CN111497426A

CN111497426A - Vacuum solder paste printing machine

Info

Publication number: CN111497426A
Application number: CN202010381582.8A
Authority: CN
Inventors: 刘照和
Original assignee: Kunshan Jiayuan Haoze Optoelectronics Technology Co ltd
Current assignee: Kunshan Jiayuan Haoze Optoelectronics Technology Co ltd
Priority date: 2020-05-08
Filing date: 2020-05-08
Publication date: 2020-08-07

Abstract

The invention discloses a vacuum solder paste printing machine which comprises a rack, a solder paste printing machine, a feeding hole, a feeding table, a first air cylinder, a first support, a second support and a second air cylinder, wherein the output of the second air cylinder is connected with the third support, one side of the third support is connected with a horizontally arranged third air cylinder, the output of the third air cylinder is connected with a fourth support, a first vacuum chuck is connected below the fourth support, a first inductor is arranged above the left side of the first vacuum chuck, a second inductor is arranged above the inner wall of the feeding hole, a fourth air cylinder is arranged above the rack, the output of the fourth air cylinder is connected with a vacuum cover plate, a fixed table is arranged in the rack, a fifth air cylinder is arranged on the left side of the fixed table, the output of the fifth air cylinder is connected with a fixed pressing plate, a sixth air cylinder is arranged on the right side of the fixed table, the output of the sixth air cylinder is connected with an -shaped clamping frame positioned in the fixed table, and the clamping frame and the fixed pressing plate are matched to form a PCB clamping.

Description

Vacuum solder paste printing machine

Technical Field

The invention relates to the technical field of printing machines, in particular to a vacuum solder paste printing machine.

Background

With the increasingly sophisticated miniaturization of electronic products, the production of PCBs (Printed Circuit boards) for electronic products must be completed by SMT (Surface Mount Technology) equipment, and in the SMT process manufacturing process, a solder paste printing process is a very critical part, and the solder paste printing process is completed by a solder paste printer.

Modern solder paste printing machines generally comprise mechanisms such as plate loading, solder paste adding, stamping, power transmission circuit boards and the like. The working principle is as follows: the PCB to be printed is fixed on a printing positioning table, then solder paste or red glue is subjected to screen printing on corresponding bonding pads through a steel mesh by a left scraper and a right scraper of a printing machine, and the PCB with uniform screen printing is input into a chip mounter through a transmission table to be subjected to automatic chip mounting.

In the solder paste printing process, the solder paste printing process of the PCB can only be completed, and before and after the solder paste printing of the PCB, an independent vacuum feeding machine is required to be configured to complete the PCB feeding and solder paste printing processes, so that the whole cost is high, the volume is large, the whole structure is not compact, and the effect is poor when the PCB is clamped, so that the improvement is required.

Disclosure of Invention

The invention aims to solve the defects of the prior art and provide a vacuum solder paste printer which has compact overall layout, small volume and good clamping effect on a PCB.

In order to achieve the purpose, the vacuum tin paste printing machine comprises a rack, the tin paste printing machine is arranged in the rack, a feeding hole is formed in the left side edge of the rack, a feeding table is arranged at the front end of the feeding hole, a horizontally arranged first air cylinder is further arranged in the rack, a vertically arranged first support is connected to the output of the first air cylinder, a second support is connected to the lower end of the first support, a vertically arranged second air cylinder is fixed on the second support, a third support is connected to the output of the second air cylinder, a horizontally arranged third air cylinder is connected to one side of the third support, a fourth support is connected to the output of the third air cylinder, a first vacuum chuck is connected to the lower portion of the fourth support, a first inductor is arranged above the left side of the first vacuum chuck, a second inductor connected with the first inductor in a signal mode is arranged above the inner wall of the feeding hole, a fourth air cylinder is arranged above the rack, a vacuum chuck capable of sealing the feeding hole, a fixing table is arranged in the rack, a fifth air cylinder is arranged above the left side of the fixing table, a fifth air cylinder is connected with a sixth air cylinder, a PCB automatic clamping cylinder, a PCB clamping cylinder is arranged above the PCB clamping cylinder, a PCB automatic clamping cylinder, a discharging hole is arranged above the PCB clamping cylinder, a discharging hole is arranged on the PCB automatic clamping table, and a discharging hole is arranged on the right side of the PCB clamping cylinder, and a PCB automatic clamping control machine, the PCB clamping cylinder, the PCB automatic clamping cylinder, and a discharging hole is arranged on the PCB automatic clamping machine, the PCB clamping position, the PCB automatic clamping machine, and a discharging hole is arranged, the PCB automatic clamping position is arranged on the PCB clamping.

