CN111473421A - Fan blade assembly for semiconductor air conditioner, fan assembly and semiconductor air conditioner - Google Patents
Fan blade assembly for semiconductor air conditioner, fan assembly and semiconductor air conditioner Download PDFInfo
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- CN111473421A CN111473421A CN202010311250.2A CN202010311250A CN111473421A CN 111473421 A CN111473421 A CN 111473421A CN 202010311250 A CN202010311250 A CN 202010311250A CN 111473421 A CN111473421 A CN 111473421A
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- fan blade
- air conditioner
- assembly
- semiconductor
- refrigeration
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 129
- 238000005057 refrigeration Methods 0.000 claims abstract description 68
- 238000009413 insulation Methods 0.000 claims description 30
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 238000001816 cooling Methods 0.000 claims description 14
- 238000005192 partition Methods 0.000 claims description 14
- 238000009434 installation Methods 0.000 claims description 10
- 230000007704 transition Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000004378 air conditioning Methods 0.000 abstract description 7
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/0007—Indoor units, e.g. fan coil units
- F24F1/0018—Indoor units, e.g. fan coil units characterised by fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/26—Rotors specially for elastic fluids
- F04D29/32—Rotors specially for elastic fluids for axial flow pumps
- F04D29/325—Rotors specially for elastic fluids for axial flow pumps for axial flow fans
- F04D29/327—Rotors specially for elastic fluids for axial flow pumps for axial flow fans with non identical blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
The invention provides a fan blade assembly, a fan assembly and a semiconductor air conditioner for a semiconductor air conditioner, relates to the technical field of semiconductor air conditioners, and solves the technical problems that an existing air conditioning unit used for a kitchen environment is complex in structure, and is difficult to clean, disassemble and assemble and large in workload. The fan blade assembly for the semiconductor air conditioner comprises a fan blade body and a semiconductor refrigeration assembly; the fan blade body comprises a cold air duct, the semiconductor refrigeration assembly is installed in the fan blade body, and the refrigeration surface of the semiconductor refrigeration assembly faces the cold air duct. The fan assembly comprises a motor assembly and a fan blade assembly for a semiconductor air conditioner. The semiconductor air conditioner comprises an air conditioner body and a fan assembly. The invention provides a fan blade assembly for a semiconductor air conditioner, a fan assembly and a semiconductor air conditioner, which are simple in structure, low in cleaning, dismounting difficulty and low in workload.
Description
Technical Field
The invention relates to the technical field of semiconductor air conditioners, in particular to a fan blade assembly for a semiconductor air conditioner, a fan assembly provided with the fan blade assembly for the semiconductor air conditioner and the semiconductor air conditioner provided with the fan assembly.
Background
At present, air conditioners used in a kitchen environment are provided in the market, and the air conditioners are provided with air duct type forms, courtyard machine forms, all-in-one machines and the like. The existing air conditioning units in the market mostly use a refrigerant refrigeration mode, air conditioning parts comprise a heat exchanger, a compressor, copper pipes, a throttle valve, fan blades, a motor and the like, the kitchen environment is severe, the units need to be regularly cleaned, the internal pipelines of the units are irregular, the fin intervals are small, the quantity is large, and the units are difficult to clean. Most air-cooled radiating air conditioning units comprise a fan component and a heat exchanger component, so that the heat exchanger exchanges heat with air, the heat exchanger mostly adopts aluminum foil sheets (fins) to increase the radiating area, the number of the fins is large, the space is small, the production procedures are multiple and complex, and the cost is high due to the existence of a refrigerant; in the semiconductor air conditioner appearing in the market, a semiconductor refrigeration part mostly exists as an independent part, although the refrigeration part is reduced to a certain extent, in the environment with large oil smoke such as a kitchen, frequent machine installation and disassembly for cleaning are required, and the workload is still large.
Disclosure of Invention
The invention aims to provide a fan blade assembly for a semiconductor air conditioner, a fan assembly provided with the fan blade assembly and the semiconductor air conditioner provided with the fan assembly, and aims to solve the technical problems that an air conditioning unit used for a kitchen environment in the prior art is complex in structure, difficult to clean and disassemble and large in workload. The technical effects that can be produced by the preferred technical scheme in the technical schemes of the invention are described in detail in the following.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention provides a fan blade assembly for a semiconductor air conditioner, which comprises a fan blade body and a semiconductor refrigeration assembly, wherein the fan blade body is provided with a fan blade body; wherein,
the fan blade body comprises a cold air duct, the semiconductor refrigeration assembly is installed in the fan blade body, and the refrigeration surface of the semiconductor refrigeration assembly faces the cold air duct.
