CN111459252B - Control method and device and electronic equipment - Google Patents
Control method and device and electronic equipment Download PDFInfo
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- CN111459252B CN111459252B CN202010245513.4A CN202010245513A CN111459252B CN 111459252 B CN111459252 B CN 111459252B CN 202010245513 A CN202010245513 A CN 202010245513A CN 111459252 B CN111459252 B CN 111459252B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The application discloses a control method, a control device and electronic equipment, wherein the control method comprises the following steps: obtaining at least two first temperature values using at least two temperature sensors disposed at least two first locations of the electronic device; the first positions and the corresponding heating devices have a first distance, the first positions and the target area of the electronic equipment shell have a second distance, and the first distance is smaller than the second distance; processing the at least two first temperature values to obtain a second temperature value, wherein the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance; and controlling a heat dissipation device of the electronic equipment at least based on the second temperature value.
Description
Technical Field
The present disclosure relates to the field of device control technologies, and in particular, to a control method, an apparatus, and an electronic device.
Background
In the heat dissipation control of an electronic device, the fan is generally controlled in wind speed based on a temperature value of a heat generation source.
However, when the user uses the electronic device, the user directly contacts a position or area which is not the heat source but is a certain distance from the heat source, and the heat of the heat source needs to be transferred to the user contact area for a certain period of time, so there is a case that the heat sensed by the user is not matched with the heat dissipation control of the electronic device.
Disclosure of Invention
In view of this, the present application provides a control method, a control device, and an electronic device, including:
a control method, comprising:
obtaining at least two first temperature values using at least two temperature sensors disposed at least two first locations of the electronic device; the first positions and the corresponding heating devices have a first distance, the first positions and the target area of the electronic equipment shell have a second distance, and the first distance is smaller than the second distance;
processing the at least two first temperature values to obtain a second temperature value, wherein the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance;
And controlling a heat dissipation device of the electronic equipment at least based on the second temperature value.
In the above method, preferably, the target area is a first area corresponding to an input device on the electronic device housing;
and/or the number of the groups of groups,
the target area is a second area on the electronic device housing that is in contact with a target that maintains the stability of the electronic device.
The above method, preferably, further comprises:
acquiring sensing parameters acquired by a first sensor and a second sensor in the electronic equipment; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal or not, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state or not;
in a case where the sensing parameter collected by the first sensor characterizes the input device to receive an input signal and the sensing parameter collected by the second sensor characterizes the electronic device in a non-motion state, the second temperature value characterizes a temperature value at a second position having the third distance from the first region, so that the second temperature value is used for controlling a heat dissipating device of the electronic device;
And under the condition that the sensing parameters acquired by the first sensor indicate that the input device does not receive an input signal and the sensing parameters acquired by the second sensor indicate that the electronic equipment is in a motion state, the second temperature value indicates a temperature value at a second position with the third distance from the second area, so that the second temperature value is used for controlling a heat dissipation device of the electronic equipment.
In the above method, preferably, in a case where the sensing parameter collected by the first sensor indicates that the input device receives the input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in a motion state, the second temperature value includes: characterizing a first target temperature value at a second location having the third distance from the first region and characterizing a second target temperature value at a second location having the third distance from the second region;
wherein, based on at least the second temperature value, control the heat dissipating device of the electronic device, including:
and controlling the heat dissipation device of the electronic equipment at least according to the first target temperature value and the second target temperature value.
In the above method, preferably, controlling the heat dissipating device of the electronic device according to the first target temperature value and the second target temperature value includes:
and controlling the heat dissipation device of the electronic equipment based on the target temperature value meeting the control condition in the first target temperature value and the second target temperature value.
Preferably, the method further comprises the step of processing the at least two first temperature values to obtain a second temperature value, including:
processing the at least two first temperature values by using a temperature conversion algorithm to obtain a second temperature value;
the temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the association relation between the first position and the second position.
The above method, preferably, further comprises:
obtaining a plurality of conversion parameters corresponding to the incidence relation in a parameter set according to the incidence relation between the first position and the second position;
wherein the conversion parameters in the parameter set are obtained by:
obtaining at least two first historical temperature values at the first location and a second historical temperature value at the second location at any one of a plurality of times;
And obtaining conversion parameters from the at least two first historical temperature values to the second historical temperature value according to the at least two first historical temperature values and the second historical temperature value.
In the above method, preferably, controlling the heat dissipating device of the electronic device at least based on the second temperature value includes:
controlling the heat dissipation parameters of the heat dissipation device of the electronic equipment to be matched with the second temperature value;
or alternatively, the process may be performed,
controlling a heat sink of the electronic device based at least on the second temperature value, comprising:
controlling a heat dissipation parameter of a heat dissipation device of the electronic equipment to be a first parameter under the condition that the second temperature value is larger than a temperature threshold value;
and controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a second parameter under the condition that the second temperature value is smaller than or equal to the temperature threshold value.
A control apparatus comprising:
a temperature acquisition unit for obtaining at least two first temperature values by using at least two temperature sensors arranged at least two first positions of the electronic equipment; the first positions and the corresponding heating devices have a first distance, the first positions and the target area of the electronic equipment shell have a second distance, and the first distance is smaller than the second distance;
The temperature processing unit is used for processing the at least two first temperature values to obtain a second temperature value, and the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance;
and the heat dissipation control unit is used for controlling the heat dissipation device of the electronic equipment at least based on the second temperature value.
