CN111485202B - Double-layer metal structure for realizing circular dichroism and preparation method thereof - Google Patents

Double-layer metal structure for realizing circular dichroism and preparation method thereof Download PDF

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CN111485202B
CN111485202B CN202010308709.3A CN202010308709A CN111485202B CN 111485202 B CN111485202 B CN 111485202B CN 202010308709 A CN202010308709 A CN 202010308709A CN 111485202 B CN111485202 B CN 111485202B
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substrate
double
dielectric layer
circular dichroism
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CN111485202A (en
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李琪
景志敏
白瑜
李颖
张中月
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Shaanxi Normal University
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • C23C14/30Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/02Pretreatment of the material to be coated
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/18Metallic material, boron or silicon on other inorganic substrates
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    • G02OPTICS
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    • G02B5/008Surface plasmon devices

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Abstract

The invention relates to a double-layer metal structure for realizing circular dichroism and a preparation method thereof, and particularly belongs to the field of optical devices. The double-layer metal structure provided by the invention is formed by periodically splicing a plurality of double-layer metal units, and each double-layer metal unit comprises: the thin film layer, the dielectric layer and the regulation layer; the structure can be obtained through one-time electron beam etching and one-time metal evaporation, the preparation method is simple, and the mechanism of the double-layer metal structure for generating the circular dichroism signal is that the four-dipole oscillation mode on the regulating layer has different regulating and controlling functions on the surface plasmon polariton and the local surface plasmon polariton on the thin layer, and in addition, the structural parameters of the regulating and controlling layer or the thin layer are regulated and controlled, so that the adjustable circular dichroism signal can be realized.

Description

Double-layer metal structure for realizing circular dichroism and preparation method thereof
Technical Field
The invention relates to the field of optical devices, in particular to a double-layer metal structure for realizing circular dichroism and a preparation method thereof.
Background
A chiral structure refers to a structure that breaks symmetry and exhibits different electromagnetic responses to absorption and transmission of Left Circularly Polarized (LCP) light and Right Circularly Polarized (RCP) light, which are commonly characterized by (Circular Dichroism, CD). In nature, chirality is ubiquitous, and organisms such as DNA, proteins, etc. all have chirality. Generally, the mutual coupling between light and natural chiral molecules is very weak, which makes the natural chiral molecules have weak ability to regulate electromagnetic waves. The artificial Plasmon structure refers to a micro-nano metal structure (e.g., a metal rod, a metal sphere, etc.) capable of exciting Surface Plasmon Resonance (SPR) on its Surface. Since SPR is heavily dependent on geometry, material, and dielectric environment, it is possible to modulate SPR to produce a very strong enhancement effect of light in the structure, providing the possibility of arbitrary propagation and manipulation of electromagnetic waves. Based on this, Artificial Plasmon Chiral Structures (APCNs) are proposed, and the expressed adjustable CD effect is widely applied to the field of biological detection and sensing.
In recent years, researchers have proposed a variety of APCNs to achieve modulation of SPR and thus further modulation of CD effects. For example, in 2009, Valev et al realized CD signals in a chiral assembly structure of G-shaped gold nanostructures, and the CD signals were regulated and controlled by adjusting the arrangement of the G-shaped gold nanostructures. In 2016, the Beijing university's Fangtaimen' topic group proposes a planar heptamer gold nanostructure, and the CD signal is regulated and controlled by changing the rotation angle and separation distance between peripheral hexamer gold particles. However, three-dimensional APCNs have an increased degree of freedom in regulation and control compared to planar APCNs, and have a greater ability to regulate electromagnetic waves. For example, in 2015, Esposito et al studied the optical chiral signal of a three-dimensional metal helical system, and by changing the degree of compactness of a single-helical nanowire, enhancement of the chiral signal could be achieved, and further, by increasing the number of helical nanowires to three helical nanowires, adjustment of the chiral signal could be achieved. In 2017, Qu Yu et al designed a twisted Z-shaped metal micro-nano structure consisting of three nanorods, and by changing the rotation angle between the nanorods, effective adjustment of CD signals was achieved. These research results lay a solid theoretical foundation for deeply understanding CD mechanism and realizing CD signal regulation.
