CN111397043A

CN111397043A - Semiconductor courtyard machine

Info

Publication number: CN111397043A
Application number: CN202010313206.5A
Authority: CN
Inventors: 邓朝胜; 薛寒冬; 谢有富
Original assignee: Gree Electric Appliances Inc of Zhuhai
Current assignee: Gree Electric Appliances Inc of Zhuhai
Priority date: 2020-04-20
Filing date: 2020-04-20
Publication date: 2020-07-10

Abstract

The application provides a semiconductor courtyard machine. The semiconductor raise boring machine comprises a raise boring machine shell and a heat exchanger assembly, wherein a return air inlet and a cold air outlet are formed in the bottom of the raise boring machine shell, a hot air outlet is further formed in the raise boring machine shell, and a cold air channel communicated with the return air inlet and the cold air outlet and a hot air channel communicated with the return air inlet and the hot air outlet are formed in the raise boring machine shell. The heat exchanger assembly is arranged in the raise shell and comprises a cold dissipation heat exchanger, a heat dissipation heat exchanger and a semiconductor refrigeration sheet arranged between the cold dissipation heat exchanger and the heat dissipation heat exchanger, wherein the cold dissipation heat exchanger is positioned in a cold air channel, and the heat dissipation heat exchanger is positioned in a hot air channel. By applying the technical scheme of the invention, the semiconductor ceiling fan can be arranged in the ceiling of the indoor space, and only the bottom of the ceiling fan shell is exposed out of the ceiling, so that the concealment of the semiconductor air conditioner is enhanced, and the occupation of the indoor space is reduced.

Description

Semiconductor courtyard machine

Technical Field

The invention relates to the technical field of air conditioners, in particular to a semiconductor courtyard machine.

Background

The air conditioner aiming at the kitchen environment is provided with an air duct type form and is arranged in a kitchen ceiling; the air conditioner has the characteristics that the air conditioner is of a single-side air outlet ceiling type, is flush with a ceiling buckle plate after being installed, and the like, is large in engineering installation amount, and is suitable for a kitchen which is not decorated. If want to install this type of kitchen air conditioner, need demolish the furred ceiling, after the installation unit, recover the furred ceiling again, the work load of installation unit is bigger for the installation cost of unit is great, and the user is difficult to accept.

And the most refrigerant refrigeration modes of present unit, the unit at this moment leads to whole unit heavy owing to have big quality devices such as compressor, even if integral type wall hang-up, also have the problem that the unit occupation space is big, it is the common fault to lead to the too big size of market feedback, and the unit is heavy, inconvenient dismouting is clean, consequently, develop a unit that still can easy to assemble after being suitable for the kitchen fitment, the unit installation work load is little simultaneously, the unit is light, easily settle, it will be necessary nature to maintain simple and convenient air conditioner.

In order to solve the above problems, some semiconductor air conditioners which are convenient to install and maintain are also beginning to appear in the market. However, most of the existing semiconductor air conditioners are installed in a wall-mounted mode, occupy more indoor space and are poor in concealment.

Disclosure of Invention

The embodiment of the invention provides a semiconductor courtyard machine, which aims to solve the technical problem that a semiconductor air conditioner in the prior art is poor in installation concealment.

The application embodiment provides a semiconductor courtyard machine, includes: the bottom of the raise boring machine shell is provided with an air return inlet and a cold air outlet, a hot air outlet is also formed on the raise boring machine shell, and a cold air channel communicated with the air return inlet and the cold air outlet and a hot air channel communicated with the air return inlet and the hot air outlet are formed in the raise boring machine shell; the heat exchanger assembly is arranged in the raise shell and comprises a cold-dissipating heat exchanger, a heat-dissipating heat exchanger and a semiconductor refrigerating sheet arranged between the cold-dissipating heat exchanger and the heat-dissipating heat exchanger, wherein the cold-dissipating heat exchanger is positioned in a cold air channel, and the heat-dissipating heat exchanger is positioned in a hot air channel.

In one embodiment, a wind direction turning structure is formed in the cold air passage and is used for changing the flow direction of the air flow entering the cold air passage from the air return opening.

