CN111495689A - L ED lamp pearl processing is with dustless injecting glue encapsulation equipment - Google Patents
L ED lamp pearl processing is with dustless injecting glue encapsulation equipment Download PDFInfo
- Publication number
- CN111495689A CN111495689A CN202010330144.9A CN202010330144A CN111495689A CN 111495689 A CN111495689 A CN 111495689A CN 202010330144 A CN202010330144 A CN 202010330144A CN 111495689 A CN111495689 A CN 111495689A
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- Prior art keywords
- groove
- plate
- cylinder
- supporting
- lamp bead
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- Granted
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- 239000003292 glue Substances 0.000 title claims abstract description 55
- 238000005538 encapsulation Methods 0.000 title claims description 14
- 238000002347 injection Methods 0.000 claims abstract description 35
- 239000007924 injection Substances 0.000 claims abstract description 35
- 239000011324 bead Substances 0.000 claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- 238000005096 rolling process Methods 0.000 claims description 8
- 239000000428 dust Substances 0.000 claims 3
- 238000000034 method Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 3
- 235000017491 Bambusa tulda Nutrition 0.000 description 3
- 241001330002 Bambuseae Species 0.000 description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 3
- 239000011425 bamboo Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Package Closures (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a dust-free glue injection packaging device for L ED lamp bead processing, which comprises a supporting table, a feeding cylinder and a supporting table, wherein one end of the top of the supporting table is fixedly connected with a stand column, the side wall of the stand column is connected with a cross rod in a sliding manner, a glue injection head is installed at the bottom of the cross rod, the top of the supporting table is provided with an annular groove, an annular plate is rotatably connected in the annular groove, the top of the annular plate is equidistantly provided with a vertical placing groove, the glue injection head is positioned right above the placing groove, the feeding cylinder is arranged above the annular plate, one end of the top of the supporting table, which is positioned on the vertical surface of the stand column, is fixedly connected with a supporting plate, the feeding cylinder is fixedly connected to the side wall of the supporting plate, L ED plates are equidistantly placed in the feeding cylinder, L ED plates are connected in the placing groove in a matching manner, the dust-free glue injection packaging device for L ED lamp bead processing is very convenient.
Description
Technical Field
The invention relates to the technical field of L ED lamp bead processing, in particular to a dust-free glue injection packaging device for L ED lamp bead processing.
Background
L ED has extensive application as a new light source material, and L ED encapsulation plays the key effect to emitting light efficiency of emitting diode, and L ED encapsulation generally adopts the mode of some glue, and when some glue, manual control point glue head slides to some glue to the different positions of L ED board.
Present L ED lamp pearl processing is with dustless injecting glue encapsulation equipment generally need be one by one to L ED board material loading encapsulation, go up the unloading in-process and consume more time, greatly reduced packaging efficiency, and present L ED lamp pearl processing is with dustless injecting glue encapsulation equipment generally through the head point of gluing of manual control point, the inhomogeneous condition of point glue appears easily, moreover, manual operation consumes great cost, for this, we provide a L ED lamp pearl processing is with dustless injecting glue encapsulation equipment.
Disclosure of Invention
The invention aims to provide a dust-free glue injection packaging device for processing L ED lamp beads, which is used for solving the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme that the dust-free glue injection packaging equipment for processing the L ED lamp beads comprises a supporting table, a feeding cylinder, a supporting table and a feeding cylinder, wherein an upright column is fixedly connected to one end of the top of the supporting table, the side wall of the upright column is connected with a cross rod in a sliding mode, a glue injection head is installed at the bottom of the cross rod, an annular groove is formed in the top of the supporting table, an annular plate is connected in the annular groove in a rotating mode, vertical placing grooves are formed in the top of the annular plate at equal intervals, the glue injection head is located right above the placing grooves, the feeding cylinder is arranged above the annular plate, a supporting plate is fixedly connected to one end, located on the vertical surface of the upright column, of the top of the supporting table, the feeding cylinder is fixedly connected to the side wall of the.