However, on the one hand, the structures for modulating circular dichroism signals are complicated, and for a double-layer structure or a multi-layer structure, modulation of one or more other layers is achieved through one layer, so that the modulation of CD signals is still lack of theoretical basis. On the other hand, for the multilayer structure, the preparation method is obtained by multiple times of electron beam etching and multiple times of metal evaporation, the steps are complex, the cost is high, and the preparation difficulty is high.
Disclosure of Invention
The present invention is directed to provide a double-layer metal structure for realizing circular dichroism and a method for manufacturing the same, so as to solve the problems in the prior art that the structure for regulating a circular dichroism signal is complex, and for a double-layer structure or a multi-layer structure, one layer of the double-layer metal structure or the multi-layer metal structure regulates another layer or layers, so that the regulation of a CD signal is still lack of a theoretical basis. On the other hand, for the multilayer structure, the preparation method is obtained by multiple times of electron beam etching and multiple times of metal evaporation, and has the problems of complex steps, higher cost and higher preparation difficulty.
In order to achieve the above purpose, the embodiment of the present invention adopts the following technical solutions:
in a first aspect, the present application provides a double-layer metal structure for realizing circular dichroism, the double-layer metal structure is formed by periodically splicing a plurality of double-layer metal units, and each double-layer metal unit includes: the thin film layer, the dielectric layer and the regulation layer; the shapes of the dielectric layer and the regulating layer are both V-shaped, the V-shaped structure is composed of two edges with different lengths, the projection areas of the dielectric layer and the regulating layer are the same, the dielectric layer is arranged on one side of the thin layer, the regulating layer is arranged on one side of the dielectric layer far away from the thin layer, the thin layer and the regulating layer are made of metal, and the dielectric layer is made of organic glass.
Optionally, an included angle between the V-shaped dielectric layer and the control layer is greater than 90 degrees and less than 180 degrees, a length of one side of the V-shaped dielectric layer is 280 nanometers to 290 nanometers, and a length of the other side of the V-shaped dielectric layer is 440 nanometers to 450 nanometers.
Optionally, the thickness of the thin film layer is 20 nm to 100 nm, the thickness of the dielectric layer is 270 nm to 400 nm, and the thickness of the control layer is 20 nm to 100 nm; the width of the V-shaped structure edge of the dielectric layer and the regulating layer is 100-300 nanometers, the edge length of the thin film layer is 780-820 nanometers, and the width of the thin film layer is 580-620 nanometers.
In a second aspect, the present invention provides a method for preparing a double-layer metal structure for realizing circular dichroism, the method being applied to the double-layer metal structure of any one of the first aspect, the method comprising:
uniformly coating photoresist on a substrate;
exposing the substrate according to a preset image by using an exposure machine;
and vertically plating the preset metal on the exposed substrate by using an electron beam evaporation coating instrument.
Optionally, the step of uniformly coating the photoresist on the substrate comprises:
placing a substrate on a tray of a spin coater, dripping photoresist on the substrate, and performing spin coating operation;
and (4) placing the substrate after the glue homogenizing treatment on a heating plate for heating and drying.
Optionally, the step of exposing the substrate according to the preset image by using the exposure machine further comprises:
and soaking the exposed substrate in a developing solution for 60 seconds, and then soaking the substrate in a fixing solution for 30 seconds, so that the exposed part of the substrate is developed.
Optionally, the step of vertically plating a predetermined metal on the exposed substrate using an electron beam evaporation coater comprises:
placing the substrate in a vacuum chamber of an electron beam coating instrument, and pumping out air in the vacuum chamber to ensure that the pressure of the vacuum chamber is 3-4 x 10-6 torr;
the electron beam evaporation coating instrument is arranged to form an included angle of 90 degrees with the substrate, and the preset metal is used for coating.
Optionally, the step of uniformly coating the photoresist on the substrate further comprises:
dividing the substrate into square blocks with the side length of 1cm, and cleaning the substrate by using acetone;
cleaning the substrate with alcohol;
carrying out ultrasonic cleaning on the substrate by using deionized water;
the substrate was blown dry using nitrogen.
Optionally, the predetermined metal is any one of gold, silver and copper.
The invention has the beneficial effects that:
the double-layer metal structure provided by the invention is formed by periodically splicing a plurality of double-layer metal units, and each double-layer metal unit comprises: the thin film layer, the dielectric layer and the regulation layer; the shapes of the dielectric layer and the regulation and control layer are both V-shaped, the V-shaped is formed by two edges with different lengths, the projection areas of the dielectric layer and the regulation and control layer are the same, the dielectric layer is arranged on one side of the thin film layer, and the regulation and control layer is arranged on one side of the dielectric layer away from the thin film layer, wherein the thin film layer and the regulation and control layer are made of metal, and the dielectric layer is made of organic glass. In addition, the regulation and control of the circular dichroism signal of the double-layer metal structure can be completed by regulating the structural parameters of the regulation and control layer or the thin film layer, so that the adjustable circular dichroism signal is realized.
The application provides a preparation method of a double-layer metal structure for realizing circular dichroism, which comprises the following steps: uniformly coating photoresist on a substrate; exposing the substrate according to a preset image by using an exposure machine; the method has the advantages that the preset metal is vertically plated on the exposed substrate by using the electron beam evaporation coating instrument, the double-layer metal structure can be obtained by performing electron beam etching and metal evaporation on the substrate once, the preparation process is simplified, and the cost of time, material consumption and the like is saved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a two-layer metal structure of the present invention implementing circular dichroism;
FIG. 2 is a partial schematic view of a two-layer metal structure of the present invention implementing circular dichroism;
FIG. 3 is a schematic diagram of a pre-designed pattern for implementing circular dichroism in a bi-layer metal structure using electron beam lithography according to the present invention;
FIG. 4 is a transmitted light spectrum of a double-layer metal structure of the present invention implementing circular dichroism;
FIG. 5 is a graph of a circular dichroism spectrum simulation of a double-layer metal structure implementing circular dichroism in accordance with the present invention;
FIG. 6 is a graph of the charge distribution at the resonance wavelength of a double-layer metal structure implementing circular dichroism in accordance with the present invention;
FIG. 7 is a graph of a circular dichroism spectrum simulation for a two-layer metal structure of the present invention with varying widths of the dielectric and tuning layers;
figure 8 is an SEM image of a double-layer metal structure implementing circular dichroism prepared by the present invention;
FIG. 9 is a transmitted light spectrum of a double-layer metal structure implementing circular dichroism prepared in accordance with the present invention;
fig. 10 is a graph of circular dichroism spectrum measurement of a double-layered metal structure implementing circular dichroism prepared in the present invention.
Icon: 1-a thin film layer; 2-a dielectric layer; 3-regulatory layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiment is a metal plate embodiment of the present invention, and not all embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In order to make the implementation of the present invention clearer, the following detailed description is made with reference to the accompanying drawings.
Example 1
FIG. 1 is a schematic diagram of a two-layer metal structure of the present invention implementing circular dichroism; FIG. 2 is a partial schematic view of a two-layer metal structure of the present invention implementing circular dichroism; as shown in fig. 1 and 2, the present invention provides a double-layered metal structure for realizing circular dichroism, the double-layered metal structure being formed by periodically splicing a plurality of double-layered metal units, each double-layered metal unit comprising: the thin film layer 1, the dielectric layer 2 and the regulation and control layer 3; the shapes of the dielectric layer 2 and the regulating layer 3 are both V-shaped, the V-shaped structure is composed of two edges with different lengths, the projection areas of the dielectric layer 2 and the regulating layer 3 are the same, the dielectric layer 2 is arranged on one side of the thin film layer 1, the regulating layer 3 is arranged on one side of the dielectric layer 2 far away from the thin film layer 1, the thin film layer 1 and the regulating layer 3 are made of metal, and the dielectric layer 2 is made of organic glass.
