductor devices
JP6696215B2 (en) Bonded body, power module substrate with heat sink, heat sink, and method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink
JP2017172871A (en) Process of manufacture of vapor chamber
ATE338737T1 (en) BRAZLED METALIZATIONS FOR DIAMOND COMPONENTS
JP2010278164A (en) Semiconductor device and method of manufacturing the same
CN104347429A (en) Micro channel heat sink manufacturing method
JP2009147111A (en) Bonding material, method of manufacturing the same, and semiconductor apparatus
Atabaki et al. Transient liquid phase diffusion brazing of stainless steel 304
US6022426A (en) Multilayer laminate process
CN111501044B (en) Anti-corrosion treatment method for heat sink surface
JP2009129983A (en) Junction structure and method of manufacturing the same, and power semiconductor module and method of manufacturing the same
Hang et al. Low temperature bonding by infiltrating Sn3. 5Ag solder into porous Ag sheet for high temperature die attachment in power device packaging
Chen et al. Review of ultrasonic-assisted soldering in Sn-based solder alloys
Bashir et al. Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration
Xin et al. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging
CN107262961A (en) Brazing composition and correlation technique and device for ductility braze-welded structure
JP2009038162A (en) Heat radiation component and manufacturing method thereof, and power module
Greve et al. Microstructural evolution of transient liquid phase sinter joints in high temperature environmental conditions
JP2016027633A (en) Method for manufacturing ceramic/aluminum assembly, method for manufacturing substrate for power module, ceramic/aluminum assembly, and substrate for power module
Chen et al. Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding
JP2017135373A (en) Assembly, power module substrate, method for manufacturing assembly, and method for manufacturing power module substrate
US5031822A (en) Methods of joining components
Liu et al. Influencing factors for resistance performance of Cu/C composites to liquid Ga corrosion

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant