CN111463351A - Lead leakage prevention packaging structure of perovskite solar cell and packaging method thereof - Google Patents
Lead leakage prevention packaging structure of perovskite solar cell and packaging method thereof Download PDFInfo
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Abstract
The invention provides a lead leakage prevention packaging structure of a perovskite solar cell and a packaging method thereof, wherein the perovskite solar cell comprises conductive glass, an electron transmission layer, a perovskite light absorption layer, a hole transmission layer and a metal electrode which are sequentially overlapped; the protective layer is thermally evaporated on the metal electrode; the ceramic packaging layer is sputtered or deposited on the protective layer; the edge sealing layer is laminated on the periphery of the perovskite solar cell; the packaging glass is arranged above the ceramic packaging layer by sticking the edge sealing layer, and forms a cavity together with the ceramic packaging layer and the edge sealing layer. According to the invention, through three-layer organic/inorganic material composite packaging protection, the damage probability of the solar cell module under external force impact of hail and the like is effectively reduced, and meanwhile, the packaging technology can also effectively prevent lead in the broken solar cell module from leaking under the conditions of rainwater scouring and the like in the nature.
Description
Technical Field
The invention relates to the technical field of packaging in the photovoltaic industry, in particular to a lead leakage prevention packaging structure of a perovskite solar cell and a packaging method thereof.
Background
Lead leakage in perovskite solar cells is one of the major concerns of the photovoltaic industry and the public at present for the rapid development of the perovskite solar cell industry. In order to reduce the environmental and social problems associated with lead in perovskite solar cells, the industry has proposed a number of possible solutions: non-lead materials are used to partially or completely replace lead or prevent leakage of lead through packaging techniques. Among them, the use of packaging techniques to prevent lead leakage is becoming one of the technological advances.
There are various packaging technologies currently used for perovskite solar cells, but not many packaging technologies that can effectively prevent lead leakage. The invention combines the magnetron sputtering technology and the characteristic that certain organic materials can generate combined reaction with lead element, provides a new packaging mode, and has the following characteristics: 1. the damage condition of the solar cell under the impact of external force in the using process can be effectively solved, and the damage rate of the solar cell module under the impact of hail, flying stones and the like is greatly reduced; 2. the damaged solar cell module can effectively reduce the erosion of water/water vapor under the composite packaging condition, and reduce the probability of lead in the perovskite material diffusing from the module to the environment under the natural environment. And finally, the harm of lead in the perovskite solar cell to the environment is effectively reduced.
Disclosure of Invention
In view of this, the present invention is directed to provide a lead leakage prevention package structure of a perovskite solar cell, so as to solve the problem of lead leakage of the existing perovskite solar cell.
In order to achieve the purpose, the technical scheme of the invention is realized by the following method:
the lead leakage prevention packaging structure of the perovskite solar cell comprises conductive glass, an electron transmission layer, a perovskite light absorption layer, a hole transmission layer and a metal electrode which are sequentially stacked, and is characterized by comprising a protective layer, a ceramic packaging layer, packaging glass and an edge sealing layer; the protective layer is thermally evaporated on the metal electrode; the ceramic packaging layer is sputtered or deposited on the protective layer; the edge sealing layer is laminated on the periphery of the perovskite solar cell; the packaging glass is arranged above the ceramic packaging layer by sticking the edge sealing layer, and forms a cavity with the ceramic packaging layer and the edge sealing layer.
Optionally, the lead leakage prevention packaging structure further comprises an adhesive layer; the bonding layer is positioned in the cavity formed by the packaging glass, the ceramic packaging layer and the edge sealing layer.
Optionally, the adhesive layer is one of a propylene oxide adhesive layer and an ethylene-vinyl acetate copolymer adhesive layer.
Optionally, the lead leakage prevention packaging structure further comprises an adhesive layer; the bonding layer is positioned in the cavity formed by the packaging glass, the ceramic packaging layer and the edge sealing layer, and the bonding layer and the edge sealing layer are integrally arranged.
Optionally, the bonding layer and the edge sealing layer are integrated into an ultraviolet curing adhesive.