An electronic device, comprising:
a housing having a target area thereon;
at least two heat generating devices;
the heat dissipation device is used for dissipating heat of the heating device;
the at least two temperature sensors are arranged at least two first positions of the electronic equipment and are used for acquiring first temperature values at the first positions, wherein the first positions and the corresponding heating devices have a first distance, the first positions and the target area have a second distance, and the first distance is smaller than the second distance;
the controller is used for obtaining at least two first temperature values, processing the at least two first temperature values to obtain a second temperature value, and the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance; and controlling the heat dissipation device at least based on the second temperature value.
According to the control method, the device and the electronic equipment, the first temperature value at the first position corresponding to the heating device is used for generating the second temperature value at the second position corresponding to the target area of the shell, and then the heat dissipation device is accurately controlled based on the second temperature value relatively close to the target area of the shell, namely the heat dissipation device is controlled according to the temperature value at the position corresponding to the perceived target area, so that the control effect that the temperature perceived by a user of the electronic equipment is matched with the heat dissipation state of the heat dissipation device is formed, and the use experience of the user on the electronic equipment is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of notebook heat dissipation;
FIG. 2 is a flow chart of a control method according to a first embodiment of the present disclosure;
FIGS. 3-9 are respectively exemplary diagrams of embodiments of the present application;
FIG. 10 is a partial flow chart of a control method according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of a control device according to a second embodiment of the present disclosure;
fig. 12 is another schematic structural diagram of a control device according to a second embodiment of the present disclosure;
fig. 13 is a schematic structural diagram of an electronic device according to a third embodiment of the present application.
Detailed Description
Taking the heat dissipation control of a notebook as an example, as shown in fig. 1, a heat generating device such as a Central Processing Unit (CPU) and a graphics processing unit (GPU, graphicsProcessingUnit) is contained in the notebook, and in order to enable normal operation of functions of the notebook, such as video viewing, document editing, video conferencing, etc., a heat dissipating device such as a fan or a heat sink is generally required to be installed for the heat generating device.
When the heat dissipation control is specifically implemented, a temperature sensor such as a thermometer is generally configured for the heating device, and then after the temperature value around the heating device is acquired, the heat dissipation parameter of the heat dissipation device such as the rotation speed of a fan or the flow speed of a heat dissipation medium is controlled according to the temperature value, so that the purpose of heat dissipation is achieved.
However, when the user uses the electronic device, the user directly contacts a location or area other than the heat generating device itself, but rather a distance from the heat generating device, such as a palm rest area of a keyboard attachment on a notebook, the user's palm or wrist directly contacts the bottom of the notebook, and the user's legs directly contact the bottom, rather than the processor. However, the heat of the heat generating device is transferred to the area contacted by the user for a certain period of time, so there are situations that the heat generation perceived by the user is not matched with the heat dissipation control effect of the electronic device due to the delay of heat transfer, for example, in the process of performing heat dissipation control on the notebook, the user perceives that the notebook does not reach high temperature yet and the high-speed operation noise of the notebook fan is large (the heat generating device heats up but is not transferred to the user contact area yet), and for example, the user perceives that the notebook is at high temperature and the notebook fan is not operated at high speed any more (the temperature of the heat generating device is reduced but the temperature of the user contact area is not reduced yet), so that poor use experience is caused to the user in such a heat dissipation scheme.
To solve the above problems, the inventors of the present application have further studied to find: after electronic equipment such as a notebook computer leaves the factory, the distances between various heating devices in the corresponding electronic equipment and the shell of the electronic equipment and the heat transfer medium related between the heating devices are fixed, so that the time delay of the heat emitted by the heating devices to reach the shell and the temperature change state generated by the shell are regular, and the inventor of the application proposes a control scheme capable of controlling the heat radiating device of the electronic equipment, and at least two first temperature values are obtained by utilizing at least two temperature sensors arranged at least two first positions of the electronic equipment; the first positions and the corresponding heating devices have a first distance, the first positions and the target area of the electronic equipment shell have a second distance, and the first distance is smaller than the second distance; then, at least two first temperature values are processed to obtain a second temperature value, and the second temperature value represents a temperature value at a second position of the electronic equipment; the second position has a third distance from the target area, and the third distance is smaller than the second distance; and further controlling the heat sink of the electronic device based on at least the second temperature value.
That is, the control scheme of the present application is to generate the second temperature value at the second position corresponding to the target area of the housing by using the first temperature value at the first position corresponding to the heat generating device, and then accurately control the heat dissipating device based on the second temperature value relatively close to the target area of the housing, that is, control the heat dissipating device according to the temperature value at the position corresponding to the target area that will be perceived by the user, thereby forming a control effect that the perceived temperature of the device by the user matches with the heat dissipating state of the heat dissipating device, for example, if the temperature value perceived by the user at the target area is higher, control the fan to operate at a high speed, and if the temperature value perceived by the user at the target area is not higher, control the fan to operate at a low speed, thereby improving the user experience.
In a specific implementation, the target area of the housing is an area on the first side and/or the second side of the housing, and the first side is opposite the second side. For example, the target area may be a first area on the electronic device housing corresponding to the input means, i.e. an area on the first side; and/or the target area may be a second area on the electronic device housing that is in contact with an object that maintains the stability of the electronic device, i.e., an area on the second side.