In a preferred or alternative embodiment, the semiconductor chilling assembly comprises at least two semiconductor chilling plates.
In a preferred or optional embodiment, the fan blade assembly for the semiconductor air conditioner further comprises a heat insulation assembly, the heat insulation assembly comprises at least two heat insulation sheets, and the semiconductor refrigeration sheet and the heat insulation sheets are arranged at intervals.
In a preferred or optional embodiment, the fan blade assembly for the semiconductor air conditioner further comprises a heat insulation assembly, the fan blade body comprises an inner side fan blade and an outer side fan blade, the inner side fan blade and the outer side fan blade are coaxially sleeved and fixed, and the semiconductor refrigeration assembly and the heat insulation assembly are both installed in a gap between the inner side fan blade and the outer side fan blade.
In a preferred or optional embodiment, the inner fan blade includes an inner hub and an inner blade, a space formed in the inner hub forms the cold air duct, the inner blade is disposed on an inner wall surface of the inner hub, at least two mounting grooves are disposed on an outer wall surface of the inner hub, and the semiconductor refrigeration assembly can be mounted in the mounting grooves.
In a preferred or alternative embodiment, a heat insulation sheet installation position is arranged between adjacent installation grooves, and a wire guide groove is arranged on the surface of the heat insulation sheet installation position.
In a preferred or optional embodiment, the outer fan blade comprises an outer hub and an outer blade, the outer hub is sleeved outside the inner hub, and the outer blade is arranged on the outer wall surface of the outer hub.
In a preferred or alternative embodiment, the inboard and outboard vanes are pitched in opposite directions.
The fan assembly provided by the invention comprises a motor assembly and a fan blade assembly for the semiconductor air conditioner, which is provided by any technical scheme of the invention; wherein,
the power output end of the motor component is in transmission connection with the fan blade component for the semiconductor air conditioner, so that the fan blade component for the semiconductor air conditioner can be driven to rotate.
The semiconductor air conditioner provided by the invention comprises an air conditioner body and the fan assembly provided by any technical scheme of the invention; wherein,
the air conditioner body comprises a refrigeration channel and a heat dissipation channel, the refrigeration channel is isolated from the heat dissipation channel, and the fan assembly is connected with the air conditioner body to enable the refrigeration surface of the semiconductor refrigeration assembly to be located in the refrigeration channel and enable the heat dissipation surface of the semiconductor refrigeration assembly to be located in the heat dissipation channel.
In a preferred or optional embodiment, the air conditioner body comprises two flow guide rings, the fan blade body is arranged in a gap between the two flow guide rings, and the two flow guide rings and the cold air duct jointly form the refrigeration channel.
In a preferred or optional embodiment, the inner diameter of each flow guide ring far away from the fan blade body is larger than the inner diameter of each flow guide ring close to the fan blade body, and the inner wall of each flow guide ring is in smooth transition.
In a preferred or optional embodiment, the air conditioner body further comprises two return air partition plates, the flow guide ring and the fan blade body are arranged in the two return air partition plates, a wind guide structure is arranged on the return air partition plates, and the heat dissipation channel is formed between the outer wall surface of the flow guide ring and the inner wall surface of the wind guide structure.
In a preferred or optional embodiment, the air conditioner body further comprises two air outlet rings, each air outlet ring is arranged on the outer side of each return air partition plate, and outside air can flow into the refrigeration channel through one air outlet ring and flow out from the other air outlet ring.
In a preferred or optional embodiment, the inner diameter of each wind outlet ring far away from the fan blade body is larger than the inner diameter of each wind outlet ring near the fan blade body, and the inner wall of each wind outlet ring is in smooth transition.
In a preferred or optional embodiment, the air conditioner body further comprises a return air panel, the return air panel is arranged outside the air outlet ring, and at least two vent holes are formed in the wall surface of the return air panel.