In order to facilitate operation, the output of the fourth cylinder is connected with a cover plate support, the vacuum cover plate is rotatably connected onto the cover plate support through a first rotating shaft, and a first motor for driving the first rotating shaft to rotate is arranged on the side edge of the first rotating shaft.

In order to improve the fixing effect, more than one first silica gel convex strip is arranged on the inner side of the fixing pressing plate, and more than one second silica gel convex strip is arranged on the inner side of the clamping frame.

In order to realize automatic control, a feeding conveying belt for conveying the PCB to the feeding table is arranged at the upper end of the feeding table, a pressure detector is arranged on the feeding table, and the pressure detector is electrically connected with the controller.

For the convenience of operation, the first vacuum chuck is rotatably connected to the fourth bracket.

In order to realize the automatic dust absorption effect, avoid adding the dust man-hour, influence later stage effect, still be equipped with in the frame and carry out the dust collector that the dust was collected and store up the dirt storehouse with dust collector output connection to the centre gripping on the intraoral PCB surface of PCB centre gripping.

In order to collect dust in later period conveniently, the opening of the dust storage bin is positioned on the side edge of the machine frame.

In order to improve the rhinoceros suction force, more than one small suction cup is distributed below the first vacuum suction cup.

In order to facilitate later-stage exhaust, a first pressure relief opening connected with the outside is formed in the side edge of the first vacuum chuck.

In order to improve the fixing and clamping effect, a second vacuum suction cup for sucking the PCB and a second pressure relief opening for relieving the pressure of the second vacuum suction cup are arranged below the -shaped clamping frame.

According to the vacuum solder paste printing machine, a PCB is firstly placed on a feeding table, a controller controls a fourth cylinder to work to lift a vacuum cover plate to open a feeding hole at the moment, then a first cylinder, a second cylinder and a third cylinder are controlled to move up and down and left and right, a first vacuum sucker is ensured to extend out of the feeding hole to suck the PCB on the feeding table in a vacuum manner, then the PCB is sent into a PCB clamping hole, the fifth cylinder and the sixth cylinder on two sides work to draw and contract the PCB clamping hole to tighten the PCB, and an internal solder paste printing machine is used for performing solder paste printing on a product; the printing is accomplished the back controller and is sent the board signal to full-automatic tin cream printing machine, the fifth cylinder of left and right sides at last, the sixth cylinder work is carried the product automatic paster position below, utilize automatic paster position to carry out automatic paster to the product, utilize first vacuum chuck of reuse to see the product out the entering unloading pipeline from the discharge gate after the paster is accomplished, thereby realize accomplishing the PCB material loading on same platform equipment, the tin cream printing, the process of automatic unloading, finally guarantee overall arrangement compactness, small in size, it is effectual to press from both sides the PCB board tightly.

Drawings

In order to more clearly illustrate the implementation of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.

FIG. 1 is a schematic view showing the overall configuration of a vacuum solder paste printer according to embodiment 1;

FIG. 2 is a schematic view showing the internal structure of a vacuum solder paste printer according to embodiment 1;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

FIG. 4 is a schematic view showing the internal structure of a vacuum solder paste printer according to embodiment 2;

FIG. 5 is a partial structural view of a fixing table in embodiment 3;

FIG. 6 is a schematic view showing the entire structure of a vacuum solder paste printer according to embodiment 4;

FIG. 7 is a schematic view showing the internal structure of a vacuum solder paste printer according to embodiment 5;

FIG. 8 is a schematic view showing the internal structure of a vacuum solder paste printer according to embodiment 6.

In the reference symbols: the automatic feeding device comprises a rack 1, a solder paste printer 2, a feeding hole 3, a feeding table 4, a first air cylinder 5, a first support 6, a second support 7, a second air cylinder 8, a third support 9, a third air cylinder 10, a fourth support 11, a first vacuum chuck 12, a first inductor 13, a second inductor 14, a fourth air cylinder 15, a vacuum cover plate 16, a fixed table 17, a fifth air cylinder 19, a fixed pressing plate 18, a sixth air cylinder 20, a clamping frame 21, an automatic chip mounter 2-1, a seventh air cylinder 22, a discharging hole 23, a discharging pipeline 24, a controller 25, a cover plate support 26, a first rotating shaft 27, a first motor 28, a first silica gel convex strip 29, a second silica gel convex strip 30, a feeding conveying belt 31, a pressure detector 32, a dust collector 33, a dust storage bin 34, a small suction cup 35, a first pressure relief hole 36, a second vacuum suction cup 37 and a second pressure relief hole 38.

Detailed Description

The invention will be further described with reference to the following examples.

