CN111497367A - 一种高导热体及其制备方法 - Google Patents

一种高导热体及其制备方法 Download PDF

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CN111497367A
CN111497367A CN202010338533.6A CN202010338533A CN111497367A CN 111497367 A CN111497367 A CN 111497367A CN 202010338533 A CN202010338533 A CN 202010338533A CN 111497367 A CN111497367 A CN 111497367A
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film
heat conducting
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王华涛
田聪
吴亚金
吴绪磊
钟博
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Harbin Institute of Technology Weihai
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Abstract

本发明提供一种高导热体及其制备方法，以高导热膜为原料，通过在导热膜之间产生凹凸互锁式的微变形，形成高导热体。该方法简单、可靠、不需要粘结剂层，操作性强，导热膜间结合紧密，可应用于众多体系导热膜。利用这种方法制备的导热体具有密度小、厚度可调节、纵向热导率高、力学性能较好、层间结合力较强等优点，可广泛应用于电子产品的热管理中。

Description

一种高导热体及其制备方法
技术领域
本发明涉及复合材料领域，尤其涉及一种高导热体及其制备方法。
背景技术
现有专利文献：1）申请专利CN 105692601 A，受理，一种石墨烯块材的制备方法及得到的石墨烯。
2）申请专利CN 109246977 A，受理，一种高导热石墨复合材料的制备方法。
3）申请专利CN 104669702 A，受理，一种石墨导热膜复合块及其制作方法。
随着集成电路产业的快速发展，电子器件体积不断缩小，晶体管数目却在增加，芯片集成度越来越高，热流密度也越来越大。大功率电子元器件会产生大量的热，若不采取有效的热管理措施，将热量传递出去，器件会受到损伤甚至损坏。碳类导热膜具有层状结构，其平面热导率可达150-1800W/(m·K)，而且其密度较小，理论密度只有2.2g/cm3，是一种具有广阔应用前景的热管理材料。但由于导热膜的二维平面特性，其热流通量较小，限制了它的很多应用，目前也仅应用于智能手机、平板电脑、笔记本等起均温效果。因此，急需一种具有一定强度、一定厚度、密度较小的高导热体，解决一些散热难题。针对导热膜平面导热强，纵向导热差的缺点，将导热膜彼此之间通过机械复合形成层状复合体是一种有效的方法。
在现有的专利文献中，有很多碳类导热膜与金属或高分子复合的方法，但石碳类导热膜与金属通常是在高温高压下进行复合，导热膜与金属的界面会生成金属碳化物。比如铝和石墨生成易水解的Al4C3，或是其它一些对复合体的机械性能有不良影响的硬脆相。导热膜与高分子复合时，由于高分子本身热导率较低，耐温性也较差，造成石墨膜层间热量传输较慢，无法作为散热材料在高温环境中使用。此外，使用粘接剂等方式使导热膜复合的方法，其导热能力可能会在很大程度上受到粘接剂的影响，削弱了导热膜原本的高导热能力。
发明内容
本发明的目的在于克服现有技术的不足，提供一种工艺简单、可靠，热导率高，不需要粘结剂层，耐温性好的高导热体。
为了达到上述的目的，本发明采用如下技术方案：
一种高导热体的制备方法，包括以下步骤：
S101，切割：选取若干张导热膜切割成同样形状；
S102，叠加：将切割好的导热膜逐层叠加，制成导热膜层叠体；
S103，加压：在垂直于导热膜层叠体表面的方向上，通过压头或辊轮对层叠体施加压力，得到高导热体。
优选的，所述S101步骤中使用的导热膜包括石墨膜、石墨复合膜、石墨烯膜、石墨烯复合膜、碳纳米管膜、碳纳米管复合膜、碳纤维膜或碳纤维复合膜；每片导热膜的材质相同或不同，选自上述材料的一种或多种；导热膜平面热导率超过50W/(m·K)，厚度为1-200μm。
优选的，所述S101步骤中使用的导热膜切割成的形状包括圆形、椭圆形、三角形、正方形、长方形、多边形或异形形状。