Based on the technical scheme, the embodiment of the invention can at least produce the following technical effects:
the fan blade assembly for the semiconductor air conditioner comprises a fan blade body and a semiconductor refrigeration assembly, wherein the refrigeration surface of the semiconductor refrigeration assembly faces a cold air duct of the fan blade body, the semiconductor refrigeration assembly can cool air flow flowing through the cold air duct, the fan blade assembly for the semiconductor air conditioner can realize an air supply function and also serves as a heat exchanger at the same time, disturbance air can be fully subjected to heat exchange with air in the rotation process of the fan blade assembly for the semiconductor air conditioner, when the fan blade assembly is installed on an air conditioner, components such as the heat exchanger, a compressor and the like in the existing air conditioner can be omitted, the structure of the air conditioner is greatly simplified, the fan blade assembly for the semiconductor air conditioner can be integrally disassembled, cleaning, disassembly and assembly are convenient.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of a fan blade assembly for a semiconductor air conditioner according to the present invention;
FIG. 2 is a schematic view of an outer fan blade structure shown in FIG. 1;
FIG. 3 is a schematic view of an inner fan blade structure shown in FIG. 1;
FIG. 4 is an exploded view of the semiconductor refrigeration and insulation assembly of FIG. 1;
FIG. 5 is a schematic structural view of a fan assembly provided by the present invention;
FIG. 6 is an exploded view of the motor assembly of FIG. 5;
FIG. 7 is a schematic view of a semiconductor air conditioner according to the present invention;
FIG. 8 is a schematic view of the exploded structure of the semiconductor air conditioner shown in FIG. 7;
FIG. 9 is a schematic view illustrating the flow direction of the air inside the semiconductor air conditioner shown in FIG. 7;
FIG. 10 is a schematic side view of a semiconductor air conditioning installation according to the present invention;
FIG. 11 is a schematic view of the inside of a semiconductor air conditioner installation provided by the present invention;
fig. 12 is an external schematic view of the semiconductor air conditioning engineering installation provided by the invention.
In the figure, 1, a fan blade body; 11. a cold air duct; 12. an inner fan blade; 121. an inboard hub; 122. an inboard blade; 123. mounting grooves; 124. a heat insulation sheet mounting position; 125. a wire guide groove; 126. a support frame; 13. outer fan blades; 131. an outboard hub; 132. an outboard blade; 2. a semiconductor refrigeration assembly; 21. a semiconductor refrigeration sheet; 22. refrigerating noodles; 23. a heat dissipating surface; 3. an insulating assembly; 31. a heat insulating sheet; 4. a motor assembly; 41. a motor; 42. a motor bracket; 43. a fixed seat; 5. an air conditioner body; 51. a refrigeration channel; 52. a heat dissipation channel; 53. a flow guide ring; 54. a return air partition plate; 541. a wind guide structure; 55. an air outlet ring; 56. an air return panel; 561. a vent hole; 6. a wall body.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
The invention provides a fan blade assembly for a semiconductor air conditioner, a fan assembly and a semiconductor air conditioner, which are simple in structure, low in cleaning, dismounting difficulty and small in workload.
The technical solution provided by the present invention will be explained in more detail with reference to fig. 1 to 12.
As shown in fig. 1 to 12, the fan blade assembly for a semiconductor air conditioner provided by the present invention includes a fan blade body 1 and a semiconductor refrigeration assembly 2; wherein,
the fan blade body 1 comprises a cold air duct 11, the semiconductor refrigeration assembly 2 is installed in the fan blade body 1, and the refrigeration surface of the semiconductor refrigeration assembly 2 faces the cold air duct 11.
The invention provides a fan blade component for a semiconductor air conditioner, which comprises a fan blade body 1 and a semiconductor refrigeration component 2, wherein a refrigeration surface 22 of the semiconductor refrigeration component 2 faces a cold air duct 11 of the fan blade body 1, the semiconductor refrigeration component 2 can cool air flow flowing through the cold air duct 11, the fan blade component for the semiconductor air conditioner realizes an air supply function and also serves as a heat exchanger at the same time, disturbance air can perform sufficient heat exchange with air in the rotation process of the fan blade component for the semiconductor air conditioner, when the fan blade component is installed on the air conditioner, components such as the heat exchanger, a compressor and the like in the existing air conditioner can be omitted, the structure of the air conditioner is greatly simplified, the fan blade component for the semiconductor air conditioner can be integrally detached, the cleaning.
As a preferred or alternative embodiment, the semiconductor refrigeration assembly 2 comprises at least two semiconductor refrigeration fins 21.