The number and the specific period of the double-layer metal units are set according to actual needs, and are not specifically limited herein, each double-layer metal unit is formed by arranging the dielectric layer 2 on the substrate, the regulating layer 3 is arranged on the dielectric layer 2, the dielectric layer 2 and the regulating layer 3 are made of metal, the dielectric layer 2 is made of organic glass, namely the material for manufacturing the template of the double-layer metal structure is organic glass, the template is generally a cuboid, etching is carried out on the cuboid template by using a preset pattern, a template with a plane bulge is obtained after development and fixation, wherein the preset pattern is shown in figure 3, the corresponding bulge obtained after etching is the dielectric layer 2, a metal film is vertically plated on the template, the metal film above the dielectric layer 2 is the regulating layer 3, the metal films of the rest parts are film layers 1, and the structure can be obtained by one-time electron beam etching and one-time metal evaporation, the preparation method is simple, and the mechanism of the double-layer metal structure for generating the circular dichroism signal is that the four-dipole oscillation mode on the regulation layer 3 has different regulation and control functions on the surface plasmon polariton and the local surface plasmon polariton on the thin film layer 1. In addition, the structural parameters of the regulating layer 3 or the thin film layer 1 are changed, so that the circular dichroism signal of the structure can be regulated and controlled, and the aim of regulating and controlling the circular dichroism signal of the structure by regulating and controlling one layer of the double-layer structure is fulfilled.
Optionally, an included angle between the V-shaped dielectric layer 2 and the control layer 3 is greater than 90 degrees and less than 180 degrees, a length of one side of the V-shaped dielectric layer is 280 nanometers to 290 nanometers, and a length of the other side of the V-shaped dielectric layer is 440 nanometers to 450 nanometers.
The included angle between the V-shaped structures of the V-shaped dielectric layer 2 and the V-shaped control layer 3 may be 100 degrees, 120 degrees, 160 degrees, or any degree between 90 degrees and 180 degrees, which is not 90 degrees or 180 degrees, and is not specifically limited herein.
One side constituting the "V" shape has a length of 280 nm to 290 nm, generally 280 nm, 282 nm, 286 nm, 288 nm and 290 nm, and is not particularly limited herein.
The length of the other side of the V-shape is 440 nm-450 nm, and is generally 440 nm, 445 nm, 447 nm and 450 nm, which is not limited herein.
Preferably, two sides of the V-shaped control layer 3 are disposed on different planes, for example, the horizontal height of the long side is higher than that of the short side, and the specific difference between the horizontal height of the long side and the horizontal height of the short side is set according to actual needs, and is not specifically limited herein.
Optionally, the thickness of the thin film layer 1 is 20 nm to 100 nm, the thickness of the dielectric layer 2 is 270 nm to 400 nm, and the thickness of the control layer 3 is 20 nm to 100 nm; the width of the V-shaped structure edge of the dielectric layer 2 and the regulation layer 3 is 100-300 nanometers, the edge length of the thin film layer 1 is 780-820 nanometers, and the width of the thin film layer 1 is 580-620 nanometers.
