CN111465253A

CN111465253A - Phase change heat dissipation equipment

Info

Publication number: CN111465253A
Application number: CN201910048605.0A
Authority: CN
Inventors: 周哲明; 周发明
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-01-18
Filing date: 2019-01-18
Publication date: 2020-07-28
Also published as: WO2020147697A1

Abstract

The invention relates to electronic equipment, in particular to heat dissipation of high-power electronic equipment such as a server, network equipment, L ED lamp and the like.

Description

Phase change heat dissipation equipment

Technical Field

The present invention relates to electronic devices, and more particularly to dissipation of heat generated by high power electronic devices such as servers, network devices, L ED lights, and the like.

Background

The heat pipe is a high-efficiency radiator, and the heat is quickly conducted by utilizing the phase change process that a liquid medium is condensed at the cold end after being evaporated at the hot end. The interior of the heat pipe is pumped into a negative pressure state and filled with proper liquid, and the liquid has a low boiling point and is easy to volatilize. The heat pipe is internally provided with a wick which is made of capillary porous materials. When one end of the heat pipe is heated, the liquid in the capillary tube is quickly vaporized, the vapor flows to the other end under the power action of heat diffusion, the vapor is condensed at the cold end to release heat, the liquid flows back to the evaporation end along the porous material under the capillary action, the circulation is not stopped until the temperatures at the two ends of the heat pipe are equal, and the heat diffusion of the vapor is stopped.

The temperature-equalizing plate is a heat pipe with a flat structure, and generally comprises an upper cover and a lower cover, wherein the lower cover of the temperature-equalizing plate is an evaporation end and is in contact with a heating source, the upper cover of the temperature-equalizing plate is a condensation end, and heat-radiating fins are installed on the surface of the temperature-equalizing plate or a flat heat pipe is installed on the surface of the temperature-equalizing plate.

The heat pipes need to be flattened to be in better contact with the temperature-equalizing plate due to the flat structure of the temperature-equalizing plate, the performance of the heat pipes is influenced to a certain degree, each heat pipe needs to occupy a large area of the temperature-equalizing plate, the space utilization rate of the temperature-equalizing plate is not high, and therefore the whole heat dissipation capacity of the radiator is limited.

Disclosure of Invention

In order to improve the heat dissipation efficiency, the invention provides a phase change heat dissipation device scheme.

The technical scheme adopted by the invention for solving the technical problems is as follows:

a phase-change heat dissipation device comprises a phase-change cavity and a heat pipe, wherein the phase-change cavity is a sealed cavity manufactured according to the principle of the heat pipe, and the surface of the phase-change cavity is provided with a groove for conveniently mounting the heat pipe or a hole for conveniently inserting the heat pipe. The evaporation end of the heat pipe is mounted on the groove or inserted into the hole. The condensation end of the heat pipe is provided with a radiating fin or an external radiator such as a water cooling component. The water cooling part is installed in such a manner that the condensation end of the heat pipe is attached to the water cooling plate or the condensation end of the heat pipe is inserted into the water cooling channel.

The invention has the beneficial effects that:

a phase-change heat dissipation device is characterized in that a groove for conveniently installing a heat pipe or a hole for conveniently inserting the heat pipe is formed in the surface of a phase-change cavity, and an evaporation end of the heat pipe is installed on the groove or inserted into the hole. The heat pipe can be well contacted with the phase change cavity without being flattened, and the capillary structure of the heat pipe can be protected; under the condition that the heat pipes are inserted into the holes, the occupied area of each heat pipe is small, more heat pipes can be inserted, and the space utilization rate of the phase change cavity is improved. Therefore, the device can effectively improve the heat dissipation efficiency and well solve the heat dissipation problem of the high-power chip.

Drawings

Fig. 1 is a schematic structural diagram of a phase change heat dissipating device according to the present invention.

Fig. 2 is a perspective view of a phase change heat dissipating apparatus according to the present invention.

Fig. 3 is a schematic perspective view of a phase change cavity of the phase change heat dissipation apparatus according to the present invention.

In the figure, 1 is a phase change cavity, 2 is a heat pipe, 3 is the surface of the phase change cavity, 4 is a round hole, 5 is a heat pipe evaporation end, 6 is a heat pipe condensation end, and 7 is a radiating fin.

Detailed Description

The invention is further illustrated with reference to the following figures and examples.

As shown in fig. 1, 2 and 3: a phase change heat dissipation device comprises a phase change cavity 1 and a heat pipe 2, wherein a round hole 4 for conveniently inserting the heat pipe 2 is formed in the surface 3 of the phase change cavity. The evaporation end 5 of the heat pipe is inserted into the round hole 4. The condensation end 6 of the heat pipe is provided with a heat sink 7.

Claims

1. The phase change heat dissipation equipment is composed of a phase change cavity and a heat pipe, and is characterized in that: and the surface of the phase change cavity is provided with a hole for conveniently installing the heat pipe.

2. The heat dissipating apparatus of claim 1, wherein: the evaporation end of the heat pipe is inserted into the hole, and the condensation end of the heat pipe is provided with a radiating fin.

3. The heat dissipating apparatus of claim 1, wherein: the evaporation end of the heat pipe is inserted into the hole, and the condensation end of the heat pipe is provided with a water cooling plate.

4. The heat dissipating apparatus of claim 1, wherein: the evaporation end of the heat pipe is inserted into the hole, and the condensation end of the heat pipe is inserted into the water cooling channel.

5. The phase change heat dissipation equipment is composed of a phase change cavity and a heat pipe, and is characterized in that: the surface of the phase change cavity is provided with a groove for conveniently installing the heat pipe.

6. The heat dissipating apparatus of claim 5, wherein: the evaporation end of the heat pipe is arranged on the groove, and the condensation end of the heat pipe is provided with a radiating fin.

7. The heat dissipating apparatus of claim 5, wherein: the evaporation end of the heat pipe is arranged on the groove, and the condensation end of the heat pipe is provided with a water cooling plate.

8. The heat dissipating apparatus of claim 5, wherein: the evaporation end of the heat pipe is arranged on the groove, and the condensation end of the heat pipe is inserted into the water cooling channel.