CN111496669A - Chemical mechanical polishing retaining ring and manufacturing method thereof - Google Patents
Chemical mechanical polishing retaining ring and manufacturing method thereof Download PDFInfo
- Publication number
- CN111496669A CN111496669A CN202010310315.1A CN202010310315A CN111496669A CN 111496669 A CN111496669 A CN 111496669A CN 202010310315 A CN202010310315 A CN 202010310315A CN 111496669 A CN111496669 A CN 111496669A
- Authority
- CN
- China
- Prior art keywords
- ring
- metal ring
- injection molding
- plastic
- outer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 19
- 239000000126 substance Substances 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 55
- 239000004033 plastic Substances 0.000 claims abstract description 39
- 229920003023 plastic Polymers 0.000 claims abstract description 39
- 238000001746 injection moulding Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000012778 molding material Substances 0.000 claims description 19
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000011065 in-situ storage Methods 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000003754 machining Methods 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to the technical field of chemical mechanical retaining rings, in particular to a chemical mechanical polishing retaining ring and a manufacturing method thereof, which are used for solving the problem that in the prior art, a groove is formed on a joint surface of a metal ring, and because the metal ring and a plastic ring are made of different materials and have different thermal contraction expansion coefficients, a gap is left between the plastic ring and the metal ring when the retaining ring is injection-molded. The metal ring comprises a mounting surface and a bonding surface, an outward protruding outer edge is arranged at the edge of the bonding surface, and the plastic ring is connected with the metal ring through injection molding. When the metal ring is subjected to injection molding, the outer edge of the metal ring is provided with the holding structure, the metal ring and the plastic ring are tightly combined together through the extra holding structure, the influence of thermal shrinkage caused by temperature change and the influence of stress in machining can be resisted, and therefore gaps generated at the combination part of the metal ring and the plastic ring can be greatly reduced.
Description
Technical Field
The invention relates to the technical field of chemical mechanical holding rings, in particular to a chemical mechanical polishing holding ring and a manufacturing method thereof.
Background
One of the key processes in the fabrication of semiconductor chips is chemical mechanical polishing, also known as chemical mechanical planarization. In the chemical mechanical polishing process, the silicon wafer is pressed on the surface of the polishing pad with a certain pressure in a face-down mode, the silicon wafer and the polishing pad do relative rotation movement, and meanwhile, polishing liquid is introduced to conduct chemical mechanical polishing. The silicon wafer can be held in its position for rotation and movement relative to the polishing pad without being carried out of its position by centrifugal forces generated by the rotation and by frictional forces of the relative movement, which is achieved by the action of a retaining ring surrounding the silicon wafer.
The prior art cmp retaining ring includes: the plastic ring is a plastic ring which is obtained by transversely cutting a plastic pipe to obtain a piece, and the two rings are vertically laminated and are adhered and fixed together through an adhesive. The surface of the plastic ring generally needs to be bonded after additional processing to enhance the bonding strength.
Based on another patent named 'groove type chemical mechanical polishing retaining ring and manufacturing method thereof' in the company, the method is provided for ditching a groove on a joint surface of a metal ring and manufacturing the retaining ring by adopting an injection molding mode, so that the strength between the metal ring and a plastic ring can be greatly improved, and the problems that the adhesive is likely to overflow and the adhesive falls off slag-shaped particles after being crushed can be avoided.
However, due to the difference of the materials used for the metal ring and the plastic ring, the difference of the thermal contraction expansion coefficients, and the influence of factors such as stress and impact in the machining process, it is difficult to completely avoid the formation of residual gaps between the plastic ring and the metal ring. Therefore, there is a strong need for a retaining ring that further reduces the residual gap between the plastic ring and the metal ring.
Disclosure of Invention
Based on the problems, the invention provides a chemical mechanical polishing retaining ring and a manufacturing method thereof, which are used for solving the problem that in the prior art, a groove is formed on a joint surface of a metal ring, and due to the fact that the metal ring and a plastic ring are made of different materials and have different thermal contraction expansion coefficients, when the retaining ring is subjected to injection molding, a gap is left between the plastic ring and the metal ring.
The invention specifically adopts the following technical scheme for realizing the purpose:
the chemical mechanical polishing retaining ring comprises a metal ring and a plastic ring, wherein the metal ring comprises a mounting surface and a bonding surface, the edge of the bonding surface is provided with an outward protruding outer edge, and the plastic ring is connected with the metal ring through injection molding.
Preferably, the outer edge is located on a side adjacent to the bonding surface.
A method of manufacturing a cmp retaining ring, comprising the steps of:
step 1: placing the metal ring with the outer edge into a mold cavity, and enabling the joint surface of the metal ring to correspond to the inflow direction of the injection molding material;
step 2: heating to melt the injection molding material, pushing the molten injection molding material to flow into a mold cavity under the action of pressure, and continuously flowing the injection molding material into the mold cavity of the metal ring which is additionally protruded out of the periphery of the outer edge to form a holding structure tightly wrapping the outer edge of the metal ring;
and step 3: cooling the injection molding material and forming a plastic ring in situ, directly combining the plastic ring and the metal ring together, and demolding the plastic ring and the metal ring;
and 4, step 4: and (3) cutting off the holding structure in the step (2) as a sacrificial material, and cutting inclined grooves in the surface of the plastic ring to obtain a finished holding ring.