In the double-layer metal unit, the thickness of the thin film layer 1 may be 20 nm, or 60 nm, or 100 nm, which is not specifically limited herein, the thickness of the dielectric layer 2 may be 270 nm, or 350 nm, or 400 nm, which is not specifically limited herein, the width of the "V" shaped structure edge of the dielectric layer 2 and the regulating layer 3 may be 100 nm, or 200 nm, or 300 nm, the edge length of the thin film layer 1 may be 780 nm, or 820 nm, the width of the thin film layer 1 may be 580 nm, or 620 nm, it should be noted that the width of the thin film layer 1 is 580 nm to 620 nm, that is, the entire width of the dielectric layer 2 and the regulating layer 3 should also be 580 nm to 620 nm, and since the included angle between the "V" shaped dielectric layer 2 and the regulating layer 3 is 90 degrees to 180 degrees, the shortest length of the sides of the V-shaped dielectric layer 2 and the control layer 3 is 580/2 × sin180 °, and the longest length is 620/2 × sin90 °; specifically, the method comprises the following steps: the included angle between the V-shaped dielectric layer 2 and the regulating layer 3 is larger than 90 degrees and smaller than 180 degrees, so that the included angle between the dielectric layer 2 and the regulating layer 3 can be flexibly regulated, the charge oscillation mode on the regulating layer 3 is regulated, and the surface plasmon polariton and the local surface plasmon polariton on the thin film layer 1 are further regulated and controlled; the thickness of the thin film layer 1 and the thickness of the regulating layer 3 are 20-100 nanometers, so that the deposition thickness of the thin film in the experimental preparation process can be flexibly controlled, the resonance wavelength and the circular dichroism intensity can be further regulated, and the thickness of the dielectric layer 2 is 270-400 nanometers, so that errors possibly brought in the spin-coating process of a spin coater can be allowed; the widths of the dielectric layer 2 and the regulating layer 3 are 100-300 nanometers, so that the charge oscillation mode on the regulating layer 3 can be regulated and controlled by flexibly controlling the width of the regulating layer 3, and further the surface plasmon polariton and the local surface plasmon polariton on the thin film layer 1 can be regulated and controlled. The side length of the thin film layer 1 is 780-820 nanometers, and the width of the thin film layer 1 is 580-620 nanometers, so that the resonance mode can be adjusted by flexibly controlling the size of the thin film layer 1, and the circular dichroism effect can be flexibly adjusted.
The invention provides a preparation method of a double-layer metal structure for realizing circular dichroism, which is applied to any one of the double-layer metal structures and comprises the following steps:
and uniformly coating photoresist on the substrate.
And (3) turning on a power supply of the spin coater, setting the time to be 60s and the rotating speed to be 4000rpm, measuring the front and the back of the substrate by a universal meter, adsorbing the front of the substrate upwards on a sample tray of the spin coater, taking out the photoresist, wherein the photoresist can be PMMA, sucking a drop of PMMA by using a suction pipe, dripping the drop of PMMA at the center of the substrate, and turning on a switch of the spin coater to spin the photoresist.
And exposing on the substrate according to the preset V-shaped image by using an exposure machine.
Setting the spot of an exposure machine to be 3, adjusting the voltage to be 10KV, setting the exposure dose to be 100 mu C/cm2, setting a preset exposure image to be an image of figure 3, carrying out exposure operation on the substrate, and carrying out development and fixation to obtain a dielectric layer after the exposure is finished.
And vertically plating the preset metal on the exposed substrate by using an electron beam evaporation coating instrument.
Placing the substrate in a vacuum chamber of an electron beam coating instrument, and pumping out air in the vacuum chamber to ensure that the pressure of the vacuum chamber is 3-4 x 10-6 torr; and setting an included angle between the electron beam evaporation coating instrument and the substrate to be 90 degrees, and coating by using preset, wherein the evaporation coating metal material is any one of gold, silver and copper, and preferably silver.
Optionally, the step of uniformly coating the photoresist on the substrate comprises:
placing a substrate on a tray of a spin coater, dripping photoresist on the substrate, and performing spin coating operation;
and (4) placing the substrate after the glue homogenizing treatment on a heating plate for heating and drying.