Preferably, the stand internal rotation is connected with the lead screw, and the outside threaded connection of lead screw has the elevator, stand top fixed mounting has the rotation motor, and the output shaft tip of rotating the motor passes stand and lead screw fixed connection, the stand is located one side of horizontal pole and sets up the draw-in groove of vertical direction, the tip of elevator passes the draw-in groove, and elevator cooperation sliding connection is in the draw-in groove, the elevator is located the outside one end of stand and horizontal pole fixed connection, the tip fixed mounting of horizontal pole has electric putter, and electric putter's piston rod tip stretches into the horizontal pole in fixedly connected with slider, slider cooperation sliding connection is in the horizontal pole, the spout that has the horizontal direction is seted up to the bottom of horizontal pole, the spout is passed to the bottom of slider, and the slider is located the outside one end of spout and first fixed connection of injecting glue.
Preferably, one side that the annular plate is located brace table inside is provided with a supporting cylinder, and the driven gear is installed in the outside of a supporting cylinder, lie in a supporting cylinder outside fixed mounting and have servo motor in the brace table, and servo motor's output shaft end fixed mounting has the driving gear, the driving gear is connected with the driven gear meshing.
Preferably, a groove is formed in one end, far away from the supporting plate, of the supporting table and is communicated with the inside of the placing groove, a top plate is connected to the groove in a sliding mode, the top end of the top plate is connected to the placing groove in a sliding mode in a matching mode, a second air cylinder is fixedly installed below the groove in the supporting table, and the end portion of a piston rod of the second air cylinder is fixedly connected with the top plate.
Preferably, the balls are symmetrically installed on the inner wall of the annular plate, a circle of rolling groove is formed in the inner wall of the limiting groove at the top of the supporting table, the balls are connected in the rolling groove in a rolling mode, and the annular plate is connected in the limiting groove at the top of the supporting table in a rotating mode through the balls arranged on the annular plate.
Preferably, a fixed plate is fixed at the center of the top of the supporting table, a first cylinder is fixedly mounted on the side wall of the fixed plate, a push plate is fixed at one end, away from the upper charging barrel, of the first cylinder, and the push plate is arranged towards the placing groove.
Preferably, four corners of the bottom of the support platform are provided with self-locking wheels.
Preferably, said L ED plate has a thickness greater than the height of the placement channel.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the automatic feeding device, the feeding cylinder is arranged, only the L ED plate needs to be overlapped in the feeding cylinder when the L ED plate is subjected to glue injection and feeding, the L ED plate in the feeding cylinder is automatically placed in the placing groove under the action of gravity in the intermittent rotation process of the annular plate, the automatic feeding process is achieved, the processed L ED plate rotates to a position above the top plate, the piston rod of the second air cylinder extends to push the top plate to slide upwards, the top of the top plate when the top plate slides to the topmost end is in the same plane with the supporting table, the bottom of the L ED plate after glue injection is flush with the top of the supporting table at the moment, the piston rod of the first air cylinder extends to push the push plate to move, and then the L ED plate is pushed to move through the push plate, so that the L ED plate after glue injection is conveniently collected.
2. The electric push rod can control the glue injection head to slide within a certain range, the lifting of the glue injection head can be controlled through the work of the rotating motor, glue injection packaging is facilitated, the plurality of placing grooves are formed in the top of the annular plate, glue injection packaging of L ED plates can be achieved one by one through intermittent rotation of the annular plate, and the situations that feeding, glue injection packaging and packaging of L ED plates are time-consuming and labor-consuming and poor in packaging efficiency are avoided.
Drawings
FIG. 1 is a schematic right side view of the present invention;
FIG. 2 is a schematic structural diagram of a front view of the present invention;
FIG. 3 is an enlarged view of the structure of the present invention at A;
FIG. 4 is a schematic top view of the connection between the support platform and the annular plate according to the present invention.