Example 1:

the vacuum solder paste printing machine provided by the embodiment, referring to fig. 1-3, the vacuum solder paste printing machine comprises a frame 1, a solder paste printing machine 2 is arranged in the frame 1, a feeding port 3 is arranged on the left side of the frame 1, a feeding table 4 is arranged at the front end of the feeding port 3, a first cylinder 5 horizontally arranged is further arranged in the frame 1, a first support 6 horizontally arranged is output and connected to the first cylinder 5, a second support 7 is connected to the lower end of the first support 6, a second cylinder 8 vertically arranged is fixed on the second support 7, a third support 9 is output and connected to one side of the third support 9, a third cylinder 10 horizontally arranged is connected to one side of the third support 9, a fourth support 11 is output and connected to the lower side of the third support 6, a first vacuum chuck 12 is connected to the lower side of the fourth support 11, a first sensor 13 is arranged above the left side of the first vacuum chuck 12, a second sensor 14 in signal connection with the first sensor 13 is arranged above the inner wall of the feeding port 3, a fourth cylinder 15 is arranged above the inner wall of the frame 1, a patch 17 is arranged above the feeding port 21, a fifth cylinder 17, a patch 17 is arranged on the left side of the PCB 2, a PCB 17, a fixing cylinder 23 and a PCB 17, a PCB 17 which is arranged on which is fixed on the right side of the PCB 17, a PCB 17 is arranged in the automatic adhesive paste printing machine, a PCB 17 is arranged in which is arranged, a PCB 2, a PCB 17, a PCB 2 fixing and a PCB 2, a PCB 17 is arranged in a PCB fixing and a PCB 2, a PCB fixing machine, a PCB 2, a PCB fixing machine is arranged in a PCB 2, a PCB fixing machine, a PCB 17, a PCB fixing and a.

To increase the rhinoceros suction, more than one small suction cup 35 is provided under the first vacuum cup 12.

In order to facilitate later exhaust, a first pressure relief port 36 connected with the outside is arranged on the side of the first vacuum chuck 12.

During working, the PCB is firstly placed on the feeding table 4, the controller 25 controls the fourth cylinder 15 to work to lift the vacuum cover plate 16 to open the feeding hole 3 at the moment, then the first cylinder 5, the second cylinder 8 and the third cylinder 10 are controlled to move up and down and left and right, the first vacuum sucker 12 is ensured to extend out of the feeding hole 3 to suck the PCB on the feeding table 4 through vacuum and then send the PCB into the PCB clamping hole, the fifth cylinder 19 and the sixth cylinder 20 on the two sides work to draw and contract the PCB clamping hole to tighten the PCB, and the internal solder paste printer 2 is used for carrying out solder paste printing on a product; after printing is completed, the controller 25 sends a plate-requiring signal to the full-automatic solder paste printing machine 2, the fifth air cylinder 19 and the sixth air cylinder 20 on the left side and the right side work to convey a product to the position 2-1 below the automatic chip mounter, automatic chip mounting is performed on the product by using the automatic chip mounter 2-1, after chip mounting is completed, the product is conveyed out from the discharge port 23 by using the first vacuum chuck 12 again to enter the discharging pipeline 24, so that the processes of PCB feeding, solder paste printing and automatic discharging are completed on the same equipment, and finally the whole layout is guaranteed to be compact, small in size and good in PCB clamping effect.

Example 2:

referring to fig. 4, in order to facilitate operation, the output of the fourth cylinder 15 is connected to a cover plate support 26, the vacuum cover plate 16 is rotatably connected to the cover plate support 26 through a first rotating shaft 27, a first motor 28 for driving the first rotating shaft 27 to rotate is arranged on a side of the first rotating shaft 27, and the vacuum cover plate 16 can rotate, so that the problem that the first vacuum chuck 12 collides with the vacuum cover plate 16 in the process of moving to the feeding hole 3 is avoided.

Example 3:

referring to fig. 5, in order to improve the fixing effect, the vacuum solder paste printer provided in this embodiment is provided with more than one first silicone rubber protruding strips 29 inside the fixing pressing plate 18, more than one second silicone rubber protruding strips 30 inside the holding frame 21, and the first silicone rubber protruding strips 29 and the second silicone rubber protruding strips 30 are arranged to clamp the PCB in an anti-slip manner.

Example 4:

the vacuum solder paste printing machine that this embodiment provided, refer to fig. 6, in order to realize automated control, be equipped with the material loading transmission band 31 of sending the PCB board to material loading platform 4 in the upper end of material loading platform 4, be equipped with pressure detector 32 on material loading platform 4, pressure detector 32 is connected with controller 25 electricity, and through setting up pressure detector 32, when pressure sensor 32 sensed pressure, control first vacuum chuck 12 and remove and send into PCB in the PCB centre gripping mouth on feed inlet 3, realize automatic feeding's function, and the automatic feeding function realizes in the solder paste printing machine for whole overall arrangement is compacter.

For the convenience of operation, the first vacuum chuck 12 is rotatably connected to the fourth frame 11.