优选的，所述S103步骤中用于压合导热膜层叠体的压头或辊轮包括设备自带压头、定制加工平板压头、设备自带辊轮或定制辊轮，其材质包括高硬度金属、金属合金、高硬度陶瓷或陶瓷复合材料、高硬度高分子或高分子复合材料。
优选的，所述S103步骤中压头或辊轮表面包含凸起结构、凹陷结构或同时具有凸起和凹陷结构；结构位于压头或辊轮与导热膜层叠体的上下接触面，或上下接触面中的任意一面；在加压过程中，导热膜层叠体中的每层导热膜在压力的作用下形成局部区域凸起和凹陷的微变形，相邻两层导热膜的凸起和凹陷相互锁定。
优选的，所述S103步骤中压头或辊轮表面上有阵列式连续硬质凸起和/或凹陷，凸起形状为半球形、方形、三角形；凸起平面尺寸为10-10000μm，凸起高度为1-1000μm，凸起密度为0.2-500000个/平方厘米；凹陷形状为半球形、方形、三角形；凹陷平面尺寸为10-10000μm，凹陷深度为1-1000μm，凹陷密度为0.2-10000个/平方厘米。
优选的，所述S103步骤中，加压设备包括压机、热压机、真空热压机、真空热压烧结炉、轧机、真空轧机、连轧机组、对辊机。
优选的，所述S103步骤中，施加压强1-300MPa，加压时间为0.001h-24h，加热温度为20℃-1500℃，真空度为10-1-10-13MPa。
本发明采用外部加压使导热膜间产生凹凸自锁式的微变形来制备高导热体，克服导热膜结合的难点，主要优点有：
1）本发明的制备方法简单、可靠，操作性强，可应用于众多体系的高导热膜体的制备；
2）所制备的高导热体，在导热膜层层之间没有其他物质，其热导率与耐温性比导热膜/高分子复合体要好，同时也具有一定的力学性能；
3）本方法所得的高导热体具有密度小、高导热，耐高温的特点。
总之，本发明的方法简单、可靠、操作性强，可应用于众多体系的高导热体的制备，而且该方法制备的高导热体具有密度小、厚度可调节、热导率高、力学性能较好等优点，可广泛应用于电子产品的热管理中。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要的附图作简单地介绍。
图1为高导热体的制备工艺示意图。
图2为加压前导热膜层叠体结构示意图。
图3为加压后形成的高导热体凹凸自锁原理示意图。
具体实施方式
下面结合具体实施例进一步说明本发明的技术方案，但本发明并不限于如下实施例所述内容，基于本发明思想的其它实施例，亦均在本发明的保护范围之中。
图2中，加压前导热膜层叠体结构示意图显示导热膜较为平整且在平面方向呈连续的层状分布，21、22均为导热膜。
图3中，加压后形成的高导热体中，导热膜内部产生连续的凹凸结构使层间结合力增大，31、32均为导热膜。
实施例1
1.S101，切割：制备20片尺寸相同（9cm×9cm×35μm）的还原氧化石墨烯膜；
2.S102，叠加：将切割好的石墨烯膜逐层叠加，制成石墨烯膜层叠体；
3.S103，加压：将石墨烯膜层叠体置于真空热压炉中，上下压头尺寸均为10cm×10cm×1cm，且表面有阵列式方形凸起，凸起高度为5μm，凸起边长为2mm×1mm，凸起密度为10个/平方厘米，抽取真空度为0.02MPa，在垂直于导热膜层叠体表面的方向上，施加60MPa的压力，加压时间为1h，得到最终的高导热体。
本实例形成的高导热体的密度为1.96g/cm3，厚度约为0.5mm，平面热导率为900W/(m·K)，本实施例说明，本发明制备的高导热体具有密度小、厚度可调节、耐高温、热导率高等优点。
实施例2
1.S101，切割：制备20片尺寸相同（30cm×10cm×30μm）的热解石墨膜；
2.S102，叠加：将制备的20片石墨膜叠层，制成石墨膜层叠体；
3.S103，加压：将石墨膜层叠体用置于轧机中，上下辊轮尺寸均为φ10*20，且表面为连续半球状凸起，凸起高度为10μm，轧制压力为100MPa，轧制次数为10次，得到最终的高导热体。
本实例形成的高导热体的密度为1.89g/cm3，厚度约为0.5mm，平面热导率为800W/(m·K)，本实施例说明，本发明制备的高导热体具有密度小、厚度可调节、耐高温、热导率高等优点。
虽然已通过几个典型实施例描述了本发明，但应当理解，所用的术语是说明和示例性、而非限制性的术语。由于本发明能够以多种形式具体实施而不脱离发明的精神或实质，所以应当理解，上述实施例不限于任何前述的细节，而应在随附权利要求所限定的精神和范围内广泛地解释，因此落入权利要求或其等效范围内的全部变化和改型都应为随附权利要求所涵盖。