Turning on a power supply of the spin coater, setting time to be 60s and rotation speed to be 4000rpm, measuring the front and back surfaces of the substrate by a universal meter, enabling the front surface of the substrate to face upwards and adsorbing the front surface of the substrate on a sample tray of the spin coater, taking out the photoresist, sucking a drop of the photoresist by a suction pipe, dripping the drop of the photoresist on the center of the substrate, and turning on a switch of the spin coater to spin the photoresist; turning on the power supply of the heating plate, setting the temperature to 150 deg.C, taking out the substrate spun with photoresist from the spin coater, heating on the heating plate, taking out the substrate after 3min, and placing in a sample box
Optionally, the step of exposing the substrate according to the preset image by using the exposure machine further comprises:
and soaking the exposed substrate in a developing solution for 60 seconds, and then soaking the substrate in a fixing solution for 30 seconds, so that the exposed part of the substrate is developed.
Optionally, the step of vertically plating a predetermined metal on the exposed substrate using an electron beam evaporation coater comprises:
placing the substrate in a vacuum chamber of an electron beam coating instrument, and pumping out air in the vacuum chamber to ensure that the pressure of the vacuum chamber is 3-4 x 10-6 torr;
the electron beam evaporation coating instrument is arranged to form an included angle of 90 degrees with the substrate, and the preset metal is used for coating.
Optionally, the step of uniformly coating the photoresist on the substrate further comprises:
dividing the substrate into squares with the side length of 1cm, and cleaning the substrate by using acetone;
cleaning the substrate with alcohol;
carrying out ultrasonic cleaning on the substrate by using deionized water;
the substrate was blown dry using nitrogen.
Optionally, the predetermined metal is any one of gold, silver and copper.
In practical application, the preparation method of the double-layer metal structure for realizing circular dichroism comprises the following steps:
first, substrate preparation: the glass is cut into small blocks of 1cm by a glass cutter, and the size arrangement meets the requirement of the size of an actual sample on one hand and is convenient for preparing a plurality of samples in a large batch in one experimental process on the other hand. During cleaning, the substrate is firstly cleaned by acetone and alcohol for 15 minutes in an ultrasonic mode, then cleaned by deionized water for 3 minutes in an ultrasonic mode, and finally the cleaned substrate is dried by nitrogen to be ready for use.
Step two, photoresist homogenizing: and (3) turning on a power supply of the spin coater, setting the time to be 60s and the rotating speed to be 4000rpm, measuring the front and the back of the substrate by a universal meter, and adsorbing the front of the substrate upwards on a sample tray of the spin coater. And taking out the PMMA in the refrigerator, sucking a drop of the PMMA by a suction pipe, dripping the drop of the PMMA at the center of the substrate, and opening a switch of a spin coater to carry out spin coating operation.
Step three, heating and drying: and (3) turning on a heating plate power supply, setting the temperature to 150 ℃, taking out the substrate spun with PMMA from the spin coater, placing the substrate on the heating plate for heating, and taking out the substrate after 3min and placing the substrate in a sample box.
Step four, exposure: when exposure is started with a dot of 3, HV of 10KV and exposure dose of 100 μ C/cm2, the pattern designed as shown in FIG. 3 is etched by the electron beam in the pattern-designed portion shown in FIG. 3.
Step five, developing and fixing: the exposed sample was put in a developing solution for 60 seconds, then a fixing solution for 30 seconds, and then taken out and set in a sample box.
Sixthly, metal evaporation: before coating, the sample is attached to a sample disc in an electron beam evaporation coating instrument and then vacuumized, and coating can be started when the pressure in the cavity reaches 3-4 x 10-6 torr. The thickness of the coating film is set to be 60 nanometers, the coating direction is set to be 90 degrees, the evaporation material is selected to be one of gold, silver or copper, the invention preferably selects silver, and the coating switch is turned on to start coating.
The preparation method of the structure utilizes the combination of the electron beam etching technology and the inclined angle deposition technology, can prepare the double-layer metal structure by only utilizing the electron beam etching technology and the inclined angle deposition technology once, reduces the steps that the double-layer or three-layer metal structure needs the electron beam etching technology for multiple times and metal evaporation for multiple times, has simple steps, saves the time, the cost of consumables and the like, and improves the preparation efficiency.