Optionally, the protective layer is a molybdenum oxide protective layer, and the thickness of the protective layer is 50 nm.
Optionally, the ceramic package layer is one of an aluminum oxide ceramic package layer, a silicon oxide ceramic package layer, and a silicon nitride ceramic package layer, and the thickness of the ceramic package layer is 350 nm.
Optionally, the encapsulation glass is one of soda lime encapsulation glass, ultra-white encapsulation glass and tempered encapsulation glass.
Optionally, the edge sealing layer is a polyisobutylene edge sealing layer, and the thickness of the edge sealing layer is 3 mm.
A second object of the present invention is to provide a packaging method of the above lead leakage prevention packaging structure, which includes the following steps:
1) thermally evaporating the protective layer on the metal electrode of the perovskite solar cell, wherein the technological parameter of thermal evaporation is that the vacuum pressure is 2.5 × 10-4Pa, thermal evaporation power: 90W, evaporation rate: 0.2A/s;
2) sputtering the ceramic packaging layer on the protective layer by adopting a magnetron sputtering method, wherein magnetron sputteringThe sputtering technological parameters comprise the target material purity of 99.9 percent, the sputtering temperature of room temperature and the background vacuum of 8 × 10-4Pa, argon flow: 20sccm, target spacing: 125mm, working air pressure: 0.4-0.7Pa, sputtering power: 60-100W, sputtering rate: 0.1-0.15A/s;
3) after removing the perovskite thin film of 0.5cm around the battery, sticking the edge sealing layer on the peripheral edge of the perovskite thin film side of the perovskite solar battery, and then sticking the packaging glass on the edge sealing layer to obtain a primary packaging battery;
4) processing the primary packaged battery by a laminating method to obtain the lead leakage prevention perovskite solar battery, wherein the laminating process comprises the following steps: temperature: 150 ℃, pressure difference: 10kPa, heat-pressure treatment time: and 5 min.
Compared with the prior art, the lead leakage prevention packaging structure of the perovskite solar cell has the following advantages:
the method comprises the steps of firstly evaporating a molybdenum oxide protective layer with the thickness of about dozens of nanometers on the perovskite solar cell device, then sputtering an aluminum oxide ceramic packaging layer with the thickness of several nanometers to hundreds of nanometers, further packaging the device by using a glass cover plate and packaging glue (PIB glue and PO glue are used together), and effectively reducing the damage probability of the solar cell component under the impact of external force such as hail and the like while realizing the protection of the perovskite solar cell device through the three-layer organic/inorganic material composite packaging protection. In addition, the packaging technology can effectively reduce the leakage of lead in the broken solar cell module under the conditions of rainwater scouring and the like in the nature, thereby reducing the pollution of the lead in the perovskite solar cell module to the environment.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of a lead leakage prevention encapsulation structure of a perovskite solar cell according to embodiment 1 of the present invention;
fig. 2 is a schematic structural view of a lead leakage prevention encapsulation structure of a perovskite solar cell according to embodiment 2 of the present invention;
fig. 3 is a schematic structural view of a lead leakage prevention encapsulation structure of a perovskite solar cell according to embodiment 3 of the present invention;
FIG. 4 is a schematic structural diagram of a perovskite solar cell packaged by an alumina ceramic packaging layer and employing a molybdenum oxide protective layer according to the present invention;
fig. 5 is a schematic structural diagram of a perovskite solar cell encapsulated with a molybdenum oxide protective layer according to the present invention.
Reference numerals:
1-conductive glass, 2-electron transport layer, 3-perovskite light absorption layer, 4-hole transport layer, 5-metal electrode, 6-protective layer, 7-ceramic packaging layer, 8-edge sealing layer, 9-packaging glass, 10-cavity and 11-bonding layer.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be described in detail below with reference to the drawings and examples.