Specifically, the semiconductor refrigeration sheet 21 is in the prior art, and after the semiconductor refrigeration sheet is electrified, the temperature of one side of the PN junction rises to form the heat dissipation surface 23, the temperature of the other side of the PN junction falls to form the refrigeration surface 22, and the refrigeration function can be realized by utilizing the refrigeration surface 22 with the reduced temperature.
As a preferred or alternative embodiment, the fan blade assembly for the semiconductor air conditioner further comprises a heat insulation assembly 3, the heat insulation assembly 3 comprises at least two heat insulation sheets 31, and the semiconductor refrigeration sheet 21 and the heat insulation sheets 31 are arranged at intervals.
Specifically, the heat insulation sheet 31 may be made of a soft heat insulation material, and the heat insulation sheet 31 may separate the cooling surface 22 and the heat dissipation surface 23 of the semiconductor cooling sheet 21, so as to prevent heat leakage and improve work efficiency.
As a preferred or optional embodiment, the fan blade assembly for the semiconductor air conditioner further comprises a heat insulation assembly 3, the fan blade body 1 comprises an inner side fan blade 12 and an outer side fan blade 13, the inner side fan blade 12 and the outer side fan blade 13 are coaxially sleeved and fixed, and the semiconductor refrigeration assembly 2 and the heat insulation assembly 3 are both installed in a gap between the inner side fan blade 12 and the outer side fan blade 13.
Specifically, the threaded fastener can sequentially penetrate through the outer fan blade 13, the partial heat insulation sheet 31 and the inner fan blade 12 to be fixedly connected, so that the inner fan blade 12 is tightly attached to the refrigerating surface 22 of the semiconductor refrigerating sheet 21, and the outer fan blade 13 is tightly attached to the heat radiating surface 23 of the semiconductor refrigerating sheet 21; in addition, the temperature of the cooling surface 22 of the semiconductor cooling plate 21 is reduced after the semiconductor cooling plate is electrified, the temperature of the radiating surface 23 is increased, and the working efficiency is reduced along with the temperature increase of the radiating surface 23, so that in order to improve the heat exchange efficiency, the inner side fan blades 12 and the outer side fan blades 13 are used as fins of a radiator in the prior art, and aluminum alloy or titanium alloy materials are selected to improve the heat exchange efficiency.
As a preferred or alternative embodiment, the inner fan blade 12 includes an inner hub 121 and an inner blade 122, a space formed in the inner hub 121 forms the cold air duct 11, the inner blade 122 is disposed on an inner wall surface of the inner hub 121, at least two mounting grooves 123 are disposed on an outer wall surface of the inner hub 121, and the semiconductor refrigeration assembly 2 can be mounted in the mounting grooves 123. The mounting groove 123 is a planar groove, and can play a role in fixedly mounting the semiconductor chilling plate 21.
In a preferred or alternative embodiment, a heat insulating sheet mounting position 124 is disposed between adjacent mounting grooves 123, and a wire guide groove 125 is disposed on a surface of the heat insulating sheet mounting position 124.
Specifically, the heat insulation sheet 31 may be soft, a part of the heat insulation sheet 31 is connected with the fan blade body 1 through a threaded fastener, and the other part of the heat insulation sheet 31 is fixed by extrusion between the outer fan blade 13 and the inner fan blade 12; the wire groove 125 is used for arranging the conductive wire of the semiconductor chilling plate 21.
In a preferred or alternative embodiment, the outer fan 13 includes an outer hub 131 and an outer blade 132, the outer hub 131 is sleeved outside the inner hub 121, and the outer blade 132 is disposed on the outer wall surface of the outer hub 131.
Specifically, the inner fan blades 12 and the outer fan blades 13 are coaxially arranged, so that the air volume is large, the air channel is relatively short, and the heat exchange efficiency is effectively improved.
In a preferred or alternative embodiment, the inboard blade 122 and the outboard blade 132 are pitched in opposite directions.
Specifically, the inner blade 122 and the outer blade 132 are both fan-shaped and are respectively integrated with the inner hub 121 and the outer hub 131 to balance the temperature of each part on the fan blade body 1, so as to avoid the influence of the local over-high temperature of the fan blade body 1 or the over-high temperature of the surface of the individual semiconductor refrigeration piece 21 on the working efficiency of the semiconductor refrigeration assembly 2; the inner blade 122 and the outer blade 132 have opposite inclination directions, so that the inner side and the outer side of the blade body 1 have opposite wind directions in the rotation process of the blade body 1, and when the blade body is installed on a semiconductor air conditioner, air can be simultaneously supplied and discharged.
