CN111479409A - Lamination process of aluminum substrate - Google Patents
Lamination process of aluminum substrate Download PDFInfo
- Publication number
- CN111479409A CN111479409A CN202010418676.8A CN202010418676A CN111479409A CN 111479409 A CN111479409 A CN 111479409A CN 202010418676 A CN202010418676 A CN 202010418676A CN 111479409 A CN111479409 A CN 111479409A
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- CN
- China
- Prior art keywords
- plate body
- laminating
- temperature
- rated
- lamination process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
A lamination process of an aluminum substrate at least comprises the following steps of heating, namely heating a primary plate body formed by sequentially laminating a copper foil, a prepreg and a substrate to rated high temperature; a laminating step of laminating the primary plate body at the rated elevated temperature using a laminator; a temperature reduction step, wherein the primary plate body in lamination is cooled to a rated low temperature to form a secondary plate body; and a re-warming step, namely putting the secondary plate body into an oven to be heated for 0.8-1.2 hours at a re-warming temperature. According to the invention, the traditional heat preservation step is required, and the temperature recovery step is added after the temperature reduction step is finished, so that the whole board forming time is reduced, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a lamination process of an aluminum substrate.
Background
The existing production process flow of the printed circuit board comprises the steps of cutting, laminating, drilling, copper deposition, wiring, etching, resistance welding, characters, tin spraying, edge milling, v cutting, flying measurement and vacuum packaging, wherein the steps of heating, heat preservation and cooling are required to be carried out on the board body in the laminating process to ensure that the prepreg can be well connected with the copper foil layer and the base layer, but the completion time of the traditional process is long, mainly because the heating and cooling are very time-consuming, and the heat preservation process takes more than two hours, so that the board forming time of the same board body is too long, and the production efficiency is influenced.
Disclosure of Invention
The invention aims to provide a lamination process of an aluminum substrate, which reduces the whole plate forming time and improves the production efficiency by needing a traditional heat preservation step and adding a temperature re-preservation step after the temperature reduction step is finished.
The technical purpose of the invention is realized by the following technical scheme: at least comprises the following steps of,
heating, namely heating a primary plate body formed by sequentially laminating a copper foil, a prepreg and a substrate to a rated high temperature;
a laminating step of laminating the primary plate body at the rated elevated temperature using a laminator;
a temperature reduction step, wherein the primary plate body in lamination is cooled to a rated low temperature to form a secondary plate body;
and a re-warming step, namely putting the secondary plate body into an oven to be heated for 0.8-1.2 hours at a re-warming temperature.
Preferably, the rated high temperature is 150-170 ℃, and the rated low temperature is 70-75 ℃.
Preferably, the rewarming temperature is less than or equal to the rated high temperature.
Preferably, in the heating step, the prepreg is heated to a liquid state before entering the laminating step.
Preferably, in the cooling step, the primary plate body is cooled to the rated low temperature and then is kept for 6-10 minutes, and then the rewarming step is performed.
In a preferred aspect of the present invention, in the heating step, the laminating step, and the cooling step, the primary plate is subjected to negative pressure air extraction using an air extractor.
Preferably, in the rewarming step, a lamination tool is used to fix the secondary plate body and then rewarming is performed.
Preferably, the laminating tool comprises an upper pressing plate and a lower pressing plate, a sealing wall is arranged at the edge of the lower pressing plate, a fixing groove for fixing the secondary plate body is arranged at the center of the lower pressing plate, the distance between the fixing groove and the sealing wall is 1-3 mm, a step-shaped supporting part is arranged at the upper end of the sealing wall, a sealing rubber layer is bonded on the surface of the step-shaped supporting part, the upper pressing plate is pressed into the step-shaped supporting part to complete connection, and a rotary pressing sheet is rotatably arranged at the top of the sealing wall.
Preferably, in the cooling step, a negative pressure interface is arranged on a sealing wall of the laminator, and the negative pressure interface is connected with a negative pressure fan.
In conclusion, the invention has the following beneficial effects:
the invention has the advantages of effectively saving the time of the laminating process and improving the board forming efficiency.
Drawings
FIG. 1 is a schematic view of a lamination process of an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a primary board according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a lamination tooling according to an embodiment of the present invention;
in the figure: 1-copper foil; 2-a prepreg; 3-a substrate; 4, an upper pressing plate; 5, pressing a lower plate; 6-sealing the wall; 7-fixing grooves; 8-a step-shaped support portion; 9-a sealing rubber layer; 10-rotary tabletting; 11-negative pressure interface.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1, the present embodiment includes the steps of,
a positioning hole processing step of processing a positioning groove hole on the semi-cured sheet 2 and the substrate 3;
an etching step of etching the substrate 3;
a plate stacking step, wherein plates are stacked in the bearing disc to form a primary plate body;
a heating step, in which a primary board body formed by sequentially laminating the copper foil 1, the prepreg 2 and the substrate 3 as shown in fig. 2 is heated to a rated high temperature until the prepreg 2 is heated to a liquid state;
a laminating step, laminating the primary plate body at the rated high temperature by using a laminating machine;
a cooling step, cooling the laminated primary plate body to a rated low temperature to form a secondary plate body, and keeping the temperature of the primary plate body for 6-10 minutes after the primary plate body is cooled to the rated low temperature;
and a re-warming step, namely putting the secondary plate body into an oven to be heated for 0.8-1.2 hours at a re-warming temperature. Compared with the steps of heating, heat preservation and cooling in the prior art, the embodiment cancels the heat preservation step, and carries out the temperature re-preservation step after the temperature reduction, the improvement can shorten the laminating process which can be finished only within 2-2.5 hours to 1-1.3 hours,
wherein the rated high temperature in the heating step is 150-170 ℃, and the rated low temperature in the cooling step is 70-75 ℃. The rewarming temperature is less than or equal to the rated high temperature, and is generally 150-170 ℃, preferably 150 ℃.
