CN111465294A - Connection method of high-end display heat radiation structure - Google Patents
Connection method of high-end display heat radiation structure Download PDFInfo
- Publication number
- CN111465294A CN111465294A CN202010435725.9A CN202010435725A CN111465294A CN 111465294 A CN111465294 A CN 111465294A CN 202010435725 A CN202010435725 A CN 202010435725A CN 111465294 A CN111465294 A CN 111465294A
- Authority
- CN
- China
- Prior art keywords
- light bar
- aluminum extruded
- extruded radiator
- aluminum
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 230000005855 radiation Effects 0.000 title claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000002791 soaking Methods 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a connection method of a heat dissipation structure of a high-end display, which comprises the following steps of 1) carrying out nickel plating soaking etching before cutting an aluminum substrate, 2) cutting the aluminum substrate according to a preset size, welding L ED and a connector on a preset position of the aluminum substrate through high-temperature tin paste to form a light bar, 3) coating low-temperature tin paste between the joint surfaces of the light bar and an aluminum extruded radiator through a coating jig, 4) fixing the light bar and the aluminum extruded radiator, then fastening the light bar and the aluminum extruded radiator through a fastening jig, 5) tightly pressing the light bar and the aluminum extruded radiator through a fastener, and 6) putting the aluminum extruded radiator with the light bar into a reflow furnace, adjusting a furnace temperature curve, and uniformly melting the low-temperature tin paste.
Description
Technical Field
The invention relates to the field of display heat dissipation, in particular to a connection method of a high-end display heat dissipation structure.
Background
The conventional curved/flat display has limited soldering space and heat-clearing countermeasures because the thickness is required to be thinner and thinner, and no space is available for designing although soldering and riveting which are commonly used in system factories are used. In addition to the space problems of thinning and curving, brightness is also increasing, and in order to make the applications of displays wider and wider, such as in the food industry (waterproof), outdoor display (direct sunlight), and automotive (direct sunlight), this will cause the efficiency of the light bar to be degraded and continuously challenge the limit of high-end displays.
In the prior art, the lamp strip and the radiator are connected in an overlapping manner, a heat dissipation adhesive tape is generally used, and heat dissipation paste and heat conduction silica gel can be better used for adhesion removal.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a connecting method of a high-end display heat dissipation structure with a good heat dissipation effect.
In order to achieve the purpose, the invention adopts the following technical scheme:
the connection method of the heat dissipation structure of the high-end display comprises the following steps:
1) before cutting the aluminum substrate, nickel plating, soaking and etching are firstly carried out;
2) cutting the aluminum substrate according to a preset size, and welding L ED and the connector on a preset position of the aluminum substrate through high-temperature solder paste to form a light bar;
3) coating low-temperature solder paste between the binding surfaces of the light bar and the aluminum extruded radiator through a coating jig;
4) fixing the light bar and the aluminum extruded radiator, and fastening and clamping the light bar and the aluminum extruded radiator by using a clamping jig;
5) the lamp strip and the aluminum extruded radiator are tightly pressed by the buckle, so that bubbles generated during tin melting and stress bouncing of a metal piece are avoided;
6) and (3) putting the aluminum extruded radiator with the lamp strip into a reflow furnace, and adjusting the temperature curve of the furnace to uniformly melt the low-temperature solder paste and avoid the empty soldering phenomenon.
And a tin paste avoiding groove is formed in the joint surface of the aluminum extruded radiator and the joint surface of the light bar. Redundant low-temperature solder paste can flow into the solder paste avoiding groove, and the plumpness of the low-temperature solder paste between the light bar and the aluminum extruded radiator can be improved through the design.
In the step 4), the periphery of the lamp strip is connected with the aluminum extruded radiator through the lightning welding or butt welding. Avoiding the generation of bubbles when the tin is melted and the metal piece from being flicked by stress.
By adopting the technical scheme, the invention has the following beneficial effects: adopt coating low temperature tin cream and realize connecting in the reflow soldering between lamp strip and the tin cream, not only connect reliably, have good heat-conduction effect moreover, can not produce bad phenomena such as heat gathering to effectively improve the radiating effect.
Drawings
The invention is described in further detail below with reference to the accompanying drawings and the detailed description;
FIG. 1 is a cross-sectional view of the final form of the present invention;
FIG. 2 is a schematic view of an aluminum substrate welded with L ED and a connector;
FIG. 3 is a schematic view of the light bar being fastened and engaged with the aluminum extruded heat sink by the clamping fixture;
fig. 4 is a schematic view of an aluminum extruded heat sink.
Detailed Description
As shown in fig. 1-4, the method for connecting a heat dissipation structure of a high-end display according to the present invention comprises the following steps:
1) before the aluminum substrate 11 is cut, nickel plating, soaking and etching are firstly carried out;
2) cutting the aluminum substrate 11 according to a predetermined size, and soldering L ED12 and the connectors 13 on predetermined positions of the aluminum substrate 11 by using high-temperature solder paste (250-270 ℃) to form a light bar 1 (as shown in FIG. 2);
3) coating low-temperature solder paste 3 (160 ℃) between the binding surfaces of the light bar 1 and the aluminum extruded radiator 2 through a coating jig (screen, needle tube, etc.);
4) fixing the light bar 1 and the aluminum extruded radiator 2, and then fastening and clamping the light bar 1 and the aluminum extruded radiator 2 by using a clamping jig 4 (as shown in fig. 3);
5) the lamp strip 1 and the aluminum extruded radiator 2 are tightly pressed by the buckle, so that bubbles generated during tin melting and stress bouncing of metal parts are avoided;
6) the aluminum extruded radiator 2 with the lamp strip 1 is placed into a reflow furnace, and the temperature curve of the furnace is adjusted to enable the low-temperature solder paste 3 to be uniformly melted, so that the empty soldering phenomenon is avoided. The final formed product is shown in figure 1.