Example 5:

referring to fig. 7, in order to realize an automatic dust collection effect and avoid adding dust during processing, and influence later-stage effects, a dust collector 33 for collecting dust on the surface of the PCB held in the PCB holding port and a dust storage bin 34 connected to the dust collector 33 are further disposed in the machine frame 1.

In order to collect dust later, the opening 34-1 of the dust storage bin 34 is located on the side edge of the rack 1, and the dust collector 33 is arranged to collect dust on the surface of the PCB clamped in the PCB clamping opening and collect the dust in the dust storage bin 34, so that the dust is prevented from being brought in during processing.

Example 6:

the vacuum solder paste printing machine that this embodiment provided, refer to fig. 8, in order to improve the fixed clamp effect, font holding frame 21's below is equipped with and is used for carrying out the second vacuum chuck 37 of holding PCB and carries out the second pressure release mouth 38 of pressure release to second vacuum chuck 37, through setting up second vacuum chuck 37 and second pressure release mouth 38, realizes carrying out high-efficient fixed clamp's effect to the intraoral PCB of PCB centre gripping, and the later stage is through second pressure release mouth 38 pressure release, makes things convenient for the later stage to take off PCB.

While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The vacuum solder paste printing machine comprises a frame (1), a solder paste printing machine (2) is arranged in the frame (1), and is characterized in that a feeding hole (3) is formed in the left side edge of the frame (1), a feeding table (4) is arranged at the front end of the feeding hole (3), a horizontally arranged first cylinder (5) is further arranged in the frame (1), a vertically arranged first support (6) is connected to the output of the first cylinder (5), a second support (7) is connected to the lower end of the first support (6), a vertically arranged second cylinder (8) is fixed on the second support (7), a third support (9) is connected to the output of the second cylinder (8), a horizontally arranged third cylinder (10) is connected to one side of the third support (9), a fourth support (11) is connected to the output of the third cylinder (10), a first vacuum suction cup (12) is connected to the lower portion of the fourth support (11), a clamping cylinder (16) is arranged above a fixed cylinder (1-17) of the printing machine, a clamping table (1-17), a clamping cylinder (16) is arranged above a fixed cylinder (1-17), a clamping cylinder (17) which is connected to the fixed to the PCB, a clamping table (17), a clamping table (17-17), a clamping table (16) is arranged above the fixed cylinder (1-17), a PCB-17, a clamping table (17) is arranged on the right side of the automatic clamping table, a PCB-17, a clamping table (17, a PCB-17, a clamping table is arranged in which is arranged, a PCB-17, a clamping table is arranged in which is arranged, a clamping table, a PCB-17, a clamping table is arranged in which is arranged, a PCB-17, a clamping table is arranged, a clamping table, a PCB-17, a clamping table is arranged in which is arranged in.

2. The vacuum solder paste printer according to claim 1, wherein: the output of the fourth cylinder (15) is connected with a cover plate support (26), the vacuum cover plate (16) is rotatably connected to the cover plate support (26) through a first rotating shaft (27), and a first motor (28) for driving the first rotating shaft (27) to rotate is arranged on the side edge of the first rotating shaft (27).

3. The vacuum solder paste printer according to claim 2, wherein: more than one first silica gel raised line (29) is arranged on the inner side of the fixed pressing plate (18), and more than one second silica gel raised line (30) is arranged on the inner side of the clamping frame.

4. The vacuum solder paste printer according to claim 3, wherein: the upper end of the feeding table (4) is provided with a feeding conveying belt (31) for conveying the PCB to the feeding table (4), the feeding table (4) is provided with a pressure detector (32), and the pressure detector (32) is electrically connected with the controller (25).

5. The vacuum solder paste printer according to claim 4, wherein: the first vacuum chuck (12) is rotatably connected to the fourth bracket (11).

6. The vacuum solder paste printer according to claim 5, wherein: a dust collector (33) for collecting dust on the surface of the PCB clamped in the PCB clamping opening and a dust storage bin (34) connected with the output of the dust collector (33) are also arranged in the frame (1).

7. The vacuum solder paste printer according to claim 6, wherein: the opening of the dust storage bin (34) is positioned on the side edge of the frame (1).

8. The vacuum solder paste printer according to claim 7, wherein: more than one small suction cup (35) is fully distributed below the first vacuum suction cup (12).

9. The vacuum solder paste printer according to claim 8, wherein: a first pressure relief opening (36) connected with the outside is arranged on the side edge of the first vacuum suction cup (12).

10. The vacuum solder paste printer according to claim 9, wherein a second vacuum suction cup (37) for sucking the PCB and a second pressure relief opening (38) for relieving pressure to the second vacuum suction cup (37) are provided below the -shaped holding frame (21).