Based on the implementation, in the technical scheme of the application, the mode of controlling the heat dissipation device can be selected based on the sensing parameters acquired by the first sensor and the second sensor in the electronic equipment; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal or not, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state or not;
for example, in a case where the sensed parameter collected by the first sensor indicates that the input device receives the input signal and the sensed parameter collected by the second sensor indicates that the electronic device is in a non-moving state, the second temperature value indicates a temperature value at a second location having a third distance from the first area, such that the second temperature value is used to control a heat dissipating device of the electronic device;
when the sensing parameter collected by the first sensor represents that the input device does not receive an input signal and the sensing parameter collected by the second sensor represents that the electronic equipment is in a motion state, the second temperature value represents a temperature value at a second position with a third distance from the second area, so that the second temperature value is used for controlling the heat radiating device of the electronic equipment;
In addition, in a case where the sensed parameter collected by the first sensor characterizes the input device receiving the input signal and the sensed parameter collected by the second sensor characterizes the electronic device in a motion state, the second temperature value includes: characterizing a first target temperature value at a second location having a third distance from the first region and characterizing a second target temperature value at a second location having a third distance from the second region;
accordingly, in the present application, when controlling the heat dissipating device of the electronic device based on at least the second temperature value, the method specifically includes:
the heat sink of the electronic device is controlled at least in accordance with the first target temperature value and the second target temperature value, for example, the heat sink of the electronic device is controlled based on the first target temperature value and the second target temperature value satisfying a control condition such as a higher or lower target temperature value.
In one implementation manner, in the technical scheme of the application, at least two first temperature values can be processed by using a temperature conversion algorithm to obtain a second temperature value; the temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the association relation between the first position and the second position. And the association relationship includes: a spatial distance between the first location and the second location and/or a spatial medium.
Based on the above, in the technical solution of the present application, according to the association relationship between the first position and the second position, a plurality of conversion parameters corresponding to the association relationship may be obtained in the parameter set;
and the scaling parameters in the parameter set may be obtained by:
obtaining at least two first historical temperature values at a first location and a second historical temperature value at a second location at any one of a plurality of times; and obtaining conversion parameters for converting the at least two first historical temperature values to the second historical temperature values according to the at least two first historical temperature values and the second historical temperature values.
In a specific implementation, controlling the heat dissipating device of the electronic device based on at least the second temperature value includes: controlling the heat dissipation parameters of the heat dissipation device of the electronic equipment to be matched with the second temperature value;
or, in another implementation, controlling the heat dissipation device of the electronic device based on at least the second temperature value includes: controlling a heat dissipation parameter of a heat dissipation device of the electronic equipment to be a first parameter under the condition that the second temperature value is larger than the temperature threshold value; and controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a second parameter under the condition that the second temperature value is smaller than or equal to the temperature threshold value.
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 2, a flowchart of a control method according to an embodiment of the present application is provided, where the method is applicable to an electronic device having a heat generating device and a heat dissipating device, such as a mobile phone, a pad, or a notebook. The technical scheme in the embodiment is mainly used for improving the heat dissipation control effect on the electronic equipment.
In a specific implementation, the control method in this embodiment may include the following steps:
step 201: at least two first temperature values are obtained with at least two temperature sensors arranged at least two first locations of the electronic device.
Wherein the first location has a first distance from the respective corresponding heat generating device, as shown in fig. 3, and the first location a has a second distance from the target area M of the electronic device housing, the first distance being smaller than the second distance. That is, the temperature sensor is disposed at a first position closer to the corresponding heat generating device, based on which, in the present embodiment, the temperature near the heat generating device is collected to obtain a first temperature value corresponding to each heat generating device, which may be regarded as the current temperature value of the heat generating device.
It should be noted that, in this embodiment, a temperature sensor is configured for each heat generating device, and a first distance is provided between each temperature sensor and its corresponding heat generating device.
Step 202: and processing at least two first temperature values to obtain a second temperature value.
The second temperature value represents a temperature value at a second location of the electronic device, where the second location has a third distance from the target area, and the third distance is smaller than the second distance, as shown in fig. 3, in this embodiment, according to the first temperature value corresponding to the heat generating device, the second temperature value at a location closer to the target area of the housing is obtained, that is, the distance from the target area is smaller than the temperature value at a second location B of the target area and the first location, where the second temperature value is closer to the temperature value of the target area M that may be contacted.
Step 203: and controlling the heat dissipation device of the electronic equipment at least based on the second temperature value.
The heat dissipating device may be a fan, a heat sink, or a liquid heat dissipating device in an electronic apparatus, and may dissipate heat from a heat generating device. Based on the above implementation, in this embodiment, the second temperature value that is closer to the target area that may be contacted is used as the reference data for heat dissipation control, and the heat dissipation parameters such as the rotation speed of the fan, the vibration amplitude and the frequency of the heat sink, or the flow rate of the heat dissipation medium in the liquid heat dissipation device are correspondingly adjusted according to the second temperature value, so that the heat perception on the target area is matched with the heat dissipation state of the heat dissipation device on the basis of implementing the heat dissipation of the heat dissipation device to the heat dissipation device. For example, if the temperature value perceived by the user on the target area is high, the fan is controlled to operate at a high speed, and if the temperature value perceived by the user on the target area is not high, the fan is controlled to operate at a low speed.
As can be seen from the foregoing, in the control method provided in the first embodiment of the present application, the first temperature value at the first position corresponding to the heating device is used to generate the second temperature value at the second position corresponding to the target area of the housing, and then the heat dissipation device is accurately controlled based on the second temperature value relatively close to the target area of the housing, that is, the heat dissipation device is controlled according to the temperature value at the position corresponding to the target area that can be perceived, so as to form a control effect that the temperature perceived by the user of the electronic device matches with the heat dissipation state of the heat dissipation device, thereby improving the use experience of the user on the electronic device.
