CN111463351A - Lead leakage prevention packaging structure of perovskite solar cell and packaging method thereof - Google Patents

Abstract

The invention provides an anti-lead leakage encapsulation structure of a perovskite solar cell and an encapsulation method thereof. The perovskite solar cell comprises a conductive glass, an electron transport layer, a perovskite light absorption layer, a hole transport layer, a conductive glass, an electron transport layer, a perovskite light absorption layer, a hole transport layer, The metal electrode is characterized in that the anti-lead leakage encapsulation structure includes a protective layer, a ceramic encapsulation layer, an encapsulation glass, and an edge seal layer; the protective layer is thermally evaporated on the metal electrode; the ceramic encapsulation layer is sputtered or deposited on the protective layer; The sealing layer is laminated around the perovskite solar cell; the packaging glass is arranged above the ceramic packaging layer by pasting the edge sealing layer, and forms a cavity with the ceramic packaging layer and the edge sealing layer. The present invention is protected by three-layer organic/inorganic material composite encapsulation, which can effectively reduce the damage probability of the solar cell module under the impact of external forces such as hail, and at the same time, the packaging technology can also effectively prevent the broken solar cell module from being washed by rain in nature and other conditions. Lead leakage from lower components.

Description

Anti-lead leakage encapsulation structure of perovskite solar cell and encapsulation method thereof

technical field

The invention relates to the technical field of encapsulation used in the photovoltaic industry, in particular to a lead leakage-preventing encapsulation structure of a perovskite solar cell and an encapsulation method thereof.

Background technique

Lead leakage in perovskite solar cells is one of the main concerns of the photovoltaic industry and the general public about the rapid development of the perovskite solar cell industry. In order to reduce the environmental and social problems caused by lead in perovskite solar cells, a variety of possible solutions have been proposed in the industry: partially or completely replacing lead with non-lead materials, or preventing lead leakage through packaging technology. Among them, the use of packaging technology to prevent lead leakage is becoming one of the technical development directions.

At present, there are many packaging technologies used in perovskite solar cells, but there are not many packaging technologies that can effectively prevent lead leakage. Combined with the magnetron sputtering technology and the characteristics that certain organic materials can combine and react with lead elements, the present invention proposes a new packaging method, which has the following characteristics: 1. It can effectively deal with the impact of external forces on solar cells during use. In case of damage, the damage rate of solar cell modules under the impact of hail, flying stones, etc. is greatly reduced; 2. Under the condition of composite packaging, the damaged solar cell modules can effectively reduce the erosion of water/water vapor and reduce perovskite The probability that lead in a material will diffuse from the component to the environment in the natural environment. Finally, the harm of lead in perovskite solar cells to the environment can be effectively reduced.

SUMMARY OF THE INVENTION

In view of this, the present invention aims to provide an anti-lead leakage encapsulation structure of perovskite solar cells, so as to solve the problem of lead leakage of existing perovskite solar cells.

To achieve the above object, the technical scheme of the present invention is realized by the following methods:

An anti-lead leakage encapsulation structure of a perovskite solar cell, the perovskite solar cell comprises a conductive glass, an electron transport layer, a perovskite light-absorbing layer, a hole transport layer, and a metal electrode that are stacked in sequence, and is characterized in that , the anti-lead leakage encapsulation structure includes a protective layer, a ceramic encapsulation layer, an encapsulation glass, and an edge seal layer; the protective layer is thermally evaporated on the metal electrode; the ceramic encapsulation layer is sputtered or deposited on the protective layer The edge seal layer is laminated around the perovskite solar cell; the encapsulation glass is arranged above the ceramic encapsulation layer by pasting the edge seal layer, and is connected with the ceramic encapsulation layer and the ceramic encapsulation layer. The edge sealing layer forms a cavity.

Optionally, the lead leakage prevention packaging structure further includes an adhesive layer; the adhesive layer is located in the cavity formed by the packaging glass, the ceramic packaging layer and the edge sealing layer.

Optionally, the adhesive layer is one of a propylene oxide adhesive layer and an ethylene-vinyl acetate copolymer adhesive layer.