Example 2:
based on the double-layer metal structure for realizing circular dichroism shown in fig. 1, a computational simulation test was performed by using three-dimensional Finite Element Method (FEM) computation software COMSOL Multiphysics. The specific setting parameters are as follows:
the included angle between the V-shaped dielectric layer 2 and the V-shaped regulating layer 3 is 105 degrees, the length of one side forming the V shape is 447 nanometers, the length of the other side is 282 nanometers, the thickness of the thin film layer is 60 nanometers, the thickness of the dielectric layer is 270 nanometers, and the thickness of the regulating layer is 60 nanometers; the width of the dielectric layer is 200 nanometers, and the width of the regulating layer is 200 nanometers; the side length of the rectangular cycle in the horizontal direction is 800 nanometers, and the cycle in the vertical direction is 600 nanometers.
FIG. 4 is a transmitted light spectrum of a double-layer metal structure of the present invention implementing circular dichroism;
fig. 5 is a graph of a circular dichroism spectrum simulation of a double-layer metal structure implementing circular dichroism according to the present invention, as shown in fig. 4 and 5, it can be seen that: three distinct transmission peaks occur at 850 nm, 810 nm, and 760 nm, labeled as Mode I, Mode II, and Mode III, respectively. At long wavelengths 850 nm, the transmittance of the bilayer metal structure for LCP light is greater than that for RCP light, and the transmittance of LCP light is about 1.7 times that of RCP light, resulting in a distinct CD valley as occurs at I of Mode in fig. 5. At short wavelengths 760 nm, however, the bi-layer metal structure has greater transmission for RCP light than for LCP light, resulting in a distinct CD peak as seen at III of Mode in fig. 5.
Fig. 6 is a graph showing the charge distribution at the resonance wavelength of the double-layer metal structure for realizing circular dichroism according to the present invention, as shown in fig. 6, it can be seen that: the mechanism of the generation of the CD effect is that the four-dipole oscillation mode on the upper regulation layer has different regulation and control effects on the surface plasmon polariton and the local surface plasmon polariton on the lower thin film layer. Thus, this embodiment complements the mechanism of circular dichroism generated by the bi-or tri-layer metal structure.
Example 3
Based on the double-layer metal structure for realizing circular dichroism shown in fig. 1, a computational simulation test was performed by using three-dimensional Finite Element Method (FEM) computation software COMSOL Multiphysics. The specific setting parameters are as follows:
the included angle between the V-shaped dielectric layer and the regulating layer is 105 degrees, the length of one side forming the V shape is 447 nanometers, the length of the other side is 282 nanometers, the thickness of the thin film layer is 60 nanometers, the thickness of the dielectric layer is 270 nanometers, and the thickness of the regulating layer is 60 nanometers; the width of the dielectric layer is 180-220 nm, and the width of the regulation layer is 180-220 nm; the side length of the rectangular cycle in the horizontal direction is 800 nanometers, and the cycle in the vertical direction is 600 nanometers. Fig. 7 is a graph of a circular dichroism spectrum simulation of the two-layer metal structure of the present invention with the width of the dielectric layer and the control layer varied, as shown in fig. 7, wherein w represents the width of the dielectric layer and the control layer. It can be seen that: as the width of the control layer is increased, the I, II and III of the model are subjected to obvious blue shift. Therefore, the double-layer metal structure has the advantages that the width of the regulating layer can be flexibly controlled to regulate and control the charge oscillation mode on the regulating layer, so that the surface plasmon polariton and the local surface plasmon polariton on the thin film layer can be regulated and controlled, and the adjustable circular dichroism effect is finally realized.