Example 1
With reference to fig. 1, in the lead leakage prevention package structure of the perovskite solar cell of the present embodiment, the perovskite solar cell includes a conductive glass 1, an electron transport layer 2, a perovskite light absorption layer 3, a hole transport layer 4, and a metal electrode 5, which are sequentially stacked; the lead leakage prevention packaging structure comprises a protective layer 6, a ceramic packaging layer 7, an edge sealing layer 8 and packaging glass 9, wherein the protective layer 6 is a molybdenum oxide protective layer which is thermally evaporated on a metal electrode 5 and can block high-energy impact generated by magnetron sputtering to achieve the purpose of protecting perovskite materials, so that lead leakage in the perovskite materials is effectively prevented; the ceramic packaging layer 7 is an aluminum oxide ceramic packaging layer, is sputtered on the molybdenum oxide protective layer by a magnetron sputtering method, can effectively prevent external water/water vapor from entering the assembly, and can further effectively prevent lead in the perovskite assembly from being removed; the edge sealing layer 8 is a Polyisobutylene (PIB) edge sealing layer, is laminated around the perovskite solar cell by a laminating method, can encapsulate the periphery of the component and further effectively prevent lead leakage; encapsulation glass 9 is soda-lime encapsulation glass, and it sets up in the top of aluminium oxide ceramic packaging layer through pasting the limit sealing layer to form cavity 10 with aluminium oxide ceramic packaging layer 7 and limit sealing layer 8, at this moment, soda-lime encapsulation glass glues with the marginal encapsulation that perovskite solar cell device set up all around (PIB glues), and limit sealing layer 8 is promptly, realizes the encapsulation to perovskite solar cell device's each direction jointly, thereby still further prevent that lead from revealing in the environment.
In this embodiment, the molybdenum oxide material plays the guard action to the perovskite material, and the aluminum oxide material plays the effect of isolated steam and oxygen, and PIB encapsulation glue plays the effect of reinforcing perovskite solar cell device shock resistance, and it prevents that external environment from producing destruction to the perovskite material through three-layer guard action, has also effectively restrained the process of the lead to external diffusion in the perovskite, has played the protection and has prevented the effect that lead revealed to the perovskite solar cell device.
When the lead leakage prevention packaging structure is used for packaging the perovskite solar cell, namely the lead leakage prevention packaging technology of the perovskite solar cell based on the combination of the molybdenum oxide protective layer, the ceramic packaging layer and the PIB edge sealing is adopted, and the specific packaging method comprises the following steps:
1) preparing a molybdenum oxide protective layer on the positive electrode (Au electrode) of the prepared perovskite solar cell device with the positive electrode and the negative electrode by adopting a thermal evaporation method, and specifically, vacuumizing the perovskite solar cell device with the positive electrode and the negative electrode to 2.5 × 10 by using a to-be-evaporated instrument-4Starting evaporation after Pa, evaporating molybdenum oxide onto the Au electrode with the thickness of about 50nm, wherein the thermal evaporation power is 90W, and the evaporation rate is 0.2A/s;
2) the aluminum oxide ceramic packaging layer is prepared by adopting a magnetron sputtering method, and the method comprises the specific steps of sputtering aluminum oxide onto a molybdenum oxide protective layer with the thickness of about 350nm, wherein the magnetron sputtering technological parameters comprise that all target materials have the purity of 99.9 percent, round targets have the size of three inches (76.2mm), the targets are sputtered at room temperature by adopting radio frequency without additional heating, and the background vacuum is 8 × 10-4Pa, argon flow of 20sccm, target spacing of 125mm, working pressure of 0.4-0.7Pa, sputteringCleaning the target material with argon gas of 20sccm for half an hour before injection; the sputtering power of the alumina is 100W, and the sputtering rate is 0.15A/s;
3) using a femtosecond laser, setting the power to be 18w and the frequency to be 100Hz, removing the perovskite thin film of 0.5cm around the battery, wiping the periphery of the battery with a little DMF, and removing the residual perovskite;
4) the preparation method of the edge sealing layer comprises the following specific steps: sticking black PIB packaging glue with the thickness of 3mm and the width of 5mm at the peripheral edge of the perovskite thin film side of the obtained perovskite solar cell, namely a side sealing layer, and sticking sodium-calcium packaging glass on the PIB side sealing layer to obtain a primary packaging cell;
5) the lamination packaging comprises the following specific steps: and placing the primarily packaged battery in a laminating machine, and heating and pressurizing for 5min under the conditions that the temperature is 150 ℃ and the pressure difference is 10kPa to obtain the packaged perovskite solar battery capable of effectively preventing lead leakage.