Optionally, the lead leakage prevention packaging structure further comprises an adhesive layer; the adhesive layer is located in the cavity formed by the packaging glass, the ceramic packaging layer and the edge sealing layer, and the The adhesive layer is integrally arranged with the edge seal layer.

Optionally, the adhesive layer and the edge sealing layer are integrated UV curing adhesives.

Optionally, the protective layer is a molybdenum oxide protective layer, and the thickness of the protective layer is 50 nm.

Optionally, the ceramic encapsulation layer is one of an alumina ceramic encapsulation layer, a silicon oxide ceramic encapsulation layer, and a silicon nitride ceramic encapsulation layer, and the thickness of the ceramic encapsulation layer is 350 nm.

Optionally, the encapsulation glass is one of soda lime encapsulation glass, ultra-white encapsulation glass, and tempered encapsulation glass.

Optionally, the side sealing layer is a polyisobutylene side sealing layer, and the thickness of the side sealing layer is 3 mm.

The second object of the present invention is to provide a packaging method for the above-mentioned lead leakage prevention packaging structure, the packaging method comprising the following steps:

1) Thermally evaporate the protective layer on the metal electrode of the perovskite solar cell, wherein the process parameters of thermal evaporation are: vacuum pressure: 2.5×10 ^-4 Pa, thermal evaporation power: 90W , evaporation rate: 0.2A/s;

2) The ceramic encapsulation layer is sputtered on the protective layer by a magnetron sputtering method, wherein the magnetron sputtering process parameters are: target purity: 99.9%, sputtering temperature: room temperature, background vacuum: 8×10 ^-4 Pa, argon flow rate: 20sccm, target spacing: 125mm, working pressure: 0.4-0.7Pa, sputtering power: 60-100W, sputtering rate: 0.1-0.15A/s;

3) After removing the 0.5 cm perovskite film around the cell, paste the edge sealing layer on the surrounding edge of the perovskite solar cell on the side with the perovskite film, and then paste the packaging glass on the perovskite solar cell. On the edge sealing layer, a preliminary packaged battery is obtained;

4) The preliminary encapsulated battery is processed by a lamination method to obtain a lead leakage-proof perovskite solar cell, wherein the lamination process is: temperature: 150° C., pressure difference: 10kPa, heating and pressure treatment time: 5min .

Compared with the prior art, the anti-lead leakage encapsulation structure of the perovskite solar cell of the present invention has the following advantages:

In the present invention, a molybdenum oxide protective layer with a thickness of about tens of nanometers is firstly evaporated on the perovskite solar cell device, and then an alumina ceramic encapsulation layer with a thickness of several nanometers to hundreds of nanometers is sputtered, and then a glass cover plate is used. The device is further encapsulated with encapsulating adhesive (PIB adhesive and PO adhesive), and is protected by three-layer organic/inorganic material composite encapsulation, which not only protects the perovskite solar cell device, but also effectively reduces the hail damage of the solar cell module. The probability of damage under the impact of external force. In addition, the encapsulation technology can also effectively reduce the leakage of lead in the broken solar cell module under the conditions of natural rain erosion and other conditions, thereby reducing the environmental pollution caused by the lead in the perovskite solar cell module.

Description of drawings

The accompanying drawings constituting a part of the present invention are used to provide further understanding of the present invention, and the exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the attached image:

1 is a schematic structural diagram of a lead leakage-preventing encapsulation structure of a perovskite solar cell according to Embodiment 1 of the present invention;

2 is a schematic structural diagram of a lead leakage-preventing packaging structure of a perovskite solar cell according to Embodiment 2 of the present invention;

3 is a schematic structural diagram of the lead leakage-preventing packaging structure of the perovskite solar cell according to Embodiment 3 of the present invention;

4 is a schematic structural diagram of a perovskite solar cell encapsulated by an alumina ceramic encapsulation layer using a molybdenum oxide protective layer according to the present invention;

FIG. 5 is a schematic structural diagram of a perovskite solar cell encapsulated by a molybdenum oxide protective layer according to the present invention.