In a specific implementation, the target area may be any area on the housing that may be contacted, and specifically, the target area may be an area on a first side and/or a second side of the housing, where the first side is opposite to the second side, and a heating device, a temperature sensor, a heat dissipating device, and other devices of the electronic device are located between the first side and the second side. For example:
in one case, the target area on the housing may be a first area on the housing of the electronic device corresponding to the input device, as shown in fig. 4, where the input device may be a keyboard or a touch screen, and the first area is an area that a user may contact when performing an input operation using the input device, such as a palm rest area, and based on this, the second temperature value obtained in the embodiment is a temperature value at a second position close to the first area;
In another case, the target area on the housing may be a second area on the housing of the electronic device that is in contact with a target that maintains the stability of the electronic device. As shown in fig. 5, the object for maintaining the stability of the electronic device refers to an object that can fix or relatively stably place the electronic device in a certain area or position, such as a desktop or a leg, and the second area is an area where the electronic device is contacted after the user places the electronic device when using the electronic device, such as a D-side area of a notebook or a back-side area of a pad. Based on this, the second temperature value obtained in the present embodiment is a temperature value at a second position close to the second region.
In another case, the target area on the housing may include two or more areas, for example, the target area includes a first area on the housing of the electronic device corresponding to the input device and a second area on the housing of the electronic device contacting with the object for maintaining stability of the electronic device, as shown in fig. 6, and based on this, the second temperature value obtained in the present embodiment includes a temperature value at a second location close to the first area and a temperature value at a second location close to the second area.
Based on the above several cases, in the embodiment, when the heat dissipation control is specifically implemented, the corresponding sensing parameters may also be obtained by using the sensors configured in the electronic device. For example, a sensing parameter acquired by a first sensor and a sensing parameter acquired by a second sensor are obtained, wherein the first sensor may be a sensor configured for an input device in an electronic apparatus, such as a capacitive sensor, for monitoring whether the input device is subjected to an input operation, such as a user typing in text, and the sensing parameter acquired by the first sensor may be indicative of whether the input device receives an input signal, and the second sensor may be a gravity sensor or an acceleration sensor, etc., for monitoring whether the electronic apparatus is in a motion state, such as a notebook being placed on a leg of a person, and the sensing parameter acquired by the second sensor may be indicative of whether the electronic apparatus is in a motion state. Then, the specific heat dissipation control mode is determined by judging the states characterized by the sensing parameters, and the specific heat dissipation control mode is as follows:
in one implementation, when the sensing parameter collected by the first sensor indicates that the input device receives the input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in a non-motion state, the second temperature value indicates a temperature value at a second position having a third distance from the first region, so that the second temperature value is used for controlling the heat dissipating device of the electronic device. That is, when it is monitored that the input device on the electronic apparatus is input and the electronic apparatus is in a relatively stationary state, it is indicated that a user of the electronic apparatus may perform a keyboard input operation when the electronic apparatus is placed on a relatively stationary desktop, and in this embodiment, a first area corresponding to the input device is taken as a target area of the housing, and a second temperature value at a second position close to the first area is correspondingly taken as reference data to control the heat dissipation device of the electronic apparatus. For example, as shown in fig. 7, the target area is a palm rest area corresponding to a keyboard on the C-plane of the notebook computer, and in this embodiment, the target area is processed based on a first temperature value acquired by a temperature sensor at a first position to obtain a second temperature value at a second position close to the palm rest area, and then the heat dissipation device is controlled based on the second temperature value at the position close to the palm rest area, so as to form a control effect that the temperature sensed by a wrist of a user performing an input operation by using the keyboard is matched with the heat dissipation state of the heat dissipation device;
In another implementation, in a case where the sensing parameter collected by the first sensor indicates that the input device does not receive the input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in a motion state, the second temperature value indicates a temperature value at a second position having a third distance from the second area, so that the second temperature value is used to control the heat dissipating device of the electronic device. That is, when it is monitored that the input device on the electronic device is not operated and the electronic device is in a state of relative motion, it is indicated that the user of the electronic device may perform operations such as video playing or image browsing on the bottom of the electronic device, such as placing the electronic device on the leg (unstable, jerky) or holding the electronic device by the hand, where no input operation is performed on the input device, in this embodiment, a second area where the object for maintaining stability of the electronic device, such as a leg, is taken as a target area of the housing, and a second temperature value at a second position near the second area is correspondingly taken as reference data, so as to control the heat dissipation device of the electronic device. For example, as shown in fig. 8, the target area is the bottom area of the D-surface of the notebook computer, and in this embodiment, the processing is performed based on the first temperature value acquired by the temperature sensor at the first position to obtain the second temperature value at the second position close to the bottom area, and then the heat dissipating device is controlled based on the second temperature value at the position close to the bottom area, so as to form a control effect that the temperature sensed by the user's legs for stably supporting the notebook computer for video viewing with the legs matches with the heat dissipating state of the heat dissipating device.
In another implementation, where the sensed parameter collected by the first sensor characterizes the input device as receiving the input signal and the sensed parameter collected by the second sensor characterizes the electronic device as being in motion, the second temperature value comprises: a first target temperature value at a second location having a third distance from the first region is characterized and a second target temperature value at a second location having a third distance from the second region is characterized.
It should be noted that, the first target temperature value and the second target temperature value may be different due to the different corresponding second positions, and the spatial distance between the corresponding second positions and the heat generating device may be different due to the different spatial mediums, i.e., heat transfer mediums, between the corresponding second positions and the heat generating device, and thus the first target temperature value and the second target temperature value obtained in the embodiment may be different. Taking a notebook as an example, if a heating device such as a processor in the notebook structure is close to a housing on one side of the input device, a first target temperature value at a second position close to the first area is generally higher than a second target temperature value at a second position close to the second area; alternatively, if the input device has a slit structure in the notebook result, a certain heat dissipation effect can be achieved, then the first target temperature value at the second position near the first area is generally lower than the second target temperature value at the second position near the second area.