The perovskite solar cell module for preventing lead leakage prepared by the embodiment is subjected to impact resistance and lead leakage performance tests.
The impact resistance is specifically carried out by the following method: the 130g steel ball is used for carrying out an impact resistance test, and the steel ball falls freely at the height of 15cm, so that the device of the embodiment is cracked when impacted;
the lead leakage performance is specifically performed by the following method: and (3) placing the device with the star-shaped cracks in a simulated acid rain solution with the temperature of 45 ℃ and the Ph of 5.6 to perform a lead leakage condition test, and measuring that the lead leakage rate is only 0.084% under the packaging condition, and the lead leakage prevention effect is obvious.
Example 2
As shown in fig. 2, the lead leakage prevention package structure of the perovskite solar cell of the present embodiment is different from that of embodiment 1 in that: the lead leakage prevention packaging structure of the embodiment further comprises a bonding layer 11, wherein the bonding layer 11 is a Propylene Oxide (PO) bonding layer, and is located in a cavity 10 formed by the packaging glass 9, the ceramic packaging layer 7 and the edge sealing layer 8, so that the component and the packaging glass 9 can be tightly bonded, the damage probability of the perovskite solar cell component under physical impact is reduced, and meanwhile, the diffusion rate of lead in the perovskite material to the environment can be effectively prevented under the condition that the solar cell is damaged, so that the impact resistance of the perovskite component is effectively improved, and the lead in the component can be effectively prevented from being leaked to the environment.
When the lead leakage prevention packaging structure is used for packaging the perovskite solar cell, namely the lead leakage prevention packaging technology of the perovskite solar cell based on the combination of the molybdenum oxide protective layer, the ceramic packaging layer, the propylene oxide bonding layer and the PIB edge sealing is adopted, the specific packaging method comprises the following steps:
1) preparing a molybdenum oxide protective layer on the positive electrode (Au electrode) of the prepared perovskite solar cell device with the positive electrode and the negative electrode by adopting a thermal evaporation method, and specifically, vacuumizing the perovskite solar cell device with the positive electrode and the negative electrode to 2.5 × 10 by using a to-be-evaporated instrument-4Starting evaporation after Pa, evaporating molybdenum oxide onto the Au electrode with the thickness of about 50nm, wherein the thermal evaporation power is 90W, and the evaporation rate is 0.2A/s;
2) the aluminum oxide ceramic packaging layer is prepared by adopting a magnetron sputtering method, and the method comprises the specific steps of sputtering aluminum oxide onto a molybdenum oxide protective layer with the thickness of about 350nm, wherein the magnetron sputtering technological parameters comprise that all target materials have the purity of 99.9 percent, round targets have the size of three inches (76.2mm), the targets are sputtered at room temperature by adopting radio frequency without additional heating, and the background vacuum is 8 × 10-4Pa, the flow of argon is 20sccm, the target spacing is 125mm, the working pressure is 0.4-0.7Pa, and the target is cleaned by argon of 20sccm for half an hour before sputtering; the sputtering power of the alumina is 100W, and the sputtering rate is 0.15A/s;
3) using a femtosecond laser, setting the power to be 18w and the frequency to be 100Hz, removing the perovskite thin film of 0.5cm around the battery, wiping the periphery of the battery with a little DMF, and removing the residual perovskite;
4) the preparation method of the edge sealing layer and the bonding layer comprises the following specific steps: sticking black PIB packaging glue with the thickness of 3mm and the width of 5mm, namely an edge sealing layer, to the peripheral edge of the perovskite thin film side of the obtained perovskite solar cell, cutting a PO (propylene oxide) glue film according to the size of the perovskite solar cell, namely an adhesive layer, placing the PO glue film on an alumina ceramic packaging layer of the perovskite solar cell, and sticking soda-lime packaging glass on the PIB edge sealing layer and the PO adhesive layer to obtain a primary packaging cell;
5) the lamination packaging comprises the following specific steps: and placing the primarily packaged battery in a laminating machine, and heating and pressurizing for 5min under the conditions that the temperature is 150 ℃ and the pressure difference is 10kPa to obtain the packaged perovskite solar battery capable of effectively preventing lead leakage.