Reference number:

1- Conductive glass, 2- Electron transport layer, 3- Perovskite light absorption layer, 4- Hole transport layer, 5- Metal electrode, 6- Protective layer, 7- Ceramic encapsulation layer, 8- Edge sealing layer, 9- Encapsulating glass, 10-cavity, 11-adhesive layer.

Detailed ways

It should be noted that the embodiments of the present invention and the features of the embodiments may be combined with each other under the condition of no conflict.

The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

Example 1

With reference to FIG. 1 , in the anti-lead leakage encapsulation structure of the perovskite solar cell of the present embodiment, the perovskite solar cell includes a conductive glass 1 , an electron transport layer 2 , a perovskite light absorbing layer 3 , an air-conducting glass 1 , an electron transport layer 2 , a perovskite light absorbing layer 3 , and an empty layer arranged in sequence. The hole transport layer 4, the metal electrode 5; the anti-lead leakage packaging structure includes a protective layer 6, a ceramic packaging layer 7, an edge sealing layer 8, and a packaging glass 9, wherein the protective layer 6 is a molybdenum oxide protective layer, which is thermally evaporated on the metal. On the electrode 5, the high-energy impact generated by magnetron sputtering can be blocked, so as to achieve the purpose of protecting the perovskite material, thereby effectively preventing the leakage of lead in the perovskite material; the ceramic encapsulation layer 7 is an alumina ceramic encapsulation layer, which passes the magnetic The controlled sputtering method is sputtered on the molybdenum oxide protective layer, which can effectively prevent external water/water vapor from entering the component, and can further effectively prevent the lead from the perovskite component from coming out; the edge sealing layer 8 is a polyisobutylene (PIB) edge sealing layer , which is laminated around the perovskite solar cell by a lamination method, which can encapsulate around the module and further effectively prevent lead leakage; the encapsulation glass 9 is soda-lime encapsulation glass, which is arranged on the alumina by pasting the edge sealing layer. Above the ceramic encapsulation layer, and form a cavity 10 with the alumina ceramic encapsulation layer 7 and the edge seal layer 8, at this time, the soda-lime encapsulation glass and the edge encapsulation glue (PIB glue) arranged around the perovskite solar cell device, namely The edge sealing layer 8 jointly realizes the encapsulation of all directions of the perovskite solar cell device, thereby further preventing the leakage of lead into the environment.

In this embodiment, the molybdenum oxide material plays a protective role on the perovskite material, the alumina material plays the role of isolating water vapor and oxygen, and the PIB encapsulant plays a role in enhancing the impact resistance of the perovskite solar cell device. Through the three-layer protection, the perovskite material is prevented from being damaged by the external environment, and the process of the diffusion of lead in the perovskite to the outside is also effectively inhibited, which plays a role in protecting the perovskite solar cell device and preventing lead leakage.

When encapsulating the perovskite solar cell with the lead-leakage-preventing encapsulation structure of this embodiment, the lead-leakage-preventing encapsulation technology of the perovskite solar cell based on the combination of the molybdenum oxide protective layer, the ceramic encapsulation layer and the PIB edge seal, the specific The packaging method includes the following steps:

1) Take the perovskite solar cell device with the prepared positive and negative electrodes, and use the thermal evaporation method to prepare a molybdenum oxide protective layer on the positive electrode (Au electrode). The evaporation starts after ^-4 Pa, the thermal evaporation power is 90W, the evaporation rate is 0.2A/s, and the molybdenum oxide is evaporated on the Au electrode with a thickness of about 50nm;

2) The alumina ceramic encapsulation layer is prepared by a magnetron sputtering method, and the specific steps are: sputtering alumina on the molybdenum oxide protective layer with a thickness of about 350 nm, wherein the magnetron sputtering process parameters are: the purity of all target materials 99.9%, round target size is three inches (76.2mm), all using radio frequency, sputtering at room temperature, no additional heating, background vacuum 8×10 ^-4 Pa, argon flow rate 20sccm, target spacing 125mm, working pressure 0.4 -0.7Pa, the target was cleaned with 20sccm argon for half an hour before sputtering; the alumina sputtering power was 100W, and the sputtering rate was 0.15A/s;

