CN111462934A - Conductive paste, preparation method thereof, wearable electronic circuit and DIY (digital image processing) suite thereof - Google Patents
Conductive paste, preparation method thereof, wearable electronic circuit and DIY (digital image processing) suite thereof Download PDFInfo
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- CN111462934A CN111462934A CN201910052236.2A CN201910052236A CN111462934A CN 111462934 A CN111462934 A CN 111462934A CN 201910052236 A CN201910052236 A CN 201910052236A CN 111462934 A CN111462934 A CN 111462934A
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- liquid metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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Abstract
The invention provides conductive paste and a preparation method thereof, a wearable electronic circuit and a DIY (digital information processing) suite thereof, and relates to the technical field of electronic circuits. The conductive slurry provided by the invention consists of gallium-based liquid metal, viscosity adjusting filler and conductive filler; the conductive slurry comprises, by weight, 4% -10% of viscosity adjusting filler, 4% -10% of conductive filler and the balance gallium-based liquid metal; the viscosity adjusting filler is one or more of iron powder, nickel powder and iron-nickel powder, and the conductive filler is silver-coated copper powder. The technical scheme of the invention can simply manufacture the wearable electronic circuit, has strong operability and is beneficial to meeting the individual requirements of users on the wearable electronic device.
Description
Technical Field
The invention relates to the technical field of electronic circuits, in particular to conductive paste and a preparation method thereof, a wearable electronic circuit and a DIY (digital information processing) kit thereof.
Background
A wearable electronic device is an electronic device that is used while being worn on, for example, a human body (e.g., a wrist, a neck, a head, etc.). Since the wearable electronic device can provide various services having great portability, the use of the wearable electronic device is increasing, and the demand for personalization of the wearable electronic device is also gradually increasing.
The wearable electronic device can realize the functions only by comprising the electronic circuit, the traditional electronic circuit adopts a copper wire or an aluminum wire, complex processes such as etching and the like are needed in the manufacturing process, DIY manufacturing cannot be carried out, and the personalized requirements of a user on the wearable electronic device cannot be met.
Disclosure of Invention
The invention provides conductive paste, a preparation method thereof, a wearable electronic circuit and a DIY kit thereof, wherein the wearable electronic circuit can be simply manufactured, the operability is strong, and the personalized requirements of users on wearable electronic devices can be met.
In a first aspect, the present invention provides a conductive paste, which adopts the following technical scheme:
the conductive slurry is composed of gallium-based liquid metal, viscosity adjusting filler and conductive filler; the conductive slurry comprises, by weight, 4% -10% of viscosity adjusting filler, 4% -10% of conductive filler and the balance gallium-based liquid metal; the viscosity adjusting filler is one or more of iron powder, nickel powder and iron-nickel powder, and the conductive filler is silver-coated copper powder.
Optionally, the gallium-based liquid metal is a simple substance of gallium, or a eutectic alloy of gallium and indium, or a eutectic alloy of gallium, indium and tin.
Optionally, the viscosity adjusting filler is iron-nickel powder, and the conductive paste comprises 5% of the viscosity adjusting filler.
Optionally, the viscosity adjusting filler is nickel powder, and the conductive paste comprises 4% of the viscosity adjusting filler.
Optionally, the particle size of the viscosity adjusting filler is 1-5 microns.
Optionally, the conductive paste comprises 5% conductive filler.
Optionally, the particle size of the conductive filler is 1-5 microns.
In a second aspect, the present invention provides a method for preparing conductive paste, which is used for preparing any one of the conductive pastes described above, and the preparation method adopts the following technical scheme:
the preparation method of the conductive paste comprises the following steps:
weighing gallium-based liquid metal, viscosity adjusting filler and conductive filler according to the weight percentage;
and uniformly mixing the gallium-based liquid metal, the viscosity adjusting filler and the conductive filler by a ball milling or kneading process to obtain the conductive slurry.
In a third aspect, the present invention provides a wearable electronic circuit, comprising: a liquid metal line on the skin of a human body, the liquid metal line being made of the conductive paste of any one of the above.
In a fourth aspect, the present invention provides a DIY kit for a wearable electronic circuit, the DIY kit comprising: the hand-painted kit comprises a brush and the conductive paste of any one of the above items.