Based on this, step 203 in this embodiment is specifically implemented when controlling the heat dissipating device of the electronic device based on at least the second temperature value by:
and controlling the heat dissipation device of the electronic equipment at least according to the first target temperature value and the second target temperature value.
For example, in this embodiment, the first target temperature value and the second target temperature are comprehensively considered, and the heat dissipating device of the electronic device is controlled based on the target temperature value satisfying the control condition in the first target temperature value and the second target temperature value.
That is, in this embodiment, when it is monitored that the input device on the electronic apparatus is input and the electronic apparatus is in a state of relative motion, it is indicated that the user of the electronic apparatus may place the electronic apparatus on the leg and input the input device, and in this embodiment, the first area corresponding to the input device and the second area where the object for maintaining stability of the electronic apparatus, such as the leg, are taken as the target area of the housing together, and accordingly, in this embodiment, the first target temperature value at the second position close to the first area and the second target temperature value at the second position close to the second area are taken as the reference data together to control the heat dissipating device of the electronic apparatus. For example, as shown in fig. 9, the target area includes both a palm rest area corresponding to the keyboard on the C-face of the notebook computer and a bottom area of the D-face of the notebook computer, and in this embodiment, the target area is processed based on a first temperature value acquired by the temperature sensor at a first position to obtain a first target temperature value at a second position close to the palm rest area and a second target temperature value at a second position close to the bottom area, and then the heat dissipation device is controlled based on the first target temperature value and the second target temperature value, so as to form a control effect that the temperature sensed by the legs and wrists of the user for stably supporting the notebook computer for keyboard input matches with the heat dissipation state of the heat dissipation device.
In a specific implementation, in this embodiment, a temperature value satisfying a control condition is selected from a first target temperature value and a second target temperature value to control the heat dissipation device, as follows:
if the control conditions are: if the first target temperature value is selected, the control condition may indicate that the heat dissipation control effect perceived by the user on the first area needs to be improved, and if the first target temperature value of the two target temperature values is selected to perform heat dissipation control on the heat dissipation device in this embodiment.
If the control conditions are: and selecting a second target temperature value, wherein the control condition may indicate that the heat dissipation control effect perceived by the user on the second area needs to be improved, and selecting the second target temperature value of the two target temperature values to perform heat dissipation control on the heat dissipation device in the embodiment.
Or:
if the control conditions are: the control condition may indicate that the sensitivity of the heat dissipation control needs to be improved and the heat dissipation effect is enhanced, because the high target temperature value is selected as the reference data of the heat dissipation device, the easily-raised target temperature value can firstly meet the heat dissipation condition of the heat dissipation device, for example, is higher than the heat dissipation threshold, and the heat dissipation control is performed on the heat dissipation device at the moment, thereby achieving the purposes of improving the sensitivity of the heat dissipation control and enhancing the heat dissipation effect;
If the control conditions are: if a lower target temperature value is selected, the control condition may indicate that the load of the heat dissipating device needs to be reduced, because if the lower target temperature value is selected as the reference data of the heat dissipating device, the target temperature value which is not easy to rise may later meet the heat dissipating condition of the heat dissipating device, for example, the heat dissipating device is only controlled until the target temperature value which is not easy to rise rises to the heat dissipating threshold value, thereby achieving the purpose of reducing the load of the heat dissipating device.
In one implementation, in step 202 of the present embodiment, when processing at least two first temperature values to obtain a second temperature value, a temperature scaling algorithm may be used to process at least two first temperature values to obtain the second temperature value.
The temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the association relation between the first position and the second position. Based on this, in the practical implementation of the present embodiment, a plurality of conversion parameters corresponding to the association relationship may be obtained in the parameter set according to the association relationship between the first position and the second position.
The association relationship means: the spatial distance and/or the spatial medium between the first and the second location, that is to say the conversion parameter is related to the distance and/or the medium of the space between the first and the second location where heat conduction is possible, the spatial distance between the first and the second location being different and/or the spatial medium being different between the first and the second location, the corresponding conversion parameter being different.
And the scaled parameters in the parameter set are obtained as shown in fig. 10 by:
step 1001: at least two first historical temperature values at a first location and a second historical temperature value at a second location at any one of a plurality of times are obtained.
That is, in this embodiment, the historical temperature data generated by testing the electronic device may be obtained in advance, so as to obtain multiple sets of temperature data, where each set of temperature data includes at least two first historical temperature values at a first position at a corresponding moment and a second historical temperature value at a second position at the moment.
In particular, in this embodiment, the temperature detection may be performed on the electronic device by using devices such as an infrared camera at multiple times within an hour or other durations, so as to obtain the multiple sets of temperature data.
Step 1002: and obtaining conversion parameters for converting the at least two first historical temperature values to the second historical temperature values according to the at least two first historical temperature values and the second historical temperature values.
In this embodiment, the conversion parameter in the conversion from the first historical temperature value to the second historical temperature value may be obtained by performing the corresponding relation analysis on the first historical temperature value and the second historical temperature value.