3) Using a femtosecond laser, set the power to 18w and the frequency to 100Hz, remove the 0.5cm perovskite film around the battery, and wipe the surrounding area of the battery with a little DMF to remove the remaining perovskite;

4) preparing the edge seal layer, the specific steps are: paste a black PIB encapsulant with a thickness of 3mm and a width of 5mm on the surrounding edges of the perovskite film side of the obtained perovskite solar cell, that is, the edge seal layer, and then , paste the soda-lime encapsulation glass on the PIB edge sealing layer to obtain a preliminary encapsulated battery;

5) Lamination packaging, the specific steps are as follows: place the preliminary packaged battery in a laminator, heat and pressurize for 5 minutes under the conditions of a temperature of 150 ° C and a pressure difference of 10 kPa, to obtain a packaged perovskite that can effectively prevent lead leakage Mine solar cells.

The impact resistance and lead leakage performance of the lead leakage-preventing perovskite solar cell components prepared in this example were tested.

Wherein, the impact resistance is specifically carried out by the following method: use 130g steel balls for impact resistance test, the steel balls fall freely at a height of 15cm, and impacting the device of this embodiment will cause cracks to occur;

The lead leakage performance is specifically carried out by the following method: The lead leakage test is carried out by placing the device with star-shaped cracks in a simulated acid rain solution with a Ph of 5.6 at 45 ° C. It is measured that the lead leakage rate is only 0.084% under this packaging condition , The anti-lead leakage effect is remarkable.

Example 2

As shown in FIG. 2 , the difference between the lead leakage prevention packaging structure of the perovskite solar cell of this embodiment and the first embodiment is that the lead leakage prevention packaging structure of this embodiment further includes an adhesive layer 11 , wherein the adhesive layer 11 is a propylene oxide (PO) adhesive layer, which is located in the cavity 10 formed by the encapsulation glass 9, the ceramic encapsulation layer 7 and the edge seal layer 8, and can tightly bond the component and the encapsulation glass 9 to reduce the number of perovskite solar cells. The damage probability of the component under physical impact, and at the same time, it can effectively prevent the diffusion rate of lead in the perovskite material to the environment under the condition of solar cell damage, so that the impact resistance of the perovskite component can be effectively improved, and can effectively prevent Lead from components leaks into the environment.

When the perovskite solar cell is encapsulated by the lead leakage-preventing encapsulation structure of this embodiment, the perovskite solar cell based on the molybdenum oxide protective layer, the ceramic encapsulation layer, the propylene oxide adhesive layer and the PIB edge sealing Lead leakage packaging technology, and its specific packaging method, including the following steps:

1) Take the perovskite solar cell device with the prepared positive and negative electrodes, and use the thermal evaporation method to prepare a molybdenum oxide protective layer on the positive electrode (Au electrode). The evaporation starts after ^-4 Pa, the thermal evaporation power is 90W, the evaporation rate is 0.2A/s, and the molybdenum oxide is evaporated on the Au electrode with a thickness of about 50nm;

2) The alumina ceramic encapsulation layer is prepared by a magnetron sputtering method, and the specific steps are: sputtering alumina on the molybdenum oxide protective layer with a thickness of about 350 nm, wherein the magnetron sputtering process parameters are: the purity of all target materials 99.9%, round target size is three inches (76.2mm), all using radio frequency, sputtering at room temperature, no additional heating, background vacuum 8×10 ^-4 Pa, argon flow rate 20sccm, target spacing 125mm, working pressure 0.4 -0.7Pa, the target was cleaned with 20sccm argon for half an hour before sputtering; the alumina sputtering power was 100W, and the sputtering rate was 0.15A/s;

3) Using a femtosecond laser, set the power to 18w and the frequency to 100Hz, remove the 0.5cm perovskite film around the battery, and wipe the surrounding area of the battery with a little DMF to remove the remaining perovskite;