The invention provides a conductive paste and a preparation method thereof, a wearable electronic circuit and a DIY kit thereof, wherein the conductive paste consists of gallium-based liquid metal, viscosity adjusting filler and conductive filler; wherein, the conductive slurry comprises 4 to 10 weight percent of viscosity adjusting filler, 4 to 10 weight percent of conductive filler and the balance of gallium-based liquid metal; the viscosity adjusting filler is one or more of iron powder, nickel powder and iron-nickel powder, and the conductive filler is silver-coated copper powder. On one hand, the gallium-based liquid metal has a lower melting point and is easy to melt into a liquid state, on the other hand, the viscosity adjusting filler enables the conductive slurry to have proper viscosity, on the other hand, the conductive filler enables the conductive slurry to have better electrical performance, on the other hand, the conductive slurry only contains three components of the gallium-based liquid metal, the viscosity adjusting filler and the conductive filler, and does not contain other components such as organic solvents, dispersing agents, coupling agents, surfactants and the like, and has better biocompatibility, so that the conductive slurry can be directly prepared into a liquid metal circuit by brushing, hand drawing and the like and is applied to a wearable electronic circuit.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart of a method for preparing a conductive paste according to an embodiment of the present invention;
fig. 2 is a top view of a wearable electronic circuit provided by an embodiment of the invention;
FIG. 3 is a schematic cross-sectional view along AA' of FIG. 2 according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
The embodiment of the invention provides conductive paste, which consists of gallium-based liquid metal, viscosity adjusting filler and conductive filler; wherein, the conductive slurry comprises 4 to 10 weight percent of viscosity adjusting filler, 4 to 10 weight percent of conductive filler and the balance of gallium-based liquid metal; the viscosity adjusting filler is one or more of iron powder, nickel powder and iron-nickel powder, and the conductive filler is silver-coated copper powder.
The iron-nickel powder described above is a powder made of an iron-nickel alloy, for example, in the iron-nickel alloy, 72.8% by weight of iron, 0.75% by weight of carbon, and the balance of nickel, and of course, a small amount of unavoidable impurity elements.
If the content of the viscosity adjusting filler in the conductive paste is higher than the range, the viscosity of the conductive paste is too high, the conductive paste cannot be brushed or painted by hands, and structures such as a liquid metal circuit are difficult to form. Alternatively, the weight percentage of the viscosity-adjusting filler in the conductive paste may be 4%, 5%, 6%, 7%, 8%, 9%, or 10%.
If the content of the conductive filler in the conductive paste is higher than the above range, the viscosity of the conductive paste is too high, and the cost is too high. Alternatively, the weight percentage of the conductive filler in the conductive paste may be 4%, 5%, 6%, 7%, 8%, 9%, or 10%.
As shown in fig. 1, fig. 1 is a flowchart of a method for preparing a conductive paste according to an embodiment of the present invention, where the method for preparing a conductive paste includes:
step S1, weighing gallium-based liquid metal, viscosity adjusting filler and conductive filler according to weight percentage;
and step S2, uniformly mixing the gallium-based liquid metal, the viscosity adjusting filler and the conductive filler through a ball milling or kneading process to obtain the conductive slurry.
Illustratively, the process parameters in the ball milling process are: the rotating speed is 500 r/m, and the ball milling time is 10-30 minutes; the technological parameters in the kneading process are 50-60 r/min of rotating speed and 2 hours of kneading time.
It should be noted that the reason for specifically selecting the above specific components in the conductive paste is as follows:
the reason for choosing gallium-based liquid metals is: the gallium-based liquid metal has a low melting point, can be melted into a liquid state at room temperature or by slight heating, and is easy to use the conductive paste to manually draw and manufacture structures such as liquid metal circuits and the like.
The reason for selecting one or more of iron powder, nickel powder and iron-nickel powder as the viscosity adjusting filler is as follows: the iron powder, the nickel powder and the iron-nickel powder can well adjust the viscosity of the conductive paste, so that the conductive paste cannot be brushed or hand-painted due to overlarge viscosity, cannot be stably adhered to a base material due to overlarge viscosity and overlarge fluidity, and is low in cost. Although the viscosity of the conductive paste can be adjusted by adding silver powder, copper powder, silver-copper powder, or the like to the conductive paste, the silver powder, copper powder, silver-copper powder, or the like easily generates large-particle compounds, increases the granular feel of the conductive paste, decreases the uniformity of the performance of the conductive paste, and is high in cost.
The reason for choosing silver-coated copper powder as the conductive filler is as follows: the silver-coated copper powder has good conductivity and low cost, and ensures good comprehensive performance of the conductive paste while increasing the conductivity of the conductive paste. Although copper powder, silver powder, and the like are also commonly used as the conductive filler, the inventors have found that copper powder is likely to react with gallium to produce a copper gallium compound, which makes the conductive paste less conductive, and that addition of a large amount of copper powder is necessary to ensure conductivity, which makes the conductive paste easily curable, while silver powder is too costly.
From the above description, it can be seen that the conductive paste in the embodiment of the invention is easily melted into a liquid state, has a suitable viscosity, and has good electrical properties (the conductivity is 5 × 10)6In addition, the conductive paste only contains three components of gallium-based liquid metal, viscosity adjusting filler and conductive filler, and does not contain other components such as organic solvent, dispersant, coupling agent, surfactant and the like, and has good biocompatibility, so that the conductive paste can be directly prepared into a liquid metal circuit by brushing, hand-drawing and the like and applied to a wearable electronic circuit.