In a preferred embodiment, the injection molding material is a polyphenylene sulfide resin material.
The invention has the beneficial effects that:
according to the invention, the outer edge is arranged on the joint surface of the metal ring, when the metal ring is subjected to injection molding, the outer edge can form the holding structure, and the additional holding structure enables the metal ring and the plastic ring to be tightly combined together, so that the influence of thermal shrinkage caused by temperature change and the influence of stress in machining can be resisted, and the gap generated at the joint part of the metal ring and the plastic ring can be greatly reduced.
Drawings
FIG. 1 is a schematic front sectional view of the present invention:
FIG. 2 is an enlarged view of FIG. 1 at A in accordance with the present invention;
FIG. 3 is a schematic top view of a finished retainer ring of the present invention;
FIG. 4 is a schematic cross-sectional view taken at B-B of FIG. 3 according to the present invention;
reference numerals: 1 metal ring, 2 outer edge, 3 plastic ring, 301 chute.
Detailed Description
For a better understanding of the present invention by those skilled in the art, the present invention will be described in further detail below with reference to the accompanying drawings and the following examples.
Example (b):
as shown in fig. 1-4, a chemical mechanical polishing retaining ring and a manufacturing method thereof, wherein the chemical mechanical polishing retaining ring comprises a metal ring 1 and a plastic ring 3, the metal ring 1 comprises a mounting surface and a bonding surface, the edge of the bonding surface is provided with an outward protruding outer edge 2, and the plastic ring 3 is connected with the metal ring 1 through injection molding.
Preferably, the outer edge 2 is located on the side close to the bonding surface, so that the holding structure can be cut off after injection molding.
A method of manufacturing a cmp retaining ring, comprising the steps of:
step 1: placing a metal ring 1 with an outer edge 2 into a mold cavity, and enabling a joint surface of the metal ring 1 to correspond to the inflow direction of injection molding materials;
step 2: heating to melt the injection molding material, pushing the molten injection molding material to flow into a mold cavity under the action of pressure, continuously flowing the injection molding material into the mold cavity of the metal ring 1 which is additionally protruded out of the periphery of the outer edge 2, and forming a wrapping structure tightly wrapping the outer edge 2 of the metal ring 1;
and step 3: cooling the injection molding material, forming a plastic ring 3 in situ, directly bonding the plastic ring 3 and the metal ring 1 together, and demolding the plastic ring 3 and the metal ring 1;
and 4, step 4: the holding structure in step 2 is cut out as a sacrificial material, and the inclined grooves 301 are cut out on the surface of the plastic ring 3, so that a finished holding ring is obtained.
The working principle is as follows: when the retaining ring is manufactured, an outward protruding outer edge 2 is arranged on the edge of the joint surface of the metal ring 1 in advance, then injection molding material is injected on the joint surface of the metal ring 1 in an injection molding mode to form the plastic ring 3, the injection molding material can continuously and additionally flow into a mold cavity around the outer edge 2 of the metal ring 1 to form an additional holding structure which tightly wraps the outer edge 2 of the metal ring 1, and the additional holding structure enables the metal ring 1 and the plastic ring 3 to be tightly combined together.
By arranging the outer edge, the retaining ring can resist the influence of thermal shrinkage caused by temperature change and the influence of stress in machining, and a gap is not generated at the joint part of the two rings, and at the end of the manufacturing process flow of the retaining ring, the outer edge 2 additionally protruding on the metal ring 1 and the plastic wrapping layer wrapped on the outer edge 2, namely the wrapping structure is cut off as a sacrificial material, so that a retaining ring product with specification and size and without the joint gap is obtained.
The above is an embodiment of the present invention. The embodiments and specific parameters in the embodiments are only for the purpose of clearly illustrating the verification process of the invention and are not intended to limit the scope of the invention, which is defined by the claims, and all equivalent structural changes made by using the contents of the specification and the drawings of the present invention should be covered by the scope of the present invention.
Claims (4)
1. Chemical mechanical polishing retaining ring, including metal ring (1) and plastics ring (3), its characterized in that: the metal ring (1) comprises a mounting surface and a bonding surface, an outer edge (2) protruding outwards is arranged at the edge of the bonding surface, and the plastic ring (3) is connected with the metal ring (1) through injection molding.
2. The chemical mechanical polishing retaining ring of claim 1, wherein: the outer edge (2) is positioned at one side close to the combining surface.