4) Prepare the edge sealing layer and the adhesive layer, the specific steps are: paste a black PIB encapsulant with a thickness of 3 mm and a width of 5 mm on the surrounding edges of the perovskite film side of the obtained perovskite solar cell, that is, the edge seal layer, and cut the PO (propylene oxide) film according to the size of the perovskite solar cell, that is, the adhesive layer, and place it on the alumina ceramic encapsulation layer of the perovskite solar cell. Then, the soda-lime encapsulation glass Paste it on the PIB side seal layer and the PO adhesive layer to obtain a preliminary packaged battery;

5) Lamination packaging, the specific steps are as follows: place the preliminary packaged battery in a laminator, heat and pressurize for 5 minutes under the conditions of a temperature of 150 ° C and a pressure difference of 10 kPa, to obtain a packaged perovskite that can effectively prevent lead leakage Mine solar cells.

The impact resistance and lead leakage performance of the lead leakage-preventing perovskite solar cell components prepared in this example were tested.

Wherein, the impact resistance is specifically carried out by the following method: use 130g steel balls for impact resistance test, the steel balls fall freely at a height of 30cm, and only when the device of this embodiment is impacted will it cause cracks;

The lead leakage performance is specifically carried out by the following method: the device with star-shaped cracks is placed in a simulated acid rain solution with a Ph of 5.6 at 45 ° C to conduct a lead leakage test. It is measured that the lead leakage rate is only 0.00036% under this packaging condition , The anti-lead leakage effect is remarkable.

Example 3

As shown in FIG. 3 , the difference between the lead leakage prevention package structure of the perovskite solar cell of this embodiment and the first embodiment is that the lead leakage prevention package structure of this embodiment further includes an adhesive layer 11 , wherein the adhesive layer 11 and the edge seal layer 8 are integrated UV curing adhesives, that is, the adhesive layer 11 in the cavity 10 formed by the encapsulation glass 9 and the ceramic encapsulation layer 7 and the edge seal layer 8 and the edge seal around the perovskite solar cell. The layers 8 are all made of UV-curable glue, and are integrally formed during the preparation process.

In this embodiment, the integrated edge sealing layer 8 and the adhesive layer 11 are prepared by UV curing gelation, which can reduce the damage rate of the perovskite solar cell module under physical impact, and effectively prevent the perovskite solar cell module from being damaged under the condition of solar cell damage. At the same time of the diffusion rate of lead in the titanium ore material to the environment, the structure is simplified, thereby effectively improving the packaging efficiency.

When the perovskite solar cell is encapsulated by the lead-leakage-preventing encapsulation structure of the present embodiment, that is, the lead-leakage-preventing encapsulation technology of the perovskite solar cell based on the combination of a molybdenum oxide protective layer, a ceramic encapsulation layer and an ultraviolet curing adhesive layer, The specific packaging method includes the following steps:

1) Take the perovskite solar cell device with the prepared positive and negative electrodes, and use the thermal evaporation method to prepare a molybdenum oxide protective layer on the positive electrode (Au electrode). The evaporation starts after ^-4 Pa, the thermal evaporation power is 90W, the evaporation rate is 0.2A/s, and the molybdenum oxide is evaporated on the Au electrode with a thickness of about 50nm;

2) The alumina ceramic encapsulation layer is prepared by a magnetron sputtering method, and the specific steps are: sputtering alumina on the molybdenum oxide protective layer with a thickness of about 350 nm, wherein the magnetron sputtering process parameters are: the purity of all target materials 99.9%, round target size is three inches (76.2mm), all using radio frequency, sputtering at room temperature, no additional heating, background vacuum 8×10 ^-4 Pa, argon flow rate 20sccm, target spacing 125mm, working pressure 0.4 -0.7Pa, the target was cleaned with 20sccm argon for half an hour before sputtering; the alumina sputtering power was 100W, and the sputtering rate was 0.15A/s;

3) Using a femtosecond laser, set the power to 18w and the frequency to 100Hz, remove the 0.5cm perovskite film around the battery, and wipe the surrounding area of the battery with a little DMF to remove the remaining perovskite;

4) preparing a UV-curable full-package adhesive layer, that is, an integrated edge sealing layer and an adhesive layer, the specific steps are as follows: drop 3-5 drops of UV-curable encapsulant on the perovskite film side of the obtained perovskite solar cell , and coating with a doctor blade to make the liquid evenly dispersed around the perovskite solar cell device and on the alumina ceramic encapsulation layer, and then paste the soda lime encapsulation glass on the UV-curable encapsulant coated on the alumina ceramic encapsulation layer , to obtain a preliminary encapsulated battery;

5) UV curing packaging, the specific steps are as follows: placing the preliminary packaged battery in a UV curing machine for 3 minutes to obtain a packaged perovskite solar cell that can effectively prevent lead leakage.