In the figure, the device comprises a supporting table 1, a supporting table 2, a stand column 3, an electric push rod 4, a cross bar 5, a sliding block 6, a glue injection head 7, a sliding groove 8, a lead screw 9, a lifting block 10, a rotating motor 11, a clamping groove 12, a ring plate 13, a supporting barrel 14, a driven gear 15, a servo motor 16, a driving gear 17, a pushing plate 18, a first air cylinder 19, a ball 20, a second air cylinder 21, a top plate 22, a placing groove 23, a groove 24, a supporting plate 25, a material feeding barrel 26, an L ED plate 27, a self-locking wheel 28 and a fixing plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the invention provides a technical scheme that the dust-free glue injection packaging equipment for processing L ED beads comprises a supporting table 1 and a feeding cylinder 25, wherein one end of the top of the supporting table 1 is fixedly connected with an upright post 2, the side wall of the upright post 2 is slidably connected with a cross rod 4, a glue injection head 6 is installed at the bottom of the cross rod 4, an annular groove is formed in the top of the supporting table 1, an annular plate 12 is rotatably connected in the annular groove, standing grooves 22 in the vertical direction are formed in the top of the annular plate 12 at equal intervals, the glue injection head 6 is positioned right above the standing grooves 22, the feeding cylinder 25 is arranged above the annular plate 12, a supporting plate 24 is fixedly connected to one end of the top of the supporting table 1, which is positioned on the vertical plane of the upright post 2, the feeding cylinder 25 is fixedly connected to the side wall of the supporting plate 24, L ED plates 26 are arranged in the feeding cylinder.
A lead screw 8 is rotatably connected in the upright post 2, the outer side of the lead screw 8 is in threaded connection with a lifting block 9, a rotating motor 10 is fixedly installed at the top of the upright post 2, the end part of an output shaft of the rotating motor 10 penetrates through the upright post 2 to be fixedly connected with the lead screw 8, a clamping groove 11 in the vertical direction is formed in one side, located on the cross rod 4, of the upright post 2, the end part of the lifting block 9 penetrates through the clamping groove 11, the lifting block 9 is in matched sliding connection with the clamping groove 11, one end, located on the outer side of the upright post 2, of the lifting block 9 is fixedly connected with the cross rod 4, an electric push rod 3 is fixedly installed at the end part of the cross rod 4, the end part of a piston rod of the electric push rod 3 extends into the cross rod 4 to be fixedly connected with a sliding block 5, the sliding block 5 is in matched sliding connection with the cross rod 4, a sliding groove 7, this setting is convenient for to the regulation of injecting glue 6 horizontal direction and vertical direction position.
The annular plate 12 is located one side of brace table 1 inside and is provided with a support section of thick bamboo 13, and supports the outside of a section of thick bamboo 13 and install driven gear 14, it has servo motor 15 to lie in the fixed mounting in the support section of thick bamboo 13 outside in 1, and servo motor 15's output shaft tip fixed mounting has driving gear 16, driving gear 16 is connected with driven gear 14 meshing, should set up the rotation of being convenient for drive annular plate 12.
Keep away from the one end of backup pad 24 in the brace table 1 and set up fluted 23, and recess 23 and the inside intercommunication of standing groove 22, sliding connection has roof 21 in recess 23, and the top cooperation sliding connection of roof 21 is in standing groove 22, it has second cylinder 20 to lie in recess 23 below fixed mounting in brace table 1, and the tailpiece of the piston rod portion and roof 21 fixed connection of second cylinder 20, can promote roof 21 to slide on through second cylinder 20 work, and the top when roof 21 slides to the top flushes with brace table 1 surface, and L ED board 26 this moment is located brace table 1 outside, is convenient for to its collection.
The ball 19 is installed to the inner wall symmetry of annular plate 12, the spacing inslot wall at brace table 1 top has seted up the round slot rolling, ball 19 roll connection is in the slot rolling, annular plate 12 rotates the spacing inslot at brace table 1 top through the ball 19 that sets up above that to connect, is convenient for the smooth rotation of annular plate 12.