In one embodiment, the return air inlet and the cold air outlet are spaced apart at opposite sides of the bottom of the patio casing, respectively.

In one embodiment, the hot air passage is located above the cold air passage.

In one embodiment, a cold air part is arranged in the cold air channel, and a hot air part is arranged in the hot air channel.

In one embodiment, the cold air component is a cross-flow fan disposed transversely within the cold air channel.

In one embodiment, the hot air unit is an axial flow fan installed at a side of the ceiling shell to communicate with the hot air passage.

In one embodiment, the cooling heat exchanger is provided with cooling fin flow passages, and the extension direction of the cooling fin flow passages is consistent with the extension direction of the cooling fin flow passages.

In one embodiment, the extending direction of the cooling fin flow channel and the air inlet direction of the air return opening are positioned on the same plane.

In one embodiment, a return air grille and/or a return air screen is mounted on the return air inlet.

In one embodiment, the cold air outlet is provided with an air deflector.

In one embodiment, the semiconductor raise boring machine further comprises a drainage mechanism, the drainage mechanism is arranged in the cold air channel, and a drainage port communicated with the drainage mechanism is arranged on the raise boring machine shell.

In one embodiment, the number of the semiconductor refrigeration pieces is multiple, and the multiple semiconductor refrigeration pieces are connected in parallel.

In the above embodiment, under the operation of the semiconductor refrigeration sheet, the heat at the side of the heat dissipation heat exchanger is transferred to the side of the heat dissipation heat exchanger for heat dissipation, so that the heat dissipation of the heat dissipation heat exchanger and the heat dissipation of the heat dissipation heat exchanger are realized. Indoor air enters the cold air channel and the hot air channel through the air return port respectively, and air flow entering the cold air channel is cooled by the cooling heat exchanger and is finally discharged into a room through the cold air outlet; the air flow entering the hot air channel is heated by the heat exchanger and finally discharged out of the room through the hot air outlet, so that the indoor temperature reduction is realized. Because during the use, can install semiconductor courtyard machine in the furred ceiling of interior space, only with the bottom of courtyard casing body expose the furred ceiling can, strengthened semiconductor air conditioner's disguise, reduced the occupation to interior space.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view from a first perspective of an embodiment of a semiconductor raise rig according to the present invention;

FIG. 2 is a schematic diagram of the semiconductor raise boring machine of FIG. 1 from a second perspective;

FIG. 3 is a schematic view of a first cross-section of the semiconductor raise rig of FIG. 1;

FIG. 4 is a schematic diagram of a second cross-sectional view of the semiconductor raise boring machine of FIG. 1;

FIG. 5 is a perspective view of a heat exchanger assembly of the semiconductor raise boring machine of FIG. 1;

FIG. 6 is a schematic structural view of a cold rejection heat exchanger of the heat exchanger assembly of FIG. 5;

fig. 7 is a perspective view of a hot air unit of the semiconductor raise boring machine of fig. 4.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.

In order to solve the technical problem of poor installation concealment of a semiconductor air conditioner in the prior art, as shown in fig. 1, fig. 2 and fig. 3, the invention provides an embodiment of a semiconductor raise boring machine, which comprises a raise boring machine shell 10 and a heat exchanger assembly 20, wherein the bottom of the raise boring machine shell 10 is provided with an air return opening 11 and a cold air outlet 12, the raise boring machine shell 10 is further provided with a hot air outlet 13, and a cold air channel a communicating the air return opening 11 with the cold air outlet 12 and a hot air channel b communicating the air return opening 11 with the hot air outlet 13 are formed in the raise boring machine shell 10. The heat exchanger assembly 20 is arranged in the raise boring machine shell 10 and comprises a cold-radiating heat exchanger 21, a heat-radiating heat exchanger 22 and a semiconductor refrigerating sheet 23 arranged between the cold-radiating heat exchanger 21 and the heat-radiating heat exchanger 22, wherein the cold-radiating heat exchanger 21 is positioned in a cold air channel a, and the heat-radiating heat exchanger 22 is positioned in a hot air channel b.