In a specific implementation, the present embodiment may preset a multiple equation by using a regression algorithm, for example, a multiple equation using x1, x2, etc. as independent variables and y as dependent variables, initialize coefficients and constants of respective variables in the multiple equation, and then substitute at least two first historical temperature values and second historical temperature values in each set of temperature data as independent variables x1, x2, etc. and dependent variables y into the multiple equation, and optimize coefficients and constants in the multiple equation until they tend to be unchanged, thereby obtaining coefficients and constants of the optimized multiple equation, that is, conversion parameters.
Based on this, in this embodiment, a multi-element equation, that is, a temperature scaling algorithm may be constructed based on this scaling parameter, and when the second temperature value is obtained, the obtained at least two first temperature values may be input as independent variables into a multi-element equation having optimized coefficients and constants, and then the multi-element equation is calculated, so as to obtain an output result of the multi-element equation, that is, the second temperature value.
It should be noted that, the number of the first historical temperature values is consistent with the number of the independent variables in the multiple equation, and the number of the first temperature values is also consistent with the number of the independent variables in the multiple equation.
In a specific implementation, when controlling the heat dissipating device of the electronic device based on at least the second temperature value, step 203 of this embodiment may be specifically implemented in the following different ways:
in one implementation, in this embodiment, a heat dissipation parameter of a heat dissipation device of the electronic device may be controlled to match the second temperature value; specifically, a parameter list including a plurality of standard parameters may be set in advance for the heat dissipation device, where each standard parameter corresponds to a temperature threshold, in this embodiment, after the second temperature value is obtained, the standard parameter matched with the second temperature value is obtained through table lookup, so as to control the current heat dissipation parameter of the heat dissipation device to be consistent with the standard parameter.
For example, in this embodiment, a linear matching list is set for the fan of the notebook computer, and then according to each standard rotation speed parameter in the linear matching list, the current rotation speed of the fan is controlled to be consistent with the standard rotation speed parameter matched with the second temperature value, the higher the second temperature value is, the larger the corresponding standard rotation speed parameter is, and the larger the rotation speed of the corresponding fan is adjusted, so that the linear control of the heat dissipating device is realized.
In another implementation, in this embodiment, when the second temperature value is greater than the temperature threshold value, the heat dissipation parameter of the heat dissipation device of the electronic device may be controlled to be the first parameter; and when the second temperature value is smaller than or equal to the temperature threshold value, controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be the second parameter, wherein the heat dissipation effect of the heat dissipation device under the first parameter is higher than that of the heat dissipation device under the second parameter, for example, the heat dissipation effect of the fan under the rotating speed parameter of 200 revolutions per second is better than that of the fan under the rotating speed parameter of 100 revolutions per second. That is, in this embodiment, a temperature threshold and a standard parameter related to the temperature threshold are set in advance for the heat dissipating device, and in this embodiment, after the second temperature value is obtained, if the second temperature value has exceeded the temperature threshold, the current heat dissipating parameter of the heat dissipating device is controlled to be a corresponding first parameter, so as to enhance the heat dissipating effect by determining the magnitude between the second temperature value and the temperature threshold; and if the second temperature value is still smaller than the temperature threshold value, controlling the current heat dissipation parameter of the heat dissipation device to be a corresponding second parameter so as to reduce the load of the heat dissipation device.
For example, in this embodiment, a threshold of 37 degrees is set for the fan of the notebook, and according to the threshold, the fan is controlled to perform heat dissipation at a high or low rotation speed, if the temperature is higher than 37 degrees, the fan is controlled to operate at a high rotation speed to enhance heat dissipation, and if the temperature is lower than 37 degrees, the fan is controlled to operate at a low rotation speed to reduce the energy consumption of the fan and reduce the load.
Referring to fig. 11, a schematic structural diagram of a control device according to a second embodiment of the present application is provided, where the control device may be configured in an electronic device having a heat generating device and a heat dissipating device, such as a mobile phone, a pad, or a notebook. The technical scheme in the embodiment is mainly used for improving the heat dissipation control effect on the electronic equipment.
In a specific implementation, the control device in this embodiment may include the following structure:
a temperature acquisition unit 1101 for obtaining at least two first temperature values using at least two temperature sensors disposed at least two first locations of the electronic device; the first positions and the corresponding heating devices have a first distance, the first positions and the target area of the electronic equipment shell have a second distance, and the first distance is smaller than the second distance;
A temperature processing unit 1102, configured to process at least two first temperature values to obtain a second temperature value, where the second temperature value represents a temperature value at a second location of the electronic device; the second position has a third distance from the target area, and the third distance is smaller than the second distance;
the heat dissipation control unit 1103 is configured to control a heat dissipation device of the electronic device based on at least the second temperature value.
As can be seen from the above, in the control device provided in the second embodiment of the present application, the first temperature value at the first position corresponding to the heating device is used to generate the second temperature value at the second position corresponding to the target area of the housing, and then the heat dissipation device is accurately controlled based on the second temperature value relatively close to the target area of the housing, that is, the heat dissipation device is controlled according to the temperature value at the position corresponding to the target area that can be perceived, so as to form a control effect that the temperature perceived by the user of the electronic device is matched with the heat dissipation state of the heat dissipation device, thereby improving the use experience of the user on the electronic device.
In a specific implementation, the target area is a first area corresponding to the input device on the electronic equipment shell; and/or the target area is a second area which is contacted with a target for maintaining the stability of the electronic equipment on the electronic equipment shell.