Claims (9)

1.一种高导热体的制备方法，包括以下步骤：
S101，切割：选取若干张导热膜切割成同样形状；
S102，叠加：将切割好的导热膜逐层叠加，制成导热膜层叠体；
S103，加压：在垂直于导热膜层叠体表面的方向上，通过压头或辊轮对层叠体施加压力，得到高导热体。
2.如权利要求1所述的方法，其特征在于，
所述S101步骤中使用的导热膜包括石墨膜、石墨复合膜、石墨烯膜、石墨烯复合膜、碳纳米管膜、碳纳米管复合膜、碳纤维膜或碳纤维复合膜；每片导热膜的材质相同或不同，选自上述材料的一种或多种；导热膜平面热导率超过50W/(m·K)，厚度为1-200μm。
3.如权利要求1所述的方法，其特征在于，
所述S101步骤中使用的导热膜切割成的形状包括圆形、椭圆形、三角形、正方形、长方形、多边形或异形形状。
4.如权利要求1所述的方法，其特征在于，
所述S103步骤中用于压合导热膜层叠体的压头或辊轮包括设备自带压头、定制加工平板压头、设备自带辊轮或定制辊轮，其材质包括高硬度金属、金属合金、高硬度陶瓷或陶瓷复合材料、高硬度高分子或高分子复合材料。
5.如权利要求4所述的方法，其特征在于，
所述S103步骤中压头或辊轮表面包含凸起结构、凹陷结构或同时具有凸起和凹陷结构；结构位于压头或辊轮与导热膜层叠体的上下接触面，或上下接触面中的任意一面；在加压过程中，导热膜层叠体中的每层导热膜在压力的作用下形成局部区域凸起和凹陷的微变形，相邻两层导热膜的凸起和凹陷相互锁定。
6.如权利要求5所述的方法，其特征在于，
所述S103步骤中压头或辊轮表面上有阵列式连续硬质凸起和/或凹陷，凸起形状为半球形、方形、三角形；凸起平面尺寸为10-10000μm，凸起高度为1-1000μm，凸起密度为0.2-500000个/平方厘米；凹陷形状为半球形、方形、三角形；凹陷平面尺寸为10-10000μm，凹陷深度为1-1000μm，凹陷密度为0.2-10000个/平方厘米。
7.如权利要求1所述的方法，其特征在于，
所述S103步骤中，加压设备包括压机、热压机、真空热压机、真空热压烧结炉、轧机、真空轧机、连轧机组、对辊机。
8.如权利要求7所述的方法，其特征在于：
所述S103步骤中，施加压强1-300MPa，加压时间为0.001h-24h，加热温度为20℃-1500℃，真空度为10-1-10-13MPa。
9.一种高导热体，其特征在于，
所述高导热体是由权利要求1-8中任一项的方法制备得到的。
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