The perovskite solar cell module for preventing lead leakage prepared by the embodiment is subjected to impact resistance and lead leakage performance tests.
The impact resistance is specifically carried out by the following method: the 130g steel ball is used for carrying out an impact resistance test, the steel ball falls freely at the height of 30cm, and the device of the embodiment is impacted to cause cracks;
the lead leakage performance is specifically performed by the following method: and (3) placing the device with the star-shaped cracks in a simulated acid rain solution with the temperature of 45 ℃ and the Ph of 5.6 to perform a lead leakage condition test, and measuring that the lead leakage rate is only 0.00036% under the packaging condition, and the lead leakage prevention effect is obvious.
Example 3
As shown in fig. 3, the lead leakage prevention package structure of the perovskite solar cell of the present embodiment is different from that of embodiment 1 in that: the lead leakage prevention packaging structure further comprises a bonding layer 11, wherein the bonding layer 11 and the edge sealing layer 8 are integrated ultraviolet curing glue, namely the bonding layer 11 in a cavity 10 formed by the packaging glass 9, the ceramic packaging layer 7 and the edge sealing layer 8 around the perovskite solar cell are both made of the ultraviolet curing glue, and the bonding layer 11 and the edge sealing layer 8 are integrally formed in the preparation process.
In the embodiment, the integrated edge sealing layer 8 and the bonding layer 11 are prepared by adopting ultraviolet curing and gelling, so that the damage rate of the perovskite solar cell module under physical impact can be reduced, the diffusion rate of lead in the perovskite material to the environment can be effectively prevented under the condition of solar cell damage, and the structure is simplified, so that the packaging efficiency is effectively improved.
When the lead leakage prevention packaging structure is used for packaging the perovskite solar cell, namely the lead leakage prevention packaging technology of the perovskite solar cell based on the combination of the molybdenum oxide protective layer, the ceramic packaging layer and the ultraviolet curing adhesive layer, the specific packaging method comprises the following steps:
1) preparing a molybdenum oxide protective layer on the positive electrode (Au electrode) of the prepared perovskite solar cell device with the positive electrode and the negative electrode by adopting a thermal evaporation method, and specifically, vacuumizing the perovskite solar cell device with the positive electrode and the negative electrode to 2.5 × 10 by using a to-be-evaporated instrument-4Starting evaporation after Pa, evaporating molybdenum oxide onto the Au electrode with the thickness of about 50nm, wherein the thermal evaporation power is 90W, and the evaporation rate is 0.2A/s;
2) the aluminum oxide ceramic packaging layer is prepared by adopting a magnetron sputtering method, and the method comprises the specific steps of sputtering aluminum oxide onto a molybdenum oxide protective layer with the thickness of about 350nm, wherein the magnetron sputtering technological parameters comprise that all target materials have the purity of 99.9 percent, round targets have the size of three inches (76.2mm), the targets are sputtered at room temperature by adopting radio frequency without additional heating, and the background vacuum is 8 × 10-4Pa, the flow of argon is 20sccm, the target spacing is 125mm, the working pressure is 0.4-0.7Pa, and the target is cleaned by argon of 20sccm for half an hour before sputtering; the sputtering power of the alumina is 100W, and the sputtering rate is 0.15A/s;
3) using a femtosecond laser, setting the power to be 18w and the frequency to be 100Hz, removing the perovskite thin film of 0.5cm around the battery, wiping the periphery of the battery with a little DMF, and removing the residual perovskite;
4) the preparation method of the ultraviolet curing full-packaging adhesive layer, namely the integrated edge sealing layer and the adhesive layer, comprises the following specific steps: dripping 3-5 drops of ultraviolet curing packaging adhesive on the side of the perovskite thin film of the obtained perovskite solar cell, coating by using a scraper to enable liquid to be uniformly dispersed on the periphery of a perovskite solar cell device and an alumina ceramic packaging layer, and then pasting soda-lime packaging glass on the ultraviolet curing packaging adhesive coated on the alumina ceramic packaging layer to obtain a primary packaging cell;
5) ultraviolet curing and packaging, which comprises the following steps: and placing the primarily packaged battery in an ultraviolet curing machine for irradiating for 3min to obtain the packaged perovskite solar battery capable of effectively preventing lead leakage.