The fan assembly provided by the invention comprises a motor assembly 4 and a fan blade assembly for the semiconductor air conditioner, which is provided by any technical scheme of the invention; wherein,
the power output end of the motor component 4 is in transmission connection with the fan blade component for the semiconductor air conditioner, and can drive the fan blade component for the semiconductor air conditioner to rotate.
Specifically, the inner side fan blade 12 is also integrally provided with a support frame 126, and the power output end of the motor component 4 is in transmission connection with the support frame 126 to drive the inner side fan blade 12 to rotate, so as to drive the fan blade component for the semiconductor air conditioner to integrally rotate; the motor assembly includes a motor 41, a motor bracket 42 and a fixing base 43, as shown in fig. 5-6, the motor bracket 42 and the fixing base 43 can fix a partial section of the motor 41 in a space formed by the two, thereby fixedly connecting the motor with the semiconductor air conditioner.
The semiconductor air conditioner provided by the invention comprises an air conditioner body 5 and a fan assembly provided by any technical scheme of the invention; wherein,
the air conditioner body 5 comprises a refrigerating channel 51 and a heat dissipation channel 52, the refrigerating channel 51 and the heat dissipation channel 52 are isolated from each other, and the fan assembly is connected with the air conditioner body 5, so that the refrigerating surface 22 of the semiconductor refrigerating assembly 2 is positioned in the refrigerating channel 51, and the heat dissipation surface 23 of the semiconductor refrigerating assembly 2 is positioned in the heat dissipation channel 52.
Specifically, as shown in fig. 9 to 12, when the semiconductor air conditioner is installed on the wall 6, the cooling capacity is transmitted to the inner hub 121 through the cooling surface 22 of the semiconductor cooling plate 21, and the temperature of the surrounding air is reduced during the rotation of the inner blades 122, and cold air is blown into the room through the cooling passage 51 to achieve cooling, and at this time, the cold air blown into the room is introduced from the outside, thereby achieving the introduction of fresh air; the heat generated during the operation of the semiconductor cooling fins 21 is transferred to the outer hub 131 through the heat dissipating surface 23, and the strong ambient temperature rises during the rotation of the inner and outer blades 132 and discharges hot air through the heat dissipating passage 52, and the discharged hot air is indoor air, so that the turbid indoor air can be discharged in time.
As a preferred or alternative embodiment, the air conditioner body 5 includes two flow guiding rings 53, the fan blade body 1 is disposed in a gap between the two flow guiding rings 53, and the two flow guiding rings 53 and the cold air duct 11 together form the refrigeration passage 51.
Specifically, one end of the flow guide ring 53 is close to the end face of the fan blade body 1, and the other end is fixed on the return air partition plate 54, so that the refrigeration channel 51 and the heat dissipation channel 52 are effectively separated, and an air duct which does not interfere with each other is formed.
As a preferred or optional embodiment, the inner diameter of each flow guiding ring 53 far away from the fan blade body 1 is larger than the inner diameter of each flow guiding ring 53 near the fan blade body 1, and the inner wall of each flow guiding ring 53 is in smooth transition. Ensuring smooth air intake.
As a preferable or optional embodiment, the air conditioner body 5 further includes two return air partition plates 54, the baffle ring 53 and the fan blade body 1 are disposed in the two return air partition plates 54, the return air partition plate 54 is provided with an air guide structure 541, and a heat dissipation channel 52 is formed between an outer wall surface of the baffle ring 53 and an inner wall surface of the air guide structure 541.
In a preferred or alternative embodiment, the air conditioner body 5 further includes two air outlet rings 55, each air outlet ring 55 is disposed outside each return air partition 54, and the outside air can flow into the cooling duct 51 through one air outlet ring 55 and flow out from the other air outlet ring 55. The air outlet ring 55 can effectively separate the cooling channel 51 from the heat dissipation channel 52, so as to form an air channel which does not interfere with each other.
As a preferred or optional embodiment, the inner diameter of each wind outlet ring 55 far away from the fan blade body 1 is larger than the inner diameter of each wind outlet ring 55 near the fan blade body 1, and the inner wall of each wind outlet ring 55 is in smooth transition. Ensuring smooth air exhaust.