6 in the cooling step, the lamination process of the aluminum substrate according to claim 1, characterized in that: in the heating step, the laminating step and the cooling step, the primary plate body is subjected to negative pressure air extraction by using an air extraction device, the air extraction device and the laminating equipment are both existing equipment, and the embodiment is not specifically developed.
The secondary plate body can be directly rewarming in the rewarming step of the embodiment, and the rewarming operation can be performed after the secondary plate body is fixed by using a laminating tool. As shown in fig. 3, the lamination tool includes an upper press plate 4, a lower press plate 5, the upper press plate 4, the lower press plate 5 adopts a metal plate body, the upper press plate 4, the lower press plate 5 is provided with a through hole 12, the edge of the lower press plate 5 is provided with a sealing wall 6, the center position of the lower press plate 5 is provided with a fixing groove 7 for fixing a secondary plate body, the distance between the fixing groove 7 and the sealing wall 6 is 1 mm-3 mm, the upper end of the sealing wall 6 is provided with a stepped supporting portion 8, a sealing rubber layer 9 is bonded on the surface of the stepped supporting portion 8, the upper press plate 4 is pressed into the stepped supporting portion 8 to complete connection, the top of the sealing wall 6 is rotatably provided with a rotating press piece 10, and after the rotating press piece 10 rotates towards the upper press plate 4, the rotating press. In the cooling step, a negative pressure interface 11 is arranged on the sealing wall 6 of the laminator, and the negative pressure interface 11 is connected with a negative pressure fan.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (9)
1. A lamination process of an aluminum substrate is characterized in that: at least comprises the following steps of,
a heating step, wherein a primary plate body formed by sequentially laminating the copper foil (1), the prepreg (2) and the substrate (3) is heated to a rated high temperature;
a laminating step of laminating the primary plate body at the rated elevated temperature using a laminator;
a temperature reduction step, wherein the primary plate body in lamination is cooled to a rated low temperature to form a secondary plate body;
and a re-warming step, namely putting the secondary plate body into an oven to be heated for 0.8-1.2 hours at a re-warming temperature.
2. The lamination process for aluminum substrates according to claim 1, wherein: the rated high temperature is 150-170 ℃, and the rated low temperature is 70-75 ℃.
3. The lamination process for aluminum substrates according to claim 1, wherein: the rewarming temperature is less than or equal to the rated high temperature.
4. The lamination process for aluminum substrates according to claim 1, wherein: in the heating step, the prepreg (2) is heated to be in a liquid state and then enters the laminating step.
5. The lamination process for aluminum substrates according to claim 1, wherein: and in the cooling step, the primary plate body is cooled to the rated low temperature and then is kept for 6-10 minutes, and then the rewarming step is carried out.
6. The lamination process for aluminum substrates according to claim 1, wherein: in the heating step, the laminating step and the cooling step, an air extractor is used for carrying out negative pressure air extraction on the primary plate body.
7. The lamination process for aluminum substrates according to claim 1, wherein: and in the temperature recovery step, a laminating tool is used for fixing the secondary plate body and then performing temperature recovery operation.
8. The process of laminating an aluminum substrate according to claim 7, wherein: lamination frock include top board (4), holding down plate (5), the border department of holding down plate (5) be provided with sealed wall (6), the central point of holding down plate (5) put and set up fixed slot (7) that are used for fixed secondary plate body, fixed slot (7) with sealed wall (6) between the interval be 1mm ~ 3mm, the upper end of sealed wall (6) be provided with step type supporting part (8), step type supporting part (8) surface bond have sealing rubber layer (9), top board (4) impress step type supporting part (8) are accomplished and are connected, the top of sealed wall (6) rotate and be provided with rotation preforming (10).
9. The process of laminating an aluminum substrate according to claim 8, wherein: in the cooling step, a negative pressure interface (11) is arranged on a sealing wall (6) of the laminating machine, and the negative pressure interface (11) is connected with a negative pressure fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010418676.8A CN111479409A (en) | 2020-05-18 | 2020-05-18 | Lamination process of aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010418676.8A CN111479409A (en) | 2020-05-18 | 2020-05-18 | Lamination process of aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111479409A true CN111479409A (en) | 2020-07-31 |
Family
ID=71763167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010418676.8A Withdrawn CN111479409A (en) | 2020-05-18 | 2020-05-18 | Lamination process of aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111479409A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112788854A (en) * | 2021-01-15 | 2021-05-11 | 新余市木林森线路板有限公司 | Hot-pressing process for production of heat-conducting aluminum substrate circuit |
-
2020
- 2020-05-18 CN CN202010418676.8A patent/CN111479409A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112788854A (en) * | 2021-01-15 | 2021-05-11 | 新余市木林森线路板有限公司 | Hot-pressing process for production of heat-conducting aluminum substrate circuit |
| CN112788854B (en) * | 2021-01-15 | 2022-04-19 | 新余市木林森线路板有限公司 | Hot-pressing process for production of heat-conducting aluminum substrate circuit |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| WW01 | Invention patent application withdrawn after publication | ||
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Application publication date: 20200731 |