3. The manufacturing approach of the retaining ring of chemical mechanical polishing, characterized by that: the method comprises the following steps:
step 1: placing a metal ring (1) with an outer edge (2) into a mold cavity, and enabling a joint surface of the metal ring (1) to correspond to the inflow direction of injection molding materials;
step 2: heating to melt the injection molding material, pushing the molten injection molding material to flow into a mold cavity under the action of pressure, continuously flowing the injection molding material into the mold cavity of the metal ring (1) which is additionally protruded out of the periphery of the outer edge (2), and forming a wrapping structure tightly wrapping the outer edge (2) of the metal ring (1);
and step 3: cooling the injection molding material, forming a plastic ring (3) in situ, directly bonding the plastic ring (3) and the metal ring (1), and demolding the plastic ring (3) and the metal ring (1);
and 4, step 4: and (3) cutting off the holding structure in the step (2) as a sacrificial material, and cutting an inclined groove (301) in the surface of the plastic ring (3) to obtain a finished holding ring.
4. The method of manufacturing a chemical mechanical polishing retainer ring according to claim 3, wherein: the injection molding material is a polyphenylene sulfide resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010310315.1A CN111496669A (en) | 2020-04-20 | 2020-04-20 | Chemical mechanical polishing retaining ring and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010310315.1A CN111496669A (en) | 2020-04-20 | 2020-04-20 | Chemical mechanical polishing retaining ring and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111496669A true CN111496669A (en) | 2020-08-07 |
Family
ID=71849276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010310315.1A Pending CN111496669A (en) | 2020-04-20 | 2020-04-20 | Chemical mechanical polishing retaining ring and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111496669A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023003625A1 (en) * | 2021-07-21 | 2023-01-26 | Applied Materials, Inc. | Interlocked stepped retaining ring |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001091974A1 (en) * | 2000-05-31 | 2001-12-06 | Philips Semiconductors, Inc. | Method and apparatus for conditioning a polish pad and for dispensing slurry |
| CN2535519Y (en) * | 2002-03-20 | 2003-02-12 | 林俊桢 | Combined door-frame stripe |
| US20030070757A1 (en) * | 2001-09-07 | 2003-04-17 | Demeyer Dale E. | Method and apparatus for two-part CMP retaining ring |
| CN2841245Y (en) * | 2003-04-30 | 2006-11-29 | 应用材料公司 | Two-part fixing-ring |
| CN103677127A (en) * | 2013-12-05 | 2014-03-26 | 通达宏泰科技(苏州)有限公司 | Laptop shell and method for producing same |
| CN104019291A (en) * | 2014-06-16 | 2014-09-03 | 解厚祥 | Composite tube special for air conditioner and tube fitting of composite tube |
| CN104416455A (en) * | 2013-08-20 | 2015-03-18 | Cnus株式会社 | Buckle structure for chemical mechanical polishing device and manufacturing method of buckle structure for chemical mechanical polishing device |
| CN206938866U (en) * | 2017-06-16 | 2018-01-30 | 浙江零跑科技有限公司 | A kind of guide rail sealing structure of floated roof |
| CN110666681A (en) * | 2019-10-28 | 2020-01-10 | 吴三西 | Retaining ring of semiconductor CMP (chemical mechanical polishing) equipment and processing method thereof |
-
2020
- 2020-04-20 CN CN202010310315.1A patent/CN111496669A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001091974A1 (en) * | 2000-05-31 | 2001-12-06 | Philips Semiconductors, Inc. | Method and apparatus for conditioning a polish pad and for dispensing slurry |
| US20030070757A1 (en) * | 2001-09-07 | 2003-04-17 | Demeyer Dale E. | Method and apparatus for two-part CMP retaining ring |
| CN2535519Y (en) * | 2002-03-20 | 2003-02-12 | 林俊桢 | Combined door-frame stripe |
| CN2841245Y (en) * | 2003-04-30 | 2006-11-29 | 应用材料公司 | Two-part fixing-ring |
| CN104416455A (en) * | 2013-08-20 | 2015-03-18 | Cnus株式会社 | Buckle structure for chemical mechanical polishing device and manufacturing method of buckle structure for chemical mechanical polishing device |
| CN103677127A (en) * | 2013-12-05 | 2014-03-26 | 通达宏泰科技(苏州)有限公司 | Laptop shell and method for producing same |
| CN104019291A (en) * | 2014-06-16 | 2014-09-03 | 解厚祥 | Composite tube special for air conditioner and tube fitting of composite tube |
| CN206938866U (en) * | 2017-06-16 | 2018-01-30 | 浙江零跑科技有限公司 | A kind of guide rail sealing structure of floated roof |
| CN110666681A (en) * | 2019-10-28 | 2020-01-10 | 吴三西 | Retaining ring of semiconductor CMP (chemical mechanical polishing) equipment and processing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023003625A1 (en) * | 2021-07-21 | 2023-01-26 | Applied Materials, Inc. | Interlocked stepped retaining ring |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200807 |
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| RJ01 | Rejection of invention patent application after publication |