As a preferred or alternative embodiment, the air conditioner body 5 further includes a return air panel 56, the return air panel 56 is disposed outside one of the air outlet rings 55, and at least two vent holes 561 are disposed on a wall surface of the return air panel 56.
Specifically, the vent 561 is used as a return air inlet, and a filter screen may be added to the vent 561 on the return air panel 56 for easy detachment and cleaning.
Any embodiment disclosed herein above is meant to disclose, unless otherwise indicated, all numerical ranges disclosed as being preferred, and any person skilled in the art would understand that: the preferred ranges are merely those values which are obvious or representative of the technical effect which can be achieved. Since the numerical values are too numerous to be exhaustive, some of the numerical values are disclosed in the present invention to illustrate the technical solutions of the present invention, and the above-mentioned numerical values should not be construed as limiting the scope of the present invention.
If the terms "first," "second," etc. are used herein to define parts, those skilled in the art will recognize that: the terms "first" and "second" are used merely to distinguish one element from another in a descriptive sense and are not intended to have a special meaning unless otherwise stated.
Meanwhile, if the invention as described above discloses or relates to parts or structural members fixedly connected to each other, the fixedly connected parts can be understood as follows, unless otherwise stated: a detachable fixed connection (for example using bolts or screws) is also understood as: non-detachable fixed connection (such as riveting and welding), of course, the mutual fixed connection can also be an integral structure (for example, the mutual fixed connection is manufactured by casting and integral forming instead (except that the integral forming process can not be adopted obviously).
In addition, terms used in any technical solutions disclosed in the present invention to indicate positional relationships or shapes include approximate, similar or approximate states or shapes unless otherwise stated. Any part provided by the invention can be assembled by a plurality of independent components or can be manufactured by an integral forming process.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art will understand that: modifications to the specific embodiments of the invention or equivalent substitutions for parts of the technical features may be made; without departing from the spirit of the present invention, it is intended to cover all aspects of the invention as defined by the appended claims.
Claims (16)
1. A fan blade assembly for a semiconductor air conditioner is characterized by comprising a fan blade body and a semiconductor refrigeration assembly; wherein,
the fan blade body comprises a cold air duct, the semiconductor refrigeration assembly is installed in the fan blade body, and the refrigeration surface of the semiconductor refrigeration assembly faces the cold air duct.
2. The fan blade assembly for the semiconductor air conditioner as claimed in claim 1, wherein the semiconductor refrigeration assembly comprises at least two semiconductor refrigeration pieces.
3. The fan blade assembly for the semiconductor air conditioner as claimed in claim 2, wherein the fan blade assembly for the semiconductor air conditioner further comprises a heat insulation assembly, the heat insulation assembly comprises at least two heat insulation sheets, and the semiconductor refrigeration sheet and the heat insulation sheets are arranged at intervals.
4. The fan blade assembly for the semiconductor air conditioner as claimed in claim 1, further comprising a heat insulation assembly, wherein the fan blade body comprises an inner fan blade and an outer fan blade, the inner fan blade and the outer fan blade are coaxially sleeved and fixed, and the semiconductor refrigeration assembly and the heat insulation assembly are both installed in a gap between the inner fan blade and the outer fan blade.
5. The fan blade assembly for the semiconductor air conditioner as claimed in claim 4, wherein the inner fan blade comprises an inner hub and an inner blade, the space formed in the inner hub forms the cold air duct, the inner blade is arranged on the inner wall surface of the inner hub, at least two mounting grooves are arranged on the outer wall surface of the inner hub, and the semiconductor refrigeration assembly can be mounted in the mounting grooves.
6. The fan blade assembly for the semiconductor air conditioner as claimed in claim 5, wherein a heat insulation sheet installation position is arranged between the adjacent installation grooves, and a wire guide groove is arranged on the surface of the heat insulation sheet installation position.
7. The fan blade assembly for the semiconductor air conditioner as claimed in claim 5, wherein the outer fan blade comprises an outer hub and an outer blade, the outer hub is sleeved outside the inner hub, and the outer blade is arranged on the outer wall surface of the outer hub.
8. The fan blade assembly for the semiconductor air conditioner as claimed in claim 7, wherein the inner blade and the outer blade are inclined in opposite directions.