Support 1 top center is fixed with fixed plate 28, and fixed plate 28 lateral wall fixed mounting has first cylinder 18, the one end of keeping away from feed cylinder 25 of first cylinder 18 is fixed with push pedal 17, and push pedal 17 sets up towards standing groove 22, through the first cylinder 18 of electric control system control and the cooperation of second cylinder 20 that sets up, the extension of second cylinder 20 piston rod promotes the roof 21 and goes up the slide, top and support 1 when the roof 21 goes up to the top are in the coplanar, L ED 26's after the injecting glue this moment bottom and support 1 top flush, then the removal of push pedal 17 is promoted in the extension of first cylinder 18 piston rod, and then promote L ED 26's removal through push pedal 17, be convenient for to the receipts material of L ED 26 after the injecting glue.
Self-locking wheels 27 are mounted at four corners of the bottom of the supporting table 1, so that the device can be moved conveniently.
The L ED plate 26 is thicker than the height of the placing groove 22, so that the L ED plate 26 at the lowest end in the upper charging barrel 25 can be conveniently placed in the placing groove 22, and the loading is convenient.
The working principle is that when the device is used, the device is moved to a proper position, a plurality of L ED plates 26 to be subjected to glue injection are placed in an upper material cylinder 25, a servo motor 15 is controlled to work through an arranged electric control system, and then the intermittent rotation of the annular plate 12 is controlled, L ED plates 26 to be subjected to glue injection in the upper material cylinder 25 are placed in a placing groove 22 in the annular plate 12 in the intermittent rotation process of the annular plate 12, when L ED plates 26 rotate to the glue injection head 6, the horizontal movement of the glue injection head 6 is controlled through the work of an electric push rod 3, the glue injection is performed on a plurality of positions of L ED plates 26, the lifting of the glue injection head 6 is controlled through the work of a rotating motor 10, the glue injection process is achieved, after the glue injection is completed, the annular plate 12 rotates at a certain angle, the next L ED plate 26 is located at a position below a to be processed, when the processed L ED plates 26 are located above a top plate 21, a piston rod 20 extends to push a top of a top plate 21, the top of the top plate is located at the same position as the top of the glue injection head 21, and the top of the support table 6717, and the top of the support table is flush with a push plate 861, and the push plate 8617, and the push plate 26 of a push rod 6717, and the push plate after the push.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A L ED lamp bead processing is with dustless injecting glue encapsulation equipment, which is characterized in that, includes a supporting bench (1) and an upper charging barrel (25),
the glue injection device comprises a supporting table (1), wherein one end of the top of the supporting table (1) is fixedly connected with a stand column (2), the side wall of the stand column (2) is connected with a cross rod (4) in a sliding mode, a glue injection head (6) is installed at the bottom of the cross rod (4), the top of the supporting table (1) is provided with an annular groove, an annular plate (12) is connected in the annular groove in a rotating mode, standing grooves (22) in the vertical direction are formed in the top of the annular plate (12) at equal intervals, and the glue injection head (6) is located right above;
go up feed cylinder (25), the top of annular plate (12) is equipped with feed cylinder (25), one end fixedly connected with backup pad (24) that backup pad (1) top is located stand (2) vertical plane, go up feed cylinder (25) fixed connection in backup pad (24) lateral wall, L ED board (26) have been placed to the equidistance in going up feed cylinder (25), L ED board (26) cooperation is connected in standing groove (22).
2. The L ED lamp bead processing dust-free glue injection packaging equipment is characterized in that a lead screw (8) is rotationally connected in the upright post (2), a lifting block (9) is in threaded connection with the outer side of the lead screw (8), a rotating motor (10) is fixedly mounted at the top of the upright post (2), the end portion of an output shaft of the rotating motor (10) penetrates through the upright post (2) and is fixedly connected with the lead screw (8), a clamping groove (11) in the vertical direction is formed in one side, located on the cross rod (4), of the upright post (2), the end portion of the lifting block (9) penetrates through the clamping groove (11), the lifting block (9) is in matched sliding connection with the clamping groove (11), one end, located on the outer portion of the upright post (2), of the lifting block (9) is fixedly connected with the cross rod (4), an electric push rod (3) is fixedly mounted at the end portion of the cross rod (4), the end portion of a piston rod of the electric push rod (3) extends into the cross rod (4) and is fixedly connected with a sliding block (5), the sliding block (5) is in matched sliding connection with the cross rod (4), one end, a sliding groove (7) in the horizontal direction, and a sliding groove (7) is connected with a sliding chute (7.