Optionally, in the embodiment of the present invention, the gallium-based liquid metal is a simple substance of gallium (melting point 29.8 ℃), or a eutectic alloy of gallium and indium (melting point 15.5 ℃), or a eutectic alloy of gallium, indium and tin (melting point 11 ℃).
The inventor finds that when the viscosity adjusting filler is nickel powder, the viscosity of the conductive paste can be adjusted by adding a small amount of nickel powder, but the viscosity of the conductive paste is difficult to be accurately controlled, and in the process of preparing the conductive paste, the nickel powder is easy to perform an alloying reaction with gallium-based liquid metal to obtain a partially alloyed product, and the partially alloyed product can spontaneously continue the alloying reaction at room temperature, so that the viscosity of the conductive paste is gradually increased, and the conductive paste is not beneficial to long-term use and stable performance of the conductive paste.
When the viscosity adjusting filler is iron powder, the iron powder is easily oxidized in the storage process, and the conductive slurry is difficult to prepare.
When the viscosity adjusting filler is iron-nickel powder, the viscosity of the conductive paste is slowly increased after the iron-nickel powder is added, the conductive paste is easy to accurately control, and the iron-nickel powder is difficult to perform alloying reaction with gallium-based liquid metal in the process of preparing the conductive paste due to the low nickel content in the iron-nickel powder, so that the conductive paste can keep proper viscosity and stable performance for a long time.
Based on the above considerations, embodiments of the present invention provide several alternative choices of viscosity modifying fillers, and corresponding weight percentages. In one example, the viscosity adjusting filler is iron nickel powder and the conductive paste includes 5% of the viscosity adjusting filler. In yet another example, the viscosity modifying filler is nickel powder and the conductive paste includes 4% of the viscosity modifying filler.
Further, in both examples described above, the conductive paste includes 5% conductive filler.
In addition, the smaller the particle size of the viscosity adjusting filler is, the larger the specific surface area of the viscosity adjusting filler is, the larger the contact area between the viscosity adjusting filler and the gallium-based liquid metal is, the easier the viscosity adjusting filler and the gallium-based liquid metal are to be mixed, the more obvious the effect of adjusting the viscosity of the conductive paste is, but the viscosity adjusting filler with the too small particle size is difficult to prepare, and the cost is high.
In the embodiment of the invention, the particle size of the viscosity adjusting filler is 1-5 microns, such as 2 microns, so that the conductive paste is fine and smooth, the granular feeling is less, the user experience is good when the liquid metal circuit is manufactured on human skin and the like, and the viscosity adjusting filler is easy to prepare and has low cost.
Based on the same consideration, the particle size of the conductive filler is selected to be 1-5 micrometers, such as 2 micrometers, so that the conductive paste is fine and smooth, the granular feeling is less, the user experience is good when the liquid metal circuit is manufactured on human skin and the like, the conductive filler is easy to prepare, and the cost is low.
In addition, an embodiment of the present invention provides a wearable electronic circuit, as shown in fig. 2 and fig. 3, fig. 2 is a top view of the wearable electronic circuit provided in the embodiment of the present invention, fig. 3 is a first schematic cross-sectional view along an AA' direction of fig. 2 provided in the embodiment of the present invention, and the wearable electronic circuit includes: a liquid metal line 1 on the skin of a human body, the liquid metal line 1 being made of the conductive paste as described in any one of the above.
Specifically, as shown in fig. 2 and 3, the wearable electronic circuit includes: a liquid metal line 1, the liquid metal line 1 being located on the skin; the power supply 2 and the at least one element 3 are connected, the power supply 2 and the at least one element 3 are connected with the liquid metal circuit 1, and the power supply 2, the liquid metal circuit 1 and the at least one element 3 form a closed loop; and the packaging layer 4 is covered on the liquid metal circuit 1, the power supply 2 and the at least one element 3.
The power supply 2, the liquid metal circuit 1 and the at least one element 3 form a closed loop, so that the wearable electronic circuit has corresponding functions, and the packaging layer 4 is used for effectively packaging the liquid metal circuit 1, the power supply 2 and the at least one element 3, and is favorable for improving the structural stability of the wearable electronic circuit.
The wearable electronic circuit can be located at any possible position of the user's hand, arm, face, leg, foot, etc., and can be selected by one skilled in the art according to actual needs.
When the wearable electronic circuit is manufactured, the wearable position of the wearable electronic circuit is determined firstly, then the liquid metal circuit 1 is manufactured by using the conductive slurry on the skin corresponding to the wearable position, the power supply 2 and the at least one element 3 are attached, then the packaging layer 4 is formed, the liquid metal circuit 1, the power supply 2 and the at least one element 3 are packaged, and the manufacturing of the wearable electronic circuit can be completed.