In one implementation, the apparatus in this embodiment may further include the following structure, as shown in fig. 12:
a parameter obtaining unit 1104, configured to obtain sensing parameters acquired by the first sensor and the second sensor in the electronic device; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal or not, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state or not;
in a case where the sensing parameter collected by the first sensor indicates that the input device receives an input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in a non-motion state, the second temperature value indicates a temperature value at a second position having the third distance from the first region, so that the heat dissipation control unit 1103 controls the heat dissipation device of the electronic device with the second temperature value;
when the sensing parameter collected by the first sensor indicates that the input device does not receive an input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in a motion state, the second temperature value indicates a temperature value at a second position having the third distance from the second area, so that the heat dissipation control unit 1103 controls the heat dissipation device of the electronic device with the second temperature value.
In the case where the sensing parameter collected by the first sensor characterizes the input device receiving an input signal and the sensing parameter collected by the second sensor characterizes the electronic device in a motion state, the second temperature value includes: characterizing a first target temperature value at a second location having the third distance from the first region and characterizing a second target temperature value at a second location having the third distance from the second region;
the heat dissipation control unit 1103 specifically is configured to: and controlling the heat dissipation device of the electronic equipment at least according to the first target temperature value and the second target temperature value. For example, the heat sink of the electronic device is controlled based on a target temperature value satisfying a control condition among the first target temperature value and the second target temperature value.
In a specific implementation, the temperature processing unit 1102 processes the at least two first temperature values to obtain a second temperature value specifically for: processing the at least two first temperature values by using a temperature conversion algorithm to obtain a second temperature value; the temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the association relation between the first position and the second position.
In one implementation, the apparatus in this embodiment may further include the following structure, as shown in fig. 12:
a parameter processing unit 1105, configured to obtain, in a parameter set, the plurality of conversion parameters corresponding to the association relationship according to the association relationship between the first position and the second position;
the parameter processing unit 1105 is further configured to: obtaining at least two first historical temperature values at the first location and a second historical temperature value at the second location at any one of a plurality of times; and obtaining conversion parameters from the at least two first historical temperature values to the second historical temperature value according to the at least two first historical temperature values and the second historical temperature value.
In one implementation manner, the heat dissipation control unit 1103 is specifically configured to control a heat dissipation parameter of a heat dissipation device of the electronic device to match the second temperature value; or, the heat dissipation control unit 1103 is specifically configured to control the heat dissipation parameter of the heat dissipation device of the electronic device to be the first parameter when the second temperature value is greater than the temperature threshold; and controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a second parameter under the condition that the second temperature value is smaller than or equal to the temperature threshold value.
It should be noted that, the specific implementation of each unit in this embodiment may refer to the foregoing, and will not be described in detail herein.
Referring to fig. 13, a schematic structural diagram of an electronic device according to a third embodiment of the present application is provided, where the electronic device in this embodiment may be an electronic device with a heat generating device and a heat dissipating device, such as a mobile phone, a pad, or a notebook. The technical scheme in the embodiment is mainly used for improving the heat dissipation control effect on the electronic equipment.
In a specific implementation, the electronic device in this embodiment may include the following structure:
a case 1301 having a target region M on the case 1301;
at least two heat generating devices 1302;
a heat dissipation device 1303 for dissipating heat from the heat generating device 1302;
at least two temperature sensors 1304, disposed at least two first positions a of the electronic device, for acquiring first temperature values at the first positions a, where the first positions have a first distance from the respective corresponding heat generating devices 1302, the first positions a have a second distance from the target area M, and the first distance is smaller than the second distance;
a controller 1305 for obtaining at least two first temperature values, processing the at least two first temperature values to obtain a second temperature value, the second temperature value being indicative of a temperature value at a second location B of the electronic device; the second position B has a third distance from the target area M, and the third distance is smaller than the second distance; the heat sink 1303 is controlled based on at least the second temperature value.
As can be seen from the above, in the electronic device provided in the third embodiment of the present application, the first temperature value at the first position corresponding to the heating device is used to generate the second temperature value at the second position corresponding to the target area of the housing, and then the heat dissipating device is accurately controlled based on the second temperature value relatively close to the target area of the housing, that is, the heat dissipating device is controlled according to the temperature value at the position corresponding to the target area that can be perceived, so as to form a control effect that the temperature perceived by the user of the electronic device is matched with the heat dissipating state of the heat dissipating device, thereby improving the use experience of the user on the electronic device.
It should be noted that, the specific implementation of the controller in this embodiment may refer to the corresponding content in the foregoing, which is not described in detail herein.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A control method, comprising:
obtaining at least two first temperature values using at least two temperature sensors disposed at least two first locations of the electronic device; the first positions and the corresponding heating devices have a first distance, the first positions and the target area of the electronic equipment shell have a second distance, and the first distance is smaller than the second distance; the target area includes: a first region on the electronic device housing corresponding to the input device, and a second region on the electronic device housing in contact with a target that maintains stability of the electronic device;
processing the at least two first temperature values based on the spatial distance and/or the spatial medium between the first location and the second location to obtain a second temperature value, the second temperature value representing a temperature value at the second location of the electronic device; wherein the second location has a third distance from the target area, the third distance being less than the second distance; the target area is a partial area of the electronic equipment shell where a user perceives temperature;
acquiring sensing parameters acquired by a first sensor and a second sensor in the electronic equipment; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal or not, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state or not;
In a case where the sensing parameter collected by the first sensor characterizes the input device to receive an input signal and the sensing parameter collected by the second sensor characterizes the electronic device in a non-motion state, the second temperature value characterizes a temperature value at a second position having the third distance from the first region, so that the second temperature value is used for controlling a heat dissipating device of the electronic device;
in a case where the sensing parameter collected by the first sensor indicates that the input device does not receive an input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in a motion state, the second temperature value indicates a temperature value at a second position having the third distance from the second area, so that the second temperature value is used for controlling a heat dissipating device of the electronic device;
and controlling a heat dissipation device of the electronic equipment at least based on the second temperature value.