3. The L ED lamp bead processing is with dustless injecting glue encapsulation equipment of claim 1, characterized in that one side that the annular plate (12) is located a supporting cylinder (13) inside supporting bench (1), and the outside of supporting cylinder (13) is installed driven gear (14), be located a supporting cylinder (13) outside fixed mounting servo motor (15) in supporting bench (1), and servo motor's (15) output shaft end fixed mounting has driving gear (16), driving gear (16) and driven gear (14) meshing are connected.
4. The L ED lamp bead processing is with dustless injecting glue encapsulation equipment of claim 1, characterized in that the one end of keeping away from backup pad (24) in supporting bench (1) is seted up fluted (23), and fluted (23) and standing groove (22) inside intercommunication, sliding connection has roof (21) in flute (23), and the top cooperation sliding connection of roof (21) is in standing groove (22), lie in supporting bench (1) below flute (23) fixed mounting have second cylinder (20), and the piston rod tip of second cylinder (20) and roof (21) fixed connection.
5. The L ED lamp bead processing use no dust injecting glue encapsulation equipment of claim 1, characterized in that the inner wall of the annular plate (12) is symmetrically installed with balls (19), the inner wall of the limit groove at the top of the support table (1) is provided with a circle of rolling groove, the balls (19) are connected in the rolling groove in a rolling way, the annular plate (12) is rotatably connected in the limit groove at the top of the support table (1) through the balls (19) arranged thereon.
6. The L ED lamp bead processing use no dust injecting glue encapsulation equipment of claim 1, characterized in that a fixed plate (28) is fixed at the top center of the supporting table (1), and a first cylinder (18) is fixedly installed on the side wall of the fixed plate (28), a push plate (17) is fixed on one end of the first cylinder (18) far away from the feeding barrel (25), and the push plate (17) is arranged towards the placing groove (22).
7. The L ED lamp bead processing use no dust injecting glue encapsulation equipment of claim 1, characterized in that the bottom four corners of the support platform (1) are all installed with self-locking wheel (27).
8. The dust-free glue injection packaging equipment for L ED lamp bead processing according to claim 1, wherein the thickness of the L ED plate (26) is larger than the height of the placement groove (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010330144.9A CN111495689B (en) | 2020-04-24 | 2020-04-24 | Dustless injecting glue encapsulation equipment is used in processing of LED lamp pearl |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010330144.9A CN111495689B (en) | 2020-04-24 | 2020-04-24 | Dustless injecting glue encapsulation equipment is used in processing of LED lamp pearl |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111495689A true CN111495689A (en) | 2020-08-07 |
| CN111495689B CN111495689B (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010330144.9A Active CN111495689B (en) | 2020-04-24 | 2020-04-24 | Dustless injecting glue encapsulation equipment is used in processing of LED lamp pearl |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111495689B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112082709A (en) * | 2020-08-24 | 2020-12-15 | 东莞理工学院 | Production equipment with glue injection sealing performance detection function for LED lamp production |
| CN114156390A (en) * | 2022-02-10 | 2022-03-08 | 江苏晶曌半导体有限公司 | Quick packaging device for light-emitting diode |
| CN116759515A (en) * | 2023-08-21 | 2023-09-15 | 山西星心半导体科技有限公司 | Packaging structure of combined LED lamp bead |
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| CN112082709A (en) * | 2020-08-24 | 2020-12-15 | 东莞理工学院 | Production equipment with glue injection sealing performance detection function for LED lamp production |
| CN114156390A (en) * | 2022-02-10 | 2022-03-08 | 江苏晶曌半导体有限公司 | Quick packaging device for light-emitting diode |
| CN116759515A (en) * | 2023-08-21 | 2023-09-15 | 山西星心半导体科技有限公司 | Packaging structure of combined LED lamp bead |
| CN116759515B (en) * | 2023-08-21 | 2023-10-27 | 山西星心半导体科技有限公司 | Packaging structure of combined LED lamp bead |
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| CN111495689B (en) | 2021-06-15 |
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