As shown in fig. 4, a solder paste avoiding groove 21 is formed on a bonding surface of the aluminum extruded heat sink 2 and the light bar 1. The redundant low-temperature solder paste 3 can flow into the solder paste avoiding groove 21, and the design can improve the fullness of the low-temperature solder paste 3 between the light bar 1 and the aluminum extruded radiator 2.
In the step 4), the periphery of the light bar 1 is connected with the aluminum extruded radiator 2 through technologies such as lightning welding or butt welding. Avoiding the generation of bubbles when the tin is melted and the metal piece from being flicked by stress.
While the invention has been described in connection with the above embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, which are illustrative and not restrictive, and that those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (3)
1. The connection method of the high-end display heat radiation structure is characterized in that: which comprises the following steps:
1) before cutting the aluminum substrate, nickel plating, soaking and etching are firstly carried out;
2) cutting the aluminum substrate according to a preset size, and welding L ED and the connector on a preset position of the aluminum substrate through high-temperature solder paste to form a light bar;
3) coating low-temperature solder paste between the binding surfaces of the light bar and the aluminum extruded radiator through a coating jig;
4) fixing the light bar and the aluminum extruded radiator, and fastening and clamping the light bar and the aluminum extruded radiator by using a clamping jig;
5) the lamp strip and the aluminum extruded radiator are tightly pressed by the buckle;
6) and (3) putting the aluminum extruded radiator with the lamp strip into a reflow furnace, and adjusting the temperature curve of the furnace to uniformly melt the low-temperature solder paste.
2. The method of claim 1, wherein the method further comprises: and a tin paste avoiding groove is formed in the joint surface of the aluminum extruded radiator and the joint surface of the light bar.
3. The method of claim 1, wherein the method further comprises: in the step 4), the periphery of the lamp strip is connected with the aluminum extruded radiator through the lightning welding or butt welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010435725.9A CN111465294A (en) | 2020-05-21 | 2020-05-21 | Connection method of high-end display heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010435725.9A CN111465294A (en) | 2020-05-21 | 2020-05-21 | Connection method of high-end display heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111465294A true CN111465294A (en) | 2020-07-28 |
Family
ID=71679664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010435725.9A Pending CN111465294A (en) | 2020-05-21 | 2020-05-21 | Connection method of high-end display heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111465294A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2733298Y (en) * | 2004-09-24 | 2005-10-12 | 王东茂 | Improved structure of radiator fins |
| CN1753172A (en) * | 2004-09-21 | 2006-03-29 | 鸿富锦精密工业（深圳）有限公司 | The heat abstractor manufacture method |
| CN101090623A (en) * | 2006-06-14 | 2007-12-19 | 华信精密股份有限公司 | Heat sink module with heat pipe |
| CN101713505A (en) * | 2009-09-23 | 2010-05-26 | 信昭(南京)电子有限公司 | Method for manufacturing LED lighting lamps and lanterns with radiating devices |
| CN101875168A (en) * | 2009-04-29 | 2010-11-03 | 技嘉科技股份有限公司 | Radiating module and assembly method thereof |
| CN102074518A (en) * | 2009-11-11 | 2011-05-25 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and conductive trace |
| US20140268562A1 (en) * | 2013-03-16 | 2014-09-18 | ADTI Media, LLC | Compound structural frame and method of using same for efficient retrofitting |
| CN106287256A (en) * | 2016-08-31 | 2017-01-04 | 海星海事电气集团有限公司 | A kind of single light source illuminating lamp |
| CN108198792A (en) * | 2017-12-28 | 2018-06-22 | 北京康普锡威科技有限公司 | A kind of heat radiation module and preparation method thereof |
-
2020
- 2020-05-21 CN CN202010435725.9A patent/CN111465294A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1753172A (en) * | 2004-09-21 | 2006-03-29 | 鸿富锦精密工业（深圳）有限公司 | The heat abstractor manufacture method |
| CN2733298Y (en) * | 2004-09-24 | 2005-10-12 | 王东茂 | Improved structure of radiator fins |
| CN101090623A (en) * | 2006-06-14 | 2007-12-19 | 华信精密股份有限公司 | Heat sink module with heat pipe |
| CN101875168A (en) * | 2009-04-29 | 2010-11-03 | 技嘉科技股份有限公司 | Radiating module and assembly method thereof |
| CN101713505A (en) * | 2009-09-23 | 2010-05-26 | 信昭(南京)电子有限公司 | Method for manufacturing LED lighting lamps and lanterns with radiating devices |
| CN102074518A (en) * | 2009-11-11 | 2011-05-25 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and conductive trace |
| US20140268562A1 (en) * | 2013-03-16 | 2014-09-18 | ADTI Media, LLC | Compound structural frame and method of using same for efficient retrofitting |
| CN106287256A (en) * | 2016-08-31 | 2017-01-04 | 海星海事电气集团有限公司 | A kind of single light source illuminating lamp |
| CN108198792A (en) * | 2017-12-28 | 2018-06-22 | 北京康普锡威科技有限公司 | A kind of heat radiation module and preparation method thereof |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200728 |
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| RJ01 | Rejection of invention patent application after publication |