By applying the technical scheme of the invention, under the work of the semiconductor refrigerating sheet 23, the heat on the side of the heat dissipation heat exchanger 21 is transferred to the side of the heat dissipation heat exchanger 22 for heat dissipation, so that the heat dissipation of the heat dissipation heat exchanger 21 and the heat dissipation of the heat dissipation heat exchanger 22 are realized. Indoor air respectively enters a cold air channel a and a hot air channel b through an air return opening 11, and air flow entering the cold air channel a is cooled by a cold dissipation heat exchanger 21 and finally discharged to the indoor through a cold air outlet 12; the air flow entering the hot air channel b is heated by the heat exchanger 22 and finally discharged out of the room through the hot air outlet 13, thereby realizing the indoor cooling. Because during the use, can install semiconductor courtyard machine in the furred ceiling of interior space, only with the bottom of courtyard casing body 10 expose the furred ceiling can, strengthened semiconductor air conditioner's disguise, reduced the occupation to interior space.

Optionally, the bottom of the patio casing 10 is a panel.

Preferably, as shown in fig. 3, in the technical solution of this embodiment, a wind direction turning structure a1 is formed in the cold air channel a, and the wind direction turning structure a1 is used for changing the flow direction of the airflow entering the cold air channel a from the air return opening 11, so as to return the air from the room, and then return the cooled airflow to the room.

As shown in fig. 3, in the solution of the present embodiment, the air return opening 11 and the cold air outlet 12 are spaced apart at two opposite sides of the bottom of the raise boring machine housing 10, respectively, so as to reduce the influence of the negative pressure at the air return opening 11 on the air outlet of the cold air outlet 12.

More preferably, as shown in fig. 3 and 4, in the solution of this embodiment, the hot air channel b is located above the cold air channel a, which better conforms to the principle of the sinking of the cold air stream and the rising of the heat flow device, thereby facilitating the discharge of the cold air stream and the hot air stream.

In the technical solution of this embodiment, a cold air part a2 is provided in the cold air passage a, and a hot air part b1 is provided in the hot air passage b. Preferably, as shown in fig. 3 and 4, the cold air component a2 is a cross flow fan transversely disposed in the cold air channel a, and the cross flow fan can increase the air pressure and realize a longer air supply distance. Preferably, the hot air unit b1 is an axial flow fan installed on the side of the ceiling casing 10 and communicating with the hot air passage b. Optionally, as shown in fig. 4 and 7, the axial flow fan may be formed by a double-blade supercharging integrated fan, and the double-blade supercharging integrated fan respectively plays a role in driving air to flow.

As shown in fig. 3 and 5, in the solution of the present embodiment, the cooling fin flow passage 211 is formed on the cooling heat exchanger 21, the cooling fin flow passage 221 is formed on the cooling heat exchanger 22, and the extending direction of the cooling fin flow passage 211 is consistent with the extending direction of the cooling fin flow passage 221. More preferably, the extending direction of the cooling fin flow channel 211 and the extending direction of the cooling fin flow channel 221 are on the same plane as the air inlet direction of the air return opening 11, so that the air flow entering from the air return opening 11 can directly enter the cooling fin flow channel 211 and the cooling fin flow channel 221, and the loss of wind speed and wind pressure due to the turning of the air flow is avoided.

As shown in fig. 5 and 6, the number of the semiconductor cooling fins 23 is plural, and the plural semiconductor cooling fins 23 are connected in parallel. The advantage of adopting a plurality of semiconductor refrigeration pieces 23 parallel connection is that the operation between a plurality of semiconductor refrigeration pieces 23 is independent each other, does not influence each other, has improved and has held the fault rate. When mounting, bolts may be used to fasten the heat rejection heat exchanger 21 and the heat rejection heat exchanger 22 together.

Preferably, as shown in fig. 3, the return air inlet 11 is provided with a return air grille 111 and a return air filter 112, and the return air filter 112 can filter impurities in the air to prevent the impurities in the air from attaching to fins of the heat exchanger to affect heat exchange. The return air grille 111 can play a certain role in guiding air, so that the air flow can be directed to the heat exchanger. More preferably, the return air grille 111 is in a form of easy disassembly, so that the user can clean the filter screen conveniently.