The perovskite solar cell module for preventing lead leakage prepared by the embodiment is subjected to impact resistance and lead leakage performance tests.
The impact resistance is specifically carried out by the following method: the 130g steel ball is used for carrying out an impact resistance test, the steel ball falls freely at the height of 35cm, and the device of the embodiment is impacted to cause cracks;
the lead leakage performance is specifically performed by the following method: and (3) placing the device with the star-shaped cracks in a simulated acid rain solution with the temperature of 45 ℃ and the Ph of 5.6 to perform a lead leakage condition test, and measuring that the lead leakage rate is only 0.0027% under the packaging condition, and the lead leakage prevention effect is obvious.
With reference to fig. 4, the perovskite solar cell module in which only the first two steps of encapsulation were performed in examples 1 to 3 of the present invention was subjected to a cell performance test, that is, a device encapsulated with a molybdenum oxide protective layer having a thickness of only 50nm and an aluminum oxide ceramic encapsulation layer was subjected to a cell performance test, and compared with a device encapsulated with a molybdenum oxide protective layer having a thickness of 50nm and a silicon oxide ceramic encapsulation layer and a device encapsulated with a molybdenum oxide protective layer having a thickness of 50nm and a silicon nitride ceramic encapsulation layer. Wherein, the silicon oxide sputtering power of the silicon oxide ceramic packaging layer prepared by the magnetron sputtering method is 70W, and the sputtering rate is 0.15A/s; the sputtering power of the silicon nitride for preparing the silicon nitride ceramic packaging layer by the magnetron sputtering method is 60W, and the sputtering rate is 0.1A/s.
Test results show that the device performance packaged by the alumina ceramic packaging layer is kept better and basically has no attenuation only by adopting the molybdenum oxide protective layer with the thickness of 50nm in the embodiments 1-3 of the invention, and 95.5 percent of the initial efficiency can be kept after 48 hours; the device packaged by the 50 nm-thick molybdenum oxide protective layer and the silicon oxide ceramic packaging layer can keep 49% of the initial efficiency after being placed for 48 hours at 30 ℃ and 30% RH without illumination; a device packaged by a 50 nm-thick molybdenum oxide protective layer and a silicon nitride ceramic packaging layer can maintain 90% of initial efficiency after being placed for 24 hours at 30 ℃ and 30% RH without light, and can maintain 67% of the initial efficiency after 48 hours.
With reference to fig. 5, the perovskite solar cell module only packaged in the first step in examples 1 to 3 of the present invention was subjected to a device performance loss rate test, that is, a device packaged with a molybdenum oxide protective layer having a thickness of only 50nm was subjected to a device performance loss rate test, and compared with a device packaged with a molybdenum oxide protective layer having a thickness of 10nm, 30nm, or 60nm, and a perovskite solar cell not packaged with a molybdenum oxide protective layer, and the test results are shown in table 1.
As can be seen from table 1, the performance loss rate of the perovskite solar cell module packaged only in the first step and the devices packaged by the molybdenum oxide protective layers with the thickness of 10nm, 30nm and 60nm in examples 1 to 3 of the present invention are lower than that of the perovskite solar cell without the molybdenum oxide protective layer, and the protection effect is the best when the thickness of the molybdenum oxide protective layer is 50 nm.
TABLE 1
It should be noted that the present invention may also employ a L D (atomic layer deposition) to deposit a ceramic encapsulation layer on the protective layer to prevent outside moisture from entering the assembly and to prevent lead in the perovskite assembly from leaking into the environment.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The lead leakage prevention packaging structure of the perovskite solar cell comprises conductive glass (1), an electron transmission layer (2), a perovskite light absorption layer (3), a hole transmission layer (4) and a metal electrode (5) which are sequentially stacked, and is characterized by comprising a protective layer (6), a ceramic packaging layer (7), an edge sealing layer (8) and packaging glass (9); the protective layer (6) is thermally evaporated on the metal electrode (5); the ceramic packaging layer (7) is sputtered or deposited on the protective layer (6); the edge sealing layer (8) is laminated on the periphery of the perovskite solar cell; the packaging glass (9) is arranged above the ceramic packaging layer (7) by sticking the edge sealing layer (8), and forms a cavity (10) with the ceramic packaging layer (7) and the edge sealing layer (8).