The impact resistance and lead leakage performance of the lead leakage-preventing perovskite solar cell components prepared in this example were tested.

Wherein, the impact resistance is specifically carried out by the following method: use 130g steel balls for impact resistance test, the steel balls fall freely at a height of 35cm, and only when the device of this embodiment is impacted will it cause cracks;

The lead leakage performance is specifically carried out by the following method: The lead leakage test is carried out by placing the device with star-shaped cracks in a simulated acid rain solution with a Ph of 5.6 at 45°C. The measured lead leakage rate is only 0.0027% under this packaging condition. , The anti-lead leakage effect is remarkable.

With reference to FIG. 4 , the battery performance test was carried out on the perovskite solar cell components that were only encapsulated in the first two steps in Examples 1-3 of the present invention. The encapsulated devices were tested for battery performance and compared with devices with a 50nm thick molybdenum oxide protective layer and a silicon oxide ceramic encapsulation layer, and a 50nm thick molybdenum oxide protective layer with a silicon nitride ceramic encapsulation layer. Compared. Among them, the silicon oxide sputtering power of the magnetron sputtering method to prepare the silicon oxide ceramic encapsulation layer is 70W, and the sputtering rate is 0.15A/s; the silicon nitride sputtering power of the magnetron sputtering method to prepare the silicon nitride ceramic encapsulation layer is 60W, sputtering rate is 0.1A/s.

The test results show that in Examples 1-3 of the present invention, only the 50nm thick molybdenum oxide protective layer is used, and the performance of the device encapsulated by the alumina ceramic encapsulation layer is maintained well, and there is basically no attenuation, and 95.5% of the initial efficiency can be maintained after 48h. ;The device with 50nm thick molybdenum oxide protective layer and encapsulated by silicon oxide ceramic encapsulation layer can keep 49% of the initial efficiency after being placed under 30℃, 30%RH, no light for 48h; using 50nm thick molybdenum oxide protective layer , The device encapsulated by the silicon nitride ceramic encapsulation layer can maintain 90% of the initial efficiency after 24 hours at 30 ° C, 30% RH, and no light conditions, and can maintain 67% of the initial efficiency after 48 hours.

With reference to FIG. 5 , the device performance loss rate test was carried out on the perovskite solar cell components that were only encapsulated in the first step in Examples 1-3 of the present invention, that is, the device performance loss rate test was carried out on the devices encapsulated only with a 50 nm thick molybdenum oxide protective layer. The performance loss rate was tested and compared with devices encapsulated with molybdenum oxide protective layers with thickness of 10 nm, 30 nm and 60 nm, and perovskite solar cells without encapsulation with molybdenum oxide protective layers. The test results are shown in Table 1.

It can be seen from Table 1 that in Examples 1-3 of the present invention, the performance loss rates of the perovskite solar cell modules that are only encapsulated in the first step and the devices encapsulated with molybdenum oxide protective layers with thicknesses of 10 nm, 30 nm, and 60 nm are lower than those of the non-volatile solar cells. The perovskite solar cell with the molybdenum oxide protective layer has the best protection effect when the thickness of the molybdenum oxide protective layer is 50 nm.

Table 1

It should be noted that the present invention can also use ALD (atomic layer deposition) to deposit the ceramic encapsulation layer on the protective layer to prevent external water vapor from entering the component and prevent lead in the perovskite component from leaking into the environment.

The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. within.