Example 4
Figure 8 is an SEM image of a double-layer metal structure implementing circular dichroism prepared by the present invention; FIG. 9 is a transmitted light spectrum of a double-layer metal structure implementing circular dichroism prepared in accordance with the present invention; fig. 10 is a circular dichroism spectrum measurement diagram of a double-layered metal structure implementing circular dichroism prepared by the present invention, the morphology of which is characterized by a scanning electron microscope based on the double-layered metal structure prepared in example 1, as shown in fig. 8. Next, the transmission spectrum of the double-layer metal structure prepared in example 1 was measured by a self-built near-field optical microscope, as shown in fig. 9 and 10, wherein the spot size was set to 600 μm and the collected spectrum range was 700-. Comparing fig. 4 with fig. 9, fig. 5 and fig. 10, it can be seen that the experimentally measured spectrum substantially agrees with the simulation results, but the resonance wavelength has a red shift phenomenon due to the influence of the substrate in the experimental preparation. Therefore, the experiment of this example verifies the feasibility of the double-layered metal structure implementing circular dichroism and the preparation method thereof. In practical applications, the control layer 3 may be covered with a silica thin film or a graphene thin film, so as to concentrate electromagnetic field energy between the silica thin film or the graphene thin film and the thin film layer 1, so as to enhance circular dichroism.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all should be considered as belonging to the protection scope of the invention
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. A double-layered metal structure for realizing circular dichroism, wherein the double-layered metal structure is formed by periodically splicing a plurality of double-layered metal units, each of the double-layered metal units comprising: the thin film layer, the dielectric layer and the regulation layer; the shape of the dielectric layer and the shape of the regulating layer are both V-shaped, the V-shaped is composed of two edges with different lengths, the projection areas of the dielectric layer and the regulating layer are the same, the dielectric layer is arranged on one side of the thin film layer, the regulating layer is arranged on one side, far away from the thin film layer, of the dielectric layer, a gap with the same shape as the dielectric layer is arranged in the bottom of the dielectric layer, the bottom of the dielectric layer is arranged in the gap, the thin film layer and the regulating layer are made of metal, the dielectric layer is made of organic glass, and the thickness of the dielectric layer is 270-400 nanometers.
2. The double-layer metal structure for realizing circular dichroism according to claim 1, wherein the included angle between the dielectric layer and the control layer in the V shape is greater than 90 degrees and less than 180 degrees, and the length of one side of the V shape is 280 nm to 290 nm, and the length of the other side is 440 nm to 450 nm.
3. The double-layered metal structure for realizing circular dichroism according to claim 1, wherein the thin film layer has a thickness of 20 nm to 100 nm, and the control layer has a thickness of 20 nm to 100 nm; the width of the V-shaped structure edge of the dielectric layer and the regulating layer is 100-300 nanometers, the edge length of the thin film layer is 780-820 nanometers, and the width of the thin film layer is 580-620 nanometers.
4. A method for preparing a double-layered metal structure for realizing circular dichroism, which is applied to the double-layered metal structure of any one of claims 1 to 3, the method comprising:
uniformly coating photoresist on a substrate;
exposing the substrate according to a preset image by using an exposure machine;
and vertically plating a preset metal on the exposed substrate by using an electron beam evaporation coating instrument.
5. The method of claim 4, wherein the step of uniformly coating the photoresist on the substrate comprises:
placing a substrate on a tray of a spin coater, and dripping photoresist on the substrate to carry out spin coating operation;
and (4) placing the substrate after the glue homogenizing treatment on a heating plate for heating and drying.
6. The method for preparing a double-layered metal structure realizing circular dichroism according to claim 4, wherein the exposing step on the substrate according to a preset image using an exposing machine further comprises:
and soaking the exposed substrate in a developing solution for 60 seconds, and then soaking the substrate in a fixing solution for 30 seconds, so that the exposed part of the substrate is developed.
7. The method for preparing a double-layered metal structure realizing circular dichroism according to claim 4, wherein the step of uniformly coating a photoresist on a substrate further comprises:
dividing the substrate into square blocks with the side length of 1cm, and cleaning the substrate by using acetone;
cleaning the substrate with alcohol;
ultrasonically cleaning the substrate by using deionized water;
the substrate was blown dry using nitrogen.
8. The method of claim 4, wherein the predetermined metal is any one of gold, silver and copper.
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