2. The perovskite solar cell lead leakage prevention encapsulation structure according to claim 1, further comprising an adhesive layer (11); the bonding layer (11) is positioned in the cavity (10) formed by the packaging glass (9), the ceramic packaging layer (7) and the edge sealing layer (8).
3. The perovskite solar cell lead leakage prevention encapsulation structure according to claim 2, wherein the adhesive layer (11) is one of a propylene oxide adhesive layer and an ethylene-vinyl acetate copolymer adhesive layer.
4. The perovskite solar cell lead leakage prevention encapsulation structure according to claim 1, further comprising an adhesive layer (11); the bonding layer (11) is positioned in the cavity (10) formed by the packaging glass (9), the ceramic packaging layer (7) and the edge sealing layer (8), and the bonding layer (11) and the edge sealing layer (8) are integrally arranged.
5. The perovskite solar cell lead leakage prevention packaging structure as claimed in claim 4, wherein the bonding layer (11) and the edge sealing layer (8) are an integrated ultraviolet curing glue.
6. The perovskite solar cell lead leakage prevention encapsulation structure according to claim 1, wherein the protection layer (6) is a molybdenum oxide protection layer.
7. The lead leakage prevention encapsulation structure of a perovskite solar cell according to claim 1, wherein the ceramic encapsulation layer (7) is one of an aluminum oxide ceramic encapsulation layer, a silicon oxide ceramic encapsulation layer and a silicon nitride ceramic encapsulation layer.
8. The perovskite solar cell lead leakage prevention encapsulation structure as claimed in claim 1, wherein the encapsulation glass (9) is one of soda-lime encapsulation glass, ultra-white encapsulation glass and tempered encapsulation glass.
9. The perovskite solar cell lead leakage prevention encapsulation structure according to claim 1, wherein the edge seal (8) is a polyisobutylene edge seal.
10. The method of encapsulating a lead leakage prevention encapsulation structure according to any one of claims 1 to 9, characterized by comprising the steps of:
1) thermally evaporating the protective layer (6) on the metal electrode (5) of the perovskite solar cell, wherein the technological parameter of the thermal evaporation is that the vacuum pressure is 2.5 × 10-4Pa, thermal evaporation power: 90W, evaporation rate: 0.2A/s;
2) sputtering the ceramic packaging layer (7) on the protective layer (6) by adopting a magnetron sputtering method, wherein the magnetron sputtering technological parameters comprise target material purity of 99.9 percent, sputtering temperature of room temperature and background vacuum of 8 × 10-4Pa, argon flow: 20sccm, target spacing: 125mm, working air pressure: 0.4-0.7Pa, sputtering power: 60-100W, sputtering rate: 0.1-0.15A/s;
3) the edge sealing layer (8) is pasted at the peripheral edge of the perovskite thin film side of the perovskite solar cell, and the packaging glass (9) is pasted on the edge sealing layer (8), so that a primary packaging cell is obtained;
4) processing the primary packaged battery by a laminating method to obtain the lead leakage prevention perovskite solar battery, wherein the laminating process comprises the following steps: temperature: 150 ℃, pressure difference: 10kPa, heat-pressure treatment time: and 5 min.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112701227A (en) * | 2021-01-27 | 2021-04-23 | 华中科技大学鄂州工业技术研究院 | Perovskite solar cell device and packaging method thereof |
| CN112909179A (en) * | 2021-01-21 | 2021-06-04 | 南开大学 | Packaging method of perovskite solar cell |
| CN113035988A (en) * | 2021-05-13 | 2021-06-25 | 中山市武汉理工大学先进工程技术研究院 | Perovskite solar cell module capable of effectively relieving hot spot effect |
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