Before the conductive paste is used for manufacturing the liquid metal circuit 1, an isolation layer can be formed on the skin corresponding to the wearing position, and the isolation layer has biocompatibility and can be adhered with the liquid metal. The setting of isolation layer can be so that when making liquid metal circuit on human skin, liquid metal can not direct contact human skin, can not cause the injury to human skin, and the security is higher. The isolation layer may be a single layer structure or a multi-layer structure, for example, when the isolation layer is a double-layer structure, the bottom layer (the layer contacting the skin) is a film layer with good biocompatibility, and the top layer (the layer contacting the liquid metal) is a film layer capable of adhering the liquid metal and the packaging layer.
The wearable electronic circuit can be used as a cultural creative product, a makeup product, a personality device, a teaching aid, a monitoring circuit, an alarm circuit and the like, and is a gospel of an electronic enthusiast, a digital DIY enthusiast, a popular science educator, a fashion pursuit, an electronic research and development staff and the like.
In addition, an embodiment of the present invention provides a wearable electronic circuit DIY kit, including: the hand-painting kit comprises a brush and the conductive paste.
The hand-drawing kit may further include a liquid metal writing pen, and/or a stamp capable of transferring liquid metal.
The DIY kit may further include one or more of a patch kit, a packaging kit, a smear kit, and a modification kit; wherein the attachment kit comprises an attachment tool, a power source, and at least one component; the packaging kit comprises a container containing packaging material and a packaging tool; the smearing kit comprises a container containing an isolation material and a plurality of smearing tools, wherein if the isolation material is various, the smearing tools are also required to be provided; the modification kit includes a liquid metal erase pen that can erase the excess liquid metal lines.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The conductive paste is characterized by consisting of gallium-based liquid metal, viscosity adjusting filler and conductive filler; the conductive slurry comprises, by weight, 4% -10% of viscosity adjusting filler, 4% -10% of conductive filler and the balance gallium-based liquid metal; the viscosity adjusting filler is one or more of iron powder, nickel powder and iron-nickel powder, and the conductive filler is silver-coated copper powder.
2. The conductive paste according to claim 1, wherein the gallium-based liquid metal is elemental gallium, or a gallium-indium eutectic alloy, or a gallium-indium-tin eutectic alloy.
3. The electroconductive paste according to claim 1, wherein the viscosity-adjusting filler is iron-nickel powder, and the electroconductive paste comprises 5% of the viscosity-adjusting filler.
4. The electroconductive paste according to claim 1, wherein said viscosity-adjusting filler is nickel powder, and said electroconductive paste comprises 4% of viscosity-adjusting filler.
5. The electroconductive paste according to claim 3 or 4, wherein the electroconductive paste comprises 5% of the electroconductive filler.
6. The conductive paste as claimed in claim 1, wherein the viscosity-adjusting filler has a particle size of 1 to 5 μm.
7. The conductive paste as claimed in claim 1, wherein the conductive filler has a particle size of 1 to 5 μm.
8. A preparation method of the conductive paste, which is used for preparing the conductive paste as claimed in any one of claims 1 to 7, and is characterized by comprising the following steps:
weighing gallium-based liquid metal, viscosity adjusting filler and conductive filler according to the weight percentage;
and uniformly mixing the gallium-based liquid metal, the viscosity adjusting filler and the conductive filler by a ball milling or kneading process to obtain the conductive slurry.
9. A wearable electronic circuit, comprising:
a liquid metal wire on human skin, the liquid metal wire being made of the conductive paste according to any one of claims 1 to 7.
10. A DIY kit of wearable electronic circuits, comprising: a hand-drawing kit comprising a brush and the conductive paste of any one of claims 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910052236.2A CN111462934B (en) | 2019-01-18 | 2019-01-18 | Conductive paste, preparation method thereof, wearable electronic circuit and DIY (digital image processing) suite thereof |
| PCT/CN2019/130073 WO2020147571A1 (en) | 2019-01-18 | 2019-12-30 | Conductive paste and preparation method therefor, and wearable electronic circuit and diy kit thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910052236.2A CN111462934B (en) | 2019-01-18 | 2019-01-18 | Conductive paste, preparation method thereof, wearable electronic circuit and DIY (digital image processing) suite thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111462934A true CN111462934A (en) | 2020-07-28 |
| CN111462934B CN111462934B (en) | 2021-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910052236.2A Active CN111462934B (en) | 2019-01-18 | 2019-01-18 | Conductive paste, preparation method thereof, wearable electronic circuit and DIY (digital image processing) suite thereof |
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| CN (1) | CN111462934B (en) |
| WO (1) | WO2020147571A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020147571A1 (en) | 2020-07-23 |
| CN111462934B (en) | 2021-06-01 |
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