2. The method of claim 1, the second temperature value comprising, if the sensed parameter collected by the first sensor characterizes the input device receiving an input signal and the sensed parameter collected by the second sensor characterizes the electronic device in a state of motion: characterizing a first target temperature value at a second location having the third distance from the first region and characterizing a second target temperature value at a second location having the third distance from the second region;
Wherein, based on at least the second temperature value, control the heat dissipating device of the electronic device, including:
and controlling the heat dissipation device of the electronic equipment at least according to the first target temperature value and the second target temperature value.
3. The method of claim 2, controlling a heat sink of the electronic device according to the first and second target temperature values, comprising:
and controlling the heat dissipation device of the electronic equipment based on the target temperature value meeting the control condition in the first target temperature value and the second target temperature value.
4. The method of claim 1, processing the at least two first temperature values to obtain a second temperature value, comprising:
processing the at least two first temperature values by using a temperature conversion algorithm to obtain a second temperature value;
the temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the association relation between the first position and the second position.
5. The method of claim 4, further comprising:
obtaining a plurality of conversion parameters corresponding to the incidence relation in a parameter set according to the incidence relation between the first position and the second position;
Wherein the conversion parameters in the parameter set are obtained by:
obtaining at least two first historical temperature values at the first location and a second historical temperature value at the second location at any one of a plurality of times;
and obtaining conversion parameters from the at least two first historical temperature values to the second historical temperature value according to the at least two first historical temperature values and the second historical temperature value.
6. The method of claim 1, controlling a heat sink of the electronic device based at least on the second temperature value, comprising:
controlling the heat dissipation parameters of the heat dissipation device of the electronic equipment to be matched with the second temperature value;
or alternatively, the process may be performed,
controlling a heat sink of the electronic device based at least on the second temperature value, comprising:
controlling a heat dissipation parameter of a heat dissipation device of the electronic equipment to be a first parameter under the condition that the second temperature value is larger than a temperature threshold value;
and controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a second parameter under the condition that the second temperature value is smaller than or equal to the temperature threshold value.
7. A control apparatus comprising:
A temperature acquisition unit for obtaining at least two first temperature values by using at least two temperature sensors arranged at least two first positions of the electronic equipment; the first positions and the corresponding heating devices have a first distance, the first positions and the target area of the electronic equipment shell have a second distance, and the first distance is smaller than the second distance; the target area includes: a first region on the electronic device housing corresponding to the input device, and a second region on the electronic device housing in contact with a target that maintains stability of the electronic device;
a temperature processing unit, configured to process the at least two first temperature values based on a spatial distance and/or a spatial medium between the first location and the second location, to obtain a second temperature value, where the second temperature value characterizes a temperature value at the second location of the electronic device; wherein the second location has a third distance from the target area, the third distance being less than the second distance; the target area is a partial area of the electronic equipment shell where a user perceives temperature; acquiring sensing parameters acquired by a first sensor and a second sensor in the electronic equipment; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal or not, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state or not; in a case where the sensing parameter collected by the first sensor characterizes the input device to receive an input signal and the sensing parameter collected by the second sensor characterizes the electronic device in a non-motion state, the second temperature value characterizes a temperature value at a second position having the third distance from the first region, so that the second temperature value is used for controlling a heat dissipating device of the electronic device; in a case where the sensing parameter collected by the first sensor indicates that the input device does not receive an input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in a motion state, the second temperature value indicates a temperature value at a second position having the third distance from the second area, so that the second temperature value is used for controlling a heat dissipating device of the electronic device;
And the heat dissipation control unit is used for controlling the heat dissipation device of the electronic equipment at least based on the second temperature value.
8. An electronic device, comprising:
a housing having a target area thereon;
at least two heat generating devices;
the heat dissipation device is used for dissipating heat of the heating device;
the at least two temperature sensors are arranged at least two first positions of the electronic equipment and are used for acquiring first temperature values at the first positions, wherein the first positions and the corresponding heating devices have a first distance, the first positions and the target area have a second distance, and the first distance is smaller than the second distance; the target area includes: a first region on the electronic device housing corresponding to the input device, and a second region on the electronic device housing in contact with a target that maintains stability of the electronic device;
a controller for obtaining at least two first temperature values, processing the at least two first temperature values based on a spatial distance and/or a spatial medium between the first location and a second location, obtaining a second temperature value, the second temperature value representing a temperature value at the second location of the electronic device; wherein the second location has a third distance from the target area, the third distance being less than the second distance; the target area is a partial area of the electronic equipment shell where a user perceives temperature; acquiring sensing parameters acquired by a first sensor and a second sensor in the electronic equipment; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal or not, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state or not; in a case where the sensing parameter collected by the first sensor characterizes the input device to receive an input signal and the sensing parameter collected by the second sensor characterizes the electronic device in a non-motion state, the second temperature value characterizes a temperature value at a second position having the third distance from the first region, so that the second temperature value is used for controlling a heat dissipating device of the electronic device; in a case where the sensing parameter collected by the first sensor indicates that the input device does not receive an input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in a motion state, the second temperature value indicates a temperature value at a second position having the third distance from the second area, so that the second temperature value is used for controlling a heat dissipating device of the electronic device; and controlling the heat dissipation device at least based on the second temperature value.
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| CN104182016B (en) * | 2013-05-24 | 2018-08-31 | 联想(北京)有限公司 | A kind of temperature control method and electronic equipment |
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