As shown in fig. 3, the air deflector 121 on the cold air outlet 12 can adjust the flow direction of the indoor cold air, and realize wider air supply.

Preferably, in the technical solution of this embodiment, the semiconductor raise boring machine further includes a drainage mechanism, the drainage mechanism is disposed in the cold air channel a, and the raise boring machine housing 10 is provided with a drainage port 14 communicated with the drainage mechanism. Optionally, the drainage mechanism includes a water pan disposed below the heat exchanger 21 and a drain pipe connecting the water pan and the drain port 14, and a delivery pressure may be supplied to the drain pipe by a water pump.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made to the embodiment of the present invention by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor raise boring machine, comprising:

the device comprises a raise boring machine shell (10), wherein the bottom of the raise boring machine shell (10) is provided with an air return inlet (11) and a cold air outlet (12), the raise boring machine shell (10) is also provided with a hot air outlet (13), and a cold air channel (a) communicating the air return inlet (11) and the cold air outlet (12) and a hot air channel (b) communicating the air return inlet (11) and the hot air outlet (13) are formed in the raise boring machine shell (10);

the heat exchanger assembly (20) is arranged in the raise boring machine shell (10) and comprises a cold dissipation heat exchanger (21), a heat dissipation heat exchanger (22) and a semiconductor refrigeration sheet (23) arranged between the cold dissipation heat exchanger (21) and the heat dissipation heat exchanger (22), wherein the cold dissipation heat exchanger (21) is positioned in the cold air channel (a), and the heat dissipation heat exchanger (22) is positioned in the hot air channel (b).

2. The semiconductor raise boring machine according to claim 1, wherein a wind direction turning structure (a1) is formed in the cold air passage (a), and the wind direction turning structure (a1) is used for changing a flow direction of the air flow entering the cold air passage (a) from the air return opening (11).

3. The semiconductor raise boring machine according to claim 1, wherein the return air inlet (11) and the cold air outlet (12) are at opposite sides of the bottom of the raise boring machine housing (10), respectively, at intervals.

4. The semiconductor raise boring machine according to claim 1, wherein the hot air passage (b) is located above the cold air passage (a).

5. The semiconductor raise boring machine according to claim 1, wherein a cold air part (a2) is provided in the cold air passage (a), and a hot air part (b1) is provided in the hot air passage (b).

6. The semiconductor raise boring machine according to claim 5, wherein the cold air member (a2) is a cross flow fan disposed transversely in the cold air passage (a).

7. The semiconductor raise boring machine according to claim 5, wherein the hot air unit (b1) is an axial flow fan installed at a side of the raise boring machine housing (10) to communicate with the hot air passage (b).

8. The semiconductor raise boring machine according to claim 1, wherein the cooling heat exchanger (21) is formed with cooling fin flow passages (211), the cooling heat exchanger (22) is formed with cooling fin flow passages (221), and an extending direction of the cooling fin flow passages (211) and an extending direction of the cooling fin flow passages (221) coincide.

9. The semiconductor raise boring machine according to claim 8, wherein an extending direction of the cooling fin flow passage (211) and an extending direction of the cooling fin flow passage (221) are in the same plane as an air intake direction of the air return opening (11).

10. The semiconductor raise boring machine according to claim 1, wherein a return air grille (111) and/or a return air screen (112) is mounted on the return air inlet (11).

11. The semiconductor raise boring machine according to claim 1, wherein the cold air outlet (12) is provided with an air deflector (121).

12. The semiconductor raise machine according to claim 1, further comprising a drainage mechanism provided in the cold air channel (a), the raise machine housing (10) being provided with a drainage port (14) communicating with the drainage mechanism.

13. The semiconductor courtyard machine of claim 1, wherein said semiconductor refrigeration sheet (23) is plural, and a plurality of said semiconductor refrigeration sheets (23) are connected in parallel.