9. A fan assembly, characterized by comprising a motor assembly and the fan blade assembly for the semiconductor air conditioner as claimed in any one of claims 1 to 8; wherein,
the power output end of the motor component is in transmission connection with the fan blade component for the semiconductor air conditioner, so that the fan blade component for the semiconductor air conditioner can be driven to rotate.
10. A semiconductor air conditioner, comprising an air conditioner body and the fan assembly of claim 9; wherein,
the air conditioner body comprises a refrigeration channel and a heat dissipation channel, the refrigeration channel is isolated from the heat dissipation channel, and the fan assembly is connected with the air conditioner body to enable the refrigeration surface of the semiconductor refrigeration assembly to be located in the refrigeration channel and enable the heat dissipation surface of the semiconductor refrigeration assembly to be located in the heat dissipation channel.
11. The semiconductor air conditioner according to claim 10, wherein the air conditioner body comprises two flow guide rings, the fan blade body is disposed in a gap between the two flow guide rings, and the two flow guide rings and the cold air duct jointly form the refrigeration channel.
12. The semiconductor air conditioner according to claim 11, wherein an inner diameter of each of the flow guide rings away from the fan blade body is larger than an inner diameter of each of the flow guide rings close to the fan blade body, and an inner wall of each of the flow guide rings is in smooth transition.
13. The semiconductor air conditioner according to claim 11, wherein the air conditioner body further comprises two return air partitions, the baffle ring and the fan blade body are disposed in the two return air partitions, a wind guide structure is disposed on the return air partitions, and the heat dissipation channel is formed between an outer wall surface of the baffle ring and an inner wall surface of the wind guide structure.
14. The semiconductor air conditioner according to claim 13, wherein the air conditioner body further comprises two air outlet rings, each air outlet ring is disposed outside each return air partition, and outside air can flow into the cooling duct through one of the air outlet rings and flow out from the other air outlet ring.
15. The semiconductor air conditioner according to claim 14, wherein an inner diameter of each of the wind outlet rings away from the fan blade body is larger than an inner diameter of each of the wind outlet rings close to the fan blade body, and an inner wall of each of the wind outlet rings is in smooth transition.
16. The semiconductor air conditioner according to claim 14, wherein the air conditioner body further comprises a return air panel, the return air panel is disposed outside the air outlet ring of one of the return air panels, and at least two vent holes are disposed in a wall surface of the return air panel.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010311250.2A CN111473421A (en) | 2020-04-20 | 2020-04-20 | Fan blade assembly for semiconductor air conditioner, fan assembly and semiconductor air conditioner |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010311250.2A CN111473421A (en) | 2020-04-20 | 2020-04-20 | Fan blade assembly for semiconductor air conditioner, fan assembly and semiconductor air conditioner |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111964194A (en) * | 2020-09-01 | 2020-11-20 | 秦斌 | Supercharging cold air blast system |
| CN112196909A (en) * | 2020-09-16 | 2021-01-08 | 江苏大学 | Air-cooled cylinder type coupler |
| CN113757838A (en) * | 2021-08-18 | 2021-12-07 | 青岛澳柯玛生活电器有限公司 | Cooling fan |
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| JPH09250836A (en) * | 1996-03-15 | 1997-09-22 | Hitachi Ltd | Thermoelectric converter |
| CN212362225U (en) * | 2020-04-20 | 2021-01-15 | 珠海格力电器股份有限公司 | Fan blade assembly for semiconductor air conditioner, fan assembly and semiconductor air conditioner |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH09250836A (en) * | 1996-03-15 | 1997-09-22 | Hitachi Ltd | Thermoelectric converter |
| CN212362225U (en) * | 2020-04-20 | 2021-01-15 | 珠海格力电器股份有限公司 | Fan blade assembly for semiconductor air conditioner, fan assembly and semiconductor air conditioner |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111964194A (en) * | 2020-09-01 | 2020-11-20 | 秦斌 | Supercharging cold air blast system |
| CN112196909A (en) * | 2020-09-16 | 2021-01-08 | 江苏大学 | Air-cooled cylinder type coupler |
| CN112196909B (en) * | 2020-09-16 | 2021-08-27 | 广东力科泵业科技有限公司 | Air-cooled cylinder type coupler |
| CN113757838A (en) * | 2021-08-18 | 2021-12-07 | 青岛澳柯玛生活电器有限公司 | Cooling fan |
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