Claims (10)

1. An anti-lead leakage encapsulation structure of a perovskite solar cell, the perovskite solar cell comprising a conductive glass (1), an electron transport layer (2), a perovskite light-absorbing layer (3), A hole transport layer (4) and a metal electrode (5), characterized in that the lead leakage prevention packaging structure comprises a protective layer (6), a ceramic packaging layer (7), an edge sealing layer (8), and a packaging glass (9). ); the protective layer (6) is thermally evaporated on the metal electrode (5); the ceramic encapsulation layer (7) is sputtered or deposited on the protective layer (6); the edge seal layer ( 8) Laminate around the perovskite solar cell; the encapsulation glass (9) is arranged above the ceramic encapsulation layer (7) by pasting the edge seal layer (8), and is connected to the ceramic encapsulation layer (7). The encapsulation layer (7) and the edge sealing layer (8) form a cavity (10). 2. The lead-leakage-preventing package structure of a perovskite solar cell according to claim 1, wherein the lead-leakage-preventing package structure further comprises an adhesive layer (11); the adhesive layer (11) is located on the in the cavity (10) formed by the packaging glass (9), the ceramic packaging layer (7) and the edge sealing layer (8). 3. The anti-lead leakage encapsulation structure of perovskite solar cell according to claim 2, wherein the adhesive layer (11) is a propylene oxide adhesive layer, an ethylene-vinyl acetate copolymer adhesive layer one of the. 4. The lead-leakage-proof encapsulation structure of a perovskite solar cell according to claim 1, wherein the lead-leakage-prevention encapsulation structure further comprises an adhesive layer (11); the adhesive layer (11) is located on the in the cavity (10) formed by the encapsulation glass (9), the ceramic encapsulation layer (7) and the edge seal layer (8), and the adhesive layer (11) and the edge seal The layer (8) is integrally arranged. 5 . The lead leakage-preventing packaging structure of perovskite solar cells according to claim 4 , wherein the adhesive layer ( 11 ) and the edge sealing layer ( 8 ) are integrated UV curing adhesives. 6 . 6 . The lead leakage-preventing packaging structure of a perovskite solar cell according to claim 1 , wherein the protective layer ( 6 ) is a molybdenum oxide protective layer. 7 . 7. The anti-lead leakage encapsulation structure of perovskite solar cell according to claim 1, wherein the ceramic encapsulation layer (7) is an alumina ceramic encapsulation layer, a silicon oxide ceramic encapsulation layer, a silicon nitride ceramic encapsulation layer One of the encapsulation layers. 8. The anti-lead leakage encapsulation structure of perovskite solar cell according to claim 1, wherein the encapsulation glass (9) is one of soda lime encapsulation glass, ultra-white encapsulation glass, and tempered encapsulation glass . 9 . The anti-lead leakage encapsulation structure of a perovskite solar cell according to claim 1 , wherein the edge sealing layer ( 8 ) is a polyisobutylene edge sealing layer. 10 . 10. The method for encapsulating a lead-leakage-preventing encapsulation structure according to any one of claims 1 to 9, wherein the method comprises the following steps: 1) Thermally vapor-depositing the protective layer (6) on the metal electrode (5) of the perovskite solar cell, wherein the process parameters of thermal vapor deposition are: vacuum pressure: 2.5×10 ^-4 Pa , Thermal evaporation power: 90W, evaporation rate: 0.2A/s; 2) The ceramic encapsulation layer (7) is sputtered on the protective layer (6) by a magnetron sputtering method, wherein the magnetron sputtering process parameters are: target purity: 99.9%, sputtering temperature: Room temperature, background vacuum: 8×10 ^-4 Pa, argon flow rate: 20sccm, target spacing: 125mm, working pressure: 0.4-0.7Pa, sputtering power: 60-100W, sputtering rate: 0.1-0.15A/s ; 3) pasting the edge seal layer (8) on the peripheral edge of the perovskite solar cell on the side with the perovskite film, and pasting the encapsulation glass (9) on the edge seal layer (8) , to obtain a preliminary encapsulated battery; 4) The preliminary encapsulated battery is processed by a lamination method to obtain a lead leakage-proof perovskite solar cell, wherein the lamination process is: temperature: 150° C., pressure difference: 10kPa, heating and pressure treatment time: 5min .

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